CN203242621U

CN203242621U - Led luminescent device

Info

Publication number: CN203242621U
Application number: CN2012207129768U
Authority: CN
Inventors: 朱晓飚; 郑群亮
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-12-20
Filing date: 2012-12-20
Publication date: 2013-10-16
Anticipated expiration: 2022-12-20

Abstract

The utility model relates to the LED luminescence technical field and specifically provides an LED luminescent device. The LED luminescent device comprises an LED luminescent mechanism having LED wafers and capable of emitting light in an omnibearing way; a packaging structural member having a transparent body and wrapped on the periphery of the LED luminescent mechanism; and a pair of electrodes electrically connected with the LED luminescent mechanism and extending to the outer side of the packaging structural member. The LED luminescent device can increase the light extraction efficiency and further reduce generated heat. Therefore, the LED luminescent device has the characteristics of high light extraction efficiency, high reliability and long service lifetime, etc.

Description

The LED light-emitting device

Technical field

The utility model relates to the LED luminescence technology, is specifically related to a kind of LED light-emitting device.

Background technology

LED (Light Emitting Diode, light-emitting diode) has been applied to a lot of fields because it has energy-saving and environmental protection, lightweight, the plurality of advantages such as the life-span is long, volume is little, stable performance.Especially at lighting field, LED is more and more widely used especially, and is regarded as one of principal light source of following illumination.

The encapsulation of existing LED light-emitting device, normally penetrate PPA (Polyphthalamide at metallic support or metal substrate, polyphthalamide) or engineering plastics, form an optics bowl cup, in optics bowl cup, fix one or more LED wafers, and make a plurality of LED wafer series/parallels by plain conductor in optics bowl cup inside, then in optics bowl cup, fill the colloid that is mixed with fluorescent material.Adopt the LED light-emitting device of this packing forms, light tight so that the light that the LED wafer sends can not see through support or substrate outwards be exported because of metallic support or metal substrate itself, this causes the light extraction efficiency of this LED light-emitting device lower; And the light of output can not produce a large amount of heat and LED wafer without independent passage of heat in optics bowl cup, and this is so that the heat that the LED wafer produces is too concentrated, and then causes the reliability of LED to be linear rule decline.In fact, the light output variable of existing LED light-emitting device only accounts for its energy-producing 20%-30%, and the energy of remaining 70%-80% all is used for producing heat and fails to be utilized.Therefore, how to improve the LED light-emitting device light extraction efficiency, strengthen its application function and prolong its useful life and just become people's problem demanding prompt solution.

The utility model content

For addressing the above problem, the utility model provides a kind of LED light-emitting device, and it not only can improve the light extraction efficiency of LED light-emitting device, and can reduce the generation of heat, thereby has the characteristics such as light extraction efficiency height, reliability height and long service life.

For this reason, the utility model provides a kind of LED light-emitting device, and it comprises: the LED lighting means, and it comprises the LED wafer and energy is omnibearing luminous; Encapsulating structure spare, it is the transparent body and the periphery that is coated on described LED lighting means; And pair of electrodes, itself and described LED lighting means are electrically connected and extend to the outside of described encapsulating structure spare.

Wherein, described LED lighting means comprises a plurality of LED wafers of electric connection, and in described a plurality of LED wafers, the LED wafer that is in the upstream of current delivery/downstream respectively with the corresponding connection of positive electrode/negative electrode in the described pair of electrodes.

Wherein, described LED lighting means also comprises carrier, and described carrier is the transparent body, and described LED wafer is arranged on the loading end of described carrier.

Wherein, between the faying face of the loading end of described carrier and described LED wafer, be formed with the first transparent adhesive layer, in order to described LED wafer is fixed on the loading end of described carrier; And/or be formed with the second transparent adhesive layer non-binding of described LED wafer.

Wherein, the even thickness of described the first adhesive layer and/or described the second adhesive layer.

Wherein, also include fluorescent material in described the first adhesive layer and/or in described the second adhesive layer.

Wherein, described encapsulating structure spare envelope described carrier loading end the wafer calmodulin binding domain CaM and on the described LED wafer fixed.

Wherein, in the cross section perpendicular to the length direction of described carrier, the coating angles of described encapsulating structure spare take central angle as 360 degree coat described carrier and described LED wafer on circumferential direction fully.

