CN203134854U - 一种热塑性塑料底座红外光敏发光二极管 - Google Patents

一种热塑性塑料底座红外光敏发光二极管 Download PDF

Info

Publication number
CN203134854U
CN203134854U CN2012207549618U CN201220754961U CN203134854U CN 203134854 U CN203134854 U CN 203134854U CN 2012207549618 U CN2012207549618 U CN 2012207549618U CN 201220754961 U CN201220754961 U CN 201220754961U CN 203134854 U CN203134854 U CN 203134854U
Authority
CN
China
Prior art keywords
pedestal
emitting diode
convex body
wire
photosensitive light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012207549618U
Other languages
English (en)
Inventor
韩肥方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN2012207549618U priority Critical patent/CN203134854U/zh
Application granted granted Critical
Publication of CN203134854U publication Critical patent/CN203134854U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)

Abstract

一种配套于遥控发射、接收和电子计数整机的热塑性塑料底座红外光敏发光二极管，底座选用硬度强、热稳定性能好、电性能优良的聚苯硫醚(PPS)做本体材料，采用注塑排气挤出工艺经模压成型，再经过塑化、淬火处理而得到，所述热塑性塑料底座红外光敏发光二极管底座为凸体型，所述凸体型底座的凸体上方为电极区域，所述电极区域的负极引线点端点注导电银胶，置放红外或光敏芯片，另一引线为正极焊线引线，将芯片与负极引线经金丝焊线超声球焊连通，用封装工艺注满环氧树脂安全密封，用装有玻璃透镜的镀金或镀镍金属帽进行密封封装。所述凸体型底座有两个贯穿引出线孔，分别引出正负极引线，底座底面有内凹槽。

Description

一种热塑性塑料底座红外光敏发光二极管
技术领域
本实用新型涉及一种采用热塑性塑料为底座的新型红外光敏发光二极管，适合用于各种遥控发射、接收和电子计数整机的热塑性塑料底座红外光敏发光二极管，属光电子技术领域。 
背景技术
我国目前生产的遥控发射、接收和电子计数整机线路板配套安装的红外光敏发光二极管系列产品底座大都为金属材质，尤其是其关键技术部位的底座材料采用的是一般的普通金属或陶瓷材质、底座引出线于底座引出孔间与玻璃直接焊接、以透镜金属帽直接封装组件的工艺，制造成本高，存在着阻热性能低、电绝缘性差和密封性能差等重大缺陷，不仅降低了红外发射光敏接收性能，而且容易引发骤时短路，导致该二极管或其它元器件的失效或损坏，甚至损坏整机线路板。 
发明内容
为克服现有红外光敏发光二极管在制造成本高、阻热性能低、电绝缘性差和密封性能差的不足，本实用新型提供一种热塑性塑料底座红外光敏发光二极管。该发光二极管不仅能将绝缘电阻提高到1010Ω，而且制造成本低，电性能和机械性能优异，阻燃性能好，其突出特点是耐高温，耐腐蚀和优越的机械性能。 
本实用新型解决技术问题所采用的技术方案是：热塑性塑料底座红外光敏发光二极管底座选用硬度强、热稳定性能好、电性能优良的聚苯硫醚 (PPS)做本体材料，采用注塑排气挤出工艺经模压成型，再经过塑化、淬火处理而得到，所述热塑性塑料底座红外光敏发光二极管底座为凸体型，所述凸体型底座的凸体上方为电极区域，所述电极区域的负极引线点端点注导电银胶，置放红外或光敏芯片，另一引线为正极引线，将芯片与负极引线经金丝焊线超声球焊连通，用封装工艺注满环氧树脂安全密封，用装有玻璃透镜的镀金或镀镍金属帽进行密封封装。所述凸体型底座有两个贯穿引出线孔，分别引出正负极引线，底座底面有内凹槽。这种热塑性塑料底座红外光敏发光二极管不仅有效克服了阻热性能低、电绝缘性差和密封性能差等重大缺陷，而且发射性能好，操控性强，实现了发光二极管与遥控发射、接收和电子计数整机线路板配套安装的可靠绝缘。 
本实用新型的有益效果是：热塑性塑料底座红外光敏发光二极管适合用于各种红外发射光敏接收遥控领域，可以满足和直接配套安装于国产遥控发射、接收和电子计数整机线路板，实现了可靠绝缘，填补了国内空白，替代了金属和陶瓷底座，为用户节约了成本，可以获得较大的经济效益和社会效益。 
附图说明
下面结合附图和实施方式对本实用新型作进一步说明。 
图1是本实用新型的结构纵剖面构造图。 
在图1中：1玻璃透镜  2金属帽  3环氧树脂  4导电银胶5热塑性塑料底座  6.负极引线  7.正极引线  8芯片9.金丝焊线  10.正极标志 
具体实施方式
在图1中将金属引线支架的两根电极引线固定，正极引线点端设计成碗型、平台型电极腔，腔内点注导电银胶，上置红外或光敏芯片，形成支架组件，进电烘箱内以150°/180分钟进行凝胶烧结固化，将点有导电银胶并置有芯片的正极引线与负极引线端面通过超声用金丝球焊，用环氧树脂材料工艺固化封装，以安全保护芯片及焊接引线，玻璃透镜用金属封帽并镀金或镀镍封装为红外发射光敏接收发光二极管，最后实施支架与引线脱离工艺。 

