CN203015270U - Circuit board - Google Patents
Circuit board Download PDFInfo
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- CN203015270U CN203015270U CN 201220632398 CN201220632398U CN203015270U CN 203015270 U CN203015270 U CN 203015270U CN 201220632398 CN201220632398 CN 201220632398 CN 201220632398 U CN201220632398 U CN 201220632398U CN 203015270 U CN203015270 U CN 203015270U
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- circuit board
- mills
- transmssion line
- signal transmssion
- described signal
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Abstract
The utility model discloses a circuit board comprising an insulation dielectric layer, a signal transmission layer and a ground wire layer, wherein the signal transmission layer is provided with a signal transmission line and a communication chip, and the output end of the signal transmission line is connected with the communication chip after being serially connected to a resistor for fine tuning impedance. The characteristic impedance requirements of a MHL signal transmission line on a two-layer circuit board can be met. Publish period and plating period of a circuit board are shortened, and plating efficiency is improved.
Description
Technical field
The utility model relates to electronic technology field, relates in particular to a kind of circuit board.
Background technology
Circuit board mainly is comprised of pad, via hole, installing hole, wire, components and parts, connector, filling, electrical boundary etc.Circuit board is called again wiring board, aluminium base, high frequency plate, printed circuit board (PCB) etc.Printed circuit board (PCB) (Printed Circuit Board, PCB), be commonly called as PCB, utilize exactly electron printing with pre-designed circuit, be printed on surface or the formed supporter for connecting between electronic devices and components of its interior metal layer of dielectric laminar substrate.
Circuit board can genealogical classification be three kinds of single sided board (Single-Sided Boards), double sided board (Double-SidedBoards) and multi-layer sheet.Wherein, there is wiring on the two sides of double sided board, and the wire of upper and lower surface carries out circuit by guide hole (via) and connect, and the wiring on two sides can intermesh, and it is more suitable for being used in than on the more complicated circuit of single sided board.Compare with multi-layer sheet, double sided board can be saved making sheet material and operation.
In High Speed PCB Design Technology, the parameter of PCB, electronic devices and components all can cause the imperfect of the signal that transmits on PCB in the factors such as layout of the layout on PCB, high-speed signal transmission lines.For the integrality of effective guarantee signal in transmitting procedure, must take effective control measure.For signal transmssion line, the inhibit signal integrality the most important thing is to guarantee that the characteristic impedance of signal transmssion line and load impedance are complementary.When impedance mismatch, signal has energy loss in transmitting procedure, and portion of energy reflects back along signal transmssion line, makes the signal waveform distorted, produces vibration back and forth, has influence on the transmission quality of signal.
The principal element that affects the characteristic impedance of signal transmssion line has: the dielectric constant of the thickness of lamination, live width, distance between centers of tracks, line thickness, dielectric, the dielectric constant of green oil and green oil thickness etc.The impedance computation method of signal transmssion line can be calculated with reference to Correlation, as the impedance computation formula of microstrip line:
Wherein, Z
0Be the characteristic impedance of transmission line, ε
rBe the dielectric constant of dielectric, W is the width of transmission line, and t is the thickness of transmission line, and H is the thickness of dielectric.Can satisfy by the wherein above one or more factor of influence of adjusting in practice the signal transmssion line type in different application field to the requirement of characteristic impedance value.
At present, adopt mobile terminal high-definition audio and video standard interface (Mobile High-Definition Link, MHL) come characteristic impedance that the MHL signal transmssion line of transmission of high-definition audio-video signal need to satisfy to require to be 30 ohm of common code impedances (± 20%), 100 ohm of differential impedances (± 15%).The MHL interface is a kind of audio-visual standard interface that connects the Portable movable electronic installation, only use a bars cable that audio-video signal is transferred to standard HDMI (High Definition Multimedia Interface) (High Definition Multimedia Interface, HDMI), can be presented on HDTV (High-Definition Television) through Data Format Transform.
