CN202830210U - Ultrathin plate electroplating hanger for vertical line electroplating of printed circuit board (PCB) industry - Google Patents

Ultrathin plate electroplating hanger for vertical line electroplating of printed circuit board (PCB) industry Download PDF

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Publication number
CN202830210U
CN202830210U CN201220473081.3U CN201220473081U CN202830210U CN 202830210 U CN202830210 U CN 202830210U CN 201220473081 U CN201220473081 U CN 201220473081U CN 202830210 U CN202830210 U CN 202830210U
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China
Prior art keywords
vertical line
electroplating
pcb
board
framework
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Expired - Lifetime
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CN201220473081.3U
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Chinese (zh)
Inventor
赖明生
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Gul Wuxi Technologies Co Ltd
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Gul Wuxi Technologies Co Ltd
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Priority to CN201220473081.3U priority Critical patent/CN202830210U/en
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Publication of CN202830210U publication Critical patent/CN202830210U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to an ultrathin plate electroplating hanger for vertical line electroplating of printed circuit board (PCB) industry, and belongs to the technical field of electroplating. Specifically, the ultrathin plate electroplating hanger for the vertical line electroplating of the PCB industry is used for fixing the PCB for electroplating, and comprises fixing wing boards, movable wing boards and clamps, a plurality of fixed wing boards are respectively fixed on the rear side of a framework, and a plurality of through holes are arranged in each fixed wing board. The plurality of movable wing boards are respectively and rotatably connected with the front side of the framework, and a plurality of through holes are arranged in each movable wing board. The left side and the right side of the framework are respectively connected with a plurality of the clamps, and the plurality of the clamps on each side are arranged in sequence from up to down. Each clamp clamps a fixing wing board and a movable wing board together. The ultrathin plate electroplating hanger for the vertical line plating of the PCB industry is simple, compact and reasonable in structure, capable of being used for electroplating production of an ultrathin soft board and an ultra-thick hard board, and flat and smooth in board surface, and improves capacity and economical benefits, lowers production cost, and is convenient and fast to use. The through holes lower the impact to a workpiece in a plating groove, and the flatness and smoothness and the stability of the thin board are guaranteed.

