CN203070258U - Infrared touch screen - Google Patents
Infrared touch screen Download PDFInfo
- Publication number
- CN203070258U CN203070258U CN 201320021138 CN201320021138U CN203070258U CN 203070258 U CN203070258 U CN 203070258U CN 201320021138 CN201320021138 CN 201320021138 CN 201320021138 U CN201320021138 U CN 201320021138U CN 203070258 U CN203070258 U CN 203070258U
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- infrared
- printed circuit
- touch
- circuit board
- pcb
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Abstract
Disclosed is an infrared touch screen. The infrared touch screen comprises printed circuit boards, infrared emission and receiving units and a glass plate, a frame is formed by the printed circuit boards, the infrared emission and receiving units are installed on the printed circuit boards, and the glass plate is used for protecting a display screen. The infrared touch screen is characterized in that the printed circuit boards are installed around the glass plate, borders of the printed circuit boards are connected with the glass plate through infrared elements welded on the printed circuit boards to from the main structure of the infrared touch screen. According to the structure of the infrared touch screen, the thicknesses of the printed circuit boards and the thickness of the protective glass plate do not needed to be increased repeatedly, and the thickness of the infrared touch screen can be minimized; meanwhile, an electrical structure similar to an externally-arranged control card of a touch screen in other types is adopted, and the widths of the printed circuit boards of the frame can be effectively reduced; and therefore the infrared touch screen is suitable for being used in displayers in various types of sizes, and the application rang of the infrared touch screen is greatly extended.
Description
Technical field
The present invention relates to field of human-computer interaction, relate in particular to a kind of mounting structure of infrared touch panel of little thickness.
Background technology
Along with the extensive of electronic product of various touch control operations popularized, the infrared touch panel technology has also experienced the progressively evolution of upgrading.In this process, occurred a variety of can with the infrared touch panel that more comes to match with frivolous display.But because the restriction of the know-why of infrared touch panel own, the width of frame and thickness are the obstacles that the puzzlement infrared touch panel is used at some small-size products always.Existing technology mainly be adopt with printed circuit board (PCB) directly stick on the cover glass, thickness and the width of technological means reduces as far as possible touch-screen frame such as plate carries the components and parts miniaturization, control card is external.But these technological means are all kept away this which floor honest and kind the adding up of unavoidable glassy layer, forme layer, components and parts layer and shell, so the frame of minimum dimension, to multipotency accomplish about thick 7mm, about wide 20mm.This is for a lot of application, and especially 10 inches with interior display, and the thickness of touch-screen is still too thick, and the width of frame is also wide.
Summary of the invention
Technical scheme
At the existing in prior technology problem, the utility model provides a kind of brand-new mounting structure to reduce width and the thickness of infrared touch panel frame.Structure of the present utility model includes P.e.c., some infrared emission and the receiving tube of welded and installed on printed circuit board (PCB) that constitutes the infrared touch panel frame, and cover glass.In structure of the present utility model, described printed circuit board (PCB) is installed round the cover glass plate, the described pipe shaft that is welded on infrared emission or receiving tube, welding end are positioned on the surface of printed circuit board (PCB), and free end stretches out within the zone that printed circuit board (PCB) is outer, the touch-screen frame surrounds; The size of described cover glass matches with the size in the zone that the printed circuit board (PCB) frame surrounds, and the marginal portion that it is used for the surface of touch operation is connected with a side of described infrared emission or receiving tube.
Further, between the touch-surface of described glass and the side that described infrared emission or receiving tube match, be connected to a fixed by bonding way.
In the utility model, the printed circuit board (PCB) of described formation touch-screen frame can constitute by two L shaped circuit boards are combined and spliced.In order to reduce the width of circuit board in the frame as far as possible, the utility model can adopt the external structure of control card, the microcontroller and the bigger integrated chip of various sizes that are used for the work of control touch-screen are installed in described control card, on the printed circuit board (PCB) that constitutes the touch-screen frame, except infrared emission and receiving tube, only include printed circuit cable and undersized components and parts like this; Be connected by the flexible wire bundle as kinds such as FPC between the circuit board of described control card and described formation touch-screen frame.
