CN203368412U - Surface mounted quartz crystal resonator matrix body with PCB pedestal - Google Patents
Surface mounted quartz crystal resonator matrix body with PCB pedestal Download PDFInfo
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- CN203368412U CN203368412U CN 201320425785 CN201320425785U CN203368412U CN 203368412 U CN203368412 U CN 203368412U CN 201320425785 CN201320425785 CN 201320425785 CN 201320425785 U CN201320425785 U CN 201320425785U CN 203368412 U CN203368412 U CN 203368412U
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- quartz crystal
- pcb
- crystal resonator
- surface mounting
- pedestal
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Abstract
The utility model discloses a surface mounted quartz crystal resonator matrix body with a PCB pedestal. The resonator matrix body comprises a plurality of surface mounted quartz crystal resonators with the PCB pedestal, and the surface mounted quartz crystal resonators are connected to form one body through a connection portion to form at least a one-dimensional matrix. Since the surface mounted quartz crystal resonators are connected to form one body through a connection portion, mass processing is more convenient. The processing efficiency of the surface mounted quartz crystal resonator matrix body with a PCB pedestal is improved, and the production cost is reduced.
Description
Technical field
The utility model relates to semiconductor applications, and quartz-crystal resonator matrix body relates in particular to a kind of surface mounting quartz crystal resonator matrix body of PCB pedestal.
Background technology
Quartz-crystal resonator, due to accuracy and the stability of its frequency, is an indispensable part in the hyundai electronics industry as communication, computer, amusement equipment and other our related field.
Up to the present, the base of ceramic of China's surface mounting quartz crystal resonator is stacked integrated application metal the overdoes ceramic structure of the technology such as deposition, metal mixed and ceramet involution, this type of base of ceramic needs high-tech to be produced, must rely on Japanese import, cost is high and lack independence.In the case, can break away from Japan to the raw-material monopolization of frequency device, solve above-mentioned many technical barriers, provide simple structure, low-cost production, effective durable surface mounting quartz crystal resonator to there is its obvious advantage and advantage.
Therefore, the surface sticked resonator that a kind of new-type PCB pedestal need to be provided is arranged, so that produced in batches, more can reduce costs, enhance productivity.
The utility model content
For above-mentioned problem, the utility model proposes a kind of surface mounting quartz crystal resonator matrix body of PCB pedestal, can be produced in enormous quantities, to reduce production costs, enhance productivity.
The utility model is achieved in that
A kind of surface mounting quartz crystal resonator matrix body of PCB pedestal, it is characterized in that described resonator matrix body includes the surface mounting quartz crystal resonator of a plurality of PCB pedestals, the surface mounting quartz crystal resonator of described a plurality of PCB pedestals links into an integrated entity by connecting portion, at least to form the one dimension matrix.
Further, the in the same size of the surface mounting quartz crystal resonator of described a plurality of PCB pedestals, and all keep identical spacing between the surface mounting quartz crystal resonator of the surface mounting quartz crystal resonator of each PCB pedestal and adjacent described PCB pedestal.
Further, the surface mounting quartz crystal resonator of each PCB pedestal includes a PCB pedestal and a quartz crystal resonance piece, and described quartz crystal resonance piece is fixed connection and is electrically connected to corresponding PCB pedestal by the conductive adhesion thing.
Further, described connecting portion is in the outside of described PCB pedestal.
Further, described a plurality of PCB pedestals and described connecting portion are manufactured from the same material the thickness that the thickness of described connecting portion is less than or equal to described PCB pedestal.
Further, described connecting portion and the described PCB pedestal structure that is formed in one.
Further, the surface mounting quartz crystal resonator of each PCB pedestal also comprises an enclosing cover, and the central authorities of described enclosing cover arrange a recess, and described recess arranges towards corresponding quartz crystal resonance piece, described recess matches with corresponding PCB pedestal, to encapsulate corresponding quartz crystal resonance piece.
Further, described enclosing cover is fixedly connected with corresponding PCB pedestal by non-conductive binding.
The utility model compared with prior art, beneficial effect is: the utility model adopts above-mentioned structure, be simple and easy to make, can comprise the surface mounting quartz crystal resonator of a plurality of PCB pedestals due to the surface mounting quartz crystal resonator matrix body of PCB pedestal simultaneously, therefore can produce in enormous quantities, with the decrease cost of manufacture, enhance productivity.
The accompanying drawing explanation
Fig. 1 is the structural representation that the utility model is implemented.
The structural representation of the surface mounting quartz crystal resonator of the PCB pedestal that Fig. 2 is the utility model enforcement.
