CN203301932U - Heat conduction pad for electronic apparatus - Google Patents
Heat conduction pad for electronic apparatus Download PDFInfo
- Publication number
- CN203301932U CN203301932U CN2013203546348U CN201320354634U CN203301932U CN 203301932 U CN203301932 U CN 203301932U CN 2013203546348 U CN2013203546348 U CN 2013203546348U CN 201320354634 U CN201320354634 U CN 201320354634U CN 203301932 U CN203301932 U CN 203301932U
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- material layer
- graphite flake
- basis material
- plastic basis
- adhesive layer
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat conduction pad for an electronic apparatus. The heat conduction pad comprises a graphite flake, a first plastic substrate layer and a second plastic substrate layer. the upper surface of the graphite flake is bonded with the first plastic substrate layer through a first adhesive layer; the first plastic substrate layer is bonded with the second plastic substrate layer through a second adhesive layer; the lower surface of the graphite flake is coated with a pressure sensitive adhesive layer; and the pressure sensitive adhesive layer is bonded with a release paper at the side opposite to the graphite flake. According to the heat conduction pad, the weight of a radiator is mitigated, anti-bending performance is provided, the heat radiation effect is raised, and operation and installation are convenient.
Description
Technical field
The utility model relates to the electromangnetic spectrum field, relates in particular to a kind of heat-conducting pad for electronic instrument.
Background technology
In electronics industry, along with the operating rate of chip increases day by day, product size deisgn approach compactness; Requirement for the current capacity of the requirement of the heat management of product and conductive film material also day by day improves.Especially the Mobile portable equipment such as mobile phone, notebook computer and the electronic products such as projecting apparatus, great power LED are strict to the unit of generating heat, device temperature.Therefore, how to solve the hot localised points that the thermal source of product or device concentrates and become the key issue that industry need solve.Design space at product is more abundant, can various structure solves heat radiation and the conduction problem of core parts; But scheme available in narrow design space is less.Therefore the membrane structure material that needs the high heat conduction of preparation, high conduction.
Summary of the invention
The utility model provides a kind of heat-conducting pad for electronic instrument, and this heat-conducting pad alleviates the weight of radiator, has bend resistance simultaneously, also improves radiating effect, operates easy for installation.
For achieving the above object, the technical solution adopted in the utility model is: a kind of heat-conducting pad for electronic instrument, comprise graphite flake, the first plastic basis material layer and the second plastic basis material layer, bonding by the first adhesive layer between described graphite flake upper surface and the first plastic basis material layer, bonding by the second adhesive layer between described the first plastic basis material layer and the second plastic basis material layer, described graphite flake lower surface is coated with pressure-sensitive adhesive layer, and a release liners is pasted on the opposing surface of this pressure-sensitive adhesive layer and graphite flake.
In technique scheme, further improved technical scheme is as follows:
1. in such scheme, described graphite flake thickness is 10 ~ 300 microns.
2. in such scheme, described the second plastic basis material layer thickness is 10 ~ 100 microns.
Because technique scheme is used, the utility model compared with prior art has following advantages:
The utility model is for the heat-conducting pad of electronic instrument, it comprises graphite flake, the first plastic basis material layer and the second plastic basis material layer, bonding by the first adhesive layer between described graphite flake upper surface and the first plastic basis material layer, bonding by the second adhesive layer between described the first plastic basis material layer and the second plastic basis material layer, alleviated the weight of radiator, have bend resistance simultaneously, also improve radiating effect, operate easy for installation.
The accompanying drawing explanation
Accompanying drawing 1 is the heat-conducting pad structural representation of the utility model for electronic instrument.
In above accompanying drawing: 1, graphite flake; 2, the first plastic basis material layer; 3, the second plastic basis material layer; 4, the first adhesive layer; 5, the second adhesive layer; 6, pressure-sensitive adhesive layer; 7, release liners.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described:
Embodiment 1: a kind of heat-conducting pad for electronic instrument, comprise graphite flake 1, the first plastic basis material layer 2 and the second plastic basis material layer 3, bonding by the first adhesive layer 4 between described graphite flake 1 upper surface and the first plastic basis material layer 2, bonding by the second adhesive layer 5 between described the first plastic basis material layer 2 and the second plastic basis material layer 3, described graphite flake 1 lower surface is pasted a release liners 7 by pressure-sensitive adhesive layer 6.
Above-mentioned graphite flake 1 thickness is 250 microns.
Above-mentioned the second plastic basis material layer 3 thickness are 25 microns.
Embodiment 2: a kind of heat-conducting pad for electronic instrument, comprise graphite flake 1, the first plastic basis material layer 2 and the second plastic basis material layer 3, bonding by the first adhesive layer 4 between described graphite flake 1 upper surface and the first plastic basis material layer 2, bonding by the second adhesive layer 5 between described the first plastic basis material layer 2 and the second plastic basis material layer 3, described graphite flake 1 lower surface is pasted a release liners 7 by pressure-sensitive adhesive layer 6.
Above-mentioned graphite flake 1 thickness is 120 microns.
Above-mentioned the second plastic basis material layer 3 thickness are 75 microns.
While adopting above-mentioned heat-conducting pad for electronic instrument, it comprises graphite flake, the first plastic basis material layer and the second plastic basis material layer, bonding by the first adhesive layer between described graphite flake upper surface and the first plastic basis material layer, bonding by the second adhesive layer between described the first plastic basis material layer and the second plastic basis material layer, alleviated the weight of radiator, have bend resistance simultaneously, also improve radiating effect, operate easy for installation.
Above-described embodiment only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the person skilled in the art can understand content of the present utility model and implement according to this, can not limit protection range of the present utility model with this.All equivalences of doing according to the utility model Spirit Essence change or modify, within all should being encompassed in protection range of the present utility model.
Claims (3)
1. heat-conducting pad for electronic instrument, it is characterized in that: comprise graphite flake (1), the first plastic basis material layer (2) and the second plastic basis material layer (3), bonding by the first adhesive layer (4) between described graphite flake (1) upper surface and the first plastic basis material layer (2), bonding by the second adhesive layer (5) between described the first plastic basis material layer (2) and the second plastic basis material layer (3), described graphite flake (1) lower surface is coated with pressure-sensitive adhesive layer (6), and a release liners (7) is pasted on the opposing surface of this pressure-sensitive adhesive layer (6) and graphite flake (1).
2. heat-conducting pad according to claim 1, it is characterized in that: described graphite flake (1) thickness is 10 ~ 300 microns.
3. heat-conducting pad according to claim 1, it is characterized in that: described the second plastic basis material layer (3) thickness is 10 ~ 100 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203546348U CN203301932U (en) | 2013-06-20 | 2013-06-20 | Heat conduction pad for electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203546348U CN203301932U (en) | 2013-06-20 | 2013-06-20 | Heat conduction pad for electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203301932U true CN203301932U (en) | 2013-11-20 |
Family
ID=49577908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203546348U Expired - Fee Related CN203301932U (en) | 2013-06-20 | 2013-06-20 | Heat conduction pad for electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203301932U (en) |
-
2013
- 2013-06-20 CN CN2013203546348U patent/CN203301932U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131120 Termination date: 20190620 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |