CN105119210A - High-voltage wall bushing semiconductor refrigeration device - Google Patents
High-voltage wall bushing semiconductor refrigeration device Download PDFInfo
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- CN105119210A CN105119210A CN201510541466.7A CN201510541466A CN105119210A CN 105119210 A CN105119210 A CN 105119210A CN 201510541466 A CN201510541466 A CN 201510541466A CN 105119210 A CN105119210 A CN 105119210A
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- wall bushing
- heat
- storage bin
- cooling device
- bushing
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Abstract
The invention relates to a high-voltage wall bushing semiconductor refrigeration device. The wall bushing comprises a conductive rod, a porcelain housing, an insulated layer, a wiring terminal and a flange, wherein the conductive rod and the wiring terminal are serially connected and then put inside the porcelain housing from one end of the wall bushing; the insulated layer coats the conductive rod; the flange is fixed in the middle part of the porcelain housing; an inner cavity for enabling a coolant to flow is arranged between the insulated layer and the porcelain housing; the coolant is connected with a storage box via a condensation reflux system; a semiconductor refrigeration cooling device is arranged around the storage box; creepage umbrella skirts are distributed on the outer wall of the porcelain housing; and the insulated layer is made of epoxy resin. The circulating coolant inside the wall bushing is cooled through a to-be-cooled region surrounded by the semiconductor, and the purpose of cooling the high-voltage wall bushing can be achieved.
Description
Technical field
The invention belongs to technical field of electric equipment, relate to a kind of wall bushing, be specifically related to a kind of high-voltage wall bushing semiconductor cooling device.
Background technology
Wall bushing is the important coupling part between transformer and distribution line, connects main transformer low-pressure side lead-out wire and switch gear room.When electric current flows through main busbar, a magnetic field can be excited being fixed on the wall bushing plate on body of wall, and produce eddy current loss.Eddy current loss can increase along with bus operating current and sharply increase, and wall bushing plate is generated heat.During summer peak meeting, this problem is particularly outstanding, has a strong impact on the service behaviour of the ampacity of bus and electric component, the normal work of wall bushing body, the safe operation of whole piece circuit and reliable power supply, even jeopardizes personal safety.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of high-voltage wall bushing semiconductor cooling device, what surrounded by semiconductor waits the region that lowers the temperature, and to the cooling of the cooling fluid of wall bushing Inner eycle, reaches to the object of high-voltage wall bushing cooling.
Technical scheme of the present invention is: a kind of high-voltage wall bushing semiconductor cooling device, described wall bushing comprises conducting rod, porcelain overcoat, insulating barrier, binding post and flange, porcelain jacket internal is put into from one end of wall bushing after conducting rod and binding post are connected in series, insulating barrier is coated with conducting rod, flange is fixed in the middle part of porcelain overcoat, the inner chamber that cooling fluid circulates is provided with between described insulating barrier and porcelain overcoat, cooling fluid is connected to storage bin by condensing reflux system, is arranged with semiconductor refrigerating heat sink outside storage bin.Described porcelain bushing outer wall is distributed with increasing and climbs full skirt.The insulating material employing epoxy resin that described insulating barrier is used.Be provided with supporting bracket in described air inner chamber, described conducting rod is fixed in the middle part of porcelain overcoat by supporting bracket, and described supporting bracket is the platy structure of band site, and supporting bracket adopts Heat Conduction Material, and Heat Conduction Material is heat conductive silica gel or heat-conducting silicone grease.Described condensing reflux system comprises return duct and recycle control valve, described storage bin is provided with inlet and liquid outlet, storage bin upper liquid outlet is arranged on the bottom of storage bin, the liquid outlet of storage bin is connected to the inlet of porcelain bushing by return duct, the liquid outlet of porcelain bushing is connected to the inlet of storage bin, and described return duct is provided with recycle control valve.Described storage bin is provided with blast pipe, and blast pipe is provided with vent valve.Semiconductor refrigerating heat sink, has the housing be square, is made up of heat-barrier material; In housing, four sides are equipped with cooling water tank, and four cooling water tanks by pipeline communication, and are provided with circulating water intake and outlet; Cooling water tank outer wall is stained with semiconductor cooling device, and the side of semiconductor cooling device is stained with heat-conducting plate; Four heat-conducting plates are equipped with the groove in circular arc, and four heat-conducting plates are round storage bin.Gap between described housing and storage bin is all filled with heat-barrier material.Described heat-barrier material is frostproof froth n material.
The present invention has following good effect: what surrounded by semiconductor waits the region that lowers the temperature, and to the cooling of the cooling fluid of wall bushing Inner eycle, reaches to the object of high-voltage wall bushing cooling.
Accompanying drawing explanation
Fig. 1 is specific embodiment of the invention wall bushing structure chart;
Fig. 2 is specific embodiment of the invention semiconductor cooling device structure chart.
Embodiment
Contrast accompanying drawing below, by the description to embodiment, the specific embodiment of the present invention is as the effect of the mutual alignment between the shape of involved each component, structure, each several part and annexation, each several part and operation principle, manufacturing process and operation using method etc., be described in further detail, have more complete, accurate and deep understanding to help those skilled in the art to inventive concept of the present invention, technical scheme.