In infrared touch panel, the design difficulty that splices and combines the circuit board of structure is being connected between plate and the plate.The utility model is for fear of such problem, designed two L shaped circuit boards connecting structure for electrical equipment of being connected with control card of the flexible wire bundle by separately respectively.
Further, in order to strengthen the strength of joint between printed circuit board (PCB) and the cover glass plate, can also above the seam crossing of the printed circuit board (PCB) of described formation touch-screen frame and cover glass, also be bonded with stiffening plate.This stiffening plate can be made continuous structure; have the some broach shape breach towards the touch area direction in the position that infrared emission or receiving tube are installed; described infrared emission or receiving tube are installed within these breach, and described broach across and be bonded on the seam between printed circuit board (PCB) and the cover glass plate.
Further, can see through ultrared optical material manufacturing if stiffening plate uses, have some through holes between the upper and lower surface; Described infrared emission or receiving tube are installed within these through holes, and the sidewall of through hole is also bonding across the seam crossing of circuit board and glass plate; The antetheca of through hole is the optical transmission window of infrared components.Stiffening plate has possessed the infrared ray of seeing through simultaneously and has protected infrared emission or the function of receiving tube like this.
Infrared touch panel of the present utility model can also add protection outer cover or shell.In said structure, if the thickness of stiffening plate is not less than the thickness of infrared emission or receiving tube; So touch-screen can outside stiffening plate, add for the protection of outer cover, paste the upper surface be installed in described stiffening plate; Can also use and to see through the integrated outer cover that ultrared optical material is made; At this moment described stiffening plate is the part of touch-screen outer cover, on the surface of contact on described touch-screen outer cover and cover glass surface, has the blind hole of some depressions; Described infrared emission or receiving tube are installed within these blind holes.
Beneficial effect
The utility model has provided a kind of the add up printed circuit board (PCB) of formation infrared touch panel frame and mounting structure of cover glass plate thickness of need not repeating, and can reduce the thickness of infrared touch panel significantly; Adopt the electrical structure of the external control card that is similar to other kind touch-screen simultaneously, can effectively reduce the width of the circuit board of frame.Therefore, the thickness of infrared touch panel of the present utility model can be fit to the application of various small-medium size displays near the thickness of surface acoustic wave touch screen even capacitance touch screen very much, has expanded the range of application of infrared touch panel greatly.
Description of drawings
Fig. 1: the cross sectional representation of frame when using the straight cutting infrared components;
Fig. 2: the cross sectional representation of frame when using the surface that infrared components is installed;
Fig. 3 a～3b: a kind of structural representation and installation diagram of broach shape stiffening plate;
Fig. 4 a～4b: a kind of structural representation of stiffening plate of through-hole structure and installation diagram;
Fig. 5: the cross sectional representation that has the frame of sheet metal outer cover;
Fig. 6: the scheme of installation of L shaped frame circuit board.
Embodiment and embodiment
Describe enforcement principle of the present utility model and embodiment in detail below in conjunction with accompanying drawing.
The infrared components (power valve and receiving tube are commonly referred to as infrared components below) that is usually used in infrared touch panel has the encapsulation of two classes: straight cutting lead type and surface-mounted.Because the size of the encapsulation of straight cutting pin configuration is bigger, when stricter to the requirement of the width of touch-screen frame and thickness, the infrared components of this encapsulation is used limited more.Therefore, except embodiment 1, all the other embodiment adopt the infrared components of Surface Mount encapsulating structure.
