CN102956789B - The encapsulating structure of multilayer type array type light emitting diode light engine - Google Patents
The encapsulating structure of multilayer type array type light emitting diode light engine Download PDFInfo
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- CN102956789B CN102956789B CN201110235576.2A CN201110235576A CN102956789B CN 102956789 B CN102956789 B CN 102956789B CN 201110235576 A CN201110235576 A CN 201110235576A CN 102956789 B CN102956789 B CN 102956789B
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- emitting diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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Abstract
A kind of encapsulating structure of multilayer type array type light emitting diode light engine, the wherein irregular surface texture of each tool in the surrounding zone of substrate and the surface of lead frame, concavo-convex surface texture can increase the surrounding zone of substrate and the surface roughness of lead frame, therefore liquid encapsulating material can be filled in concave point and recess, the packaging body formed after encapsulating material solidification like this can closely be combined with substrate and lead frame and be integrally fixed, bonding agent can be coated with bottom another lens, use the seal degree increasing lens, and the present invention more utilizes the soldering paste of the excellent material of doping heat conduction efficiency, the heat energy that LED grain is produced is shed by row rapidly.
Description
Technical field
An encapsulating structure for LED light engines, especially a kind ofly blocks that aqueous vapor enters, the encapsulating structure of a kind of high strength airtight type multilayer array type light emitting diode of sturdy and durable and long term maintenance optical module usefulness completely.
Background technology
Utilize semiconductor inherent characteristic by the principle of luminosity of LED, the electric discharge of the incandescent lamp tube that it is different from the past, heating luminous principle, but just can emit beam when electric current forward being flowed into the PN junction of semiconductor, so LED is called as cold light source (coldlight).Due to LED there is high-durability, the life-span is long, light and handy, power consumption is low and not containing the advantage of the harmful substances such as mercury etc., therefore can be widely used in lighting apparatus industry, and it is applied in the commercial field such as electronic bill-board, traffic sign with LED array packaged type usually.
Please refer to the optical lens with fluorescence coating being applied to package structure for LED of the application case of new patent notification number M393044, only do the description of general utility functions at this.With reference to figure 1, be applied to the cutaway view with the optical lens of fluorescence coating of package structure for LED, it comprises substrate 1a, packaging body 2a, lead frame 3a, optical lens 4a and lens cap 5a, substrate 1a is positioned at the bottom part of encapsulating structure, the wherein face that all shape is smooth and smooth, each face of substrate 1a, the periphery branch of this substrate 1a is coated and fixed by this packaging body 1a, the internal face of packaging body 2a is also provided with optical reflecting cover 6a, packaging body 2a and be also coated and fixed lead frame 3a, lead frame 3a each face all shape be also smooth and smooth face.
Optical reflecting cover 6a is configured with optical lens 4a and lens cap 5a, wherein lens cap 5a covers optical lens 4a, lens cap 5a is fixed on the top of optical reflecting cover 6a by bonding mode, and make lens cap 5a be embedded among packaging body 2a, can closely be fixed on packaging body 2a and optical reflecting cover 6a to make lens cap 5a.
But the shortcoming of prior art is because each face of substrate is level and smooth surface, after packaging body is fixing by substrate package, the contact relation of a kind of plane to plane can be formed, because plane is to the contact of plane, make packaging body and the mutual frictional force of substrate little, cause producing unsteady situation of sliding, this kind of unsteady situation of slip also occurs on lead frame, and the material that packaging body typically uses liquid state is coated on around substrate or other component for package, when the material solid state of liquid state is to get up substrate package, but when each face of substrate is too level and smooth, be covered with in each of substrate by what be difficult to make the material evenness of liquid state, the settling mode of this kind of situation, nothing more than being increase material usage or going process to manually, suitable consume cost.
Another shortcoming of prior art also has lens cap to be difficult to be fixed on optical reflecting cover for a long time, because the material of lens cap is plastic material, and optical reflecting cover improves to make light reflection height, metal material can be selected or plate layer of metal film from the teeth outwards, but because plastics are not easily then fixed with metallic surface, cause the lens cap of plastic material can depart from optical reflecting cover in metal material at leisure.