As shown in Figure 1, a kind of high-voltage wall bushing, include conducting rod, conducting rod is coated with porcelain bushing, porcelain bushing outer wall is distributed with increasing and climbs full skirt, conducting rod two ends are all provided with binding post, in the middle part of porcelain bushing, adpting flange is installed, also insulating barrier is provided with between conducting rod and porcelain bushing, insulating barrier is coated with conducting rod, it is put into from one end of wall bushing inner after conducting rod and binding post are connected in series, the other end that the part of binding post runs through wall bushing is used as to be connected with high voltage electric field to use, with insulating material, one end embedding of conducting rod and binding post is fixed in wall bushing again, thus reach the object of insulated enclosure, the insulating material employing epoxy resin that insulating barrier is used.
A cavity structure is also provided with between insulating barrier and porcelain bushing, as the circulation passage of cooling fluid, the inlet of cooling fluid and liquid outlet are located at the two ends of porcelain bushing respectively, concrete, inlet is located at the bottom of porcelain bushing, and liquid outlet is located at the top of porcelain bushing, the liquid high due to temperature can float, therefore, inlet is located at bottom, can cooling performance be improved.
Inner chamber is provided with supporting bracket, conducting rod is fixed on cavity central authorities by supporting bracket, supporting bracket plane is vertical with conducting rod, supporting bracket adopts Heat Conduction Material, by the heat conduction of insulating barrier in inner chamber, concrete, Heat Conduction Material is heat conductive silica gel or heat-conducting silicone grease, thus improve the speed of heat by conduction, reach good heat-conducting effect.In addition, for longer wall bushing, supporting bracket has a supporting role to conducting rod, avoids conducting rod long formation degree of disturbing, affects conducting rod performance.
Cooling system of the present invention comprises semiconductor refrigerating heat sink and condensing reflux system, condensing reflux system comprises coolant storage tank, return duct, recycle control valve and vent valve, storage bin is provided with inlet and liquid outlet, the same with the liquid outlet of porcelain bushing, inlet principle, storage bin upper liquid outlet is arranged on the bottom of storage bin, the liquid outlet of storage bin is connected to the inlet of porcelain bushing by return duct, the liquid outlet of porcelain bushing is connected to the inlet of storage bin.Return duct is provided with recycle control valve, the flowing of liquid can be controlled by recycle control valve.In addition, storage bin is provided with discharge duct, discharge duct is provided with vent valve.Around storage bin, be provided with heat sink, vent valve is used for controlling the air pressure balance in storage bin.
Semiconductor refrigerating heat sink, has the housing 2 being square, being made up of heat-barrier material, and interior four sides of housing 2 are equipped with cooling water tank 3, and four cooling water tanks 3 are communicated with by pipeline 9, and is provided with circulating water intake 8 and outlet 1.Cooling water tank 3 outer wall is stained with semiconductor cooling device 7, and the side of semiconductor cooling device 7 is stained with heat-conducting plate 6.Four heat-conducting plates 6 are equipped with the groove in circular arc, and four heat-conducting plates 6 surround circular case to be stored 5.In order to improve heat insulation effect and cooling efficiency, the gap between housing 2 and storage bin 5 is all filled with heat-barrier material 4.As preferably, above-mentioned heat-barrier material is all preferably frostproof froth n material.
Operation principle of the present invention is: cooling fluid is under the effect of dynamical system, circulate at porcelain bushing cavity and storage bin, the heat of porcelain bushing is taken in storage bin by cooling fluid, when needs are lowered the temperature, start semiconductor cooling device 7, heat is passed in semiconductor cooling device 7 through heat-conducting plate 6, and last heat is gone out in environment by the water-band in cooling water tank 3, thus plays the object of cooling.
Above by reference to the accompanying drawings to invention has been exemplary description; obvious specific implementation of the present invention is not subject to the restrictions described above; as long as have employed the improvement of the various unsubstantialities that method of the present invention is conceived and technical scheme is carried out; or design of the present invention and technical scheme directly applied to other occasion, all within protection scope of the present invention without to improve.
Claims (9)
1. a high-voltage wall bushing semiconductor cooling device, it is characterized in that, described wall bushing comprises conducting rod, porcelain overcoat, insulating barrier, binding post and flange, porcelain jacket internal is put into from one end of wall bushing after conducting rod and binding post are connected in series, insulating barrier is coated with conducting rod, flange is fixed in the middle part of porcelain overcoat, the inner chamber that cooling fluid circulates is provided with between described insulating barrier and porcelain overcoat, cooling fluid is connected to storage bin by condensing reflux system, is arranged with semiconductor refrigerating heat sink outside storage bin.
2. high-voltage wall bushing semiconductor cooling device according to claim 1, is characterized in that, described porcelain bushing outer wall is distributed with increasing and climbs full skirt.
3. high-voltage wall bushing semiconductor cooling device according to claim 1, is characterized in that, the insulating material employing epoxy resin that described insulating barrier is used.