In the prior art, usually adopt the multi-layer sheet more than four layers or four layers to satisfy the common code impedance of MHL signal transmssion line and the requirement of differential impedance.Adopt multiple-plate outstanding advantages to be, as the thickness of the circuit board lamination of one of Key Influential Factors of signal transmssion line characteristic impedance, it can be adjusted flexibly, thereby can reach easily the impedance requirement of MHL signal transmssion line.But, increase the materials such as line layer due to multi-layer sheet, and increased the operations such as making sheet pressing, boring, therefore, the number of plies is more, and its release cycle and making sheet cycle are longer, cause that making sheet efficient is low, cost is high.Take four-layer circuit board as example, comprehensive various factors, its batch making sheet cycle is compared with double sided board prolongation 3 ~ 5 days, and increases approximately 60% cost.
Adopt in theory double sided board, and only rely on adjustment live width, two factors of influence of distance between centers of tracks also can reach the characteristic impedance requirement of MHL signal transmssion line, but be 100.42 Mills (mil) according to the signal transmssion line live width that the impedance computation formula of microstrip line calculates, the signal transmssion line spacing is 96mil, the area that takies circuit board is excessive, cost is high, is difficult to satisfy the practical application needs.
Therefore, be necessary to study and a kind ofly can satisfy signal transmssion line, the circuit board that requires of the impedance of MHL signal transmssion line especially, and putting before this, shorten release cycle and the manufacturing cycle of circuit board, further reduce the production cost of circuit board.
Summary of the invention
The technical issues that need to address of the present utility model and purpose are to provide a kind of circuit board, to satisfy signal transmssion line, especially the impedance index of the signal transmssion line of mobile terminal high-definition audio and video standard interface HML in data transmission procedure, shorten its release cycle and manufacturing cycle, further reduce the production cost of circuit board.
For achieving the above object, the utility model provides a kind of circuit board, comprises insulating medium layer, signal transport layer and ground plane, and described signal transport layer is provided with signal transmssion line and communication chip.
After one of the output series connection of described signal transmssion line is used for the resistor of fine setting impedance, be connected with described communication chip.
Further, described resistor for the fine setting impedance is that resistance is the exclusion of Rx ohm or independent resistance, 3.3≤Rx≤6.8.
Further, also be provided with mobile terminal high-definition audio and video standard interface on described circuit board; The input of described signal transmssion line connects described mobile terminal high-definition audio and video standard interface;
The input data of described mobile terminal high-definition audio and video standard interface transfer to described communication chip by described signal transmssion line, by described communication chip, described input data are carried out forwarding after format conversion processing.
In order further to limit the characteristic impedance value of circuit board, can the parameters of described circuit board be arranged, comprising: described signal transmssion line is microstrip line; The top live width of described signal transmssion line is W1, and the bottom live width is W2, and the bottom spacing is S1, and thickness is T1; Wherein, 9 Mills≤W1≤13 Mills, 10 Mills≤W2≤14 Mills, 3.5 Mills≤S1≤6.5 Mills, 0.7 Mill≤T1≤2.1 Mills.
The insulating medium layer of described circuit board is that dielectric constant is that Er1, thickness are the insulation board of H1,3.8≤Er1≤5.0,6.8 Mills≤H1≤65 Mills.
It is 3.5 green oil that described circuit board surface is coated with dielectric constant CEr, and the green oil thickness C 1 at the top of described signal transmssion line is 0.5 Mill, and the green oil thickness C 2 between described signal transmssion line is 0.5 Mill; The green oil thickness C 3 on described insulating medium layer surface is 0.8 Mill.
Further, the length of described signal transmssion line is less than or equal to 600 Mills.
The beneficial effect of the technical program is, by the resistor that adopts double sided board and series connection is used for the fine setting impedance on signal transmssion line, in conjunction with circuit board parameter setting flexibly, can make the signal transmssion line on this circuit board can satisfy the impedance requirement of high definition audio and video standard data in transmitting procedure.In addition, use double sided board and design, can shorten release cycle and the making sheet cycle of circuit board, improve making sheet efficient and the further production cost of saving circuit board.
Description of drawings
Fig. 1 is the structural representation of an embodiment of the circuit board that provides of the utility model;
Fig. 2 is the cross sectional representation of circuit board shown in Figure 1;
Fig. 3 is the structural representation of another embodiment of the circuit board that provides of the utility model;
Fig. 4 is the structural representation of another embodiment of the circuit board that provides of Fig. 3;
Fig. 5 is that the making sheet parameter of the circuit board that provides of the utility model arranges schematic diagram.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described.
Referring to Fig. 1, be the structural representation of an embodiment of the circuit board that provides of the utility model, Fig. 2 is the cross sectional representation of the circuit board 100 of embodiment shown in Figure 1.Circuit board 100 in the present embodiment comprises signal transport layer 21, insulating medium layer 22 and ground plane 23.Wherein, be furnished with signal transmssion line 101 and communication chip 103 in the signal transport layer.After one of the output series connection of signal transmssion line is used for the resistor 102 of fine setting impedance, be connected with described communication chip 103.
Further, the resistor 102 that is used for the fine setting impedance described in the present embodiment is that resistance is the exclusion of Rx ohm or independent resistance, and wherein, the span of Rx is defined as 3.3≤Rx≤6.8.
Referring to Fig. 3, it is the structural representation of another embodiment of the circuit board that provides of the utility model.The communication interface of the circuit board that the present embodiment provides is mobile terminal high-definition audio and video standard interface (MHL interface).Particularly, the input of signal transmssion line 201 connects described mobile terminal high-definition audio and video standard interface 204; The input data of mobile terminal high-definition audio and video standard interface 204 transfer to described communication chip 203 by described signal transmssion line 201, are undertaken forwarding after format conversion processing by 203 pairs of described input data of described communication chip.
Further, in two embodiment that Fig. 1 and Fig. 3 provide, the length of signal transmssion line is less than or equal to 600 Mills (mil).
Referring to Fig. 4, it is the structural representation of another embodiment of the circuit board that provides of Fig. 3.During concrete enforcement, mobile terminal high-definition audio and video standard interface 301 is mainly used in the transmission of digital audio-video signal, can adopt D connector (the High Definition MultimediaInterface D Type of the HDMI (High Definition Multimedia Interface) of 19 pins (PIN), HDMI D Type), be commonly called as the Miniature HDMI for Micro HDMI() realize.Miniature HDMI is the HDMI standard interface of 1.4 versions, and it keeps the 19PIN of HDMI standard, is of a size of 2.8mm * 6.4mm, be mainly used on some small-sized mobile communication terminal devices, and as mobile phone, palmtop PC etc.
In the present embodiment, on mobile terminal high-definition audio and video standard interface 301, label is that two signal transmssion lines that 10,12 pin connects are the MHL signal transmssion line.For satisfying mobile terminal high-definition audio and video normal data to the characteristic impedance requirement of MHL signal transmssion line, be that common code impedance is 30 ohm (± 20%), differential impedance is 100 ohm (± 15%), MHL signal transmssion line 10,12 is finely tuned its characteristic impedance value separately by series connection 3.3 Ω～exclusion of 6.8 Ω or independent resistance 302.After the standard pronunciation vision signal that communication chip 303 receives by 301 inputs of mobile terminal high-definition audio and video standard interface, this its form is changed rear forwarding.
Be the characteristic impedance requirement of the signal transmssion line that satisfies the different application field, except with reference to above embodiment, namely resistors in series is realized also needing every making sheet parameter of circuit board is adjusted outside fine setting to its characteristic impedance value on signal transmssion line.
Fig. 5 is that the making sheet parameter of the circuit board that provides of the utility model arranges schematic diagram.
Signal transmssion line in circuit board is microstrip line.The top live width of described signal transmssion line is W1, and the bottom live width is W2, and the bottom spacing is S1, and thickness is T1.
The integrality in transmitting procedure for the input data of guaranteeing mobile terminal high-definition audio and video standard interface (MHL interface) when specifically implementing, arranges the above making sheet parameter.Wherein, 9 Mills≤W1≤13 Mills, 10 Mills≤W2≤14 Mills, 1≤6.5 Mill, 3.5 Mills≤S, 0.7 Mill≤T1≤2.1 Mills.
Further, the insulating medium layer of circuit board is that dielectric constant is that Er1, thickness are the insulation board of H1,3.8≤Er1≤5.0,6.8 Mills≤H1≤65 Mills.
Further, it is 3.5 green oil that described circuit board surface is coated with dielectric constant CEr, and the green oil thickness C 1 at the top of described signal transmssion line is 0.5 Mill, and the green oil thickness C 2 between described signal transmssion line is 0.5 Mill; The green oil thickness C 3 on described insulating medium layer surface is 0.8 Mill.