Wherein, in the cross section perpendicular to the length direction of described carrier, the setting position of described LED lighting means departs from the center of described encapsulating structure spare.

Wherein, described pair of electrodes is the electrode slice of pair of metal, and be provided with the electrode slice assembly section at the two ends of described carrier, be provided with position limiting structure in each described electrode slice assembly section, described electrode slice is positioned in the described electrode slice assembly section by means of described position limiting structure.

Wherein, be provided with the close-fitting groove on the fitting surface of described electrode slice and/or in the electrode slice assembly section of described carrier, described close-fitting groove is V-shaped, " Y " shape, "-" shape, "+" shape, " * " shape, " well " shape, " mouth " shape or " worker " shape; And/or be provided with the mark that is used to indicate electrode slice polarity in the zone that extends in described encapsulating structure spare outside on described electrode slice.

Wherein, the surface of described carrier is formed with the alligatoring reflector that is concaveconvex structure through roughening treatment, is translucent body from the appearance with the carrier in described alligatoring reflector.

Wherein, the material of described carrier comprises a kind of in glass, pottery and the plastics.

Wherein, described encapsulating structure spare and/or described carrier also include fluorescent material.

Wherein, described a plurality of LED wafers all are the blue light wafer, perhaps all are the arbitrary visible light wafer beyond the blue light, perhaps are the combination of blue light wafer and other visible light wafer.

With respect to prior art, the utlity model has following beneficial effect:

In the LED light-emitting device that the utility model provides, the LED lighting means can be omnibearing luminous, and the encapsulating structure spare that is coated on the periphery of this LED lighting means is the transparent body, therefore this LED light-emitting device can realize that multidimensional is luminous, this not only can improve the light extraction efficiency of LED light-emitting device, and can reduce and produce a large amount of bad phenomenon such as heat because the light output variable is few described in the background technology, thereby improve this LED light-emitting device reliability, prolong its useful life.

In a preferred embodiment of the LED light-emitting device that the utility model provides, the carrier that is used for carrying LED wafer is the transparent body, and the surface at this transparent body is formed with the alligatoring reflector that is concaveconvex structure through roughening treatment, this not only can strengthen reflection of light and further improve light extraction efficiency, but also can be filled to the adhesion that strengthens LED wafer and carrier in the concaveconvex structure by making binding agent.

Description of drawings

The front view of the LED light-emitting device that Figure 1A provides for the utility model the first embodiment;

Figure 1B is the profile of the carrier in the LED light-emitting device shown in Figure 1A;

The end view of the LED light-emitting device that Fig. 1 C provides for the utility model the first embodiment;

The vertical view of the LED light-emitting device that Fig. 2 provides for the utility model the first embodiment;

Electrode slice in the LED light-emitting device that the utility model the first embodiment is shown provides and the end view of the annexation between the carrier are provided Fig. 3 A;

Fig. 3 B is the partial enlarged drawing of Fig. 3 A;

Electrode slice in the LED light-emitting device that the utility model the first embodiment is shown provides and the vertical view of the annexation between the carrier are provided Fig. 4 A;

Fig. 4 B is the partial enlarged drawing of electrode slice among Fig. 4 A;

The index path of the LED light-emitting device that Fig. 4 C provides for the utility model the first embodiment;

The front view of the another kind of encapsulating structure spare in the LED light-emitting device that Fig. 4 D provides for the utility model the first embodiment;

The front view of another the encapsulating structure spare in the LED light-emitting device that Fig. 4 E provides for the utility model the first embodiment;

The front view of the LED light-emitting device that Fig. 5 A provides for the utility model the second embodiment;

The index path of the LED light-emitting device that Fig. 5 B provides for the utility model the second embodiment;

The end view of the LED light-emitting device that Fig. 6 A provides for the utility model the 3rd embodiment;

The front view of the LED light-emitting device that Fig. 6 B provides for the utility model the 3rd embodiment;

Fig. 6 C is the front view of sealing the position of encapsulating structure spare;

The front view of the LED light-emitting device that Fig. 7 A provides for the utility model the 4th embodiment;

The index path of the LED light-emitting device that Fig. 7 B provides for the utility model the 4th embodiment; And

The vertical view of the LED light-emitting device that Fig. 8 provides for the utility model the 5th embodiment.

Embodiment

For making those skilled in the art understand better the technical solution of the utility model, further describe for implementing optimal way of the present utility model below in conjunction with accompanying drawing.But embodiment shown below is to specialize for the LED light-emitting device that the utility model is provided and the technical thought of manufacture method thereof, is not for utility model thinking of the present utility model is limited.And, each member size shown in the drawings and position relationship etc., just only be that explanation is more clear and definite amplifies exaggeration to some extent in order to make, and be not for limiting actual member size and proportionate relationship.

The utility model provides a kind of LED light-emitting device, and it comprises following assembly: comprise LED wafer and LED lighting means that can be omnibearing luminous, be coated on the transparent encapsulating structure spare of this LED lighting means periphery and be electrically connected and extend to the pair of electrodes of encapsulating structure spare outside with this LED lighting means.And the quantity of the LED wafer in the LED lighting means can be for one or more.

Wherein, the LED lighting means can comprise a plurality of LED wafers of electric connection, and in described a plurality of LED wafers, be in the LED wafer of the upstream of current delivery and link to each other with positive electrode in the above-mentioned pair of electrodes, be in the LED wafer in the downstream of current delivery and link to each other with negative electrode in the above-mentioned pair of electrodes.The LED wafer that what is called is in the upstream of current delivery refers to that LED wafer that electric current is at first flowed through in these LED wafers; The LED wafer that what is called is in the downstream of current delivery refers to that LED wafer that electric current is flowed through at last in these LED wafers.In fact, be in LED wafer and the LED wafer setting position physically and inconsistent in the upstream of current delivery/downstream, that is, in these LED wafers, the LED wafer that geographically is in two ends may not be the upstream/downstream on the current delivery.Only have when described a plurality of LED wafers are electrically connected by wire successively according to its setting position, the LED wafer that is in the LED wafer of the upstream of current delivery and is in the downstream of current delivery just is those two wafers that are in the end in described a plurality of LED wafers.And above-mentioned electrode can be wire, stick electrode, shape electrode (referred to as electrode slice) in the form of sheets etc., just can adopt as long as can realize LED wafer in the LED lighting means and the conductor of the electric connection between the power supply, and needn't limit its shape.

In actual applications, the LED lighting means also comprises transparent carrier, and described one or described a plurality of LED wafer that the LED lighting means comprises are arranged on the loading end of this carrier.So-called loading end refers to the surface that is used for arranging the LED wafer on this carrier.Preferably, the surface of carrier is formed with the alligatoring reflector that is concaveconvex structure through roughening treatment, is translucent from the appearance with the carrier in the alligatoring reflector of concaveconvex structure.

In the LED light-emitting device that the utility model provides, because the LED lighting means can be omnibearing luminous, and the encapsulating structure spare that is coated on the periphery of this LED lighting means is the transparent body, therefore this LED light-emitting device can realize that multidimensional is luminous, light extraction efficiency (in fact, the light extraction efficiency of the LED light-emitting device that provides of the utility model exceeds 30%-50% than the light extraction efficiency of existing LED light-emitting device) of LED light-emitting device not only can be provided for this; And can reduce and produce a large amount of bad phenomenon such as heat because the light output variable is few described in the background technology, thereby improve this LED light-emitting device reliability, prolong its useful life.

It is pointed out that among the application so-called omnibearing luminous referring to, this LED lighting means itself is made the as a whole light that can be sent by its LED wafer that comprises to all directions output.That is to say, when the LED lighting means does not comprise carrier, the so-called omnibearing luminous light that is directly sent to all directions by the LED wafer that refers to; When the LED lighting means comprises carrier, so-called omnibearing luminous refer to the light that is directly sent to all directions by the LED wafer and sent by the LED wafer and see through carrier and the light exported.Among the application, when explanation is omnibearing luminous, can ignore set wire stopping luminous light path in the LED lighting means.

The first embodiment

See also Figure 1A to Fig. 4 E, wherein show the structure of the LED light-emitting device that the utility model the first embodiment provides.LED light-emitting device 10 in the present embodiment comprises: carrier 11, a plurality of LED wafer 12, pair of electrodes sheet (20a, 20b), plain conductor 18 and encapsulating structure spare 13.And the LED lighting means in the present embodiment comprises carrier 11, a plurality of LED wafer 12 and is connected to plain conductor 18 between a plurality of LED wafers 12.