When loosening situation occurs for substrate and packaging body, and lens cap is when closely cannot be fixed on optical mirror, moisture or aqueous vapor will be caused easily to infiltrate in encapsulating structure inner, luminescence component and optical unit deterioration is caused even to be damaged, therefore under cannot being used in moist environment, therefore must be improved this, and provide a kind of aqueous vapor that blocks completely to enter and the encapsulating structure of a kind of light-emitting diode of sturdy and durable and long term maintenance optical module usefulness.
Summary of the invention
Main purpose of the present invention is the encapsulating structure providing a kind of multilayer type array type light emitting diode light engine.
In order to achieve the above object, the encapsulating structure of a kind of multilayer type array type light emitting diode light engine of the present invention, includes:
One substrate, this substrate can divide into a center and a surrounding zone, the end face of this center is an exiting surface, this substrate also has an edge, this center is the middle block containing this substrate, this surrounding zone is the block between this center and this edge, and wherein this surrounding zone has an end face, a side and a bottom surface, is formed with two storage tanks at this end face;
One packaging body, this surrounding zone part of this this substrate of packaging body coats but this center not coated, the coated region of this packaging body includes this end face, this side and this bottom surface, and this packaging body has a package cavity, and this package cavity is positioned on this exiting surface;
Two lead frames, this two lead frame all has an inner end and an outer end, this inner end of this two lead frame lays respectively among this two storage tank, partly all be embedded among this packaging body by envelope between this inner end of this two lead frame and this outer end, this inner end and this outer end are then exposed to outside this packaging body; And
Multiple LED crystal particle, described LED crystal particle is arranged at this exiting surface, and described LED crystal particle and this two lead frame form electrical connection.
Wherein, each of the periphery block of substrate is formed with a surface texture, this surface texture is the aspect that depressed part and protuberance hand over compartment mistake mutually, depressed part can make the encapsulating material of liquid condition fill out the depressed part flowed in surface texture, when after encapsulating material solid state, encapsulating material is filled out and is flowed the part corresponding to protuberance in the part of depressed part and encapsulating material and all form with substrate the relation engaged, substrate like this can closely be combined with solid-state rear the formed packaging body of encapsulating material and be integrally fixed, and then significantly promote substrate to the structural strength of packaging body and encapsulation adaptation.
Wherein, the lead frame be coated in packaging body has multiple second concave point, described second concave point can make the encapsulating material of liquid condition fill out stream wherein, the encapsulating material of liquid state is avoided to scatter away from lead frame, when after encapsulating material solid state, encapsulating material fills out the part flowed in described second concave point all can form with lead frame the relation engaged, and lead frame like this can closely be combined with solid-state rear the formed packaging body of encapsulating material and be integrally fixed, and then lifting lead wire frame is to the conjugation grade of packaging body.
Wherein, bonding agent can be coated with further bottom the lens being arranged on the encapsulating structure the superiors, bonding agent can make lens more closely with its under component bind mutually, use and block extraneous moisture and invade in lens and the inside of encapsulating structure, and lens are floating on the silica gel separator similar to lens material, but not be configured on optical reflecting cover, and then prevent lens from occurring to loosen the situation departed from, and promote the adaptation of lens in encapsulating structure.
Wherein, utilize the soldering paste of doped diamond powder, LED crystal particle weldering is located on substrate, because diamond dust has preferably heat-conducting effect, therefore can effectively the heat energy that LED crystal particle produces be derived, wherein diamond dust also can plate the material with excellent thermal conductivity, and the heat energy that LED crystal particle like this produces can be arranged quickly is dissipated to Outdoor Space.
Accompanying drawing explanation
Fig. 1 is the cutaway view with the optical lens of fluorescence coating being applied to package structure for LED of prior art;
Fig. 2 is the first embodiment schematic diagram of the encapsulating structure of multilayer type array type light emitting diode light engine of the present invention;
Fig. 3 A is the schematic top plan view of the encapsulating structure of multilayer type array type light emitting diode light engine of the present invention;
Fig. 3 B is the broken section enlarged drawing of the region A of Fig. 2 A;
Fig. 4 is the second embodiment schematic diagram of the encapsulating structure of multilayer type array type light emitting diode light engine of the present invention;
Fig. 5 is the first embodiment schematic diagram of substrate of the present invention;
Fig. 6 is the second embodiment schematic diagram of substrate of the present invention;
Fig. 7 is the 3rd embodiment schematic diagram of substrate of the present invention;
Fig. 8 is the 4th embodiment schematic diagram of substrate of the present invention;
Fig. 9 is the 5th embodiment schematic diagram of substrate of the present invention;
Figure 10 is the 6th embodiment schematic diagram of substrate of the present invention;
Figure 11 is a preferred embodiment schematic diagram of the encapsulating structure of multilayer type array type light emitting diode light engine of the present invention;
Figure 12 A is the partial enlarged drawing of the region A of Figure 11;
Figure 12 B is the partial enlarged drawing of the region B of Figure 11.
