CN203301437U - Quartz crystal resonator - Google Patents
Quartz crystal resonator Download PDFInfo
- Publication number
- CN203301437U CN203301437U CN2013202911433U CN201320291143U CN203301437U CN 203301437 U CN203301437 U CN 203301437U CN 2013202911433 U CN2013202911433 U CN 2013202911433U CN 201320291143 U CN201320291143 U CN 201320291143U CN 203301437 U CN203301437 U CN 203301437U
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- Prior art keywords
- quartz
- crystal resonator
- metal
- enclosing cover
- metlbond
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- Expired - Lifetime
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Abstract
The utility model is applicable to the semiconductor field, provides a quartz crystal resonator. The quartz crystal resonator comprises a quartz crystal resonance slice, a PCB base and an outer cover, wherein the PCB base comprises an upper surface and a lower surface which face opposite directions, the upper surface is provided with at least two metal binding disks, the lower surface is provided with at least two metal welding disks, the at least two metal binding disks are respectively and electrically connected with the at least two metal welding disks; the quartz crystal resonance slice comprises at least one first metal electrode and at least one second metal electrode which are respectively mechanically and electrically connected with the at least two metal binding disks; the outer cover covers the PCB base and is fixedly connected with the PCB base, the outer cover comprises a fixation surface facing the quartz crystal resonance slice, and a concave part for housing the quartz crystal resonance slice and the at least two metal binding disks is formed on the fixation surface. The quartz crystal resonator has features of simple structure, easy production and relatively low production cost.
Description
Technical field
The utility model relates to quartz-crystal resonator, is exactly a kind of surface mounting quartz crystal resonator of PCB pedestal, and the resonator of this PCB pedestal can be processed in enormous quantities and produce, and also can reduce the production cost of resonator.
Background technology
Quartz-crystal resonator, due to accuracy and the stability of its frequency, is an indispensable part in hyundai electronics industry such as communication, computer, amusement equipment and other our related field.
Up to the present, the base of ceramic of China's surface mounting quartz crystal resonator is stacked integrated application metal the overdoes ceramic structure of the technology such as deposition, metal mixed and ceramet involution, this type of base of ceramic needs high-tech to produce, must rely on Japanese import, cost is high and lack independence.In the case, can break away from Japan to the raw-material monopolization of frequency device, solve above-mentioned many technical barriers, provide simple structure, low-cost production, effective durable surface mounting quartz crystal resonator to have its obvious advantage and advantage.
Therefore,, in the urgent need to a kind of new-type quartz-crystal resonator is provided, produce in batches under simple structure, reduce costs, improve the production efficiency of quartz-crystal resonator.
The utility model content
For above-mentioned problem, the utility model proposes a kind of surface mounting quartz crystal resonator of PCB pedestal, this resonator can be processed in enormous quantities and produce, and this resonator structure is simple, be easy to make, and can reduce the cost of manufacture of resonator.
Based on this, the utility model is achieved in that
A kind of quartz-crystal resonator, described quartz-crystal resonator include PCB pedestal, quartz crystal resonance piece, enclosing cover; Described PCB pedestal comprises upper surface and the lower surface of opposing setting, at least two metlbond thing dishes of described upper surface setting, at least two metal pads of described lower surface setting, described at least two metlbond thing dishes are electrically connected to described two metal pads respectively at least; Described quartz crystal resonance piece comprises at least one first metal electrode and at least one the second metal electrode, and described at least one first metal electrode and at least one the second metal electrode carry out mechanical connection and are electrically connected to described at least two metlbond thing dishes respectively; Described enclosing cover be located on described PCB pedestal, and with described PCB pedestal, be fixedly connected with, described enclosing cover comprises towards the stationary plane of described quartz crystal resonance piece, offers the recess for accommodating described quartz crystal resonance piece and at least two metlbond thing dishes on described stationary plane.
Further, the length and width consistent size of the length and width size of described enclosing cover and PCB pedestal.
Further, the surface mounting quartz crystal resonator of described PCB pedestal, bonding connection is carried out by the marginal portion of non-conductive capping binding and metal enclosing cover or ceramic enclosing cover in the marginal portion of described PCB pedestal, and whole quartz crystal resonance piece is sealed in by the PCB pedestal and has in the formed space of enclosing cover of recess.
Further, described quartz-crystal resonator also comprises the capping binding, the upper surface of described PCB pedestal comprises the first edge that described at least two metlbond thing dishes are surrounded, the stationary plane of described enclosing cover also comprises the second edge around described recess, described the first edge and described the second corresponding setting in edge, described the first edge and described the second edge carry out bonding connection by described capping binding.
Further, at least two metlbond thing dishes on described PCB pedestal and at least two corresponding settings of metal pad, and each metlbond thing dish is electrically connected to corresponding metal pad respectively.