In the present embodiment, carrier 11 is the transparent base that is formed by glass, pottery, plastic or other material.The surface of carrier 11 forms the alligatoring reflector 28 with concaveconvex structure through roughening treatment, and this makes carrier 11 body that is translucent from the appearance, as shown in Figure 1B.And in (that is, the cross section that obtains perpendicular to the paper direction), the shape of the bossing in the concaveconvex structure can be semicircle, ellipse, zigzag, triangle etc. in the longitudinal section in alligatoring reflector 28.The light that LED wafer 12 sends can be reflected by the alligatoring reflector 28 with concaveconvex structure, and carry out the light beam mutual coupling, so that the light of these LED light-emitting device 10 outputs is evenly soft.In actual applications, can be according to the ray structure of different LED wafer 12, in various degree alligatoring is carried out on each surface of carrier 11, make it have different concaveconvex structure shapes, the recessed degree of depth and height of projection etc.

In the present embodiment, a plurality of LED wafers 12 are realized being electrically connected by plain conductor 18, for example, and series, parallel or series-parallel connection, and between the faying face of the loading end of carrier 11 and LED wafer 12, be formed with the first transparent adhesive layer 15.Particularly, in the zone that fits with a plurality of LED wafers 12 on the loading end in alligatoring reflector 28, and/or apply the first binding agent in the zone that fits with alligatoring reflector 28 on a plurality of LED wafers 12, and a plurality of LED wafers 12 are fitted with alligatoring reflector 28 and realize fixing of LED wafer 12.Be appreciated that, because the surface of carrier 11 is formed with the alligatoring reflector 28 with concaveconvex structure, therefore the first adhesive layer 15 can be filled in the recess in alligatoring reflector 28, thereby can strengthen the snap-in force between the first adhesive layer 15 and the carrier 11, and then the adhesion between increase LED wafer 12 and the carrier 11, strengthen the reliability of these LED light-emitting device 10 integral body with this.In addition, apply the second adhesive layer 16 in the non-fit area on the loading end in alligatoring reflector 28 and in the non-fit area on LED wafer 12 surfaces.Wherein, the two mixes the first adhesive layer 15 and the second adhesive layer 16 by transparent adhesive tape and fluorescent material, and the material of the two selected transparent adhesive tape and mixing ratio etc. can be identical or different.

In actual applications, when LED light-emitting device 10 is the light-emitting device of ordinary monochromatic light, a plurality of LED wafers 12 all are corresponding common monochromatic LED wafer 12, and for example, a plurality of LED wafers 12 all are the blue light wafer or all are blue light arbitrary visible light wafer in addition.When LED light-emitting device 10 is the light-emitting device of high light efficiency, high color rendering index (CRI), a plurality of LED wafers 12 comprise the LED wafer 12a of blue light and the LED wafer 12b of redness (or yellow) light, and between red (or yellow) LED wafer 12b of light and the LED wafer 12a of blue light apart from one another by and equably distribution, for example shown in Figure 2, the LED wafer 12a of two blue lights that every interval the is continuous and LED wafer 12b of a redness (or yellow) light is set is to realize sufficient mixed light.Refer to regular distribution this so-called evenly distribution, for example, two blue led wafers in an interval and redness (or yellow) light LED wafer is set; And so-called regular distribution is not limited to above-mentioned distribution and interval mode, but can adjust and set according to actual conditions.

In the present embodiment, pair of electrodes sheet (20a, 20b) as LED light-emitting device 10 just/negative electrode, be separately positioned on carrier 11 two ends and with the two ends that are arranged on carrier 11 on LED wafer 12 at a distance of 0.5mm at least, and realize being electrically connected by plain conductor 18 and LED wafer 12.For ease of the polarity at identification LED light-emitting device 10 two ends, be provided with the positive pole sign (21) that is labeled as "+" and the negative pole sign (22) that is labeled as "-" at front and/or the back side of pair of electrodes sheet (20a, 20b), as shown in Figure 2.And, in the assembly area of pair of electrodes sheet (20a, 20b), form the groove shape close-fitting structure 30 of " X " shape, shown in Fig. 4 A and 4B, in order in assembling process, make partial fixing thing (26a, 26b) be filled in the groove of close-fitting structure 30 and in the recess in alligatoring reflector 28, to strengthen the bond strength of pair of electrodes sheet (20a, 20b) and carrier 11.Wherein, fixture (26a, 26b) can adopt the materials such as elargol high temperature resistant and high-viscosity glue, tin cream or high heat conduction high adhesion, and the thickness of the fixture (26a, 26b) between carrier 11 and the electrode slice (20a, 20b) is at least more than 0.5mm.As for the shape of close-fitting structure 30, can certainly be designed to the shapes such as " V ", " Y ", "-", "+", " * ", " well ", " mouth ", " worker " font, do not do concrete restriction at this.