Embodiment 1
When Fig. 1 has provided the infrared components of the utility model use straight cutting encapsulating structure, the mounting structure synoptic diagram of frame xsect.As seen from the figure, infrared components 103 is by the pin 105 of its welding end, and welded and installed is on the surface of printed circuit board (PCB) 101; And the free end 106 of infrared components 103; infrared ray emission just or the end that receives are to touch-screen inside, just the direction at cover glass plate 102 places is stretched out the edge of circuit board; and a side (being lower surface among the figure) forms a composition surface 107 with the surface (being upper surface among the figure, the surface of namely implementing touch operation) at an edge of cover glass plate 102.If use bonding agent that infrared components 103 and glass plate 102 is 107 bonding on the composition surface, can be assembled into cover glass plate and printed circuit board (PCB) frame as a whole.Because on each piece touch-screen numerous infrared componentss is arranged, and the inner down-lead bracket 104 that also has a metal of direct insertion infrared components, so the intensity of this assembly is enough used generally speaking.The additional thickness that has produced when so just having avoided circuit board 101 and glass plate superimposed about in the of 102 makes touch-screen more frivolous.If pass through the conduction of soft lead-in wire bundle 108 again, the installation site of a part of components and parts is transferred on the additional control card from frame, can also further reduce the width of circuit board 101, to adapt to the requirement that cooperates with the more and more narrow frame of present display device.
Embodiment 2
Similar to Fig. 1, when Fig. 2 is to use the infrared components of straight cutting encapsulating structure, the mounting structure synoptic diagram of frame xsect.Here change the straight cutting element into sticking-element, and provided a kind of structure of adding protection outer cover 204.Among the figure, the infrared components 201 of Surface Mount is installed in the surface of printed circuit board (PCB) 101 by welding end 202, the infrared components 103 the same edges that stretch out circuit board among free end 203 and Fig. 1, and the upper surface of side and glass plate 102 bonds together by composition surface 107.In general, although the lens component of the infrared emission of surface encapsulation or receiving tube (described free end just) also fixes by bonding with the base material of welding portion, physical strength is not very high, but same because infrared components One's name is legion, so can both satisfy requirement to intensity generally speaking.Outer cover among the figure (shell) 204 this use can see through infrared ray but the optical material of the visible light of decaying by the injection moulding manufacturing, the components and parts on can the holding circuit plate can see through infrared ray again and not influence the touch-screen operate as normal.What provide among Fig. 2 is a kind of cross-sectional structure of this outer cover, namely has groove holding infrared components 201 at the bearing of trend along glass plate or frame, but and has other structures will illustrate in other embodiments for selecting for use.
Embodiment 3
Fig. 3 a～3b is a kind of structure in order to strength of joint between accentuator plate and the cover glass plate.The position that broach shape stiffening plate 301 shown in Fig. 3 a is installed in shown in Fig. 3 b, the broach part 302 of broach shape stiffening plate is across the seam crossing of circuit board 101 with glass plate 102, it is bonding to re-use bonding agent, just can improve the bond strength between glass plate and the frame significantly.Because infrared components 201 is positioned among the space 303 of broach, and can control relation between the thickness of the thickness of stiffening plate and infrared components, so this mounting structure can not influence the thickness of whole touch screen, also can not influence the wiring of touch-screen basically.
Embodiment 4
Shown in Fig. 4 a～4b, it is the another kind of structure in order to strength of joint between accentuator plate and the cover glass plate.Here, use can see through the structure of the stiffening plate 401 that ultrared optical material makes shown in Fig. 4 a, is the stiffening plate that has through hole 402 between a kind of upper and lower surface, and infrared components 201 is installed in these through holes.Similar with Fig. 3, the sidewall of through hole 402 adds the antetheca 404 at glass surface across the seam crossing of circuit board 101 with glass plate 102, and it is bonding to re-use bonding agent.Because stiffening plate infrared optical material manufacturing, so in fact the antetheca 404 of through hole still is the optical transmission window of infrared components.This structure can increase substantially the bond strength between glass plate and the frame equally, has also solved the problem of optical transmission window simultaneously, is a kind of more excellent organization plan.
Embodiment 5
What embodiment 3,4 provided all is the basic structure of " naked screen ", because not protection, so in some practical application, can be subjected to some restrictions.Fig. 5 is according to the given structure of Fig. 4; upper surface at touch-screen has increased a protection outer cover (shell or protective seam) 501; as shown in Figure 5; under the situation that can satisfy the major applications demand; basically can not increase the thickness of touch-screen; be the thick sheet metal of 0.1～0.2mm or plastic plate such as used thickness, even the higher adhesive tape of intensity, bond to the upper surface of touch-screen stiffening plate 401.If the use sheet metal is because metal is conductor, so the thickness of stiffening plate more preferably greater than the thickness of infrared components, more is conducive to electric insulation.
