CN104576617B - Module integrated circuit packaging structure and preparation method thereof - Google Patents
Module integrated circuit packaging structure and preparation method thereof Download PDFInfo
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- CN104576617B CN104576617B CN201310479235.9A CN201310479235A CN104576617B CN 104576617 B CN104576617 B CN 104576617B CN 201310479235 A CN201310479235 A CN 201310479235A CN 104576617 B CN104576617 B CN 104576617B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15158—Shape the die mounting substrate being other than a cuboid
- H01L2924/15162—Top view
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
A kind of module integrated circuit packaging structure and preparation method thereof, the module integrated circuit packaging structure includes：One base board unit, an electronic unit, an encapsulation unit and a screen unit.Base board unit includes a circuit substrate, one is arranged on the ground plane inside circuit substrate and one is arranged on outer conducting structure in the outer circular surrounding of circuit substrate, and outer conducting structure includes multiple outer conducting layers.The outer circular surrounding of ground plane from circuit substrate is exposed directly to contact multiple outer conducting layers.Electronic unit includes multiple electronic components being arranged on circuit substrate.Encapsulation unit includes a packing colloid for being arranged on circuit substrate and covering multiple electronic components.Screen unit includes a metal screen layer for being coated on the outer surface of packing colloid and directly contacting outer conducting structure.Thereby, ground plane can be directly by outer conducting structure, to be electrically connected at metal screen layer.
Description
Technical field
It is espespecially a kind of that there is electrically shielding work(the present invention relates to a kind of module integrated circuit packaging structure and preparation method thereof
Module integrated circuit packaging structure of energy and preparation method thereof.
Background technology
In recent years, scientific and technological Fast Growth so that various products are numerous and confused towards the application for combining science and technology, and it is also continuous
Ground is among progress.Additionally due to the function of product is more and more so that current most product is all to use module
The mode of change carrys out Integration Design.However, integrating the module of a variety of difference in functionalitys in the product, although obtain so that the function of product is big
Width increase, but under the demand for being particular about product miniaturization and attractive appearance now, how to design and have small product size concurrently
Small and multi-functional product is current all trades and professions all in the target strongly studied.
And be constantly to be made by the evolution of technology with the technology of increasingly high-order in terms of semiconductor manufacturing
The chip or element of small volume are produced, is able to design less functional module so that the Module manufacturers of application are relative, and then
End product can be allowed to utilize and arrange in pairs or groups as more effective.And from the point of view of current known technology, most application module is still
It is with printed circuit board (PCB), epoxy resin base plate or BT（Bismaleimide Triazine）The substrate of the unlike materials such as substrate comes
As the main support plate of module, and the part such as all chips, element passes through surface mount technology again（SMT）Sticked Deng piece mode
In the surface of support plate.Then support plate when carrier forms circuit connection purely simply to be used, and structure therein is also
To the hierarchy being laid out as circuit cabling.
Furthermore, with the development of radio-frequency communication technology, it is meant that wireless communication unit is in must be more rigorous in circuit design
With efficiency optimization.Wireless communications products require greatly lightweight, small volume, high-quality, low price, low consumpting power and highly reliable
The features such as spending, these features promote the technological development of RF/Microwave integrated circuit and market is grown up.And in wireless communications products
The electro-magnetic screen function and quality requirements of wireless module are relative to seem important, with ensure signal will not be interfering with each other and have influence on logical
Interrogate quality.
Known wireless module or other needs make the circuit module being electromagnetically shielded, and it must add electricity according to required application
The structure of magnetic screen, for example, be electromagnetically shielded metal cap body design.And the size of electromagnetic armouring structure must coordinate difference
Module, to enable the signal source in circuit to be isolated and completely cut off.But such a known electromagnetic shielding metal cap body must pin
Making is designed to different module or device, make known electromagnetic shielding metal cap body need to expend more man-hour, manpower with
Cost.
In addition, electronic circuit or dress that the further drawback of above-mentioned known electromagnetic shielding metal cap body is made to be electromagnetically shielded for needs
The size put, shape, block differ, and such as need to be made manual mould for each different size, shape, the module of block
Tool, punch process and progressively component encapsulation are carried out, then make it that the making of electromagnetic shielding metal cap body is difficult and can not be applied to fast
The production of fast-growing production is online, and the economic benefit of known electromagnetic shielding metal cap body production must be made to be reduced with industry applications.
The content of the invention
The embodiment of the present invention is to provide a kind of module integrated circuit packaging structure and its system with electrical function of shielding
Make method, it can effectively solve the defect of " known using electromagnetic shielding metal cap body ".
A kind of module integrated circuit packaging structure with electrical function of shielding that a wherein embodiment of the invention is provided,
It includes：One base board unit, an electronic unit, an encapsulation unit and a screen unit.The base board unit, which includes one, has one
Circuit substrate outside around surrounding, the ground connection for being arranged on inside the circuit substrate and being coated completely by the circuit substrate
Layer, an outer conducting structure being arranged in the outer circular surrounding of the circuit substrate and one are arranged on the circuit substrate
It is internal and be electrically connected at the interior conductive structure between the ground plane and the outer conducting structure, wherein the outer conducting structure
Including multiple outer conducting layers being arranged in the outer circular surrounding of the circuit substrate, the interior conductive structure includes multiple
The inner conducting layer of the outer conducting layer is corresponded respectively to, and two opposite ends of each inner conducting layer directly connect respectively
Touch the ground plane and the corresponding outer conducting layer.The electronic unit include it is multiple be arranged on the circuit substrate and
Be electrically connected at the electronic component of the circuit substrate, wherein the electronic component by the circuit substrate to be electrically connected at
The ground plane.The encapsulation unit includes a packaging plastic for being arranged on the circuit substrate and covering the electronic component
Body.The screen unit includes a gold for being coated on the outer surface of the packing colloid and directly contacting the outer conducting structure
Belong to screen layer, wherein the ground plane is sequentially by the interior conductive structure and the outer conducting structure, to be electrically connected at
State metal screen layer.
A kind of module integrated circuit packaging structure with electrical function of shielding that the other embodiment of the present invention is provided,
It includes：One base board unit, an electronic unit, an encapsulation unit and a screen unit.The base board unit, which includes one, has one
Outer circuit substrate around surrounding, one are arranged on ground plane inside the circuit substrate and one are arranged on the circuit substrate
The outer circular surrounding on outer conducting structure, wherein the outer conducting structure includes multiple being arranged on the circuit substrate
Outer conducting layer in the outer circular surrounding, and the outer circular surrounding of the ground plane from the circuit substrate is exposed, with
Directly contact the outer conducting layer.The electronic unit includes multiple being arranged on the circuit substrate and being electrically connected at described
The electronic component of circuit substrate, wherein the electronic component by the circuit substrate to be electrically connected at the ground plane.Institute
State the packing colloid that encapsulation unit is arranged on the circuit substrate including one and covers the electronic component.The screen unit
The metal screen layer of the outer conducting structure, wherein institute are coated on the outer surface of the packing colloid and directly contacted including one
Ground plane is stated directly by the outer conducting structure, to be electrically connected at the metal screen layer.
A kind of modular integrated circuit encapsulation knot with electrical function of shielding that another embodiment in addition of the invention is provided
The preparation method of structure, it comprises the following steps：There is provided an initial substrate, the initial substrate includes multiple be connected with each other and into square
The base board unit of battle array arrangement, base board unit described in each of which is arranged in the circuit substrate including a circuit substrate and one
The ground plane in portion；Multiple electronic units are separately positioned on the circuit substrate of the base board unit, each of which institute
Electronic unit is stated to be arranged on the corresponding circuit substrate including multiple and be electrically connected at the corresponding circuit base
The electronic component of plate, and each electronic unit the electronic component by the corresponding circuit substrate with electricity
Property is connected to the corresponding ground plane；An initial encapsulation unit is formed in the initial substrate, to cover the electronics
Unit, wherein the initial encapsulation unit includes multiple packing colloids being connected with each other, and each described packing colloid is set
On the corresponding circuit substrate and cover multiple corresponding electronic components；Cut the initial substrate and described
Initial encapsulation unit, to separate the base board unit and separate the packing colloid, the institute of base board unit described in each of which
State the corresponding circuit substrate of outer conducting layer slave phase and the corresponding packing colloid is exposed；And, respectively in the envelope
Multiple metal screen layers are formed on the outer surface for filling colloid, metal screen layer described in each of which directly contacts corresponding institute
State the outer conducting structure of base board unit.
