CN203034126U - Electroplating fixture for printed circuit board (PCB) - Google Patents
Electroplating fixture for printed circuit board (PCB) Download PDFInfo
- Publication number
- CN203034126U CN203034126U CN 201220733426 CN201220733426U CN203034126U CN 203034126 U CN203034126 U CN 203034126U CN 201220733426 CN201220733426 CN 201220733426 CN 201220733426 U CN201220733426 U CN 201220733426U CN 203034126 U CN203034126 U CN 203034126U
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- CN
- China
- Prior art keywords
- pcb
- pcb board
- central layer
- press strip
- electroplating clamp
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Abstract
An electroplating fixture for a PCB comprises a conductive frame, a plurality of fixing parts and a plurality of pressing strips, wherein the conductive frame is defined by four frame edges, an electroplating opening is defined by inner side faces of the four frame edges, and fixing parts and pressing strips are installed on the conductive frame. The electroplating fixture for the PCB is used for fixing a PCB core plate with the thickness less than 0.4mm and comprises the conductive frame and a plurality of screws, wherein the conductive frame is defined by four frame edges, the electroplating opening is defined by inner side faces of the four frame edges, each of the screws comprises a connecting portion and a pressing portion, connecting portions of screws are fixed at frame edges, and pressing portions press and fix the PCB core plate on the conductive frame. The PCB core plate is positioned by pressing strips and screws, so that the plate surface can withstand impacts caused by swing and pumping during electroplating, ultrathin articles are flat and are not crumpled, and the good electroplating effect can be achieved. Two faces of the PCB core plate are electroplated simultaneously through the electroplating opening, the structure is simple, and the product production efficiency can be improved.
Description
Technical field
The utility model relates to a kind of anchor clamps, particularly relates to a kind of PCB(Printed Circuit Board printed circuit board (PCB)) the central layer electroplating jig.
Background technology
Most printed circuit board (PCB) or its central layer processing units have requirement to the product thickness of slab, most PCB central layer thicknesss of slab are more than 0.4mm when at present electroplating the PCB central layer, can use at present general on the market thin plate frame or folder rod can fix the electroplating of going forward side by side basically.
Yet, along with electronic product towards development multi-functional and ultra-thinization direction, thickness requirement to central layer is more and more higher, and increasing PCB product must adopt ultra-thin central layer to come processing and fabricating when central layer is made, and this type of central layer thickness is often less than 0.2mm.At this moment, though adopting traditional electroplating clamp can fix, because central layer is too thin and electroplate to exist in the cylinder and factor such as inflate, wave, the PCB central layer is stressed uneven, easily cause the bending of PCB central layer, electroplate bad phenomenon such as inhomogeneous, that tear folder point position, have a strong impact on the electroplating quality of PCB central layer.
The utility model content
Based on this, be necessary the problem at the shortcoming of prior art, the utility model provides a kind of pcb board electroplating clamp of the PCB of assurance central layer electroplating quality.
Based on this, the utility model provides a kind of pcb board electroplating clamp, comprises conductive pane, some mounting blocks and some press strips, and described conductive pane is enclosed by four edges and forms, article four, the edge medial surface is enclosed to form one and electroplates mouth, and described mounting block and press strip are installed on the edge of conductive pane.
Among embodiment, the front end face of every edge of described conductive pane offers several grooves therein, and groove bottom land wall offers fixed orifices; Described mounting block is a screw, and it comprises a pressure section that has the connection section of screw thread and be connected in connection section one end, and the connection section of mounting block is installed on the fixed orifices.
Among embodiment, the material of described mounting block is the PP material therein.
Among embodiment, the length of described press strip is corresponding with the length of conductive pane frame therein, and described press strip is fastened between pressure section and the PCB central layer.
Among embodiment, the material of described conductive pane and press strip is metal material therein.
Among embodiment, the thickness of described press strip is between 0.1mm to 0.4mm therein.
A kind of pcb board electroplating clamp, for fixing the PCB central layer of a thickness less than 0.4 millimeter, comprise conductive pane and some screws, described conductive pane is enclosed by four edges and forms, article four, the edge medial surface is enclosed to form one and electroplates mouth, described mounting block comprises that one has the connection section of screw thread and is connected in the pressure section of connection section one end, and on the fixing described edge of the connection section of described screw, described pressure section compresses described PCB central layer and is fixed on the described conductive pane.
Among embodiment, also comprise some press strips therein, described press strip is fixed between the pressure section of described PCB central layer and described screw.
Among embodiment, the thickness of described press strip is between 0.1mm to 0.4mm therein.