Embodiment
Below, by reference to the accompanying drawings shown in, enforcement of the present utility model is described further.
Shown in Fig. 1, the surface mounting quartz crystal resonator matrix body 30 of a kind of PCB pedestal that the utility model is implemented, include the surface mounting quartz crystal resonator 31 of a plurality of PCB pedestals, the surface mounting quartz crystal resonator 31 of described PCB pedestal forms the surface mounting quartz crystal resonator matrix body 30 of PCB pedestal by connecting portion 32.Described connecting portion 32 links the surface mounting quartz crystal resonator of PCB pedestal 31 in together, form an assembly with surface mounting quartz crystal resonator 31 of a plurality of PCB pedestals, the thickness of described connecting portion 32 is less than or equal to the thickness of resonator PCB pedestal, be convenient to carry out the batch machining of the surface mounting quartz crystal resonator 31 of described PCB pedestal, improve the working (machining) efficiency of the surface mounting quartz crystal resonator 31 of described PCB pedestal, also reduced cost of manufacture.
The in the same size of the surface mounting quartz crystal resonator 31 of described a plurality of PCB pedestals, and keep identical spacing between the surface mounting quartz crystal resonator 31 of described a plurality of PCB pedestals.
Shown in Fig. 2, the surface mounting quartz crystal resonator 31 of each PCB pedestal includes a PCB pedestal 11, quartz crystal resonance piece 311 and an enclosing cover 20.
At least two metlbond thing dishes 12 are set on each PCB pedestal 11, and are provided with conductive adhesion thing 13 on each described metlbond thing dish 12.Each quartz crystal resonance piece 311 all is fixed on corresponding PCB pedestal 11 by corresponding conductive adhesion thing 13, and is electrically connected to corresponding PCB pedestal 11.
The periphery of each described PCB pedestal 11 all arranges non-conductive binding 14.The central authorities of each enclosing cover 20 all arrange a recess 15.The recess 15 of each enclosing cover 20 arranges towards corresponding quartz crystal resonance piece 311, to cover corresponding quartz crystal resonance piece 311, and does not contact corresponding quartz crystal resonance piece 311.The edge 16 of each described enclosing cover 20 all is fixedly connected with corresponding PCB pedestal 11 by described non-conductive binding 14.Described enclosing cover 20 can be metal enclosing cover or ceramic enclosing cover.
Described connecting portion 32 is positioned at the side of described a plurality of PCB pedestals 11, is convenient to the following process of the surface mounting quartz crystal resonator 31 of described PCB pedestal.
During making, first select a PCB pedestal matrix body 10 that given size and thickness are arranged, this matrix body 10 is one dimension or two-dimensional matrix sheet, and includes the PCB pedestal 11 of specified quantity.
Then distribute described conductive adhesion thing 13 on the metlbond thing dish 12 in each PCB pedestal 11 front on described PCB pedestal matrix body 10, then lay a quartz crystal resonance piece 311 on each PCB pedestal 11.After solidifying described conductive adhesion thing 13, each quartz crystal resonance piece 311 can with the metlbond thing dish 12 in each PCB pedestal 11 front on described conductive adhesion thing 13 link together securely, and be electrically connected to.
Then the edge in each PCB pedestal 11 front on PCB pedestal matrix body 10 distributes non-conductive binding 14, again at a described enclosing cover 20 of each PCB pedestal 11 positive installation, now, the described recess 15 of each enclosing cover 20 contains but does not contact each quartz crystal resonance piece 311.After solidifying non-conductive binding 14, each enclosing cover 20 can with each PCB pedestal 11 front edge on non-conductive binding 14 link together securely, each quartz crystal resonance piece 311 is encapsulated in by each PCB pedestal 11 and each formed space of enclosing cover 20, formed the surface mounting quartz crystal resonator matrix body 30 of described PCB pedestal.In following process, can use wire cutting machine to decompose this resonator matrix body 30 and make it become the surface mounting quartz crystal resonator 31 of single PCB pedestal.
Shape, thickness and the size of above-mentioned PCB pedestal matrix body 10 can be determined according to designing requirement and product specification.
The utility model adopts above-mentioned structure, make the surface mounting quartz crystal resonator matrix body 30 of described PCB pedestal can comprise the surface mounting quartz crystal resonator 31 of a plurality of PCB pedestals, when making, just can produce in enormous quantities the surface mounting quartz crystal resonator 31 of described PCB pedestal, the cost of manufacture of surface mounting quartz crystal resonator 31 that can the described PCB pedestal of decrease, improve the production efficiency of the surface mounting quartz crystal resonator 31 of described PCB pedestal.During following process, the surface mounting quartz crystal resonator matrix body 30 that can use wire cutting machine to decompose described PCB pedestal makes it become the surface mounting quartz crystal resonator 31 of single described PCB pedestal.