Embodiment
Below coordinate and graphic more detailed description is done to embodiments of the present invention, those of ordinary skill in the art can be implemented according to this after studying this specification carefully.
With reference to figure 2, the first embodiment schematic diagram of the encapsulating structure of multilayer type array type light emitting diode light engine of the present invention.The present invention is the encapsulating structure about a kind of multilayer type array type light emitting diode light engine, it can stop the inside that extraneous moisture enters the encapsulating structure of multilayer type array type light emitting diode light engine completely, prevents the deterioration because making moist of inner each optical module.
The encapsulating structure of multilayer type array type light emitting diode light engine at least includes substrate 1, packaging body 3, two lead frame to 5.Substrate 1 can divide into center 11 and surrounding zone 13, the end face of center 11 is exiting surface 111, center 11 is the center blocks being covered by substrate 1, preferably center 11 contain that area is greater than surrounding zone 13 contain area, and surrounding zone 13 is the block between center 11 and substrate 1 edge, another surrounding zone 13 has end face 131, side 133 and bottom surface 135.
With reference to figure 3A, the schematic top plan view of the encapsulating structure of multilayer type array type light emitting diode light engine of the present invention, is the broken section enlarged drawing of the region A of Fig. 3 A with reference to figure 3B, Fig. 3 B, and coordinates shown in Fig. 1.End face 131 is formed two storage tank 131A and 131B and multiple first concave point 1315, preferably two storage tank 131A and 131B are separately positioned on the position of the mutual correspondence on end face 131, preferably two storage tank 131A and 131B can be arranged on the position being as far as possible close to exiting surface 111, that is allow two storage tank 131A and 131B be positioned at the both sides of close exiting surface 111, described first concave point 1315 can be arranged to ring-type, and described first concave point 1315 also can be arranged among two storage tank 131A and 131B.Wherein this center 11 shape can circle, ellipse, quadrangle, polygon and other suitable shape.
Packaging body 3 envelopes the part of the surrounding zone 13 of substrate 1, but do not envelope center 11, end face 131, side 133 and bottom surface 135 need be contained in the coated region of packaging body 3, wherein packaging body 3 has package cavity 31, package cavity 31 is the part that packaging body 3 does not envelope center 11, therefore packaging body 3 encloses structure and goes out accommodation space above center 11, and accommodation space is for configurable suitable optical component among package cavity 31, and the bottom of package cavity 31 is just exiting surface 111.
Internal face 311 and the exiting surface 111 of package cavity 31 have an angled relationships each other, preferably angle is less than 90 degree, when angle between internal face 311 and exiting surface 111 is less than 90 degree, internal face 311 is intended for outside package cavity 31, therefore when there being light directive to internal face 311, to contribute to light is reflected onto outside package cavity 31, on internal face 311, can optical reflecting cover 4 be set further, through on internal face 311, optical reflecting cover 4 is set, more significantly can promote the probability outside light reflection to package cavity 31, luminous illumination is improved.
Packaging body 3 uses encapsulating material to envelope the part of the surrounding zone 13 of substrate 1, wherein encapsulating material can be moulding resin (MoldResin), the material of moulding resin can be polyphthalamide molding resin (poly-phthal-amide, or liquid crystal polymer (LiquidCrystallinePolymer, LCP) PPA).
With reference to figure 3A and Fig. 3 B, and coordinate shown in Fig. 2, two lead frames 5 all have inner end 51 and outer end 53, the inner end 51 of two lead frames 5 lays respectively among two storage tank 131A and 131B, wherein the level height of outer end 53 can higher than the level height of inner end 51, as shown in Figure 1, a wherein part for two lead frames 5 can be formed with bending segment, and namely the two ends of bending segment extend out is inner end 51 and the outer end 53 of two lead frames 5.