Among embodiment, the material of described mounting block is polypropylene material therein.
Above-mentioned pcb board electroplating clamp is provided with a plating mouth by electroplating frame, press strip is installed in to be electroplated on the frame, during plating, by press strip and mounting block the PCB central layer is positioned, can make the plate face in electroplating process, withstand the impact of factors such as waving, inflate, guarantee the smooth not fold of ultra-thin article, obtain good electroplating effect.And electroplate simultaneously the PCB central layer is two-sided by electroplating mouth, simple in structure, improve products production efficient.
Description of drawings
Fig. 1 is the exploded view of pcb board electroplating clamp.
Fig. 2 is installed on synoptic diagram on the pcb board electroplating clamp for the PCB central layer.
Below be the explanation of the utility model component sign flag:
Embodiment
For further understanding feature of the present utility model, technique means and the specific purposes that reach, function, resolve advantage of the present utility model and spirit, by below in conjunction with accompanying drawing and embodiment detailed description of the present utility model being further understood.
The utility model pcb board electroplating clamp comprises conductive pane 10, some mounting blocks 20 and some press strips 30, and described mounting block 20 and press strip 30 are installed on the conductive pane 10.
Described conductive pane 10 is enclosed by four edges and forms, article four, the edge medial surface is enclosed to form one and electroplates mouth 12, described conductive pane is made by metal material, and the front end face of every edge of conductive pane 10 offers several grooves 11, and groove 11 bottom land walls offer fixed orifices (not indicating among the figure).Described mounting block 20 is a screw in the present embodiment, it comprises a pressure section 21 that has the connection section (not indicating among the figure) of screw thread and be connected in connection section one end, the cross-sectional area of described pressure section is greater than the cross-sectional area of connection section, and the connection section of mounting block 20 is installed on the fixed orifices.The material of this mounting block 20 is by PP(Polypropylene, polypropylene) material, to avoid hurting the PCB central layer 40 that needs plating.
Described press strip 30 is made by metal material, and the length of press strip 30 is corresponding with the length of conductive pane 10 frames, and press strip 30 correspondences are installed on the edge of conductive pane 10.In the present embodiment, the thickness of each press strip 30 is between 0.1mm to 0.4mm.Described press strip 30 is fastened between pressure section 21 and the PCB central layer 40, and mounting block 20 is pressed in press strip 30 on the conductive pane 10 by pressure section 21, thereby namely article to be plated is fixed by press strip 30.
Preferably, the pcb board electroplating clamp determines that according to the thickness of PCB central layer 40 quantity of press strip 30 is to position PCB central layer 40, when common PCB central layer 40 is electroplated greater than the PCB central layer 40 of 0.4mm as thickness, can directly adopt mounting block 20 to fix; When the PCB central layer 40 that thickness is slightly less than common PCB central layer 40 is electroplated, can adopt 30 pairs of PCB central layers of two press strips 40 to carry out the long limit of PCB central layer 40 is positioned, at this moment, two press strips 30 are installed on 10 liang of relative edges of conductive pane; When the thickness of PCB central layer 40 is very little, then adopt three or 30 pairs of PCB central layers 40 of four press strips to position.
During use, take off the mounting block 20 of correspondence when pressing plate is installed earlier, and PCB central layer 40 and pcb board electroplating clamp fitted, add press strip 30 and press strip 30 is fixing by mounting block 20 at PCB central layer 40, thereby 30 pairs of PCB central layers 40 of press strip are positioned, ensure when PCB central layer 40 is electroplated that PCB central layer 40 is stressed evenly, and shape and position are not subjected to ectocine to cause occurring problems such as fold, fracture, plating is inhomogeneous too greatly.At last, conductive pane 10 is linked to each other with electroplating device, give PCB central layer 40 in the anchor clamps with current delivery, make it to accept the electric current electroplating of going forward side by side, and by using the press strip of being made by metal material 30, increase conductive effect.Electroplate mouthfuls 12 because conductive pane 10 is provided with, make to be installed on pcb board electroplating clamp two sides and to electroplate simultaneously, improve the product electroplating efficiency.
In sum, the utility model pcb board electroplating clamp is provided with a plating mouth 12 by electroplating frame, press strip 30 is installed in to be electroplated on the frame, during plating, position by press strip 30 and 20 pairs of PCB central layers 40 of mounting block, can make the plate face in electroplating process, withstand the impact of factors such as waving, inflate, guarantee the smooth not fold of ultra-thin article, obtain good electroplating effect.And mouthfuls of 12 pairs PCB central layers 40 are two-sided to be electroplated simultaneously by electroplating, simple in structure, improves products production efficient.
