CN105682360B - High-frequency model and mobile terminal - Google Patents
High-frequency model and mobile terminal Download PDFInfo
- Publication number
- CN105682360B CN105682360B CN201610105677.0A CN201610105677A CN105682360B CN 105682360 B CN105682360 B CN 105682360B CN 201610105677 A CN201610105677 A CN 201610105677A CN 105682360 B CN105682360 B CN 105682360B
- Authority
- CN
- China
- Prior art keywords
- copper foil
- layer
- foil layer
- frequency model
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 59
- 239000011889 copper foil Substances 0.000 claims abstract description 59
- 239000010410 layer Substances 0.000 claims description 99
- 238000012546 transfer Methods 0.000 claims description 25
- 239000011241 protective layer Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 4
- 229910000906 Bronze Inorganic materials 0.000 claims 1
- 239000010974 bronze Substances 0.000 claims 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Transceivers (AREA)
Abstract
The invention discloses a kind of high-frequency models, it include: printed circuit board, including the first copper foil layer, first medium layer and the second copper foil layer being cascading, first copper foil layer offers the first hole, the first medium layer offers the second hole, and first hole is connected with second hole and mounting groove is collectively formed；Matching element is placed in the mounting groove, and the matching element includes first port；And chip, the chip are located at side of first copper foil layer far from the first medium layer, the chip includes first interface, and the first interface connects the first port.The production cost of high-frequency model of the present invention is low.The invention also discloses a kind of mobile terminals using the high-frequency model.
Description
Technical field
The present invention relates to high frequency signal transmission technical field more particularly to a kind of high-frequency model and a kind of application height
The mobile terminal of frequency module.
Background technique
With the development of wireless communication technique, wireless Netcom's product day shows important.High-frequency model in general wireless communication
It include the transfer wire of chip, antenna and the connection chip and the antenna.When the transfer wire is formed in printing electricity
When on road plate (Printed Circuit Board, PCB), the cabling cabling scenario of the printed circuit board needs to meet impedance
It matches (impedance matching), to avoid the reflection due to caused by impedance mismatch, reduces Jie when signal transmitting
Enter loss (insertion loss), and the return loss (return loss) reduced when opposite raising signal transmitting, thus
Avoid influencing the quality of signal transmitting.
Impedance matching refers in energy transmission, it is desirable that load impedance is equal with the characteristic impedance of transmission line, at this time
Transmission will not generate reflection, this shows that all energy are all supported and absorbs.It is on the contrary then have energy loss in the transmission.Existing skill
In art, the reflection of signal in order to prevent usually requires that the characteristic impedance of transfer wire on printed circuit board is 50 ohm, so that high
Loss and reflection of the frequency signal when transferring are minimum, to ensure signal quality.
In order to enable the characteristic impedance control of transmission line is at 50 ohm, insider's usually addition on a printed circuit
Cabling with element and for connecting chip and matching element.However, the program meeting of also tending to is so that walking on printed circuit board
Line and structure is complicated change, the volume of printed circuit board is increased, so that the increased costs of the high-frequency model.
Summary of the invention
Technical problem to be solved by the present invention lies in described in the high-frequency model for providing a kind of low cost and a kind of application
The mobile terminal of high-frequency model.
To achieve the goals above, embodiment of the present invention adopts the following technical scheme that
On the one hand, a kind of high-frequency model is provided, comprising:
Printed circuit board, it is described including the first copper foil layer, first medium layer and the second copper foil layer being cascading
First copper foil layer offers the first hole, and the first medium layer offers the second hole, and first hole is connected with second hole
Lead to and mounting groove is collectively formed；
Matching element is placed in the mounting groove, and the matching element includes first port；And
Chip, the chip are located at side of first copper foil layer far from the first medium layer, and the chip includes
First interface, the first interface connect the first port.
Wherein, first copper foil layer includes transfer wire, and the matching element includes second port, the transfer wire
One end connect the second port, and the transfer wire be used for by the second port with it is other in the high-frequency model
Element electrical connection.
Wherein, the high-frequency model further includes antenna, and the antenna is connected to the other end of the transfer wire.
Wherein, the matching element includes resistance, and one end of the resistance connects the first interface, the resistance it is another
One end connects one end of the transfer wire, is connected in series in the resistance between the chip and the transfer wire.