This packaging body 3 is separated with mutually between this two lead frame 5 with this substrate 1, and the part between the inner end 51 of two lead frames 5 and outer end 53 is embedded among packaging body 3 by envelope, inner end 51 and outer end 53 are then exposed to outside packaging body 3, wherein the one side of this two lead frame 5 is provided with multiple second concave point 511, preferably described second concave point can be arranged on the inner end 51 of two lead frames 5 and the peripheral region at inner end 51.
Described first concave point 1315 and described second concave point 511 the adherence being respectively to increase packaging body 3 pairs of substrates 1 and lead frame 5 is set, because lead frame 5 makes the metal of apparatus conduction property make, packaging body 3 uses the material of plastics or resin, due to plastics or resin not easily with metal bond, but through being provided with described second concave point 511 at lead frame 5, the surface roughness of lead frame 5 can be increased, and described second concave point 511 can also be filled up by the plastics of liquid state or resin, allow liquid plastics or resin can be covered with on the surface of lead frame 5, therefore when after the plastics or resin solidification of liquid state, the adherence of packaging body 3 pairs of lead frames 5 can be increased, make packaging body 3 closely involution in lead frame 5.
With reference to figure 4, the second embodiment schematic diagram of the encapsulating structure of multilayer type array type light emitting diode light engine of the present invention.Wherein can be provided with multiple LED crystal particle 6 on exiting surface 111, LED crystal particle 6 can utilize the arrangement mode of array to be configured on exiting surface 111, LED crystal particle 6 forming with two lead frames 5 is electrically connected, and wherein LED crystal particle 6 engages and two lead frames 5 and form electrical connection by routing.
Wherein said LED crystal particle 6 is located on the exiting surface 111 of this substrate 1 by a soldering paste (not shown) is welded, wherein this soldering paste can be tin cream or elargol at least one of them, wherein tin cream also can mix with diamond crystal with carbon crystalline substance mutually, this diamond crystal also can the material of plated with nickel, silver or other excellent thermal conductivity, through adding heat-conducting effect preferably material at soldering paste, the heat conduction efficiency of soldering paste can be allowed effectively to promote, use the heat energy that LED crystal particle 6 is produced and conduct to Outdoor Space via substrate 1 rapidly.
Crystal grain protective layer 7 can be formed with further on described LED crystal particle 6; the coated described LED crystal particle 6 of crystal grain protective layer 7 palpus; use the protection moisture of described LED crystal particle 6 from the external world and the pollution in the external world; wherein the material of crystal grain protective layer 7 is a silica gel; can form fluorescent adhesive layer 8 again on crystal grain protective layer 7, the light that described LED crystal particle 6 sends can be given colour mixture by fluorescent adhesive layer 8.
More can form silica gel separator 9 on fluorescent adhesive layer 8, silica gel separator 9 can completely cut off extraneous moisture and invade to fluorescent adhesive layer 8, and fluorescent adhesive layer 8 like this can not go bad because making moist.Moreover, configurable lens 10 on silica gel separator 9, and lens 10 are cemented on silica gel separator 9 by primer layer 20 (underfilling), wherein lens 10 are floating on silica gel separator 9, directly do not contact with optical reflecting cover 4, and silica gel separator 9 and lens 10 all belong to plastic material, lens 10 can closely be fixed on silica gel separator 9, moreover also can be fixed by primer layer 20 through lens 10, more can effectively prevent lens 10 from the situation loosened occurring, wherein the material of primer layer 20 can be epoxy resin or other suitable material.
Wherein can be coated with bonding agent 30 (primer) between silica gel separator 9 and lens 10, bonding agent 30 tightness increased between silica gel separator 9 and lens 10, and block extraneous moisture and invade fluorescent adhesive layer 8 within lens 10 and under silica gel separator 9.
With reference to figure 5, the first embodiment schematic diagram of substrate of the present invention, with reference to figure 6, the second embodiment schematic diagram of substrate of the present invention.The end face 131 of wherein substrate 1 can be formed with groove 1311 on first, as shown in Figure 5.Or, also as shown in Figure 6, end face 131 can form upper convex portion 1313 further, wherein groove 1311 or upper convex portion 1313 on first can be set individually on end face 131, also groove 1311 and upper convex portion 1313 on first can be set on end face 131 simultaneously.
On first, the shape of groove 1311 can be U-shaped, matrix, V-type or other suitable shape.It should be noted that the number of groove 1311 and the number of upper convex portion 1313, depending on actual needs, are only the examples illustrated at this, and are not used to limit the scope of the invention on above-mentioned first.