4. high-voltage wall bushing semiconductor cooling device according to claim 1, it is characterized in that, supporting bracket is provided with in described air inner chamber, described conducting rod is fixed in the middle part of porcelain overcoat by supporting bracket, described supporting bracket is the platy structure of band site, supporting bracket adopts Heat Conduction Material, and Heat Conduction Material is heat conductive silica gel or heat-conducting silicone grease.
5. high-voltage wall bushing semiconductor cooling device according to claim 1, it is characterized in that, described condensing reflux system comprises return duct and recycle control valve, described storage bin is provided with inlet and liquid outlet, storage bin upper liquid outlet is arranged on the bottom of storage bin, the liquid outlet of storage bin is connected to the inlet of porcelain bushing by return duct, the liquid outlet of porcelain bushing is connected to the inlet of storage bin, and described return duct is provided with recycle control valve.
6. high-voltage wall bushing semiconductor cooling device according to claim 5, is characterized in that, described storage bin is provided with blast pipe, and blast pipe is provided with vent valve.
7. high-voltage wall bushing semiconductor cooling device according to claim 1, is characterized in that, semiconductor refrigerating heat sink has the housing be square, is made up of heat-barrier material; In housing, four sides are equipped with cooling water tank, and four cooling water tanks by pipeline communication, and are provided with circulating water intake and outlet; Cooling water tank outer wall is stained with semiconductor cooling device, and the side of semiconductor cooling device is stained with heat-conducting plate; Four heat-conducting plates are equipped with the groove in circular arc, and four heat-conducting plates are round storage bin.
8. high-voltage wall bushing semiconductor cooling device according to claim 7, is characterized in that, the gap between described housing and storage bin is all filled with heat-barrier material.
9. high-voltage wall bushing semiconductor cooling device according to claim 8, is characterized in that, described heat-barrier material is frostproof froth n material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510541466.7A CN105119210A (en) | 2015-08-26 | 2015-08-26 | High-voltage wall bushing semiconductor refrigeration device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510541466.7A CN105119210A (en) | 2015-08-26 | 2015-08-26 | High-voltage wall bushing semiconductor refrigeration device |
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| CN105119210A true CN105119210A (en) | 2015-12-02 |
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| CN201510541466.7A Pending CN105119210A (en) | 2015-08-26 | 2015-08-26 | High-voltage wall bushing semiconductor refrigeration device |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101346779A (en) * | 2005-12-30 | 2009-01-14 | Abb技术有限公司 | Cooling of high voltage devices |
| CN201398049Y (en) * | 2009-03-13 | 2010-02-03 | 中能电力科技开发有限公司 | Dry type high voltage bushing |
| CN101719646A (en) * | 2010-01-22 | 2010-06-02 | 朱桂盛 | High voltage wall bushing |
| CN203068871U (en) * | 2012-12-24 | 2013-07-17 | 合肥知森制冷科技有限公司 | Semiconductor refrigeration cooling device |
| JP2013160261A (en) * | 2012-02-02 | 2013-08-19 | Hitachi-Ge Nuclear Energy Ltd | End structure of pipe penetration section |
| CN203367912U (en) * | 2013-05-29 | 2013-12-25 | 大连北方互感器集团有限公司 | High-voltage compound insulation wall bushing for box-type circuit breaker |
| CN104319034A (en) * | 2014-10-28 | 2015-01-28 | 成都峰达科技有限公司 | Simple composite high-voltage bushing |
| CN204167019U (en) * | 2014-10-28 | 2015-02-18 | 成都峰达科技有限公司 | A kind of composite high-voltage bushing |
| CN204407158U (en) * | 2015-03-05 | 2015-06-17 | 国家电网公司 | A kind of high-voltage conductive rod |
-
2015
- 2015-08-26 CN CN201510541466.7A patent/CN105119210A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101346779A (en) * | 2005-12-30 | 2009-01-14 | Abb技术有限公司 | Cooling of high voltage devices |
| CN201398049Y (en) * | 2009-03-13 | 2010-02-03 | 中能电力科技开发有限公司 | Dry type high voltage bushing |
| CN101719646A (en) * | 2010-01-22 | 2010-06-02 | 朱桂盛 | High voltage wall bushing |
| JP2013160261A (en) * | 2012-02-02 | 2013-08-19 | Hitachi-Ge Nuclear Energy Ltd | End structure of pipe penetration section |
| CN203068871U (en) * | 2012-12-24 | 2013-07-17 | 合肥知森制冷科技有限公司 | Semiconductor refrigeration cooling device |
| CN203367912U (en) * | 2013-05-29 | 2013-12-25 | 大连北方互感器集团有限公司 | High-voltage compound insulation wall bushing for box-type circuit breaker |
| CN104319034A (en) * | 2014-10-28 | 2015-01-28 | 成都峰达科技有限公司 | Simple composite high-voltage bushing |
| CN204167019U (en) * | 2014-10-28 | 2015-02-18 | 成都峰达科技有限公司 | A kind of composite high-voltage bushing |
| CN204407158U (en) * | 2015-03-05 | 2015-06-17 | 国家电网公司 | A kind of high-voltage conductive rod |
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Application publication date: 20151202 |