Further, in the specific implementation, for the circuit board that is provided with mobile terminal high-definition audio and video standard interface (MHL interface), for guaranteeing the integrality in transmitting procedure of input data, the length of described signal transmssion line is less than or equal to 600 Mills.Can be referring to Fig. 3 or Fig. 4, the length of signal transmssion line refers to the length of the transmission line track of described mobile terminal high-definition audio and video standard interface and described communication chip.In the present embodiment, can by limiting the length of differential signal transmission, further limit the resistance value of the test result of this differential signal transmission, to satisfy the needs of different applications.
In specific implementation process, circuit board making sheet parameter can be input to a simulation software, calculated according to the characteristic impedance computing formula of circuit board by this simulation software, thereby can verify based on the actual application requirements the characteristic impedance value that obtains required signal transmssion line.
The circuit board that the utility model provides, adopt double sided board to design, series connection is used for the resistor of fine setting impedance on signal transmssion line, and in conjunction with circuit board parameter setting flexibly, can realize the impedance index of input data in transmitting procedure of mobile terminal high-definition audio and video standard MHL interface, and shortened release cycle and the manufacturing cycle of circuit board, can improve making sheet efficient and further reduce the production cost of circuit board.The above is preferred implementation of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also are considered as protection range of the present utility model.
Claims (7)
1. a circuit board, comprise insulating medium layer, signal transport layer and ground plane, it is characterized in that, described signal transport layer is provided with signal transmssion line and communication chip;
After one of the output series connection of described signal transmssion line is used for the resistor of fine setting impedance, be connected with described communication chip.
2. at circuit board as claimed in claim 1, it is characterized in that, described resistor for the fine setting impedance is that resistance is the exclusion of Rx ohm or independent resistance, 3.3≤Rx≤6.8.
3. circuit board as claimed in claim 1 or 2, is characterized in that, also is provided with mobile terminal high-definition audio and video standard interface on described circuit board; The input of described signal transmssion line connects described mobile terminal high-definition audio and video standard interface;
The input data of described mobile terminal high-definition audio and video standard interface transfer to described communication chip by described signal transmssion line, by described communication chip, described input data are carried out forwarding after format conversion processing.
4. circuit board as claimed in claim 3, is characterized in that, described signal transmssion line is microstrip line; The top live width of described signal transmssion line is W1, and the bottom live width is W2, and the bottom spacing is S1, and thickness is T1; Wherein, 9 Mills≤W1≤13 Mills, 10 Mills≤W2≤14 Mills, 3.5 Mills≤S1≤6.5 Mills, 0.7 Mill≤T1≤2.1 Mills.
5. circuit board as claimed in claim 4, is characterized in that, the insulating medium layer of described circuit board is that dielectric constant is that Er1, thickness are the insulation board of H1,3.8≤Er1≤5.0,6.8 Mills≤H1≤65 Mills.
6. circuit board as claimed in claim 5, it is characterized in that, it is 3.5 green oil that described circuit board surface is coated with dielectric constant CEr, and the green oil thickness C 1 at the top of described signal transmssion line is 0.5 Mill, and the green oil thickness C 2 between described signal transmssion line is 0.5 Mill; The green oil thickness C 3 on described insulating medium layer surface is 0.8 Mill.
7. circuit board as claimed in claim 3, is characterized in that, the length of described signal transmssion line is less than or equal to 600 Mills.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220632398 CN203015270U (en) | 2012-11-26 | 2012-11-26 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220632398 CN203015270U (en) | 2012-11-26 | 2012-11-26 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203015270U true CN203015270U (en) | 2013-06-19 |
Family
ID=48606821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220632398 Expired - Lifetime CN203015270U (en) | 2012-11-26 | 2012-11-26 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203015270U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104134918A (en) * | 2014-07-29 | 2014-11-05 | 浪潮电子信息产业股份有限公司 | Method for changing characteristic impedance of signal transmission link |
-
2012
- 2012-11-26 CN CN 201220632398 patent/CN203015270U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104134918A (en) * | 2014-07-29 | 2014-11-05 | 浪潮电子信息产业股份有限公司 | Method for changing characteristic impedance of signal transmission link |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130619 |