To enable the feature and technology contents that are further understood that the present invention, refer to below in connection with the present invention specifically
Bright and accompanying drawing, however institute's accompanying drawings only provide with reference to and explanation use, not for being any limitation as to the present invention.
Brief description of the drawings
Fig. 1 is a kind of modular integrated circuit encapsulation knot with electrical function of shielding disclosed by first embodiment of the invention
The flow chart of the preparation method of structure.
Fig. 2 for first embodiment of the invention module integrated circuit packaging structure preparation method step S100 on regard
Schematic diagram.
Fig. 3 is the diagrammatic cross-section of Fig. 2 A-A face lines.
Fig. 4 is the step S102 of the preparation method of the module integrated circuit packaging structure of first embodiment of the invention section
Schematic diagram.
Fig. 5 is the step S104 of the preparation method of the module integrated circuit packaging structure of first embodiment of the invention section
Schematic diagram.
Fig. 6 is the step S106 of the preparation method of the module integrated circuit packaging structure of first embodiment of the invention section
Schematic diagram.
Fig. 7 is the step S108 and module of the preparation method of the module integrated circuit packaging structure of first embodiment of the invention
The diagrammatic cross-section of integrated circuit package structure.
Fig. 8 is the step S108 and module of the preparation method of the module integrated circuit packaging structure of first embodiment of the invention
The upper schematic diagram of integrated circuit package structure.
Fig. 9 is the diagrammatic cross-section of the module integrated circuit packaging structure disclosed by second embodiment of the invention.
【Symbol description】
Encapsulating structure Z
Screen unit initial substrate 1 '
Base board unit 1
Circuit substrate 10
Outside around surrounding 100
Ground plane 11
Outer conducting structure 12
Outer conducting layer 120
Cutting side wall 1200
Chadless 121
Interior conductive structure 13
Inner conducting layer 130
Electronic unit 2
Electronic component 20
Initial encapsulation unit 3 '
Encapsulation unit 3
Packing colloid 30
Screen unit 4
Metal screen layer 40
Face line A-A
Line of cut X-X
Embodiment
(first embodiment)
Refer to shown in Fig. 1 to Fig. 7, it is integrated that first embodiment of the invention provides a kind of module with electrical function of shielding
Circuit encapsulating structure Z preparation method, it comprises the following steps：
First, step S100 is：Coordinate shown in Fig. 1, Fig. 2 and Fig. 3 there is provided an initial substrate 1 ', initial substrate 1 ' includes
Multiple to be connected with each other and into the base board unit 1 of matrix arrangement, each of which base board unit 1 is set including a circuit substrate 10, one
Put the ground plane 11 inside circuit substrate 10（The ground plane 11 of such as sheet）And one be electrically connected at the outer of ground plane 11 and lead
Electric structure 12.For example, base board unit 1 can be a Multi-layer circuit board structure, and ground plane 11 is exactly Multi-layer circuit board structure
In wherein one layer, certain ground plane 11 can also be the superiors of Multi-layer circuit board structure, and the ground plane 11 of this superiors
On the top surface that circuit substrate 10 can be set directly at, but the present invention is not limited with this example.