Wherein, the chip further includes second interface, and first copper foil layer includes signal wire, the second interface connection
The signal wire, the signal wire are used for the other elements being electrically connected to the second interface in the high-frequency model.
Wherein, the printed circuit board further includes being sequentially laminated on second copper foil layer far from the first medium layer
Second dielectric layer, third copper foil layer, third dielectric layer and the 4th copper foil layer of side.
Wherein, first copper foil layer is the first signals layer, and second copper foil layer is ground plane, the third copper foil layer
For bus plane, the 4th copper foil layer is second signal layer.
Wherein, the printed circuit board further includes the first protective layer and the second protective layer, and first protective layer is located at institute
Side of first copper foil layer far from the first medium layer is stated, second protective layer is located at the 4th copper foil layer far from described
The side of third dielectric layer.
Wherein, the material of the first medium layer, the second dielectric layer and the third dielectric layer is identical.
On the other hand, a kind of mobile terminal is also provided, including as above described in any item high-frequency models.
Compared to the prior art, the invention has the following advantages:
High-frequency model of the present invention, since matching element described in its is placed directly within the installation of the printed circuit board
In slot, and the first interface of the first port of the matching element and chip contact connectio namely described
It partly overlaps to place with the chip with element and be electrically connected with realizing, therefore the high-frequency model does not both need to be arranged for connecting
The connection cabling of the matching element and the chip, the matching element will not additionally occupy the cloth of the printed circuit board
Space of lines reduces the high-frequency model so that the structure of the printed circuit board and cabling cabling scenario are more simple, optimize
Production cost.
Detailed description of the invention
In order to illustrate more clearly of technical solution of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, other attached drawings can also be obtained such as these attached drawings.
Fig. 1 is a kind of structural schematic diagram of high-frequency model provided in an embodiment of the present invention.
Fig. 2 is the structural schematic diagram of the printed circuit board of high-frequency model shown in Fig. 1.
Fig. 3 is the overlooking structure diagram of high-frequency model shown in Fig. 1.
Fig. 4 is the structural schematic diagram of another high-frequency model provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Also referring to Fig. 1 to Fig. 3, the embodiment of the present invention provides a kind of high-frequency model, including printed circuit board 1, matching
Element 3 and chip 2.Wherein: the printed circuit board 1 includes the first copper foil layer 11, the first medium layer 12 being cascading
And second copper foil layer 13, first copper foil layer 11 offer the first hole 110, the first medium layer 12 offers the second hole
120, first hole 110 is connected with second hole 120 and mounting groove 10 is collectively formed.The matching element 3 is placed in institute
It states in mounting groove 10, the matching element 3 includes first port 31.The chip 2 is located at first copper foil layer 11 far from institute
The side of first medium layer 12 is stated, the chip 2 includes first interface 21, and the first interface 21 connects the first end
Mouth 31.
In the present embodiment, the matching element 3 of the high-frequency model is placed directly within the described of the printed circuit board 1
In mounting groove 10, and 21 company of contact of the first interface of the first port 31 of the matching element 3 and the chip 2
It connects namely the matching element 3 partly overlaps to place with the chip 2 and is electrically connected with realizing, therefore the high-frequency model is neither
Need to be arranged the connection cabling for connecting the matching element 3 and the chip 2, the matching element 3 will not be accounted for additionally
According to the wiring space of the printed circuit board 1 so that the structure of the printed circuit board 1 and cabling cabling scenario it is more simple,
Optimization, reduces the production cost of the high-frequency model.
Further, also referring to Fig. 1 to Fig. 3, first copper foil layer 11 includes transfer wire 100, the matching
Element 3 includes second port 32, and one end of the transfer wire 100 connects the second port 32, and the transfer wire 100
For the second port 32 to be electrically connected with other elements in the high-frequency model, to realize signal transfer functions.