Embodiment 6
Of the present utility model can also the employing can see through the integrated outer cover that ultrared optical material is made.Referring to Fig. 5, equal the fender of the described optical material manufacturing of protection outer cover 501 usefulness among Fig. 5 is replaced, and become one with modes such as injection moulding, bonding or welding.At this moment, stiffening plate is the part of touch-screen outer cover, from figure below, be equivalent on the surface of contact on outer cover and cover glass surface, have some blind holes; After described infrared emission or receiving tube are mounted, just in time be positioned within these blind holes.The structure of this embodiment can be referring to Fig. 2 at the synoptic diagram of the xsect of blind hole position.
Embodiment 7
The present invention be different from circuit board that general infrared touch panel adopts and glass plate stacked, big overlapping structure is arranged between mutually, and the width of circuit board is very little, and therefore two problems that relatively are difficult to solve are arranged.One (whole frame when being to use the integrated frame of printed circuit board (PCB), dig up the part that the glass plate position is installed from printed circuit board (PCB)), quality of fit problem between P.e.c. sheet frame inside dimension and the glass plate overall size, when especially using the infrared components of Surface Mount encapsulation, components and parts small-sized can not provide very big tolerance surplus; The 2nd, during the frame of splicing construction (frame is spliced by 4 or more printed circuit board (PCB)s), the problem that is electrically connected between each circuit board.Present embodiment has provided a kind of technical scheme that can address this problem simultaneously, and namely frame uses the circuit board of L type.
Fig. 6 has provided the synoptic diagram of this technical scheme.As shown in the figure, when two block weldings have the L shaped circuit board 601,602 of infrared components to cooperate with glass plate 102 along the direction shown in the arrow, as long as the angle that cuts that cuts angle and glass plate edge of control circuit board inboard equates that circuit board just can agree with fully with glass plate.For avoiding the puzzlement that line causes between plate, can also arrange one as the soft lead-in wire bundle of FPC structure at each piece circuit board, realize being electrically connected with control card respectively.As for the processing of L shaped circuit board, can adopt the mode that tilts to cut out to cut out from the starting material of printed circuit board (PCB), compare with the bar shaped connecting method, only wasted a spot of tailing; But compare with the circuit board of integral structure, then saved starting material greatly.
The main target of the technical scheme that above-described embodiment is given is the thickness that reduces touch-screen.But the width of touch-screen frame also is the further parameters of reduction of needs.In order to reduce the width of the circuit board that constitutes the touch-screen frame, the utility model has adopted the structure of external control card.The microcontroller and the bigger integrated chip of various sizes that are used for the work of control touch-screen, be installed on the control card, like this on the printed circuit board (PCB) that constitutes the touch-screen frame, except infrared emission and receiving tube, only include printed circuit cable and undersized components and parts, avoided the problem that to reduce border width because the installation dimension of components and parts is excessive.As for the wiring on the frame printed circuit board (PCB), then can solve with multilayer board.Between the circuit board of control card and frame, be connected by the flexible wire bundle 108 as kinds such as FPC.
It should be noted that at last the technical solution of the utility model is not limited to the concrete technical scheme among each embodiment, constitute the frame of touch-screen such as the mode that can use many circuit board splicings fully.Therefore should be appreciated that carrying out equivalents, transplanting, replacement or deterioration in the scope that does not break away from technological thought of the present utility model all belongs to the claimed scope of the utility model.