For further, the ground plane 11 of base board unit 1 is coated completely by circuit substrate 10, and base board unit 1
Outer conducting structure 12 be arranged on the one outer in surrounding 100 of circuit substrate 10.In addition, outer conducting structure 12 includes multiple set
Put circuit substrate 10 it is outer it is circular around outer conducting layer 120 on 100, outer conducting structure 12 includes multiple being arranged on circuit base
In the outer circular surrounding 100 of plate 10 and through the chadless 121 of circuit substrate 10, and multiple outer conducting layers 120 set respectively
On the inner surface of multiple chadlesses 121.In addition, base board unit 1 is arranged on the inside of circuit substrate 10 including one and is electrically connected with
Interior conductive structure 13 between ground plane 11 and outer conducting structure 12, interior conductive structure 13 include it is multiple correspond respectively to it is multiple
The inner conducting layer 130 of outer conducting layer 120（The inner conducting layer 130 of such as strip）, and two phases of each inner conducting layer 130
Anti- end directly contacts ground plane 11 and corresponding outer conducting layer 120 respectively.
Then, step S102 is：Coordinate shown in Fig. 1, Fig. 3 and Fig. 4, multiple electronic units 2 are separately positioned on multiple bases
On multiple circuit substrates 10 of Slab element 1, each of which electronic unit 2 is arranged on corresponding circuit substrate 10 including multiple
Electronic component 20 that is upper and being electrically connected at corresponding circuit substrate 10, and multiple electronics member of each electronic unit 2
Part 20 is by corresponding circuit substrate 10, to be electrically connected at corresponding ground plane 11.For example, as multilayer circuit
The inside of circuit substrate 10 of hardened structure has at least one conductive structure being electrically connected between electronic component 20 and ground plane 11
Design, to cause multiple electronic components 20 of each electronic unit 2 to be electrically connected with by corresponding circuit substrate 10
In corresponding ground plane 11.
Then, step S104 is：Coordinate shown in Fig. 1, Fig. 4 and Fig. 5, form an initial encapsulation unit 3 ' in initial substrate 1 '
On, to cover multiple electronic units 2, wherein initial encapsulation unit 3 ' includes multiple packing colloids 30 being connected with each other, and often
One packing colloid 30 is arranged on corresponding circuit substrate 10 and covers multiple corresponding electronic components 20.Citing comes
Say, packing colloid 30 can be silicones（silicone）Or epoxy resin（epoxy）Made nontransparent colloid.
Next, step S106 is：Coordinate shown in Fig. 1, Fig. 5 and Fig. 6, just primordium is cut along Fig. 5 X-X lines of cut
Plate 1 ' and initial encapsulation unit 3 ', to separate multiple base board units 1 and separate multiple packing colloids 30, each of which substrate list
The corresponding circuit substrate 10 of the slave phase of outer conducting layer 120 and corresponding packing colloid 30 of member 1 are exposed.It is many for further
Individual chadless 121 is packaged colloid 30 and filled up, and is covered so as to obtain multiple outer conducting layers 120 and be packaged colloid 30.In addition, every
Respectively there is a cutting side wall 1200 in two opposite ends of one outer conducting layer 120, and each outer conducting layer 120 is every
One cutting side wall 1200 is exposed from circuit substrate 10 and packing colloid 30.
Finally, step S108 is：Coordinate shown in Fig. 1, Fig. 6, Fig. 7 and Fig. 8, form multiple metal screen layers 40 respectively many
On the outer surface of individual packing colloid 30, each of which metal screen layer 40 directly contacts the multiple of corresponding base board unit 1
Outer conducting structure 12, with cause each base board unit 1 ground plane 11 can sequentially by corresponding interior conductive structure 13 and
Corresponding outer conducting structure 12, to be electrically connected at corresponding metal screen layer 40.
In summary, coordinate shown in Fig. 7 and Fig. 8, according to above-mentioned provided preparation method, first embodiment of the invention can
To provide a kind of module integrated circuit packaging structure Z with electrical function of shielding, it includes：One base board unit 1, an electronics list
First 2, one encapsulation unit 3 and a screen unit 4.