Further, the quantity of described metlbond thing dish is four, and is separately positioned on four drift angle places of described upper surface; The quantity of described metal pad is also four, and is separately positioned on four drift angle places of described lower surface.
Further, described quartz crystal resonance piece comprises end face and the bottom surface of opposing setting, described bottom surface arranges towards described PCB pedestal, the major part of described at least one the first metal electrode is arranged on described bottom surface, and fraction extends to described end face, the major part of described at least one the second metal electrode is arranged on described end face, and fraction extends to described bottom surface.
Further, the material of described enclosing cover is metal or pottery.The utility model adopts above-mentioned PCB pedestal and the structure of metal enclosing cover or ceramic enclosing cover, and this kind resonator can be produced in enormous quantities at low cost, improves occupation rate of market.
The surface mounting quartz crystal resonator of this PCB pedestal is simple in structure, be easy to make, and is convenient to produce in enormous quantities, cost of manufacture that can the decrease quartz-crystal resonator.
Description of drawings
Fig. 1 is the structural representation of the quartz-crystal resonator that provides of the utility model embodiment.
Fig. 2 is the decomposing schematic representation of quartz-crystal resonator shown in Figure 1.
Fig. 3 is the structural representation of another angle of quartz-crystal resonator shown in Figure 1.
Fig. 4 is the decomposing schematic representation of quartz-crystal resonator shown in Figure 3.
Embodiment
Below, by reference to the accompanying drawings shown in, enforcement of the present utility model is described further.
As shown in Figures 1 to 4, the surface mounting quartz crystal resonator 10 of a kind of PCB pedestal that the utility model is implemented, include PCB pedestal 20, quartz crystal resonance piece 30, metal enclosing cover or ceramic enclosing cover 40.PCB pedestal 20 is plate, and upper surface has at least two metlbond thing dishes 21,22, and lower surface has two metal pads 23,24 at least; A metlbond thing dish 21 and a metal pad 23 have electrical connection, and another one metlbond thing dish 22 and another one metal pad 24 have electrical connection; 30 two faces of quartz crystal resonance piece respectively have a metal electrode 31,32, this resonance piece 30 is fixed at least two metlbond thing dishes 21,22 of PCB pedestal 20 by conductive adhesion thing 50, simultaneously each metal electrode 31,32 on 30 two faces of resonance piece has mechanical connection and electrical connection with two metlbond thing dishes 21,22 of PCB pedestal 20 respectively by conductive adhesion thing 50, thus respectively with PCB pedestal 20 on two metal pads 23,24 electrical connection is arranged; Matrix 41 in the middle of metal enclosing cover or ceramic enclosing cover 40, in order to can cover whole metlbond thing dishes 21,22 of quartz crystal resonance piece 30 and PCB pedestal 20, and the while does not contact any metlbond thing dish 21,22 on quartz crystal resonance piece 30 and PCB pedestal 20.
Bonding connection can be carried out by capping binding 60 and the marginal portion 25 of PCB pedestal 20 in the marginal portion 42 of described metal enclosing cover and ceramic enclosing cover 40, and whole quartz crystal resonance piece 30 is sealed in by PCB pedestal 20 and the metal enclosing cover 40 of recess 41 is arranged or have in the formed space of ceramic enclosing cover 40 of recess 41.
During making, first select a PCB pedestal 20 that given size and thickness are arranged, then conductive adhesion thing 50 is assigned on the metlbond thing dish 21,22 on PCB pedestal 20, then quartz crystal resonance piece 30 direction according to the rules is placed on conductive adhesion thing 50.Press gently while laying, so that quartz crystal resonance piece 30 has good contacting with conductive adhesion thing 50.At this moment, the metal electrode 31 on quartz crystal resonance piece 30 two sides, 32 has electrical connection by the metlbond thing dish 21,22 on conductive adhesion thing 50 and PCB pedestal 20.Then these semi-finished product are put into curing oven conductive adhesion thing 50, so that quartz crystal resonance piece 30 is securely fixed on metlbond thing dish 21,22 on PCB pedestal 20.It is fixed that the temperature and time that conductive adhesion thing 50 solidifies is come by the specification of conductive adhesion thing 50.
When semi-finished product are taken out from baking oven after, then capping binding 60 is distributed in PCB pedestal 20 has on first edge 25 of the side of metlbond thing dish 21,22, and then will have the metal enclosing cover of recess 41 or ceramic enclosing cover 40 to be arranged on these semi-finished product.The recess 41 of enclosing cover 40 can hold and don't contact quartz crystal resonance piece 30.When being installed, enclosing cover 40 presses gently, in order to there is the capping binding 60 on the first edge 25 of metlbond thing dish 21,22 those faces that good contact is arranged on the second edge 42 of metal enclosing cover or ceramic enclosing cover 40 and PCB pedestal 20.
