CN203218226U - Pdfn芯片铝带键合用钢嘴 - Google Patents
Pdfn芯片铝带键合用钢嘴 Download PDFInfo
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- CN203218226U CN203218226U CN2013202265633U CN201320226563U CN203218226U CN 203218226 U CN203218226 U CN 203218226U CN 2013202265633 U CN2013202265633 U CN 2013202265633U CN 201320226563 U CN201320226563 U CN 201320226563U CN 203218226 U CN203218226 U CN 203218226U
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- steel nozzle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/77—Apparatus for connecting with strap connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/77—Apparatus for connecting with strap connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/77—Apparatus for connecting with strap connectors
- H01L2224/7725—Means for applying energy, e.g. heating means
- H01L2224/773—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/77313—Wedge
- H01L2224/77314—Shape
- H01L2224/77315—Shape of the pressing surface, e.g. tip or head
- H01L2224/77316—Shape of the pressing surface, e.g. tip or head comprising protrusions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
本实用新型涉及一种PDFN芯片铝带键合用钢嘴,它包括钢嘴杆(1)以及位于钢嘴杆(1)端部的钢嘴头(2),所述钢嘴头(2)为一个锥台形结构,所述锥台形结构的顶端为矩形面,其特征在于所述矩形面上设置有凸块(3),所述凸块(3)有一个或者多个。本实用新型由于钢嘴头顶端的矩形面上设置有凸块,使得在铝带键合时钢嘴的能量传输不受影响,能量传输效果较好,保证键合工艺。
Description
技术领域
本实用新型涉及一种PDFN芯片铝带键合用钢嘴,属于半导体封装领域。
背景技术
现在在半导体封装行业器件封装方面,一直在向外形越来越小,功率越来越大,成本越来越低的方向发展,但是根据原来的生产工艺条件,现在使得小型化的封装和优质的电性要求成为一种矛盾,当采用封装小型化的时候,因为工艺能力的限制,产品的电性指标会受限制,产品的最终设计功率也受到限制。
针对原有的小型封装外形的PDFN3*3的这款产品由铜丝键合工艺改为铝带键合工艺,因为框架厚度很薄,对铝带键合用钢嘴的能量传输有影响,一般的铝带键合用钢嘴下端为凸起的条纹,能量传输效果较差,影响键合工艺。
发明内容
本实用新型的目的在于克服上述不足,提供一种在铝带键合时钢嘴的能量传输不受影响,能量传输效果较好,保证键合工艺的PDFN芯片铝带键合用钢嘴。
本实用新型的目的是这样实现的:
一种PDFN芯片铝带键合用钢嘴,它包括钢嘴杆以及位于钢嘴杆 端部的钢嘴头,所述钢嘴头为一个锥台形结构,所述锥台形结构的顶端为矩形面,其特征是所述矩形面上设置有凸块,所述凸块有一个或者多个。
与现有技术相比,本实用新型的有益效果是:
本实用新型由于钢嘴头顶端的矩形面上设置有凸块,使得在铝带键合时钢嘴的能量传输不受影响,能量传输效果较好,保证键合工艺。
附图说明
图1为本实用新型PDFN芯片铝带键合用钢嘴的侧视图。
图2为本实用新型PDFN芯片铝带键合用钢嘴的实施例一示意图。
图3为本实用新型PDFN芯片铝带键合用钢嘴的实施例二示意图。
其中:
钢嘴杆1
钢嘴头2
凸块3。
具体实施方式
参见图1~图3,本实用新型涉及的一种PDFN芯片铝带键合用钢嘴,它包括钢嘴杆1以及位于钢嘴杆1 端部的钢嘴头2,所述钢嘴杆1用于和键合移动架连接,所述钢嘴杆1的一侧为定位平面,所述钢嘴头2为一个锥台形结构,所述锥台形结构的顶端为矩形面,所述矩形面上设置有凸块3,所述凸块3有一个或者多个,所述凸块3为椭圆形、菱形或者正多边形结构。
实施例一、参见图2,凸块3为菱形,所述凸块3有六个,六个凸块呈2*3阵列布置。
实施例二、参见图3,凸块3为正六边形,所述凸块3有十二个,十二个凸块呈2*6阵列布置。
Claims (2)
1.一种PDFN芯片铝带键合用钢嘴,它包括钢嘴杆(1)以及位于钢嘴杆(1) 端部的钢嘴头(2),所述钢嘴头(2)为一个锥台形结构,所述锥台形结构的顶端为矩形面,其特征在于所述矩形面上设置有凸块(3),所述凸块(3)有一个或者多个。
2.根据权利要求1所述的一种PDFN芯片铝带键合用钢嘴,其特征在于所述凸块(3)为椭圆形、菱形或者正多边形结构。
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CN2013202265633U CN203218226U (zh) | 2013-04-28 | 2013-04-28 | Pdfn芯片铝带键合用钢嘴 |
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CN2013202265633U CN203218226U (zh) | 2013-04-28 | 2013-04-28 | Pdfn芯片铝带键合用钢嘴 |
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2013
- 2013-04-28 CN CN2013202265633U patent/CN203218226U/zh not_active Expired - Fee Related
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130925 Termination date: 20200428 |