In a word, the above, be only preferred embodiment of the present utility model, not is used for limiting the scope of the utility model embodiment.Be that all equalizations of doing according to the utility model claim change and modify, be all in the scope of the claims of the present utility model.
Claims (9)
1. the surface mounting quartz crystal resonator matrix body of a PCB pedestal, it is characterized in that, described matrix body comprises the surface mounting quartz crystal resonator of a plurality of PCB pedestals, the surface mounting quartz crystal resonator of described PCB pedestal links into an integrated entity by connecting portion, and the surface mounting quartz crystal resonator of described a plurality of PCB pedestals at least forms the one dimension matrix.
2. the surface mounting quartz crystal resonator matrix body of PCB pedestal as claimed in claim 1, it is characterized in that, the in the same size of the surface mounting quartz crystal resonator of described a plurality of PCB pedestals, and keep identical spacing between the surface mounting quartz crystal resonator of the surface mounting quartz crystal resonator of each described PCB pedestal and adjacent described PCB pedestal.
3. the surface mounting quartz crystal resonator matrix body of PCB pedestal as claimed in claim 1, it is characterized in that, the surface mounting quartz crystal resonator of each PCB pedestal includes a PCB pedestal and a quartz crystal resonance piece, and described quartz crystal resonance piece is fixed connection and is electrically connected to corresponding PCB pedestal by the conductive adhesion thing.
4. the surface mounting quartz crystal resonator matrix body of PCB pedestal as claimed in claim 3, is characterized in that, described connecting portion is in the outside of described PCB pedestal.
5. the surface mounting quartz crystal resonator matrix body of PCB pedestal as claimed in claim 3, is characterized in that, the thickness of described connecting portion is less than or equal to the thickness of described PCB pedestal.
6. the surface mounting quartz crystal resonator matrix body of PCB pedestal as claimed in claim 3, is characterized in that, described a plurality of PCB pedestals and described connecting portion are manufactured from the same material.
7. the surface mounting quartz crystal resonator matrix body of PCB pedestal as claimed in claim 3, is characterized in that, described connecting portion and the described PCB pedestal structure that is formed in one.
8. the surface mounting quartz crystal resonator matrix body of PCB pedestal as claimed in claim 3, it is characterized in that, the surface mounting quartz crystal resonator of each PCB pedestal also comprises an enclosing cover, the central authorities of described enclosing cover arrange a recess, described recess arranges towards corresponding quartz crystal resonance piece, described recess matches with corresponding PCB pedestal, to encapsulate corresponding quartz crystal resonance piece.
9. the surface mounting quartz crystal resonator matrix body of PCB pedestal as claimed in claim 8, is characterized in that, described enclosing cover is fixedly connected with corresponding PCB pedestal by non-conductive binding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320425785 CN203368412U (en) | 2013-07-17 | 2013-07-17 | Surface mounted quartz crystal resonator matrix body with PCB pedestal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320425785 CN203368412U (en) | 2013-07-17 | 2013-07-17 | Surface mounted quartz crystal resonator matrix body with PCB pedestal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203368412U true CN203368412U (en) | 2013-12-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320425785 Expired - Lifetime CN203368412U (en) | 2013-07-17 | 2013-07-17 | Surface mounted quartz crystal resonator matrix body with PCB pedestal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203368412U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465312A (en) * | 2020-04-14 | 2020-07-28 | 杭州洛微科技有限公司 | Photoelectric product packaging production method based on periodic array arrangement |
-
2013
- 2013-07-17 CN CN 201320425785 patent/CN203368412U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465312A (en) * | 2020-04-14 | 2020-07-28 | 杭州洛微科技有限公司 | Photoelectric product packaging production method based on periodic array arrangement |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 518000, building 3-4, building C, 4 / F, Tai Po Industrial Park, Fenghuang second industrial zone, Fenghuang Industrial Zone, Baoan District, Shenzhen, Guangdong, Fuyong, China Patentee after: INTERQUIP ELECTRONICS (SHENZHEN) Co.,Ltd. Address before: 518103 D, Tai Po Industrial Park, Fenghuang second industrial zone, Fuyong Town, Shenzhen, Guangdong, Baoan District, China Patentee before: INTERQUIP ELECTRONICS (SHENZHEN) Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131225 |