First, base board unit 1 includes one, and there is an outer circuit substrate 10, one around surrounding 100 to be arranged on circuit substrate
Inside 10 and it is arranged on by the ground plane 11, one that circuit substrate 10 is coated completely in the outer circular surrounding 100 of circuit substrate 10
Outer conducting structure 12 and one is arranged on the inside of circuit substrate 10 and is electrically connected between ground plane 11 and outer conducting structure 12
Interior conductive structure 13.Wherein, outer conducting structure 12 include it is multiple be arranged in the outer circular surrounding 100 of circuit substrate 10 outer lead
Electric layer 120, interior conductive structure 13 includes multiple inner conducting layers 130 for corresponding respectively to multiple outer conducting layers 120, and each
Two opposite ends of inner conducting layer 130 directly contact ground plane 11 and corresponding outer conducting layer 120 respectively.
Furthermore, electronic unit 2 includes multiple electronics for being arranged on circuit substrate 10 and being electrically connected at circuit substrate 10
Element 20, plurality of electronic component 20 can be electrically connected at ground plane 11 by circuit substrate 10.For example, Duo Ge electricity
Subcomponent 20 can be resistance, electric capacity, inductance or semiconductor chip with a predetermined function etc., but the present invention is not with this
It is limited.
In addition, encapsulation unit 3 includes a packing colloid for being arranged on circuit substrate 10 and covering multiple electronic components 20
30, and screen unit 4 includes a metal for being coated on the outer surface of packing colloid 30 and directly contacting outer conducting structure 12
Screen layer 40, wherein packing colloid 30 are coated by metal screen layer 40 completely.Thereby, ground plane 11 can sequentially pass through interior conduction
Structure 13 and outer conducting structure 12, to be electrically connected at metal screen layer 40.For example, according to different design requirements, gold
Category screen layer 40 can pass through spraying method for one（spraying）The conductive sprayed coating that is formed, one are by sputtering way
（sputtering）The conductive sputtered layer that is formed, one are by mode of printing（printing）The conductive printing layer that is formed or
One passes through plating mode（electroplating）Conductive electroplated layer formed etc., but the present invention is not limited.
For further, outer conducting structure 12 include it is multiple be arranged in the outer circular surrounding 100 of circuit substrate 10 and
Through the chadless 121 of circuit substrate 10, multiple outer conducting layers 120 are separately positioned on the inner surface of multiple chadlesses 121, and
And multiple chadlesses 121 are packaged colloid 30 and filled up, covered so as to obtain multiple outer conducting layers 120 and be packaged colloid 30.Separately
Outside, respectively there is a cutting side wall 1200, and each outer conducting layer in two opposite ends of each outer conducting layer 120
120 each cutting side wall 1200 is exposed from circuit substrate 10 and packing colloid 30, with direct contacting metal screen layer 40.
(second embodiment)
Refer to shown in Fig. 9, it is integrated that second embodiment of the invention can provide a kind of module with electrical function of shielding
Circuit encapsulating structure Z, it includes：One base board unit 1, an electronic unit 2, an encapsulation unit 3 and a screen unit 4.By Fig. 9 and
Fig. 7 comparison understands that the second embodiment of the invention difference maximum with first embodiment is：In a second embodiment, substrate
Unit 1 include one have ground plane 11 that an outer circuit substrate 10, one around surrounding 100 is arranged on inside circuit substrate 10,
And one be arranged on outer conducting structure 12 in the outer circular surrounding 100 of circuit substrate 10, wherein outer conducting structure 12 includes multiple
The outer conducting layer 120 in the outer circular surrounding 100 of circuit substrate 10 is arranged on, and the end of ground plane 11 is direct from circuit base
The outer circular surrounding 100 of plate 10 is exposed, directly to contact multiple outer conducting layers 120, so ground plane 11 can be directly by outer
Conductive structure 12, to be electrically connected at metal screen layer 40.
Therefore, in the first embodiment, as shown in fig. 7, ground plane 11 needs sequentially to lead by interior conductive structure 13 and outside
Electric structure 12, can just be electrically connected at metal screen layer 40；However, in a second embodiment, as shown in figure 9, ground plane 11
As long as passing through outer conducting structure 12 merely, you can be electrically connected at metal screen layer 40.