In addition, for more accurate, more quickly electrode slice (20a, 20b) is positioned and assembles, the electrode slice assembly area on carrier 11 is provided with for spacing position limiting structure, for example the terraced steps 27 shown in Fig. 3 A and Fig. 3 B.Certainly, also can adopt the position limiting structure of other shape or form, not do concrete restriction at this.

In the present embodiment, encapsulating structure spare 13 is arranged on the loading end side in the alligatoring reflector 28 of carrier 11, is used for the assembly area on carrier 11, LED wafer 12 and the electrode slice (20a, 20b) is enveloped.Encapsulating structure spare 13 is the transparent body, and its material can be in the materials such as silica gel, silicones, epoxy resin and modified resin one or more, and it is can be for semicircle, oval, square etc., shown in Figure 1A perpendicular to the cross sectional shape on electrode slice (20a, the 20b) bearing of trend.

In the present embodiment, shown in Fig. 4 C, owing in the zone that a plurality of LED wafers 12 and alligatoring reflector 28 fit, be coated with the first adhesive layer 15 that comprises transparent adhesive tape and fluorescent material, and be coated with the second adhesive layer 16 that comprises transparent adhesive tape and fluorescent material in the non-fit area on the loading end in alligatoring reflector 28 and in the non-fit area on LED wafer 12 surfaces, therefore, a part of light 100a that LED wafer 12 sends can see through the first transparent adhesive layer 15 and carrier 11 and output to the outside of this LED light-emitting device 10, and another part light 100b that LED wafer 12 sends can see through the second transparent adhesive layer 16 and encapsulating structure spare 13 and output to the outside of this LED light-emitting device 10, thereby realizes that multidimensional is luminous; And when LED wafer 12 is the blue-ray LED wafer, adopt above-mentioned encapsulating structure, can make the mixed layer that is coated with equably transparent adhesive tape and fluorescent material on every side of each blue-ray LED wafer 12, and its a part of light 100a that sends is by exciting the fluorescent material in the first adhesive layer 15 also to see through the first adhesive layer 15 and carrier 11 and outwards export white light, another part light 100b that it sends is by exciting the fluorescent material in the second adhesive layer 16 and see through the second adhesive layer 16 and encapsulating structure spare 13 and outwards export white light, thereby can outwards export uniform white light.

Need to prove, in the present embodiment, the external diameter of the external diameter on the surface that the loading end with carrier 11 of encapsulating structure spare 13 is relative and the loading end of carrier 11 equates, namely, on the loading end of carrier 11, the projected outline of encapsulating structure spare 13 overlaps fully with the profile of the loading end of carrier 11, but the utility model is not limited to this, in actual applications, shown in Fig. 4 D and 4E, also can make the external diameter L on the relative surface of the loading end with carrier 11 of encapsulating structure spare 13 greater than the outer diameter D of the loading end of carrier 11, can also make the external diameter L ' on the relative surface of the loading end with carrier 11 of encapsulating structure spare 13 less than the outer diameter D of the loading end of carrier 11, if encapsulating structure spare 13 can envelope carrier 11 loading end the wafer calmodulin binding domain CaM and on the LED wafer 12 fixed.

The second embodiment

See also Fig. 5 A and Fig. 5 B, the structure of the LED light-emitting device that the second embodiment of the utility model shown in it provides.Be similar to aforementioned the first embodiment, the LED light-emitting device 10 that the second embodiment provides comprises carrier 11, a plurality of LED wafer 12, pair of electrodes sheet (20a, 20b), plain conductor 18 and the encapsulating structure spare 13 that is used for coated carrier 11, a plurality of LED wafer 12, pair of electrodes sheet (20a, 20b) and plain conductor 18.And the LED lighting means in the present embodiment comprises carrier 11, a plurality of LED wafer 12 and is connected to plain conductor 18 between a plurality of LED wafers 12.