After installing the metal enclosing cover or ceramic enclosing cover 40 of recess 41, whole product is put into curing oven capping binding 60.After curing is completed, product is taken out baking oven, obtain the surface mounting quartz crystal resonator 10 of PCB pedestal.It is fixed that the temperature and time that capping binding 60 solidifies is come by the specification of capping binding 60.
The surface mounting quartz crystal resonator 10 of this PCB pedestal is simple in structure, be easy to make, and is convenient to produce in enormous quantities, cost of manufacture that can the decrease quartz-crystal resonator.
In a word, the above, be only preferred embodiment of the present utility model, not is used for limiting the scope of the utility model embodiment.Be that all equalizations of doing according to the utility model claim change and modify, be all in the scope of the claims of the present utility model.
Claims (8)
1. a quartz-crystal resonator, is characterized in that, described quartz-crystal resonator includes PCB pedestal, quartz crystal resonance piece, enclosing cover; Described PCB pedestal comprises upper surface and the lower surface of opposing setting, at least two metlbond thing dishes of described upper surface setting, at least two metal pads of described lower surface setting, described at least two metlbond thing dishes are electrically connected to described two metal pads respectively at least; Described quartz crystal resonance piece comprises at least one first metal electrode and at least one the second metal electrode, and described at least one first metal electrode and at least one the second metal electrode carry out mechanical connection and are electrically connected to described at least two metlbond thing dishes respectively; Described enclosing cover be located on described PCB pedestal, and with described PCB pedestal, be fixedly connected with, described enclosing cover comprises towards the stationary plane of described quartz crystal resonance piece, offers the recess for accommodating described quartz crystal resonance piece and at least two metlbond thing dishes on described stationary plane.
2. quartz-crystal resonator as claimed in claim 1, is characterized in that the length and width size of described enclosing cover and the length and width consistent size of PCB pedestal.
3. quartz-crystal resonator as claimed in claim 1, it is characterized in that, bonding connection is carried out by the marginal portion of non-conductive capping binding and metal enclosing cover or ceramic enclosing cover in the marginal portion of described PCB pedestal, and whole quartz crystal resonance piece is sealed in by the PCB pedestal and has in the formed space of enclosing cover of recess.
4. quartz-crystal resonator as claimed in claim 1, it is characterized in that, described quartz-crystal resonator also comprises the capping binding, the upper surface of described PCB pedestal comprises the first edge that described at least two metlbond thing dishes are surrounded, the stationary plane of described enclosing cover also comprises the second edge around described recess, described the first edge and described the second corresponding setting in edge, described the first edge and described the second edge carry out bonding connection by described capping binding.
5. quartz-crystal resonator as claimed in claim 1, is characterized in that, at least two metlbond thing dishes on described PCB pedestal and at least two corresponding settings of metal pad, and each metlbond thing dish is electrically connected to corresponding metal pad respectively.
6. quartz-crystal resonator as claimed in claim 5, is characterized in that, the quantity of described metlbond thing dish is four, and be separately positioned on four drift angle places of described upper surface; The quantity of described metal pad is also four, and is separately positioned on four drift angle places of described lower surface.
7. quartz-crystal resonator as claimed in claim 1, it is characterized in that, described quartz crystal resonance piece comprises end face and the bottom surface of opposing setting, described bottom surface arranges towards described PCB pedestal, the major part of described at least one the first metal electrode is arranged on described bottom surface, and fraction extends to described end face, and the major part of described at least one the second metal electrode is arranged on described end face, and fraction extends to described bottom surface.
8. quartz-crystal resonator as claimed in claim 1, is characterized in that, the material of described enclosing cover is metal or pottery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202911433U CN203301437U (en) | 2013-05-24 | 2013-05-24 | Quartz crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202911433U CN203301437U (en) | 2013-05-24 | 2013-05-24 | Quartz crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203301437U true CN203301437U (en) | 2013-11-20 |
Family
ID=49577417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202911433U Expired - Lifetime CN203301437U (en) | 2013-05-24 | 2013-05-24 | Quartz crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203301437U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118199556A (en) * | 2024-03-14 | 2024-06-14 | 泰晶科技股份有限公司 | Wafer-level packaging resonator, preparation method thereof and electronic equipment |
-
2013
- 2013-05-24 CN CN2013202911433U patent/CN203301437U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118199556A (en) * | 2024-03-14 | 2024-06-14 | 泰晶科技股份有限公司 | Wafer-level packaging resonator, preparation method thereof and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 518000, building 3-4, building C, 4 / F, Tai Po Industrial Park, Fenghuang second industrial zone, Fenghuang Industrial Zone, Baoan District, Shenzhen, Guangdong, Fuyong, China Patentee after: INTERQUIP ELECTRONICS (SHENZHEN) Co.,Ltd. Address before: 518000 D, Tai Po Industrial Park, Fenghuang second industrial zone, Fuyong street, Shenzhen, Guangdong, Baoan District, China Patentee before: INTERQUIP ELECTRONICS (SHENZHEN) Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131120 |