Description

A kind of PCB industry vertical line is electroplated and is used the ultra thin plate Electropolating hangers
Technical field
The utility model relates to a kind of PCB industry vertical line electroplates and use the ultra thin plate Electropolating hangers, specifically electroplates for fixed printed circuit board, belongs to the electroplating technology field.
Background technology
Present electronic product is just towards compact trend development.Ultra-thin soft board in the printed circuit board (PCB) (Printed circuit board), the demand of Rigid Flex is increasing, along with the thickness of ultra-thin soft board more and more thinner (the thinnest arrived 25um).Electroplating is the one common operation in present PCB field, and when carrying out electroplating technology, pcb board can be fixed on the Electropolating hangers, and making current is electroplated.Electropolating hangers has played fixing and two effects of conducting, is the key part of electroplating technology.At present carry out ultra-thin soft board electro-coppering with vertical line electroplating device and Electropolating hangers, the ultra-thin soft board after be difficult to guarantee electroplating is smooth, only has that waving of whole piece upright plating line turned off the ultra-thin soft board of guarantee is smooth.But can not produce simultaneously thicker hardboard after turning off the waving of upright plating line, badly influence production capacity.Therefore, need a kind of better Electropolating hangers can produce simultaneously ultra-thin soft board and thicker hardboard, improve production capacity.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned weak point, use the ultra thin plate Electropolating hangers thereby provide a kind of PCB industry vertical line to electroplate, can be simultaneously for the Electroplating Production of ultra-thin soft board and thicker hardboard, improved production capacity and economic benefit.
The technical scheme that provides according to the utility model, a kind of PCB industry vertical line is electroplated and is comprised framework and copper conductor with the ultra thin plate Electropolating hangers, the framework both sides are respectively equipped with a copper conductor, it is characterized in that: also comprise fixedly wing plate, movable wing plate and clip, described framework rear side is fixed respectively a plurality of fixedly wing plates, and fixedly wing plate is provided with a plurality of through holes.Described framework front side is rotationally connected respectively a plurality of movable wing plates, and movable wing plate is provided with a plurality of through holes.The left and right sides of framework is rotationally connected respectively a plurality of clips, and a plurality of clips of every side distribute up and down successively.Fixedly wing plate and a movable wing plate are clamped together described each clip with one.
Described framework comprises two mobile jibs and two poles, connects two poles between two mobile jibs, and mobile jib and pole are orthogonal.
Described two mobile jibs are parallel to each other.
Described two poles are parallel to each other.
Described mobile jib upper end is provided with hook.
Described fixedly wing plate adopts the PVC material to make.
Described movable wing plate adopts the PVC material to make.
Described fixedly wing plate has four.
Described movable wing plate has four.
Described clip has four.
Compared with the prior art the utility model has the following advantages:
The utility model is simple, compact and reasonable for structure; Can be simultaneously be used for the Electroplating Production of ultra-thin soft board and thicker hardboard, the plate face is smooth; Production capacity and economic benefit have been improved; Lower production cost; Easy to use, quick; Through hole has reduced the surging force that workpiece is subject in coating bath, guaranteed planarization and the stability of thin plate.
Description of drawings
Fig. 1 is the utility model structural representation.
Description of reference numerals: 1-framework, 2-be wing plate, 3-movable wing plate, 4-clip, 5-copper conductor, 6-mobile jib, 7-pole, 8-hook fixedly.
Embodiment
Following the utility model is further described in connection with the embodiment in the accompanying drawing:
As shown in Figure 1, the utility model mainly comprises framework 1, fixedly wing plate 2, movable wing plate 3, clip 4 and copper conductor 5.
Framework 1 comprises two mobile jibs 6 and 6 settings parallel to each other of 7, two mobile jibs of two poles, connects 7, two poles 7 of two poles between two mobile jibs 6 parallel to each other.Described mobile jib 6 and pole 7 are orthogonal.Described mobile jib 6 upper ends are provided with hook 8.
Described framework 1 rear side is fixed respectively four fixedly wing plates 2, and fixedly wing plate 2 is provided with a plurality of through holes, and through hole has reduced the surging force that workpiece is subject in coating bath, has guaranteed planarization and the stability of thin plate.Described framework 1 front side is rotationally connected respectively four movable wing plates 3, and movable wing plate 3 is provided with a plurality of through holes.
The left and right sides of framework 1 is rotationally connected respectively two clips 4, and two clips 4 of every side distribute up and down successively.Fixedly wing plate 2 and a movable wing plate 3 are clamped together described each clip 4 with one.
Described framework 1 both sides are respectively equipped with a copper conductor 5.
Described fixedly wing plate 2 and movable wing plate 3 adopt the PVC material to make.
The utility model in use, the workpiece that needs are electroplated is placed on four fixedly in the wing plate 2, rotates movable wing plate 3 piece-holder is lived, fixedly wing plate 2 and movable wing plate 3 are fixed by stirring clip 4.By link up with 8 hang over plating line fly carry out normal electroplating activity on the target.The utility model is simple, compact and reasonable for structure, can be simultaneously be used for the Electroplating Production of ultra-thin soft board and thicker hardboard, and the plate face of production is smooth, has improved production capacity and economic benefit, lower production cost.It is easy to use, quick.

Claims (10)

1. a PCB industry vertical line is electroplated and is used the ultra thin plate Electropolating hangers, comprise framework (1) and copper conductor (5), framework (1) both sides are respectively equipped with a copper conductor (5), it is characterized in that: also comprise fixedly wing plate (2), movable wing plate (3) and clip (4), described framework (1) rear side is fixed respectively a plurality of fixedly wing plates (2), and fixedly wing plate (2) is provided with a plurality of through holes; Described framework (1) front side is rotationally connected respectively a plurality of movable wing plates (3), and movable wing plate (3) is provided with a plurality of through holes; The left and right sides of framework (1) is rotationally connected respectively a plurality of clips (4), and a plurality of clips (4) of every side distribute up and down successively; Fixedly wing plate (2) and a movable wing plate (3) are clamped together described each clip (4) with one.
2. a kind of PCB industry vertical line as claimed in claim 1 is electroplated and is used the ultra thin plate Electropolating hangers, it is characterized in that: described framework (1) comprises two mobile jibs (6) and two poles (7), connect two poles (7) between two mobile jibs (6), mobile jib (6) and pole (7) are orthogonal.
3. a kind of PCB industry vertical line as claimed in claim 2 is electroplated and is used the ultra thin plate Electropolating hangers, and it is characterized in that: described two mobile jibs (6) are parallel to each other.
4. a kind of PCB industry vertical line as claimed in claim 2 is electroplated and is used the ultra thin plate Electropolating hangers, and it is characterized in that: described two poles (7) are parallel to each other.
5. a kind of PCB industry vertical line as claimed in claim 2 is electroplated and used the ultra thin plate Electropolating hangers, it is characterized in that: described mobile jib (6) upper end is provided with hook (8).
6. a kind of PCB industry vertical line as claimed in claim 1 is electroplated and used the ultra thin plate Electropolating hangers, it is characterized in that: described fixedly wing plate (2) adopts the PVC material to make.
7. a kind of PCB industry vertical line as claimed in claim 1 is electroplated and used the ultra thin plate Electropolating hangers, it is characterized in that: described movable wing plate (3) adopts the PVC material to make.
8. a kind of PCB industry vertical line as claimed in claim 1 is electroplated and is used the ultra thin plate Electropolating hangers, and it is characterized in that: described fixedly wing plate (2) has four.
9. a kind of PCB industry vertical line as claimed in claim 1 is electroplated and is used the ultra thin plate Electropolating hangers, and it is characterized in that: described movable wing plate (3) has four.
10. a kind of PCB industry vertical line as claimed in claim 1 is electroplated and is used the ultra thin plate Electropolating hangers, and it is characterized in that: described clip (4) has four.
CN201220473081.3U 2012-09-17 2012-09-17 Ultrathin plate electroplating hanger for vertical line electroplating of printed circuit board (PCB) industry Expired - Lifetime CN202830210U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201220473081.3U CN202830210U (en) 2012-09-17 2012-09-17 Ultrathin plate electroplating hanger for vertical line electroplating of printed circuit board (PCB) industry

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201220473081.3U CN202830210U (en) 2012-09-17 2012-09-17 Ultrathin plate electroplating hanger for vertical line electroplating of printed circuit board (PCB) industry

Publications (1)

Publication Number Publication Date
CN202830210U true CN202830210U (en) 2013-03-27

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Application Number Title Priority Date Filing Date
CN201220473081.3U Expired - Lifetime CN202830210U (en) 2012-09-17 2012-09-17 Ultrathin plate electroplating hanger for vertical line electroplating of printed circuit board (PCB) industry

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Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102839411A (en) * 2012-09-17 2012-12-26 高德(无锡)电子有限公司 Ultrathin sheet electroplating hanger for electroplating vertical line in PCB (Printed Circuit Board) industry
CN103619132A (en) * 2013-11-28 2014-03-05 昆山亿诚化工容器有限公司 Electroplating cathode hanging piece

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102839411A (en) * 2012-09-17 2012-12-26 高德(无锡)电子有限公司 Ultrathin sheet electroplating hanger for electroplating vertical line in PCB (Printed Circuit Board) industry
CN103619132A (en) * 2013-11-28 2014-03-05 昆山亿诚化工容器有限公司 Electroplating cathode hanging piece

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CX01 Expiry of patent term

Granted publication date: 20130327

CX01 Expiry of patent term