Claims (10)
1. infrared touch panel, include the P.e.c. that constitutes the infrared touch panel frame, welded and installed some infrared emission and the receiving tube, cover glass on printed circuit board (PCB), it is characterized in that: described printed circuit board (PCB) is installed round the cover glass plate, described infrared emission on the printed circuit board (PCB) or the pipe shaft of receiving tube of being welded on, welding end is positioned on the surface of printed circuit board (PCB), and free end stretches out within the zone that printed circuit board (PCB) is outer, the touch-screen frame surrounds; The size of described cover glass matches with the size in the zone that the printed circuit board (PCB) frame surrounds, and the marginal portion that it is used for the surface of touch operation is connected with a side of described infrared emission or receiving tube.
2. infrared touch panel according to claim 1 is characterized in that: between the touch-surface of described glass and the side that described infrared emission or receiving tube match, be connected to a fixed by bonding way.
3. infrared touch panel according to claim 1 is characterized in that: the printed circuit board (PCB) of described formation touch-screen frame constitutes by two L shaped circuit boards are combined and spliced.
4. according to claim 1 or 3 described infrared touch panels, it is characterized in that: described infrared touch panel also includes a control card, the microcontroller and the bigger integrated chip of various sizes that are used for the work of control touch-screen are installed in described control card, on the printed circuit board (PCB) of described formation touch-screen frame, except infrared emission and receiving tube, only include printed circuit cable and undersized components and parts; Be connected by the flexible wire bundle between the circuit board of described control card and described formation touch-screen frame.
5. infrared touch panel according to claim 4 is characterized in that: described two L shaped circuit boards flexible wire bundle by separately respectively are connected with control card.
6. infrared touch panel according to claim 1 is characterized in that: also be bonded with stiffening plate above the seam crossing of the printed circuit board (PCB) of described formation touch-screen frame and cover glass.
7. infrared touch panel according to claim 6; it is characterized in that: described stiffening plate has the some broach shape breach towards the touch area direction in the position that infrared emission or receiving tube are installed; described infrared emission or receiving tube are installed within these breach, described broach across and be bonded on the seam between printed circuit board (PCB) and the cover glass plate.
8. infrared touch panel according to claim 6 is characterized in that: described stiffening plate uses can see through ultrared optical material manufacturing, has some through holes between the upper and lower surface; Described infrared emission or receiving tube are installed within these through holes, and the sidewall of through hole is also bonding across the seam crossing of circuit board and glass plate, and the antetheca of through hole is the optical transmission window of infrared components.
9. infrared touch panel according to claim 8, it is characterized in that: described touch-screen also includes outer cover; Described outer cover is pasted the upper surface that is installed in described stiffening plate.
10. according to claim 6 or 8 described infrared touch panels, it is characterized in that: described touch-screen also includes use can see through the integrated outer cover that ultrared optical material is made; Described stiffening plate is the part of touch-screen outer cover, on the surface of contact on described touch-screen outer cover and cover glass surface, has the blind hole of some depressions; After being mounted, described infrared emission or receiving tube be positioned within these blind holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320021138 CN203070258U (en) | 2013-01-15 | 2013-01-15 | Infrared touch screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320021138 CN203070258U (en) | 2013-01-15 | 2013-01-15 | Infrared touch screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203070258U true CN203070258U (en) | 2013-07-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320021138 Expired - Fee Related CN203070258U (en) | 2013-01-15 | 2013-01-15 | Infrared touch screen |
Country Status (1)
| Country | Link |
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| CN (1) | CN203070258U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104699326A (en) * | 2013-12-06 | 2015-06-10 | 深圳市天时通科技有限公司 | Novel infrared touch control screen and touch control display device |
-
2013
- 2013-01-15 CN CN 201320021138 patent/CN203070258U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104699326A (en) * | 2013-12-06 | 2015-06-10 | 深圳市天时通科技有限公司 | Novel infrared touch control screen and touch control display device |
| WO2015081637A1 (en) * | 2013-12-06 | 2015-06-11 | 深圳市天时通科技有限公司 | Infrared touch screen and touch-control display device |
| CN104699326B (en) * | 2013-12-06 | 2020-07-14 | 深圳市天英联合教育股份有限公司 | Novel infrared touch screen and touch display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130717 Termination date: 20160115 |
|
| EXPY | Termination of patent right or utility model |