The above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (10)
1. pcb board electroplating clamp, be used for fixing a PCB central layer, it is characterized in that, this pcb board electroplating clamp comprises conductive pane, some mounting blocks and some press strips, described conductive pane is enclosed by four edges and forms, article four, the edge medial surface is enclosed to form one and electroplates mouth, and described mounting block and press strip are installed on the edge of conductive pane.
2. pcb board electroplating clamp according to claim 1 is characterized in that, the front end face of every edge of described conductive pane offers some fixed orificess; Described mounting block comprises that one has the connection section of screw thread and is connected in the pressure section of connection section one end, and the connection section of this mounting block is installed on the fixed orifices, and described pressure section is used for compressing described PCB central layer.
3. pcb board electroplating clamp according to claim 2 is characterized in that, the material of described mounting block is polypropylene material.
4. pcb board electroplating clamp according to claim 2 is characterized in that, the length of described press strip is corresponding with the length of conductive pane frame, and described press strip is fastened between pressure section and the PCB central layer.
5. pcb board electroplating clamp according to claim 1 is characterized in that, the material of described conductive pane and press strip is metal material.
6. pcb board electroplating clamp according to claim 1 is characterized in that, the thickness of described press strip is between 0.1mm to 0.4mm.
7. pcb board electroplating clamp, for fixing the PCB central layer of a thickness less than 0.4 millimeter, comprise conductive pane and some mounting blocks, it is characterized in that, described conductive pane is enclosed by four edges and forms, and four edge medial surfaces are enclosed to form one and electroplate mouthful, and described mounting block comprises that one has the connection section of screw thread and is connected in the pressure section of connection section one end, on the fixing described edge of the connection section of described screw, described pressure section compresses described PCB central layer and is fixed on the described conductive pane.
8. pcb board electroplating clamp according to claim 7 is characterized in that, also comprises some press strips, and described press strip is fixed between the pressure section of described PCB central layer and described screw.
9. pcb board electroplating clamp according to claim 7 is characterized in that, the thickness of described press strip is between 0.1mm to 0.4mm.
10. pcb board electroplating clamp according to claim 7 is characterized in that, the material of described mounting block is polypropylene material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220733426 CN203034126U (en) | 2012-12-27 | 2012-12-27 | Electroplating fixture for printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220733426 CN203034126U (en) | 2012-12-27 | 2012-12-27 | Electroplating fixture for printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203034126U true CN203034126U (en) | 2013-07-03 |
Family
ID=48686263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220733426 Expired - Fee Related CN203034126U (en) | 2012-12-27 | 2012-12-27 | Electroplating fixture for printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203034126U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI715954B (en) * | 2019-04-01 | 2021-01-11 | 大陸商廣州明毅電子機械有限公司 | Plating rack capable of simultaneously plating two single-sided circuit boards |
| CN112609230A (en) * | 2020-12-10 | 2021-04-06 | 天津普林电路股份有限公司 | Electroplating support plate for ultrathin circuit board, electroplating system and electroplating method thereof |
| CN113056103A (en) * | 2021-03-29 | 2021-06-29 | 惠州市金百泽电路科技有限公司 | FPC (flexible printed circuit) jig, manufacturing method and mounting method of jig |
| CN113225927A (en) * | 2021-03-15 | 2021-08-06 | 广州美维电子有限公司 | Device and method for improving edge leakage of substrate of PCB (printed circuit board) of fine circuit |
-
2012
- 2012-12-27 CN CN 201220733426 patent/CN203034126U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI715954B (en) * | 2019-04-01 | 2021-01-11 | 大陸商廣州明毅電子機械有限公司 | Plating rack capable of simultaneously plating two single-sided circuit boards |
| CN112609230A (en) * | 2020-12-10 | 2021-04-06 | 天津普林电路股份有限公司 | Electroplating support plate for ultrathin circuit board, electroplating system and electroplating method thereof |
| CN113225927A (en) * | 2021-03-15 | 2021-08-06 | 广州美维电子有限公司 | Device and method for improving edge leakage of substrate of PCB (printed circuit board) of fine circuit |
| CN113225927B (en) * | 2021-03-15 | 2024-03-08 | 广州美维电子有限公司 | Device and method for improving edge leakage base material of fine circuit PCB |
| CN113056103A (en) * | 2021-03-29 | 2021-06-29 | 惠州市金百泽电路科技有限公司 | FPC (flexible printed circuit) jig, manufacturing method and mounting method of jig |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130703 Termination date: 20181227 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |