CN205648189U - Flexible line way board and display device - Google Patents
Flexible line way board and display device Download PDFInfo
- Publication number
- CN205648189U CN205648189U CN201620483592.1U CN201620483592U CN205648189U CN 205648189 U CN205648189 U CN 205648189U CN 201620483592 U CN201620483592 U CN 201620483592U CN 205648189 U CN205648189 U CN 205648189U
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- copper foil
- element region
- pad area
- district
- circuit board
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Abstract
The utility model provides a flexible line way board and display device, this display device contain this flexible line way board. Flexible line way board includes: flexible parent metal, flexible parent metal include the basement and set up the one deck copper foil layer in the basement, the copper foil layer includes: pad area, element region, ground connection copper foil district and at least one fretwork district, pad area, element region and ground connection copper foil district all set up the copper foil, do not set up the copper foil in the fretwork district, the pad area is used for welding electron device, the element region is used for setting up electronic component, ground connection copper foil district for provide the earthing potential, ground connection copper foil district centers on pad area and element region, and ground connection copper foil district and pad area and the insulating setting of element region electrical property, at least one fretwork district sets up between pad area and element region. The utility model discloses a set up the fretwork district and effectively avoided the harm of flexible line way board soldering tin in -process high temperature to the element region, promoted the reliability of flexible line way board, promoted the reliability of using this flexible line way board simultaneously.
Description
Technical field
This utility model relates to a kind of flexible circuit board and uses the display device of this kind of flexible circuit board.
Background technology
Flexible PCB (Flexible Printed Circuit board, FPC) possesses flexible feature, extensively
Applying in each electronic product, wherein the reliability to flexible PCB proposes higher requirement, existing
Having the flexible PCB in technology, its pad area is close together with element region, carries out scolding tin work at pad area
During industry, can make the high temperature that pad area local reaches 300 DEG C to 460 DEG C, heat can be by flexible circuit board
Copper Foil be rapidly transferred to element region, element region local is affected by high temperature is easy to occur what stress was concentrated
Phenomenon causes element region to walk thread breakage, and high temperature can cause electronic building brick and the flexible circuit board of element region
Junction point melts, and makes product the situation that electric function lost efficacy occur, ultimately results in the reliable of flexible circuit board
Property is low.
Utility model content
This utility model provides a kind of flexible circuit board and applies the display device of this kind of flexible circuit board, logical
Cross and vacancy section is set on the copper foil layer of flexible circuit board, heat during to intercept solder pad district electronic device
Propagate to element region, promote the reliability of flexible circuit board.
For achieving the above object, the technical scheme that this utility model provides is as follows:
A kind of flexible circuit board, including: flexible parent metal, described flexible parent metal includes substrate and is arranged at institute
State suprabasil one layer of copper foil layer；
Described copper foil layer includes: pad area, element region, ground connection Copper Foil district and at least one vacancy section, institute
State pad area, described element region and described ground connection Copper Foil district and be respectively provided with Copper Foil, be not provided with in described vacancy section
Described Copper Foil；Described pad area is used for welding electronic device；Described element region is used for arranging electronic building brick；
Described ground connection Copper Foil district, is used for providing earthing potential；
Described ground connection Copper Foil district is around described pad area and described element region, and described ground connection Copper Foil district and institute
State pad area and described element region is electrically insulated setting；At least one described vacancy section is arranged on described pad
Between district and described element region.
Preferably, described vacancy section is by through to the described copper foil layer of described substrate.
Preferably, described vacancy section projection of shape on the substrate is by the polygon diagram of rectilinear(-al)
One in case, the polygon pattern being made up of curve or the polygon pattern being made up of straight line and curve.
Preferably, multiple described vacancy sections are arranged around described pad area interval.
Preferably, described flexible circuit board also includes reinforced structure, and described reinforced structure corresponds to described electricity
Sub-component is arranged, and is used for keeping described flexible parent metal smooth.
Preferably, described substrate is by polyimides, Merlon, PEN, polyethers
A kind of formation in sulfone, polyethylene terephthalate, polyarylate or fibre glass reinforced plastics.
Accordingly, this utility model additionally provides a kind of display device, and described display device includes above-mentioned
Flexible circuit board.