In the prior art, it usually needs setting connection cabling is somebody's turn to do with connecting the matching element 3 and the chip 2
The characteristic impedance and the characteristic impedance of the transfer wire 100 of section connection cabling are simultaneously discontinuous, therefore are easy to make in this section connection
The high-frequency signal transmitted on cabling is distorted, and not can guarantee the signal quality of high-frequency signal.High-frequency model described in the present embodiment
High-frequency signal from the chip 2 sending after, be directly entered the matching element 3, and be and then passed to the transfer wire
100, connection Wiring structure in the prior art is omitted, avoids high-frequency signal and is sent out before entering the transfer wire 100
Raw distortion, influences the quality of high-frequency signal.Meanwhile the setting of the matching element 3 is so that the feature of the transfer wire 100 hinders
Resisting is 50 ohm, reduces the reflection and loss of high-frequency signal, ensure that high-frequency signal is able to carry out high-quality transmission.
Further, referring to Fig. 3, the high-frequency model further includes antenna 4, the antenna 4 is connected to the transmission and leads
The other end of line 100.
Further, the matching element 3 includes resistance, and one end of the resistance connects the first interface, the electricity
The other end of resistance connects one end of the transfer wire, make the resistance be connected in series in the chip and the transfer wire it
Between.The small power consumption of the resistance will not bring additional DC load to the chip 2, therefore be not required for the chip 2 and have
There is very big current driving ability, reduces requirement of the high-frequency model to the chip 2, be applicable to larger range of institute
Chip 2 is stated, applicability is high, at low cost.
Certainly, the matching element 3 can also carry out other designs, the matching member according to different impedance matching demands
Part 3 includes but is not limited to the elements such as resistance, inductance, capacitor.
Further, referring to Fig. 4, the chip 2 further includes second interface 22, first copper foil layer 11 includes signal
Line 110, the second interface 22 connect the signal wire 110, and the signal wire 110 is for the second interface 22 to be electrically connected
To other elements in the high-frequency model.The signal wire 110 can be used for transmitting other signals, so that the chip 2 is realized
Other function.
Further, referring to Fig. 2, the printed circuit board 1 further includes being sequentially laminated on second copper foil layer 13 far
Second dielectric layer 14, third copper foil layer 15, third dielectric layer 16 and the 4th copper foil of side from the first medium layer 12
Layer 17.In the present embodiment, first copper foil layer 11 is the first signals layer, and second copper foil layer 13 is ground plane, described
Third copper foil layer 15 is bus plane, and the 4th copper foil layer 17 is second signal layer.First copper foil layer 11 and the described 4th
Copper foil layer 17 can be used for transmitting unlike signal, such as other low frequency signals or different height different from above-mentioned high-frequency signal
Frequency signal, so that the high-frequency model can carry out the transmission of multi-signal simultaneously, to realize multifunction.Second copper foil
Layer 13 is ground plane, and the third copper foil layer 15 is bus plane, improves the stability of the circuit of the high-frequency model and resists dry
Disturb ability.
Preferably, the material phase of the first medium layer 12, the second dielectric layer 14 and the third dielectric layer 16
Together, with the production material and production process of the simplification printed circuit board 1, the production cost of the printed circuit board 1 is reduced,
Reduce the cost of the high-frequency model.
Further, referring to Fig. 2, the printed circuit board 1 further includes the first protective layer 19 and the second protective layer 18, institute
It states the first protective layer 19 and is located at side of first copper foil layer 11 far from the first medium layer 12, second protective layer 18
Positioned at the side of the 4th copper foil layer 17 far from the third dielectric layer 16.First protective layer 19 and second protection
Layer 18 ensures the signal of the high-frequency model to protect first copper foil layer 11 and the cabling on the 4th copper foil layer 17
The reliability of transmission.
The embodiment of the present invention also provides a kind of mobile terminal, including high-frequency model as described above.The mobile terminal refers to
The computer equipment that can be used on the move, including but not limited to mobile phone, notebook, tablet computer, POS machine, vehicle-mounted computer,
Camera etc..
The embodiment of the present invention has been described in detail above, specific case used herein to the principle of the present invention and
Embodiment is expounded, and the above description of the embodiment is only used to help understand the method for the present invention and its core ideas；
At the same time, for those skilled in the art can in specific embodiments and applications according to the thought of the present invention
There is change place, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (10)
1. a kind of high-frequency model characterized by comprising
Printed circuit board, including the first copper foil layer, first medium layer and the second copper foil layer being cascading, described first
Copper foil layer offers the first hole, and the first medium layer offers the second hole, first hole be connected with second hole and
Mounting groove is collectively formed；
Matching element is placed in the mounting groove, and the matching element includes first port；And
Chip, the chip are located at side of first copper foil layer far from the first medium layer, and the chip includes first
Interface, the first interface connect the first port；
Wherein, first copper foil layer includes transfer wire, and the matching element includes second port, and the one of the transfer wire
End connects the second port, and the transfer wire is used for other elements in the second port and the high-frequency model
Electrical connection.