Claims (3)

1.一种热塑性塑料底座红外光敏发光二极管，其特征是：热塑性塑料底座(5)选用聚苯硫醚做本体材料，采用注塑排气挤出工艺经模压成型，再经过塑化、淬火处理而得到。 
2.根据权利要求1所述的热塑性塑料底座红外光敏发光二极管，其特征是：热塑性塑料底座(5)为凸体型，凸体上方为电极区域，电极区域的负极引线(6)点端点注导电银胶(4)，置放红外或光敏芯片(8)，另一引线为正极引线(7)。 
3.根据权利要求1所述的热塑性塑料底座红外光敏发光二极管，其特征是：将芯片(8)与负极引线(6)经金丝焊线超声球焊连通，用封装工艺注满环氧树脂(3)安全密封，用装有玻璃透镜(1)的镀金或镀镍金属帽(2)进行密封封装，凸体型热塑性塑料底座(5)有两个贯穿引出线孔，分别引出正极引线(7)、负极引线(6)，热塑性塑料底座(5)底面有内凹槽。 
CN2012207549618U 2012-12-26 2012-12-26 一种热塑性塑料底座红外光敏发光二极管 Expired - Fee Related CN203134854U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012207549618U CN203134854U (zh) 2012-12-26 2012-12-26 一种热塑性塑料底座红外光敏发光二极管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012207549618U CN203134854U (zh) 2012-12-26 2012-12-26 一种热塑性塑料底座红外光敏发光二极管

Publications (1)

Publication Number Publication Date
CN203134854U true CN203134854U (zh) 2013-08-14

Family

ID=48942799

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012207549618U Expired - Fee Related CN203134854U (zh) 2012-12-26 2012-12-26 一种热塑性塑料底座红外光敏发光二极管

Country Status (1)

Country Link
CN (1) CN203134854U (zh)

Similar Documents

Publication Publication Date Title
US9899587B2 (en) Lead frame and light emitting diode package having the same
US20120091487A1 (en) Light emitting diode package and method for manufacturing the same
CN105765716A (zh) 功率半导体模块和复合模块
US8900895B2 (en) Method for manufacturing LED package
US20120235193A1 (en) Led package
CN104064662A (zh) 发光二极管封装结构
CN104064656A (zh) 一种具有良好防潮性能的led支架及其led器件和制备方法
CN202308051U (zh) Led封装支架及led器件
CN203967120U (zh) 一种具有良好防潮性能的led支架及其led器件
CN102760822A (zh) 发光二极管封装结构及其制造方法
CN203134854U (zh) 一种热塑性塑料底座红外光敏发光二极管
CN207458992U (zh) Led封装结构
CN102779919B (zh) 半导体封装结构
CN103427007B (zh) 发光二极管及其封装方法
CN202633053U (zh) 一种多芯组陶瓷电容器
CN201699054U (zh) 贴片发光二极管
CN209389058U (zh) 一种发光二极管
CN103346240B (zh) 一种发光二极管封装结构及方法
CN207558820U (zh) 发光二极管封装结构
CN103094450A (zh) Led封装支架、led器件及led器件的制造方法
CN212365989U (zh) 一种用于led封装的外封装胶加热机构
CN212365990U (zh) 一种用于led封装的外封装胶加热机构
CN202231060U (zh) 采用透明陶瓷支架的高效白光led封装
CN217641388U (zh) 一种防渗透的led支架结构
CN205141018U (zh) 一种发光二极管封装结构

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130814

Termination date: 20141226

EXPY Termination of patent right or utility model