As shown in the above, the technical scheme that this utility model provides is by the Copper Foil on flexible parent metal
Vacancy section is set on Ceng, especially arranges by the vacancy section of through to the described copper foil layer of described substrate, in weldering
Can effectively weaken the heat of pad area when panel carries out scolding tin operation to transmit to element region, it is to avoid high temperature
Impact on element region electronic building brick, it is ensured that the electrical characteristic of element region electronic building brick, improves flexibility
The reliability of wiring board, and then improve the reliability of the display device using this kind of flexible circuit board.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme of this utility model embodiment, embodiment will be described below
The accompanying drawing used required in is briefly described, it should be apparent that, the accompanying drawing in describing below is only
Embodiment of the present utility model, for those of ordinary skill in the art, is not paying creative work
On the premise of, it is also possible to other accompanying drawing is obtained according to the accompanying drawing provided.
A kind of flexible circuit board schematic top plan view that Fig. 1 provides for this utility model；
Fig. 2 is the flexible circuit board generalized section intercepted along AA ' line in Fig. 1；
The another kind of flexible circuit board schematic top plan view that Fig. 3 provides for this utility model；
Fig. 4 is the flexible circuit board generalized section intercepted along AA ' line in Fig. 3.
Detailed description of the invention
It is more fully described this utility model, with the ordinary skill people for this area now with reference to accompanying drawing
Execution this utility model of hell and high water can be had no for Yuan.But, this utility model can be with many
Different forms is implemented, and should not be construed as limited embodiment set forth herein.
It addition, in accompanying drawing with describe in detail unrelated part be sometimes omitted to guarantee of the present utility model clearly
Clear.The element that the most same reference instruction is same, therefore their description will not be repeated.
By explanation by the same element of same reference instruction in representational first embodiment,
Will focus on the embodiment that other is described on element different from the element in first embodiment.
Each accompanying drawing is not drawn necessarily to scale.In the accompanying drawings, for the ease of explaining, element is arbitrarily shown
Size and thickness, therefore this utility model is not limited to this.
Each layer being for the sake of clarity exaggerated in accompanying drawing and the thickness in region.For the ease of explaining, overstate
The bigger thickness of layers and region.It will be appreciated that when layer, film, region or plate be referred to as " "
Another layer, film, region or plate " on " time, its can directly on another layer, film, region or plate,
Or layer, film, region or the panel element of centre can be there is.
Embodiment one
Refer to accompanying drawing 1 and accompanying drawing 2, a kind of flexible circuit board that accompanying drawing 1 provides for this utility model is bowed
Depending on schematic diagram, Fig. 2 is the flexible circuit board generalized section intercepted along AA ' line in Fig. 1.This practicality is new
The flexible circuit board 1 that type provides, including: flexible parent metal 10, flexible parent metal includes substrate 101 and arranges
One layer of copper foil layer 106 in substrate 101；Copper foil layer 106 includes: pad area 1061, element region 1062,
Ground connection Copper Foil district 1063 and at least one vacancy section 1066, pad area 1061, element region 1062 and ground connection
Copper Foil district 1063 is respectively provided with Copper Foil, is not provided with Copper Foil in vacancy section 1066；Pad area 1061 is used for welding
Electronic device；Element region 1062 is used for arranging electronic building brick；Ground connection Copper Foil district 1063, connects for offer
Earth potential；Ground connection Copper Foil district 1063 is around pad area 1061 and element region 1062, and ground connection Copper Foil district 1063
It is electrically insulated setting with pad area 1061 and element region 1062；At least one vacancy section 1066 is arranged on weldering
Between panel 1061 and element region 1062.Wherein electronic device can be another flexible circuit board, electricity
Sub-component can be resistance, electric capacity, diode, audion, integrated circuit etc..Soft shown in Fig. 2
Property wiring board 1 also include adhering agent layer 102 and protective layer 103, adhering agent layer 102 is for by protective layer
103 are attached on copper foil layer 106, and protective layer 103 covers copper foil layer 106, are used for preventing copper foil layer 106
Oxidation, the material forming protective layer 103 can be identical with the material forming substrate 101, and substrate 101 can
With by polyimides, Merlon, PEN, polyether sulfone, poly terephthalic acid second
A kind of formation in diol ester, polyarylate or fibre glass reinforced plastics.In Fig. 2, vacancy section 1066 is for setting
Put and made after protective layer 103, vacancy section 1066 is through protective layer 103, adhering agent layer 102 and copper
Layers of foil 106；Preferably, vacancy section 1066 arranging protective layer 103 and can also arrange adhering agent layer 102
Arranging, now vacancy section 1066 will not through protective layer 103 and adhering agent layer 102 before；Preferably,
Vacancy section 1066 can also be by the most through for substrate 101.
