CN203194016U - Flame-retardant polyester film used for flexible circuit board - Google Patents
Flame-retardant polyester film used for flexible circuit board Download PDFInfo
- Publication number
- CN203194016U CN203194016U CN 201320186413 CN201320186413U CN203194016U CN 203194016 U CN203194016 U CN 203194016U CN 201320186413 CN201320186413 CN 201320186413 CN 201320186413 U CN201320186413 U CN 201320186413U CN 203194016 U CN203194016 U CN 203194016U
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- Prior art keywords
- flame
- retardant
- layer
- low temperature
- circuit board
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Abstract
The utility model discloses a flame-retardant polyester film used for a flexible circuit board. The flame-retardant polyester film comprises, by weight, 80%-90% of a modified copolyester PETG slice, 0-6% of a silicon-dioxide antisticking PET slice and a low temperature bonding layer made of 4-20% of a flame-retardant grafting copolymerization modification PET slice. One side of the low temperature bonding layer is provided with a copper plating layer. A transparent flame-retardant layer is made of 70-85% of the flame-retardant grafting copolymerization modification PET slice and 15-30% of the silicon-dioxide antisticking PET slice by weight. The transparent flame-retardant layer is arranged on the other side of the low temperature bonding layer. Copper plating is performed on the low temperature bonding layer, and then the low temperature bonding layer and a copper plate or a copper bar carry out heating, compacting and recombination. An adhesive layer is saved. Subsequent manufacturing procedures of the flexible circuit board and cost are omitted. The transparent flame-retardant layer possesses flame-retardant performance. A usage temperature of the flexible circuit board is increased. And effects of environmental protection and the flame retardance during usage in a high temperature are achieved.
Description
Technical field
The utility model relates to a kind of flexible PCB fire retardant mylar, belongs to the thin film fabrication techniques field.
Background technology
Polyester film has excellent performance, advantages such as for example good, the transparency of intensity height, temperature tolerance, glossiness be good, characteristics such as its good insulation performance, low-hygroscopicity, chemical resistance, wear-resisting wiping, high-melting-point, be widely used on the flexible circuit board (FPC), make the FPC that makes have the characteristics of distribution density height, in light weight, thin thickness, can dwindle the weight and volume of electronic product so greatly, be suitable for the needs that electronic product develops to high density, miniaturization, highly reliable direction.Therefore, FPC in field such as notebook computer, computer peripheral equipment, LCD liquid crystal module, LED illumination, office equipment, digital camera, mobile phone, PDA, laser head, instrument and meter, Medical Instruments and automobile product or product obtained using widely.General common FPC is made up of five-layer structure, and sandwich layer is copper bar or copper cash, and the levels of copper bar or copper cash is protective layer, and one deck laminated polyester film is covered on the top layer of protective layer again.
At present, this kind protective layer can be selected adhesives such as the polyester of acrylic resin, polyimide resin, epoxy resin, improvement and butyral phenolic resins for use on the market, flexible PCB making sheet that the success to some extent of these adhesives is bonding.
But owing to there is glue process, refer in the FPC manufacturing process in the flexible board course of processing, need earlier that gluing be called gluing on copper bar or copper cash, have environmental pollution problem on the one hand, these adhesive fusing points are low on the other hand, inapplicablely use under higher temperature.
The utility model content
Technical problem to be solved in the utility model is at above deficiency, a kind of flexible PCB fire retardant mylar is provided, this fire retardant mylar can to add hot pressing compound with copper coin or copper bar, saved glue-line, follow-up flexible board manufacturing procedure and cost have been saved again, add that the transparent flame-retarding layer has anti-flammability concurrently, has improved the serviceability temperature of this flexible PCB
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of flexible PCB fire retardant mylar, it is characterized in that: described fire retardant mylar comprises: by weight the low temperature adhesion layer that the anti-stick PET section 0-6% of modified copolyester PETG 80%-90%, silicon dioxide and fire-retardant grafting, copolymerization and modification PET section 4-20% make, the one side of described low temperature adhesion layer is provided with copper plate;
By weight the transparent flame-retarding layer that fire-retardant grafting, copolymerization and modification PET section 70-85%, the anti-stick PET section of silicon dioxide 15-30% make, described transparent flame-retarding layer is arranged on the another side of low temperature adhesion layer.
A kind of prioritization scheme, the thickness of described low temperature adhesion layer are 0.5-1um, and the thickness of transparent flame-retarding layer is 30-60um.
Another kind of prioritization scheme, the thickness of described copper plate is at the 50-300 dust.
The utility model adopts above technical scheme, compared with prior art, have the following advantages: the low temperature adhesion layer by copper facing after, by to add hot pressing compound with copper coin or copper bar, saved glue-line, saved follow-up flexible board manufacturing procedure and cost again, added that the transparent flame-retarding layer has anti-flammability concurrently, improved the serviceability temperature of flexible PCB, reached and at high temperature used and the effect of environmental protection flame retardant.