With reference to figure 7, the 3rd embodiment schematic diagram of substrate of the present invention.From the above, on end face, 111 can set out groove 1315 on second again, and on second, groove 1315 is arranged between the edge of upper convex portion 1313 and substrate 1, and on second, the shape of groove 1315 can be U-shaped, matrix, V-type or other suitable shape.
With reference to figure 8, the 4th embodiment schematic diagram of substrate of the present invention, with reference to figure 9, the 5th embodiment schematic diagram of substrate of the present invention.Side 133 can be formed with side trench 1331, as shown in Figure 8.Or, also can be as shown in Figure 9, side 133 sets out side protuberance 1333, and side protuberance 1333 forms the structure of L-type with side 133 part under side protuberance 1333, wherein side trench 1331 or side protuberance 1333 can be set individually on side 133, also can side trench 1331 and side protuberance 1333 be set on end face 133 simultaneously.The shape of side trench 1331 can be U-shaped, matrix, V-type or other suitable shape.
With reference to Figure 10, the 6th embodiment schematic diagram of substrate of the present invention.Bottom surface 135 can be formed with lower groove 1351, as shown in Figure 10.Or, also can set out protuberance (not shown) in bottom surface 135, wherein lower groove 1351 or lower protuberance can be set individually on bottom surface 135, also can lower groove 1351 and lower protuberance be set on bottom surface 135 simultaneously.
With reference to Figure 11, a preferred embodiment schematic diagram of the encapsulating structure of multilayer type array type light emitting diode light engine of the present invention.Wherein in the preferred embodiment, can through sequentially arranging on two first groove 1315 on groove 1311, upper convex portion 1313 and second on the end face 131 of surrounding zone 13 from the inside to the outside, wherein groove 1311 is all arranged to matrix shape on two first, on second, groove 1315 arranges forming V-shape shape, and side 133 is formed side protuberance 1333, and side protuberance 1333 and side 133 form the structure of L-type, 135, bottom surface forms a lower groove 1351.
Being the partial enlarged drawing of the region A of Figure 11 with reference to figure 12A, Figure 12 A, is the partial enlarged drawing of the region B of Figure 11 with reference to figure 12B, Figure 12 B.Wherein on two first groove 1311 internal face on also can form flange 1311a, and the internal face of groove 1315 forms recessed edge 1315a further on second.
Above-mentioned described groove and described groove can make the encapsulating material of liquid state fill out to flow among described groove, therefore after encapsulating material forms solid-state shape, fill out to flow and can form with substrate 1 relation engaged in the part of described groove and the part corresponding to protuberance of solid-state rear the formed packaging body 3 of encapsulating material, substrate 1 like this can closely be combined with packaging body 3 and be integrally fixed, can not slide because getting loose, so can increase the structural strength of substrate and packaging body and encapsulating adaptation.
When being especially formed with flange 1311a and recessed edge 1315a on the internal face of described groove, after encapsulating material forms solid-state shape, can fasten with the flange 1311a in described trench wall face and recessed edge 1315a respectively, make substrate 1 be combined more closely with packaging body 3 and to be integrally fixed, substrate is more strengthened the structural strength of packaging body and encapsulation adaptation.
It should be noted that, the actual setting position of flange 1311a and recessed edge 1315a is depending on actual needs, only the example illustrated at this, and be not used to limit the scope of the invention, that is above-mentioned arbitrary groove and arbitrary protuberance can depending on actual needs arrange further flange 1311a or recessed edge 1315a at least one of them, to promote structural strength and the encapsulation adaptation of encapsulating structure of the present invention.
The foregoing is only to explain preferred embodiment of the present invention; not attempt does any pro forma restriction to the present invention according to this; therefore, all have any modification for the present invention or the change done under identical invention spirit, all must be included in the category that the invention is intended to protect.