It the foregoing is only the preferred possible embodiments of the present invention, non-therefore the limitation present invention the scope of the claims, therefore such as
The equivalence techniques change done with description of the invention and schema content, is both contained in scope of the presently claimed invention.
Claims (8)
1. a kind of module integrated circuit packaging structure, it is characterised in that the module integrated circuit packaging structure includes：
One base board unit, the base board unit includes one, and there is an outer circuit substrate around surrounding, one to be arranged on the circuit
The inside of substrate and coated completely by the circuit substrate ground plane, one be arranged in the outer circular surrounding of the circuit substrate
Outer conducting structure and one be arranged on the inside of the circuit substrate and be electrically connected at the ground plane and outer conductive tied with described
Interior conductive structure between structure, wherein the outer conducting structure includes multiple be arranged in the outer circular surrounding of the circuit substrate
Outer conducting layer, the interior conductive structure includes multiple inner conducting layers for corresponding respectively to the outer conducting layer, and each institute
Two opposite ends for stating inner conducting layer directly contact the ground plane and the corresponding outer conducting layer respectively；
One electronic unit, the electronic unit is arranged on the circuit substrate and electrically connected with the circuit substrate including multiple
The electronic component connect, wherein the electronic component by the circuit substrate with the ground plane be electrically connected with；
One encapsulation unit, the encapsulation unit includes an encapsulation for being arranged on the circuit substrate and covering the electronic component
Colloid；And
One screen unit, the screen unit is coated on the outer surface of the packing colloid including one and tied with the outer conduction
The metal screen layer that structure is directly contacted, wherein the ground plane passes through the interior conductive structure and the outer conducting structure in order
To be electrically connected with the metal screen layer；
Wherein, the outer conducting structure includes multiple be arranged in the outer circular surrounding of the circuit substrate and through the circuit
The chadless of substrate, the outer conducting layer is separately positioned on the inner surface of the chadless, and the chadless is by the envelope
Dress colloid is filled up, to cause the outer conducting layer to be covered by the packing colloid.
2. module integrated circuit packaging structure according to claim 1, it is characterised in that each outer conducting layer
Respectively there is a cutting side wall in two opposite ends, and each outer conducting layer each cutting side wall from the circuit
Substrate and the packing colloid are exposed, directly to contact the metal screen layer.
3. a kind of module integrated circuit packaging structure, it is characterised in that the module integrated circuit packaging structure includes：
One base board unit, the base board unit includes one, and there is an outer circuit substrate around surrounding, one to be arranged on the circuit
The ground plane of the inside of substrate and one outer conducting structure in the outer circular surrounding of the circuit substrate is arranged on, wherein described
Outer conducting structure includes multiple outer conducting layers being arranged in the outer circular surrounding of the circuit substrate, and the ground plane is from institute
The outer circular surrounding for stating circuit substrate is exposed directly to contact the outer conducting layer；
One electronic unit, the electronic unit is arranged on the circuit substrate and electrically connected with the circuit substrate including multiple
The electronic component connect, wherein the electronic component by the circuit substrate with the ground plane be electrically connected with；
One encapsulation unit, the encapsulation unit includes an encapsulation for being arranged on the circuit substrate and covering the electronic component
Colloid；And
One screen unit, the screen unit is coated on the outer surface of the packing colloid including one and tied with the outer conduction
The metal screen layer that structure is directly contacted, wherein the ground plane directly by the outer conducting structure with the metal screen layer
It is electrically connected with；
Wherein, the outer conducting structure includes multiple be arranged in the outer circular surrounding of the circuit substrate and through the circuit
The chadless of substrate, the outer conducting layer is separately positioned on the inner surface of the chadless, and the chadless is by the envelope
Dress colloid is filled up, to cause the outer conducting layer to be covered by the packing colloid.
4. module integrated circuit packaging structure according to claim 3, it is characterised in that each outer conducting layer
Respectively there is a cutting side wall in two opposite ends, and each outer conducting layer each cutting side wall from the circuit
Substrate and the packing colloid are exposed, directly to contact the metal screen layer.
