CN203068871U - Semiconductor refrigeration cooling device - Google Patents
Semiconductor refrigeration cooling device Download PDFInfo
- Publication number
- CN203068871U CN203068871U CN 201220718507 CN201220718507U CN203068871U CN 203068871 U CN203068871 U CN 203068871U CN 201220718507 CN201220718507 CN 201220718507 CN 201220718507 U CN201220718507 U CN 201220718507U CN 203068871 U CN203068871 U CN 203068871U
- Authority
- CN
- China
- Prior art keywords
- heat
- semiconductor refrigeration
- cooling device
- semiconductor
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a refrigeration device, in particular to a semiconductor refrigeration cooling device. The semiconductor refrigeration cooling device is provided with a square shell body which is made of thermal insulation materials. Heat dissipation water tanks are arranged on four side faces inside the shell body, and the four heat dissipation water tanks are communicated through pipelines and provided with circulating water inlets and outlets. Semiconductor refrigeration devices are attached to the outer walls of the heat dissipation water tanks, and heat conduction plates are adhered to side faces of the semiconductor refrigeration devices. The four heat conduction plates are all provided with circular arc grooves, and the four heat conduction plates define a circular area to be cooled in an enclosing mode. Thermal insulation materials are filled in gap parts between the shell body and the area to be cooled. The thermal insulation materials are foam expanded materials. The semiconductor refrigeration cooling device is reasonable in structural design, good in refrigeration effect and high in cooling efficiency. Compared with a traditional refrigerant cooling mode, the semiconductor refrigeration cooling device has the advantages of free of refrigerants harmful to the environment, low in noise, high in heat transmission efficiency, and the like.
Description
Technical field
The utility model relates to a kind of refrigerating plant, specifically relates to a kind of semiconductor refrigerating heat sink.
Background technology
For the reaction vessel that for example temperature change is had relatively high expectations, its cooling efficient directly influences reaction rate, even the success or failure of reaction.
The utility model content
At the technical problem that exists in the prior art, the utility model provides a kind of semiconductor refrigerating heat sink of reasonable in design.
To achieve these goals, the technical scheme of employing is as follows:
The semiconductor refrigerating heat sink is characterized in that, has,
The housing that is square is made by heat-barrier material;
Four sides are equipped with cooling water tank in the housing, and four cooling water tanks are communicated with by pipeline, and are provided with circulating water intake and outlet;
The cooling water tank outer wall is stained with semiconductor cooling device, and the side of semiconductor cooling device is stained with heat-conducting plate;
Four heat-conducting plates are equipped with the groove that is circular arc, and four heat-conducting plates surround circle and treat the cooling zone.
Further, described housing and the gap of waiting to lower the temperature between the zone all are filled with heat-barrier material.
Further, described heat-barrier material is the frostproof froth n material.
The utility model semiconductor refrigerating heat sink, reasonable in design, good refrigeration effect, cooling efficient height.Compare with the conventional refrigerants cooling method, have no environmentally harmful cold-producing medium, little, the rate of heat transfer advantages of higher of noise.
Description of drawings
For the ease of it will be appreciated by those skilled in the art that below in conjunction with accompanying drawing the utility model is further described.
Fig. 1 is structural representation of the present utility model.
The specific embodiment
See also Fig. 1, the semiconductor refrigerating heat sink has the housing 2 that is square, is made by heat-barrier material, and housing 2 interior four sides are equipped with 3, four cooling water tanks of cooling water tank 3 and are communicated with by pipeline 9, and is provided with circulating water intake 8 and outlet 1.
Cooling water tank 3 outer walls are stained with semiconductor cooling device 7, and the side of semiconductor cooling device 7 is stained with heat-conducting plate 6.
Four heat-conducting plates 6 are equipped with the groove that is circular arc, and four heat-conducting plates 6 surround circle and treat cooling zone 5.
In order to improve heat insulation effect and cooling efficient, housing 2 all is filled with heat-barrier material 4 with the gap of waiting to lower the temperature between regional 5.
As preferably, above-mentioned heat-barrier material all is preferably frostproof froth n material (in the prior art common heat preserving and insulating material).
As a kind of concrete embodiment, treat that cooling zone 5 is the reaction vessel put area, when needs are lowered the temperature, start semiconductor cooling device 7, heat is passed in the semiconductor cooling device 7 through heat-conducting plate 6, last heat is taken out of to environment by the water in the cooling water tank 3, thereby plays the purpose of cooling.
Above content only is to the utility model structure example and explanation; under those skilled in the art described specific embodiment is made various modifications or replenish or adopt similar mode to substitute; only otherwise depart from the structure of utility model or surmount the defined scope of these claims, all should belong to protection domain of the present utility model.
Claims (3)
1. the semiconductor refrigerating heat sink is characterized in that, have,
The housing that is square is made by heat-barrier material;
Four sides are equipped with cooling water tank in the housing, and four cooling water tanks are communicated with by pipeline, and are provided with circulating water intake and outlet;
The cooling water tank outer wall is stained with semiconductor cooling device, and the side of semiconductor cooling device is stained with heat-conducting plate;
Four heat-conducting plates are equipped with the groove that is circular arc, and four heat-conducting plates surround circle and treat the cooling zone.
2. semiconductor refrigerating heat sink according to claim 1 is characterized in that, described housing and the gap of waiting to lower the temperature between the zone all are filled with heat-barrier material.
3. semiconductor refrigerating heat sink according to claim 1 and 2 is characterized in that, described heat-barrier material is the frostproof froth n material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220718507 CN203068871U (en) | 2012-12-24 | 2012-12-24 | Semiconductor refrigeration cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220718507 CN203068871U (en) | 2012-12-24 | 2012-12-24 | Semiconductor refrigeration cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203068871U true CN203068871U (en) | 2013-07-17 |
Family
ID=48767650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220718507 Expired - Fee Related CN203068871U (en) | 2012-12-24 | 2012-12-24 | Semiconductor refrigeration cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203068871U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105119210A (en) * | 2015-08-26 | 2015-12-02 | 芜湖市凯鑫避雷器有限责任公司 | High-voltage wall bushing semiconductor refrigeration device |
-
2012
- 2012-12-24 CN CN 201220718507 patent/CN203068871U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105119210A (en) * | 2015-08-26 | 2015-12-02 | 芜湖市凯鑫避雷器有限责任公司 | High-voltage wall bushing semiconductor refrigeration device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130717 Termination date: 20141224 |
|
| EXPY | Termination of patent right or utility model |