Fig. 1 shows and only arranges on copper foil layer 106 between pad area 1061 and element region 1062
The situation of one section of vacancy section 1066, this kind arranges and can effectively weaken pad area 1061 and carry out scolding tin operation
Time, the heat of pad area 1061 is directly by the copper foil layer between pad area 1061 and original paper district 1062
106 are delivered to element region 1062, the impact on element region 1062 cabling of high temperature when reducing scolding tin operation,
Avoid the junction point of the electronic building brick in element region 1062 and flexible circuit board 1 because of high temperature melting, lifting
The reliability of flexible circuit board 1.
The another kind of flexible circuit board schematic top plan view that Fig. 3 provides for this utility model；Fig. 4 is in Fig. 3
The flexible circuit board schematic diagram intercepted along AA ' line.Fig. 3 is provided with multiple hollow out around pad area 3061
District 3066, multiple vacancy sections 3066 around pad area 3061 interval arrange, multiple vacancy sections 3066 by
Substrate 301 is through to copper foil layer 306 as shown in Figure 4, and the set-up mode of this multiple vacancy sections 3066 can
The heat produced during effectively to prevent pad area 3061 scolding tin operation spreads to periphery.Although shown in Fig. 3
The vacancy section, two ends 3066 projection in substrate 301 be by the polygon pattern of rectilinear(-al), but hollow out
The district 3066 projection of shape in substrate 301 can also is that the polygon pattern being made up of curve or by straight line
One with the polygon pattern of curve composition.Two elements it are provided with in flexible circuit board 1 in Fig. 3
District 3062, those skilled in the art are it is understood that arranging of element region 3062 can be made according to customer requirement
Going out corresponding change, this utility model not setting to element region 3062 makes restriction, typically away from weldering
The electronic building brick that element region 3062 part in panel 3061 is arranged is integrated circuit (not shown), can simultaneously
Arranging reinforced structure (not shown) at corresponding Integrated circuit portion, reinforced structure is arranged on flexible parent metal the back of the body
From the side of integrated circuit, being used for maintaining flexible parent metal smooth, this is routine techniques means, the most no longer
Repeat.
Fig. 4 also show the situation being provided with two-layer copper foil layer at substrate 308 homonymy, two-layer Copper Foil
Layer includes the first copper foil layer 308 and copper foil layer 306, between the first copper foil layer 308 and copper foil layer 306
Being additionally provided with adhering agent layer 302 and insulating barrier 304, the material forming insulating barrier 304 can be with formation base
The material at the end 301 is identical.Institute between through substrate 301 to the copper foil layer 306 in vacancy section 3066 in figure
There is film layer, effectively intercepted the heat transmission to element region.Developing Tendency along with flexible circuit board fine
Gesture, substrate 301 can arrange multilamellar the first copper foil layer 308, correspondingly, the first copper foil layer 308 with
Between copper foil layer 306 and between the first copper foil layer 308, insulating barrier 304 is set.It is understandable that Fig. 4
In illustrate only two-layer copper foil layer and be positioned at the situation of substrate 301 homonymy, those skilled in the art it is understood that
Two-layer copper foil layer can be arranged on the both sides of substrate 301, still can take by arranging vacancy section 3066
Obtain identical technique effect.
Embodiment two
This utility model additionally provides a kind of display device, and described display device includes above-mentioned flexible circuitry
Plate.By the flexible circuit board using this utility model to provide, the electrical characteristic of display device gets a promotion.
Described display device can be the display devices such as liquid crystal display, Electronic Paper, OLED display with
And include that the TV of these display devices, digital camera, mobile phone, panel computer etc. are any there is display merit
The product of energy or parts.
The above, detailed description of the invention the most of the present utility model, but protection domain of the present utility model
It is not limited thereto, the technology model that any those familiar with the art discloses at this utility model
In enclosing, the change that can readily occur in or replacement, all should contain within protection domain of the present utility model.
Therefore, protection domain of the present utility model should be as the criterion with described scope of the claims.