Below in conjunction with drawings and Examples the utility model is elaborated.
Description of drawings
Fig. 1 is the structural representation of fire retardant mylar among the utility model embodiment;
Among the figure,
The 1-copper plate, 2-low temperature adhesion layer, 3-transparent flame-retarding layer.
Embodiment
Embodiment, as shown in Figure 1, a kind of flexible PCB fire retardant mylar, comprise low temperature adhesion layer 2 and transparent flame-retarding layer 3, the weight percent of low temperature adhesion layer 2 consists of modified copolyester PETG 80%-90%, the anti-stick PET section 0-6% of silicon dioxide and fire-retardant grafting, copolymerization and modification PET section 4-20%, the weight percent component of transparent flame-retarding layer 3 becomes and contains fire-retardant grafting, copolymerization and modification PET section 70-85%, the anti-stick PET section of silicon dioxide 15-30%
Polyester film stretches by biaxial orientation and obtains, generally speaking: the thickness of low temperature adhesion layer 2 is 0.5-1um, the thickness of transparent flame-retarding layer 3 is 30-60um, the thickness of polyester film is 0.036mm in the present embodiment, adhesive layer 0.001mm wherein, by vacuumizing the copper facing machine, plate a copper plate 1 on the surface of low temperature adhesion layer 2, the thickness of copper plate 1 is at the 50-300 dust, make the flexible PCB polyester film through the cooling rolling, the fusing point of low temperature adhesion layer 2 is between 180-220 ℃, it is a kind of modification PETG, the transparent flame-retarding layer is selected commercially available fire-retardant grafting, copolymerization and modification polyester PET section for use, keeps film forming, the transparency is good, satisfies the fire-retardant requirement of VTM-O.
The anti-stick PET section of silicon dioxide, wherein PET refers to ethylene glycol terephthalate, is called for short polyester or PET, the anti-stick PET section of silicon dioxide refers to disperse to add the silicon dioxide of certain content in the PET building-up process.These all are the general calls of this industry.
Fire-retardant grafting, copolymerization and modification PET section refers in the PET building-up process, add the flame-retardant modified polyester (PET) that flame-proof modifier forms, and this modified poly ester is transparent.
The above is giving an example of best mode for carrying out the invention, and the part of wherein not addressing in detail is those of ordinary skills' common practise.Protection scope of the present invention is as the criterion with the content of claim, and any equivalent transformation that carries out based on technology enlightenment of the present invention is also within protection scope of the present invention.
Claims (3)
1. flexible PCB fire retardant mylar, it is characterized in that: described fire retardant mylar comprises: by weight the low temperature adhesion layer (2) that the anti-stick PET section 0-6% of modified copolyester PETG 80%-90%, silicon dioxide and fire-retardant grafting, copolymerization and modification PET section 4-20% make, the one side of described low temperature adhesion layer (2) is provided with copper plate (1);
By weight the transparent flame-retarding layer (3) that fire-retardant grafting, copolymerization and modification PET section 70-85%, the anti-stick PET section of silicon dioxide 15-30% make, described transparent flame-retarding layer (3) is arranged on the another side of low temperature adhesion layer (2).
2. a kind of flexible PCB fire retardant mylar as claimed in claim 1, it is characterized in that: the thickness of described low temperature adhesion layer (2) is 0.5-1um, the thickness of transparent flame-retarding layer (3) is 30-60um.
3. a kind of flexible PCB fire retardant mylar as claimed in claim 1 or 2, it is characterized in that: the thickness of described copper plate (1) is at the 50-300 dust.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320186413 CN203194016U (en) | 2013-04-15 | 2013-04-15 | Flame-retardant polyester film used for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320186413 CN203194016U (en) | 2013-04-15 | 2013-04-15 | Flame-retardant polyester film used for flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203194016U true CN203194016U (en) | 2013-09-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320186413 Expired - Fee Related CN203194016U (en) | 2013-04-15 | 2013-04-15 | Flame-retardant polyester film used for flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203194016U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112644112A (en) * | 2020-12-17 | 2021-04-13 | 万奔电子科技股份有限公司 | Automobile intelligent central control multilayer board and preparation method thereof |
-
2013
- 2013-04-15 CN CN 201320186413 patent/CN203194016U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112644112A (en) * | 2020-12-17 | 2021-04-13 | 万奔电子科技股份有限公司 | Automobile intelligent central control multilayer board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190131 Address after: 262700 West of Xinhua West Road, Shouguanghou Town Project Area, Weifang City, Shandong Province Patentee after: SHANDONG LONGXING PLASTIC FILM TECHNOLOGY Co.,Ltd. Address before: 262700 Lingang Industrial Park, Yangkou Town, Shouguang City, Weifang City, Shandong Province Patentee before: SHANDONG JIANYUANCHUN PACKING MATERIAL CO.,LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130911 |