Claims (43)
1. an encapsulating structure for multilayer type array type light emitting diode light engine, is characterized in that, this encapsulating structure includes:
One substrate, this substrate can divide into a center and a surrounding zone, the end face of this center is an exiting surface, this substrate also has an edge, this center is the middle block containing this substrate, and this surrounding zone is the block between this center and this edge, and wherein this surrounding zone has an end face, a side and a bottom surface, be formed with two storage tanks at this end face, this end face is more formed with multiple first concave point;
One packaging body, this surrounding zone part of this this substrate of packaging body coats but this center not coated, the coated region of this packaging body includes this end face, this side and this bottom surface, and this packaging body has a package cavity, and this package cavity is positioned on this exiting surface;
Two lead frames, this two lead frame all has an inner end and an outer end, this inner end of this two lead frame lays respectively among this two storage tank, partly all be embedded among this packaging body by envelope between this inner end of this two lead frame and this outer end, this inner end and this outer end are then exposed to outside this packaging body; And
Multiple LED crystal particle, described LED crystal particle is arranged at this exiting surface, and described LED crystal particle and this two lead frame form electrical connection.
2. the encapsulating structure of multilayer type array type light emitting diode light engine as claimed in claim 1, is characterized in that, this two storage tank is mutually corresponding setting.
3. the encapsulating structure of multilayer type array type light emitting diode light engine as claimed in claim 1, it is characterized in that, this package cavity has an internal face, has an angle of cut relation between this internal face is relative with this exiting surface.
4. the encapsulating structure of multilayer type array type light emitting diode light engine as claimed in claim 3, is characterized in that, be provided with an optical reflecting cover on this internal face.
5. the encapsulating structure of multilayer type array type light emitting diode light engine as claimed in claim 1, it is characterized in that, this packaging body can utilize the part of this surrounding zone of an encapsulating material this substrate coated.
6. the encapsulating structure of multilayer type array type light emitting diode light engine as claimed in claim 5, it is characterized in that, this encapsulating material is a moulding resin.
7. the encapsulating structure of multilayer type array type light emitting diode light engine as claimed in claim 6, it is characterized in that, the material of this moulding resin is polyphthalamide molding resin or liquid crystal polymer.
8. the encapsulating structure of multilayer type array type light emitting diode light engine as claimed in claim 1, is characterized in that, be separated with this packaging body mutually between this two lead frames with this substrate.
9. the encapsulating structure of multilayer type array type light emitting diode light engine as claimed in claim 1, is characterized in that, be equipped with multiple second concave point at this two wire erection.
10. the encapsulating structure of multilayer type array type light emitting diode light engine as claimed in claim 9, it is characterized in that, described second concave point is arranged on this inner end of this two lead frame and the peripheral region at this inner end.
The encapsulating structure of 11. multilayer type array type light emitting diode light engines as claimed in claim 1, is characterized in that, described LED crystal particle is configured on this exiting surface with the arrangement mode of array.
The encapsulating structure of 12. multilayer type array type light emitting diode light engines as described in claim 1 or 11, is characterized in that, described LED crystal particle mat routing engages and forms electrical connection with this two lead frame.
The encapsulating structure of 13. multilayer type array type light emitting diode light engines as claimed in claim 1, it is characterized in that, described LED crystal particle is configured at this exiting surface of this substrate by a soldering paste.
The encapsulating structure of 14. multilayer type array type light emitting diode light engines as claimed in claim 13, is characterized in that, this soldering paste include a tin cream or an elargol at least one of them.
The encapsulating structure of 15. multilayer type array type light emitting diode light engines as claimed in claim 14, is characterized in that, this tin cream be mixed with carbon crystalline substance, diamond crystal or be coated with nickel diamond crystal at least one of them.
The encapsulating structure of 16. multilayer type array type light emitting diode light engines as claimed in claim 1, is characterized in that, more comprise a crystal grain protective layer, this crystal grain protective layer is formed on described LED crystal particle, and must coated described LED crystal particle.
The encapsulating structure of 17. multilayer type array type light emitting diode light engines as claimed in claim 16, is characterized in that, the material of this crystal grain protective layer is a silica gel.
The encapsulating structure of 18. multilayer type array type light emitting diode light engines as claimed in claim 16, it is characterized in that, comprise a fluorescent adhesive layer further, this fluorescent adhesive layer is formed on this crystal grain protective layer.
The encapsulating structure of 19. multilayer type array type light emitting diode light engines as claimed in claim 18, is characterized in that, comprise a silica gel separator further, this silica gel separator is formed on this fluorescent adhesive layer.
The encapsulating structure of 20. multilayer type array type light emitting diode light engines as claimed in claim 19, it is characterized in that, comprise lens further, these lens are positioned on this silica gel separator.