Claims (8)
1. a flexible circuit board, it is characterised in that including: flexible parent metal, described flexible parent metal includes
Substrate and be arranged at described suprabasil one layer of copper foil layer；
Described copper foil layer includes: pad area, element region, ground connection Copper Foil district and at least one vacancy section, described
Pad area, described element region and described ground connection Copper Foil district are respectively provided with Copper Foil, are not provided with described in described vacancy section
Copper Foil；Described pad area is used for welding electronic device；Described element region is used for arranging electronic building brick；Described connect
Copper Foil district, ground, is used for providing earthing potential；
Described ground connection Copper Foil district is around described pad area and described element region, and described ground connection Copper Foil district is with described
Pad area and described element region are electrically insulated setting；At least one described vacancy section be arranged on described pad area and
Between described element region.
2. flexible circuit board as claimed in claim 1, it is characterised in that described vacancy section is by described base
Through to the described copper foil layer in the end.
3. flexible circuit board as claimed in claim 1, it is characterised in that described vacancy section is at described base
Polygon pattern that projection of shape at the end by the polygon pattern of rectilinear(-al), is made up of curve or by directly
One in the polygon pattern of line and curve composition.
4. flexible circuit board as claimed in claim 1, it is characterised in that multiple described vacancy sections around
Described pad area interval is arranged.
5. flexible circuit board as claimed in claim 1, it is characterised in that also include reinforced structure, institute
State reinforced structure to arrange corresponding to described electronic building brick, be used for keeping described flexible parent metal smooth.
6. flexible circuit board as claimed in claim 1, it is characterised in that in described substrate, multilamellar is set
First copper foil layer, between described first copper foil layer and described copper foil layer and between adjacent described first copper foil layer
Insulating barrier is set.
7. flexible circuit board as claimed in claim 1, it is characterised in that described substrate by polyimides,
Merlon, PEN, polyether sulfone, polyethylene terephthalate, polyarylate or
A kind of formation in fibre glass reinforced plastics.
8. a display device, it is characterised in that include as arbitrary in claim 1～7 as described in flexible wires
Road plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620483592.1U CN205648189U (en) | 2016-05-24 | 2016-05-24 | Flexible line way board and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620483592.1U CN205648189U (en) | 2016-05-24 | 2016-05-24 | Flexible line way board and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205648189U true CN205648189U (en) | 2016-10-12 |
Family
ID=57052673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620483592.1U Active CN205648189U (en) | 2016-05-24 | 2016-05-24 | Flexible line way board and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205648189U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793458A (en) * | 2016-12-15 | 2017-05-31 | 北京小鸟看看科技有限公司 | Printed circuit board, printing buck plate and electronic equipment for heating element |
| CN107134443A (en) * | 2017-06-23 | 2017-09-05 | 厦门天马微电子有限公司 | The method for packing of chip on film, display device and integrated circuit |
| CN108012405A (en) * | 2017-11-29 | 2018-05-08 | 武汉天马微电子有限公司 | Flexible circuit board and display device |
| CN108901125A (en) * | 2018-08-20 | 2018-11-27 | 索尔思光电（成都）有限公司 | A kind of printed wiring board, optical transceiver module and optical module |
-
2016
- 2016-05-24 CN CN201620483592.1U patent/CN205648189U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793458A (en) * | 2016-12-15 | 2017-05-31 | 北京小鸟看看科技有限公司 | Printed circuit board, printing buck plate and electronic equipment for heating element |
| CN106793458B (en) * | 2016-12-15 | 2023-11-24 | 北京小鸟看看科技有限公司 | Printed circuit board, printed assembly board and electronic equipment for heating element |
| CN107134443A (en) * | 2017-06-23 | 2017-09-05 | 厦门天马微电子有限公司 | The method for packing of chip on film, display device and integrated circuit |
| CN107134443B (en) * | 2017-06-23 | 2019-09-03 | 厦门天马微电子有限公司 | The packaging method of flip chip, display device and integrated circuit |
| CN108012405A (en) * | 2017-11-29 | 2018-05-08 | 武汉天马微电子有限公司 | Flexible circuit board and display device |
| CN108012405B (en) * | 2017-11-29 | 2020-05-12 | 武汉天马微电子有限公司 | Flexible circuit board and display device |
| CN108901125A (en) * | 2018-08-20 | 2018-11-27 | 索尔思光电（成都）有限公司 | A kind of printed wiring board, optical transceiver module and optical module |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |