CN204285886U - Semiconductor refrigerating heating cycle system - Google Patents
Semiconductor refrigerating heating cycle system Download PDFInfo
- Publication number
- CN204285886U CN204285886U CN201420731575.6U CN201420731575U CN204285886U CN 204285886 U CN204285886 U CN 204285886U CN 201420731575 U CN201420731575 U CN 201420731575U CN 204285886 U CN204285886 U CN 204285886U
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- semiconductor
- heat
- heating cycle
- cycle system
- integration module
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Abstract
The utility model discloses a kind of semiconductor refrigerating heating cycle system, belong to refrigerating and heat-supplying technical field.This semiconductor refrigerating heating cycle system comprises cross flow fan, negative pressure heat exchanging chamber, gas-liquid heat-exchange, water circulating pump, water tank, semiconductor integration module, heat pipe fin radiator, radiator fan and heat-preservation cotton and pipeline parts.The utility model mainly solves that cooling in summer and heating in winter, direct current or battery Direct driver, circulating system structure are simple, heating efficiency high-technology problem.Huyashi-chuuka (cold chinese-style noodles) and the semiconductor integration module SAPMAC method loop of semiconductor chilling plate are adjacent to, hot side and the semiconductor integration module soft circulation circuit of semiconductor are adjacent to, and during refrigeration, semiconductor huyashi-chuuka (cold chinese-style noodles) produces cold and just taken away by the liquid in system, distributed by cross flow fan again, reach the object of refrigeration; The heat part that semiconductor hot side produces is taken away by the liquid in system, and another part heat passes to heat-pipe radiator, being distributed all external worlds by radiator fan, reaches the object of heat of cooling closed circuit.This semiconductor refrigerating heating cycle system has simply, low noise, environmental protection, safety, easy accessibility feature.
Description
Technical field
The utility model relates to a kind of refrigeration system, particularly a kind of semiconductor refrigerating heating cycle system.
Background technology
Utilize the Peltier effect of semi-conducting material, when the galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, heat can be absorbed at the two ends of galvanic couple respectively and release heat, realizing the object of refrigerating and heat-supplying.A lot of refrigeration air-conditioner all needs refrigerant at present, and cold-producing medium has pollution to environment, and refrigeration compressor has noise, the shortcomings such as volume is large, complex structure.All can to changing the pollution caused in various degree into when combustion heat supplying with coal-fired or combustion gas, especially the discharge of NOx is quite serious to the destruction of environment.
Utility model content
The deficiency that the utility model exists for above-mentioned prior art, provides a kind of semiconductor refrigerating heating cycle system.This semiconductor refrigerating heating cycle system has refrigeration and heating function simultaneously, and has that structure is simple, volume is little, the feature of easy accessibility, low noise, no pollution.
This semiconductor refrigerating heating cycle system comprises cross flow fan, negative pressure heat exchanging chamber, gas-liquid heat-exchange, water circulating pump, water tank, semiconductor integration module, heat pipe fin radiator, radiator fan and heat-preservation cotton and pipeline parts.The utility model mainly solves that cooling in summer and heating in winter, direct current or battery Direct driver, circulating system structure are simple, heating efficiency high-technology problem.Huyashi-chuuka (cold chinese-style noodles) and the semiconductor integration module SAPMAC method loop of semiconductor chilling plate are adjacent to, hot side and the semiconductor integration module soft circulation circuit of semiconductor are adjacent to, and during refrigeration, semiconductor huyashi-chuuka (cold chinese-style noodles) produces cold and just taken away by the liquid in system, distributed by cross flow fan again, reach the object of refrigeration; The heat part that semiconductor hot side produces is taken away by the liquid in system, and another part heat passes to heat-pipe radiator, being distributed all external worlds by radiator fan, reaches the object of heat of cooling closed circuit.
Be adjacent to semiconductor integration module upper part lower surface after heat-conducting silicone grease coated by the huyashi-chuuka (cold chinese-style noodles) of the utility model semiconductor chilling plate, be adjacent to semiconductor integration module lower part upper surface after the hot side of semiconductor coats heat-conducting silicone grease; During refrigeration, semiconductor huyashi-chuuka (cold chinese-style noodles) generation cold is just recycled the liquid absorption in system, and liquid is taken to gas-liquid heat-exchange by water circulating pump cold liquid and by cross flow fan, cold discharged, reaches the object of refrigeration.Heat-conducting silicone grease is all coated in semiconductor chilling plate two sides.Semiconductor chilling plate two sides and semiconductor integration module inner surface are adjacent to.Semiconductor integration module and heat exchanger, water circulating pump, water tank form closed circuit.Cross flow fan and negative pressure heat exchanging chamber are connected to form negative pressure channel.Cross flow fan cover is ad hoc structure.Semiconductor integration module and heat pipe fin radiator, radiator fan form heat abstractor.
Accompanying drawing explanation
Fig. 1 is semiconductor refrigerating heating cycle system schematic.
Fig. 2 is semiconductor refrigerating heating cycle system three-dimensional structure diagram.
Fig. 3 is semiconductor integrated module components three-dimensional structure diagram.
Detailed description of the invention
As shown in Figure 1 to Figure 3, the utility model semiconductor refrigerating heating cycle system comprises cross flow fan, negative pressure heat exchanging chamber, gas-liquid heat-exchange, water circulating pump, water tank, semiconductor integration module, heat pipe fin radiator, radiator fan and heat-preservation cotton and pipeline parts.
As shown in Figure 3, the semiconductor chilling plate laminating of heat-conducting silicone grease is all coated on the parts of semiconductor integration module 6 and six pieces of two sides, put heat insulation foam again, and then the upper part of semiconductor integration module 6 and semiconductor chilling plate are fitted, be assembled into semiconductor integration module 6.
As shown in Figure 2, one end of semiconductor integration module 6 connects water tank 5 with water pipe, the other end water pipe of water tank 5 is connected with water circulating pump 4, the other end of water circulating pump 4 is connected with water pipe with gas-liquid radiator 3, and the other end of gas-liquid radiator 3 and the other end water pipe of semiconductor integration module 6 are connected to form closed circuit.With fixed support, gas-liquid radiator 3 bottom with negative pressure heat exchanging chamber 2 is coupled together, have mounting hole in the two bottom sides of negative pressure heat exchanging chamber 2, negative pressure heat exchanging chamber 2 top and cross flow fan 1 shell couple together formation negative pressure channel.One end of the lower part assembly of semiconductor integration module 6 is connected with storage tank water pipe, and storage tank is connected with water circulating pump 4 again, and the other end that water pipe passes the lower part assembly of fin and semiconductor integration module 6 is connected to form closed circuit.Radiator fan 8 is connected and fixed with the lower part of semiconductor integration module 6.
Claims (7)
1. a semiconductor refrigerating heating cycle system, comprise cross flow fan (1), negative pressure heat exchanging chamber (2), heat exchanger (3), water circulating pump (4), water tank (5), semiconductor integration module (6), heat pipe fin radiator (7), radiator fan (8), and corresponding pipeline parts and insulation material, the feature of described semiconductor refrigerating heating cycle system is be adjacent to semiconductor integration module (6) upper part lower surface after heat-conducting silicone grease coated by the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, be adjacent to semiconductor integration module (6) lower part upper surface after the hot side of semiconductor coats heat-conducting silicone grease, during refrigeration, semiconductor huyashi-chuuka (cold chinese-style noodles) generation cold is just recycled the liquid absorption in system, liquid is taken to gas-liquid heat-exchange (3) by water circulating pump (4) cold liquid and by cross flow fan, cold is discharged, reach the object of refrigeration.
2. a kind of semiconductor refrigerating heating cycle system according to claim 1, is characterized in that: heat-conducting silicone grease is all coated in semiconductor chilling plate two sides.
3. a kind of semiconductor refrigerating heating cycle system according to claim 1, is characterized in that: semiconductor chilling plate two sides and semiconductor integration module (6) inner surface are adjacent to.
4. a kind of semiconductor refrigerating heating cycle system according to claim 1, is characterized in that: semiconductor integration module (6) and heat exchanger (3), water circulating pump (4), water tank (5) form closed circuit.
5. a kind of semiconductor refrigerating heating cycle system according to claim 1, is characterized in that: cross flow fan (1) and negative pressure heat exchanging chamber (2) are connected to form negative pressure channel.
6. a kind of semiconductor refrigerating heating cycle system according to claim 5, is characterized in that: cross flow fan (1) cover is ad hoc structure.
7. a kind of semiconductor refrigerating heating cycle system according to claim 5, is characterized in that: semiconductor integration module (6) and heat pipe fin radiator (7), radiator fan (8) form heat abstractor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420731575.6U CN204285886U (en) | 2014-11-28 | 2014-11-28 | Semiconductor refrigerating heating cycle system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420731575.6U CN204285886U (en) | 2014-11-28 | 2014-11-28 | Semiconductor refrigerating heating cycle system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204285886U true CN204285886U (en) | 2015-04-22 |
Family
ID=52869037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420731575.6U Expired - Fee Related CN204285886U (en) | 2014-11-28 | 2014-11-28 | Semiconductor refrigerating heating cycle system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204285886U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106123174A (en) * | 2016-07-11 | 2016-11-16 | 柳泽堃 | A kind of split type semiconductor air-conditioner of cold, hot two-purpose |
| CN107101293A (en) * | 2017-02-14 | 2017-08-29 | 王泳荃 | A kind of method that utilization solar energy provides Cooling and Heat Source |
| CN109000291A (en) * | 2018-08-13 | 2018-12-14 | 佛山市顺德区美的洗涤电器制造有限公司 | Kitchen ventilator |
| CN109121370A (en) * | 2018-10-11 | 2019-01-01 | 郑州云海信息技术有限公司 | A kind of server gas phase refrigerant high-pressure jet fountain cooling system |
| CN113048812A (en) * | 2021-04-25 | 2021-06-29 | 珠海格力电器股份有限公司 | Radiator and refrigeration equipment |
-
2014
- 2014-11-28 CN CN201420731575.6U patent/CN204285886U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106123174A (en) * | 2016-07-11 | 2016-11-16 | 柳泽堃 | A kind of split type semiconductor air-conditioner of cold, hot two-purpose |
| CN106123174B (en) * | 2016-07-11 | 2018-11-02 | 柳泽堃 | A kind of split type semiconductor air-conditioner of cold, hot two-purpose |
| CN107101293A (en) * | 2017-02-14 | 2017-08-29 | 王泳荃 | A kind of method that utilization solar energy provides Cooling and Heat Source |
| CN109000291A (en) * | 2018-08-13 | 2018-12-14 | 佛山市顺德区美的洗涤电器制造有限公司 | Kitchen ventilator |
| CN109121370A (en) * | 2018-10-11 | 2019-01-01 | 郑州云海信息技术有限公司 | A kind of server gas phase refrigerant high-pressure jet fountain cooling system |
| CN113048812A (en) * | 2021-04-25 | 2021-06-29 | 珠海格力电器股份有限公司 | Radiator and refrigeration equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20191128 |