Wherein, the generation type in alligatoring reflector 28 on the material of carrier 11 and surface thereof and face shaping, a plurality of LED wafer 12 each other and the electric connection mode between LED wafer 12 and the electrode slice (20a, 20b), the cross sectional shape of encapsulating structure spare 13 etc. all be similar to aforementioned the first embodiment, do not repeat them here.

The below describes the part that the second embodiment is different from the first embodiment in detail.

In a second embodiment, encapsulating structure spare 13 is the transparent body, and its material is the mixture of transparent adhesive tape and fluorescent material, is similar to the second adhesive layer among aforementioned the first embodiment.And, coating the first adhesive layer 15 in the zone that fits with alligatoring reflector 28 in the zone that fits with a plurality of LED wafers 12 on the loading end in alligatoring reflector 28 and/or on a plurality of LED wafers 12 only, and not in the non-fit area on the loading end in alligatoring reflector 28 and/or in the non-fit area on LED wafer 12 surfaces, apply again the second adhesive layer 16.

In the present embodiment, shown in Fig. 5 B, owing in the zone that a plurality of LED wafers 12 and alligatoring reflector 28 fit, be coated with the first adhesive layer 15 that comprises transparent adhesive tape and fluorescent material, and encapsulating structure spare 13 is formed by transparent adhesive tape and phosphor mixture material, therefore, a part of light 100a that LED wafer 12 sends can see through the first transparent adhesive layer 15 and carrier 11 and output to the outside of this LED light-emitting device 10, and another part light 100b that LED wafer 12 sends can output to through transparent encapsulating structure spare 13 outside of this LED light-emitting device 10, thereby realizes that multidimensional is luminous; And when LED wafer 12 is the blue-ray LED wafer, its a part of light 100a that sends is by exciting the fluorescent material in the first adhesive layer 15 also to see through the first adhesive layer 15 and carrier 11 and outwards export white light, another part light 100b that it sends outwards exports white light by the fluorescent material in the excite encapsulated structural member 13 and through encapsulating structure spare 13, thereby can outwards export uniform white light.

The 3rd embodiment

See also Fig. 6 A to 6C, the structure of the LED light-emitting device that the 3rd embodiment of the utility model shown in it provides.Be similar to aforementioned the first embodiment, the LED light-emitting device 10 that the 3rd embodiment provides comprises carrier 11, a plurality of LED wafer 12, pair of electrodes sheet (20a, 20b), plain conductor 18 and the encapsulating structure spare 13 that is used for coated carrier 11, a plurality of LED wafer 12, pair of electrodes sheet (20a, 20b) and plain conductor 18.And the LED lighting means in the present embodiment comprises carrier 11, a plurality of LED wafer 12 and is connected to plain conductor 18 between a plurality of LED wafers 12.

In the present embodiment, between the generation type in alligatoring reflector 28 on the material of carrier 11 and surface thereof and face shaping, a plurality of LED wafer 12 and the electric connection mode between LED wafer 12 and the electrode slice etc. all be similar to aforementioned the first embodiment, do not repeat them here.

The below describes the part that the 3rd embodiment is different from the first embodiment in detail.

In the 3rd embodiment, coating only comprises the first adhesive layer 15 of transparent adhesive tape in the zone that fits with alligatoring reflector 28 in the zone that fits with a plurality of LED wafers 12 on the loading end in alligatoring reflector 28 and/or on a plurality of LED wafers 12, and not in the non-fit area on the loading end in alligatoring reflector 28 and/or in the non-fit area on LED wafer 12 surfaces again coating comprise the second adhesive layer 16 of transparent adhesive tape and fluorescent material.The material of encapsulating structure spare 13 is transparent adhesive tape and phosphor mixture, is similar to the second binding agent among aforementioned the first embodiment; And, encapsulating structure spare 13 is along the circle that is shaped as in the cross section that obtains perpendicular to electrode slice (20a, 20b) bearing of trend, namely, in the plane perpendicular to electrode slice (20a, 20b) bearing of trend, encapsulating structure spare 13 with the coverage of 360 ° of central angles (namely, take the coating angles of central angle as 360 degree) the device district of carrier 11, LED wafer 12, plain conductor 18 and electrode slice (20a, 20b) is coated on circumferential direction fully, shown in Fig. 6 B and 6C.