2. high-frequency model as described in claim 1, which is characterized in that the high-frequency model further includes antenna, and the antenna connects
It is connected to the other end of the transfer wire.
3. high-frequency model as described in claim 1, which is characterized in that the matching element includes resistance, and the one of the resistance
End connects the first interface, and the other end of the resistance connects one end of the transfer wire, and the resistance is connected in series
Between the chip and the transfer wire.
4. high-frequency model as described in claim 1, which is characterized in that the chip further includes second interface, first bronze medal
Layers of foil includes signal wire, and the second interface connects the signal wire, and the signal wire is for the second interface to be electrically connected
To other elements in the high-frequency model.
5. high-frequency model as described in claim 1, which is characterized in that the printed circuit board further include be sequentially laminated on it is described
The second dielectric layer of side of second copper foil layer far from the first medium layer, third copper foil layer, third dielectric layer and the 4th
Copper foil layer.
6. high-frequency model as claimed in claim 5, which is characterized in that first copper foil layer is the first signals layer, described the
Two copper foil layers are ground plane, and the third copper foil layer is bus plane, and the 4th copper foil layer is second signal layer.
7. high-frequency model as claimed in claim 5, which is characterized in that the printed circuit board further includes the first protective layer and
Two protective layers, first protective layer are located at side of first copper foil layer far from the first medium layer, and described second protects
Sheath is located at the side of the 4th copper foil layer far from the third dielectric layer.
8. high-frequency model as claimed in claim 5, which is characterized in that the first medium layer, the second dielectric layer and
The material of the third dielectric layer is identical.
9. a kind of high-frequency model characterized by comprising
Printed circuit board, including the first copper foil layer, first medium layer and the second copper foil layer being cascading, described first
Copper foil layer offers the first hole, and the first medium layer offers the second hole, first hole be connected with second hole and
Mounting groove is collectively formed；
Matching element is placed in the mounting groove, and the matching element includes first port；And
Chip, the chip are located at side of first copper foil layer far from the first medium layer, and the chip includes first
Interface, the first interface connect the first port；
Wherein, the chip further includes second interface, and first copper foil layer includes signal wire, described in the second interface connection
Signal wire, the signal wire are used for the other elements being electrically connected to the second interface in the high-frequency model.
10. a kind of mobile terminal, which is characterized in that including such as described in any item high-frequency models of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105677.0A CN105682360B (en) | 2016-02-25 | 2016-02-25 | High-frequency model and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105677.0A CN105682360B (en) | 2016-02-25 | 2016-02-25 | High-frequency model and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105682360A CN105682360A (en) | 2016-06-15 |
| CN105682360B true CN105682360B (en) | 2018-12-11 |
Family
ID=56305964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610105677.0A Expired - Fee Related CN105682360B (en) | 2016-02-25 | 2016-02-25 | High-frequency model and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105682360B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114966542A (en) * | 2022-07-29 | 2022-08-30 | 合肥有感科技有限责任公司 | Digital key positioning system and positioning method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101588195A (en) * | 2008-05-21 | 2009-11-25 | 华为技术有限公司 | Power amplification device and signal receiving and transmitting system |
| CN201986264U (en) * | 2011-04-28 | 2011-09-21 | 芯通科技（成都）有限公司 | Compound substrate for low-thermal resistance radio frequency amplifier |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101801162A (en) * | 2010-02-25 | 2010-08-11 | 中兴通讯股份有限公司 | Wireless communication module |
-
2016
- 2016-02-25 CN CN201610105677.0A patent/CN105682360B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101588195A (en) * | 2008-05-21 | 2009-11-25 | 华为技术有限公司 | Power amplification device and signal receiving and transmitting system |
| CN201986264U (en) * | 2011-04-28 | 2011-09-21 | 芯通科技（成都）有限公司 | Compound substrate for low-thermal resistance radio frequency amplifier |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105682360A (en) | 2016-06-15 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181211 |
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| CF01 | Termination of patent right due to non-payment of annual fee |