The encapsulating structure of 21. multilayer type array type light emitting diode light engines as claimed in claim 20, is characterized in that, comprise a primer layer further, wherein these lens are cemented on this silica gel separator by this primer layer.
The encapsulating structure of 22. multilayer type array type light emitting diode light engines as claimed in claim 21, is characterized in that, the material of this primer layer is epoxy resin.
The encapsulating structure of 23. multilayer type array type light emitting diode light engines as claimed in claim 20, is characterized in that having a bonding agent between these silica gel separator and this lens.
The encapsulating structure of 24. multilayer type array type light emitting diode light engines as claimed in claim 1, it is characterized in that, described first concave point can be configured to ring-type.
The encapsulating structure of 25. multilayer type array type light emitting diode light engines as claimed in claim 1, is characterized in that, this end face be at least formed groove on one first, a upper convex portion or this on first groove and this upper convex portion at least one of them.
The encapsulating structure of 26. multilayer type array type light emitting diode light engines as claimed in claim 25, is characterized in that, this on first the internal face of groove also can be formed a projection or a groove at least one of them.
The encapsulating structure of 27. multilayer type array type light emitting diode light engines as claimed in claim 25, is characterized in that, the outside wall surface of this upper convex portion also can be formed a projection or a groove at least one of them.
The encapsulating structure of 28. multilayer type array type light emitting diode light engines as claimed in claim 25, is characterized in that, this on first the shape of groove be matrix.
The encapsulating structure of 29. multilayer type array type light emitting diode light engines as claimed in claim 28, is characterized in that, this on first the shape of groove be U-shaped further and V-type at least one of them.
The encapsulating structure of 30. multilayer type array type light emitting diode light engines as claimed in claim 25, it is characterized in that, this end face also can be formed with groove on one second, and this upper convex portion is arranged at this groove and this is on second between groove on first, and this on first groove be arranged on the position being close to this two storage tank, this on second groove be arranged on the position at this edge being close to this substrate.
The encapsulating structure of 31. multilayer type array type light emitting diode light engines as claimed in claim 30, is characterized in that, this on second the internal face of groove also can be formed a projection or a groove at least one of them.
The encapsulating structure of 32. multilayer type array type light emitting diode light engines as claimed in claim 30, is characterized in that, this on second the shape of groove be matrix.
The encapsulating structure of 33. multilayer type array type light emitting diode light engines as claimed in claim 32, is characterized in that, this on second the shape of groove be U-shaped further and V-type at least one of them.
The encapsulating structure of 34. multilayer type array type light emitting diode light engines as claimed in claim 1, is characterized in that, this side be formed at least one side trench or at least side protuberance at least one of them.
The encapsulating structure of 35. multilayer type array type light emitting diode light engines as claimed in claim 34, is characterized in that, the internal face of this at least one side trench also can be formed a projection or a groove at least one of them.
The encapsulating structure of 36. multilayer type array type light emitting diode light engines as claimed in claim 34, is characterized in that, the outside wall surface of this at least side protuberance be formed a projection or a groove at least one of them.
The encapsulating structure of 37. multilayer type array type light emitting diode light engines as claimed in claim 34, is characterized in that, the shape of this at least one side trench is matrix.
The encapsulating structure of 38. multilayer type array type light emitting diode light engines as claimed in claim 37, is characterized in that, the shape of this at least one side trench be U-shaped further and V-type at least one of them.
The encapsulating structure of 39. multilayer type array type light emitting diode light engines as claimed in claim 1, is characterized in that, this bottom surface be formed at least one lower groove or at least one lower protuberance at least one of them.
The encapsulating structure of 40. multilayer type array type light emitting diode light engines as claimed in claim 39, is characterized in that, the internal face of this at least one lower groove also can be formed a projection or a groove at least one of them.
The encapsulating structure of 41. multilayer type array type light emitting diode light engines as claimed in claim 39, is characterized in that, the outside wall surface of this at least one lower protuberance also can be formed a projection or a groove at least one of them.
The encapsulating structure of 42. multilayer type array type light emitting diode light engines as claimed in claim 39, is characterized in that, the shape of this at least one lower groove is matrix.
The encapsulating structure of 43. multilayer type array type light emitting diode light engines as claimed in claim 42, is characterized in that, the shape of this at least one lower groove be U-shaped further and V-type at least one of them.
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