In the present embodiment, shown in Fig. 6 B, because encapsulating structure spare 13 is perpendicular to electrode slice (20a, 20b) in the plane of bearing of trend with the coverage of 360 ° of central angles with carrier 11, LED wafer 12, plain conductor 18 and electrode slice (20a, device district 20b) coats fully, and encapsulating structure spare 13 is formed by transparent adhesive tape and phosphor mixture material, therefore, a part of light 100a that LED wafer 12 sends can see through the first transparent adhesive layer 15, carrier 11 and encapsulating structure spare 13 and output to the outside of this LED light-emitting device 10, and another part light 100b that LED wafer 12 sends can output to through transparent encapsulating structure spare 13 outside of this LED light-emitting device 10, thereby realizes that multidimensional is luminous; And when LED wafer 12 is the blue-ray LED wafer, its a part of light 100a that sends is by exciting the fluorescent material in the first adhesive layer 15 and the encapsulating structure spare 13 also to see through the first adhesive layer 15, carrier 11 and encapsulating structure spare 13 and outwards export white light, another part light 100b that it sends outwards exports white light by the fluorescent material in the excite encapsulated structural member 13 and through encapsulating structure spare 13, thereby can outwards export uniform white light.

Further, for the light (100a, 100b) that prevents from sending because of LED wafer 12 different light-emitting areas strong and weak different excite the color of the light that the fluorescent material in the circular encapsulating structure spare 13 send inconsistent, seal the position (namely to encapsulating structure spare 13 in the present embodiment, the setting position of the setting position of LED lighting means or LED wafer 12) does following restriction: make the LED lighting means be in 1/2 eccentric position of encapsulating structure spare 13, namely, make the top light emitting face of LED wafer 12 be positioned at the center of encapsulating structure spare 13, shown in Fig. 6 C.Certainly, when the color of the light that will send was done change, sealing the position and can doing as required corresponding trickle adjustment of its encapsulating structure spare 13 do not done clear and definite restriction at this.

The 4th embodiment

See also Fig. 7 A and 7B, the structure of the LED light-emitting device that the 4th embodiment of the utility model shown in it provides.The LED light-emitting device that the 4th embodiment provides is similar to aforementioned the 3rd embodiment, the difference of the two only is that the shape of encapsulating structure spare 13 is different, and the encapsulating structure spare 13 among the 4th embodiment is square along being shaped as of the cross section that obtains perpendicular to electrode slice (20a, 20b) bearing of trend.

In fact, the cross sectional shape of encapsulating structure spare 13 can also be the shapes such as ellipse, rhombus, as long as this encapsulating structure spare 13 can be in perpendicular to the plane of electrode slice (20a, 20b) bearing of trend coated fully with the coverage of the 360 ° of central angles device district with carrier 11, LED wafer 12, plain conductor 18 and electrode slice (20a, 20b).

The 5th embodiment

See also Fig. 8, the structure of the LED light-emitting device that the 5th embodiment of the utility model shown in it provides.The difference of the 5th embodiment and aforementioned each embodiment is: in the present embodiment, the width of carrier 11 is wider, at the many rows of carrier 11 devices LED wafer 12, the device mode of each row LED wafer 12 is similar to aforementioned each embodiment, and respectively arrange LED wafer 12 and carry out the electric connection of series/parallel by the plain conductor 18 that is electrically connected, at last be connected to electrode slice (20a, 20b) by the LED wafer 12 that is arranged on carrier 11 two ends via plain conductor 18, so that realize external electric connection.

In actual applications, length and the width of the carrier 11 in the LED light-emitting device 10 is not construed as limiting, and also is not construed as limiting for the row of the LED wafer 12 of device on the carrier 11.

Be understandable that, in actual applications, can determine whether according to actual needs roughening treatment is carried out on the surface of carrier.And, can look concrete condition and carry out following selection: the non-binding zone on the loading end of carrier applies the first adhesive layer, whether apply the second adhesive layer in the non-binding district of LED wafer, whether make encapsulating structure spare fully encapsulation vehicle and LED wafer on circumferential direction, and whether make in the first adhesive layer, the second adhesive layer, encapsulating structure spare and/or the carrier and comprise fluorescent material.In addition, although the LED light-emitting device among aforementioned each embodiment includes carrier, but also can not comprise carrier in actual applications, but directly a plurality of or 1 LED wafer are placed in the encapsulating structure body, and when the quantity of LED wafer when being a plurality of, can by wire described a plurality of LED wafers be electrically connected in advance, described a plurality of LED wafers (being similar to common bangle) that then will connect are fixed in the encapsulating structure body, for example be fixed in first on a part of spherical crown plane in the encapsulating structure spare, reprocessing forms another part spherical crown of encapsulating structure spare.

Will also be appreciated that above execution mode only is the illustrative embodiments that adopts for principle of the present utility model is described, yet the utility model is not limited to this.For those skilled in the art, in the situation that does not break away from spirit of the present utility model and essence, can make various modification and improvement, these modification and improvement also are considered as protection range of the present utility model.

Claims

1. a LED light-emitting device is characterized in that, comprising:

The LED lighting means, it comprises the LED wafer and energy is omnibearing luminous;

Encapsulating structure spare, it is the transparent body and the periphery that is coated on described LED lighting means; And

Pair of electrodes, itself and described LED lighting means are electrically connected and extend to the outside of described encapsulating structure spare.

2. LED light-emitting device according to claim 1, it is characterized in that, described LED lighting means comprises a plurality of LED wafers of electric connection, and in described a plurality of LED wafers, the LED wafer that is in the upstream of current delivery/downstream respectively with the corresponding connection of positive electrode/negative electrode in the described pair of electrodes.

3. LED light-emitting device according to claim 1 and 2 is characterized in that, described LED lighting means also comprises carrier, and described carrier is the transparent body, and described LED wafer is arranged on the loading end of described carrier.

4. LED light-emitting device according to claim 3 is characterized in that, is formed with the first transparent adhesive layer between the faying face of the loading end of described carrier and described LED wafer, in order to described LED wafer is fixed on the loading end of described carrier; And/or

Non-binding at described LED wafer is formed with the second transparent adhesive layer.

5. LED light-emitting device according to claim 4 is characterized in that, the even thickness of described the first adhesive layer and/or described the second adhesive layer.

6. LED light-emitting device according to claim 4 is characterized in that, also includes fluorescent material in described the first adhesive layer and/or in described the second adhesive layer.

7. LED light-emitting device according to claim 3 is characterized in that, described encapsulating structure spare envelope described carrier loading end the wafer calmodulin binding domain CaM and on the described LED wafer fixed.

8. LED light-emitting device according to claim 7, it is characterized in that, in the cross section perpendicular to the length direction of described carrier, the coating angles of described encapsulating structure spare take central angle as 360 degree coat described carrier and described LED wafer on circumferential direction fully.

9. LED light-emitting device according to claim 8 is characterized in that, in the cross section perpendicular to the length direction of described carrier, the setting position of described LED lighting means departs from the center of described encapsulating structure spare.

10. LED light-emitting device according to claim 3, it is characterized in that, described pair of electrodes is the electrode slice of pair of metal, and be provided with the electrode slice assembly section at the two ends of described carrier, be provided with position limiting structure in each described electrode slice assembly section, described electrode slice is positioned in the described electrode slice assembly section by means of described position limiting structure.

11. LED light-emitting device according to claim 10, it is characterized in that, be provided with the close-fitting groove on the fitting surface of described electrode slice and/or in the electrode slice assembly section of described carrier, described close-fitting groove is V-shaped, " Y " shape, "-" shape, "+" shape, " * " shape, " well " shape, " mouth " shape or " worker " shape; And/or

Be provided with the mark that is used to indicate electrode slice polarity in the zone that extends in described encapsulating structure spare outside on described electrode slice.

12. each described LED light-emitting device in 11 is characterized in that the surface of described carrier is formed with the alligatoring reflector that is concaveconvex structure through roughening treatment according to claim 4, is translucent body from the appearance with the carrier in described alligatoring reflector.

13. LED light-emitting device according to claim 12 is characterized in that, the material of described carrier comprises a kind of in glass, pottery and the plastics.

14. LED light-emitting device according to claim 13 is characterized in that, described encapsulating structure spare and/or described carrier also include fluorescent material.

15. LED light-emitting device according to claim 2 is characterized in that, described a plurality of LED wafers all are the blue light wafer, perhaps all are the arbitrary visible light wafer beyond the blue light, perhaps are the combination of blue light wafer and other visible light wafer.