5. a kind of preparation method of module integrated circuit packaging structure, it is characterised in that the module integrated circuit packaging structure
Preparation method comprise the following steps：
An initial substrate is provided, the initial substrate is connected with each other and base board unit arranged in arrays including multiple, wherein often
One base board unit includes one, and there is an outer circuit substrate around surrounding, one to be arranged on the inside of the circuit substrate
Ground plane and one outer conducting structure in the outer circular surrounding of the circuit substrate is arranged on, wherein the outer conducting structure bag
Include multiple outer conducting layers being arranged in the outer circular surrounding of the circuit substrate；
Multiple electronic units are separately positioned on the circuit substrate of the base board unit, electronics list described in each of which
Member includes multiple electronics for being arranged on the corresponding circuit substrate and being electrically connected with the corresponding circuit substrate
Element, and each electronic unit the electronic component by the corresponding circuit substrate to be electrically connected at
The corresponding ground plane；
An initial encapsulation unit is formed in the initial substrate to cover the electronic unit, wherein the initial encapsulation unit
Including multiple packing colloids being connected with each other, and each described packing colloid be arranged on the corresponding circuit substrate and
Cover multiple corresponding electronic components；
The initial substrate and the initial encapsulation unit are cut, to separate the base board unit and separate the packing colloid,
The corresponding circuit substrate of the outer conducting layer slave phase of base board unit described in each of which and the corresponding encapsulation
Colloid is exposed；And
Multiple metal screen layers are formed on the outer surface of the packing colloid respectively, metal screen layer described in each of which is straight
The outer conducting structure of the corresponding base board unit of contact；
Wherein, the outer conducting structure includes multiple be arranged in the outer circular surrounding of the circuit substrate and through the circuit
The chadless of substrate, the outer conducting layer is separately positioned on the inner surface of the chadless, and the chadless is by the envelope
Dress colloid is filled up, to cause the outer conducting layer to be covered by the packing colloid.
6. the preparation method of module integrated circuit packaging structure according to claim 5, it is characterised in that the substrate list
The ground plane of member is coated completely by the circuit substrate, and the base board unit is arranged on the circuit substrate including one
Internal and be electrically connected at the interior conductive structure between the ground plane and the outer conducting structure, the interior conductive structure includes
Multiple inner conducting layers for corresponding respectively to the outer conducting layer, and two opposite ends difference of each inner conducting layer is straight
Contact the ground plane and the corresponding outer conducting layer.
7. the preparation method of module integrated circuit packaging structure according to claim 5, it is characterised in that the ground plane
It is exposed directly to contact the outer conducting layer from the outer circular surrounding of the circuit substrate.
8. the preparation method of module integrated circuit packaging structure according to claim 7, it is characterised in that each of which
Respectively there is a cutting side wall, and each cutting of each outer conducting layer in two opposite ends of the outer conducting layer
Side wall is exposed from the circuit substrate and the packing colloid, directly to contact the metal screen layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310479235.9A CN104576617B (en) | 2013-10-14 | 2013-10-14 | Module integrated circuit packaging structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310479235.9A CN104576617B (en) | 2013-10-14 | 2013-10-14 | Module integrated circuit packaging structure and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104576617A CN104576617A (en) | 2015-04-29 |
| CN104576617B true CN104576617B (en) | 2017-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310479235.9A Active CN104576617B (en) | 2013-10-14 | 2013-10-14 | Module integrated circuit packaging structure and preparation method thereof |
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| CN109585393A (en) * | 2018-12-19 | 2019-04-05 | 中国电子科技集团公司第四十三研究所 | A kind of microelectronic component integrative packaging structure and packaging method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2451259A4 (en) * | 2009-10-01 | 2013-07-03 | Panasonic Corp | Module and process for production thereof |
| JP5365647B2 (en) * | 2011-02-09 | 2013-12-11 | 株式会社村田製作所 | High frequency module manufacturing method and high frequency module |
| US8766654B2 (en) * | 2012-03-27 | 2014-07-01 | Universal Scientific Industrial Co., Ltd. | Package structure with conformal shielding and inspection method using the same |
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