CN202884857U - Heat dissipation conductor device of light emitting diode (LED) lamp panel - Google Patents
Heat dissipation conductor device of light emitting diode (LED) lamp panel Download PDFInfo
- Publication number
- CN202884857U CN202884857U CN2012205367719U CN201220536771U CN202884857U CN 202884857 U CN202884857 U CN 202884857U CN 2012205367719 U CN2012205367719 U CN 2012205367719U CN 201220536771 U CN201220536771 U CN 201220536771U CN 202884857 U CN202884857 U CN 202884857U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- wafer
- led lamp
- led
- dissipation conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model relates to a light emitting diode (LED) lamp, in particular to a heat dissipation conductor device of an LED lamp panel. The heat dissipation conductor device of the LED lamp panel is characterized by comprising an insulating baseplate, a metal wire section is arranged inside the insulating baseplate, the diameter of the metal wires are between 2-5 millimeters, and the intervals are between 0.1-5millimeters; the metal wires section are a wafer carrier and a heat dissipation conductor of the wafer; and an LED lamp cup is formed in the center of the metal wires section by stamping. The heat dissipation conductor device of the LED lamp panel has the advantages of being small in size, good in manufacturability and heat dissipation performance and low in cost.
Description
Technical field
The utility model relates to the heat dissipation conductor device of a kind of LED lamp, particularly a kind of LED lamp plate.
Background technology
Affect life-span and the brightness constancy of LED lamp, on the one hand relevant with manufacturing process, whether constant current is relevant with temperature and electric current on the other hand.The former belongs to production link, and the latter belongs to the use link.Use technique and technology bad, will have a strong impact on life-span and brightness.
High-powered LED lamp is at the electric current of very little wafer by more than the 300ma, and such as operating voltage 3.3v, therefore its power need good radiator that tube core is dispelled the heat at 1w.Otherwise the life-span of LED lamp will be affected.
Low power LED operating current is at 20ma, therefore just can well dispel the heat with the support by itself, but a lot of low-power LED serial or parallel connections of the high-power needs that reach use, the white light LEDs of 3.3v such as operating voltage, its single power is at 0.06W, and the luminous power that reach 5w needs 84 LED.This just brings the production link quality Control.The lamp plate volume increases on the other hand.
The utility model content
The purpose of this utility model provides that a kind of lamp plate volume is little, the heat dissipation conductor device of good manufacturability and a kind of LED lamp plate that thermal diffusivity is good, cost is low.
The purpose of this utility model is achieved in that a kind of heat dissipation conductor device of LED lamp plate, it is characterized in that: comprise insulated substrate, the metal guide line segment is arranged in the insulated substrate, the plain conductor diameter is between 2-5mm, and its interval is between 0.1mm-5mm.
Described metal guide line segment is the heat dissipation conductor of wafer carrier and wafer.
Described metal guide line segment center forms the LED Lamp cup by punching press.
Electrode of described wafer is fixed in the Lamp cup by conducting resinl, and another electrode of wafer is connected with the second wafer by the side alignment, and lamp plate is placed LED wafer face and processed by light-transmissive resin or blue white light process seal.
The utility model has the advantages that: because lamp plate is to be made of the conductor that evenly passes in insulator and the insulator, the conductor center forms the LED Lamp cup by punching press, electrode of wafer is fixed in the Lamp cup by conducting resinl, like this can integrated up to a hundred LED in a little area, be 0.06W by a LED, 100 LED are 6W.The LED of each 0.06W reaches its heat radiation requirement far away on one section diameter 5mm-2mm cylindrical body.
Description of drawings
The utility model is described in further detail below in conjunction with the embodiment accompanying drawing:
Fig. 1 is the utility model embodiment 1 structural representation;
Fig. 2 is the utility model embodiment 1 structural representation;
Fig. 3 is the utility model embodiment 1 structural representation.
Among the figure: 1, insulated substrate; 2, heat dissipation conductor; 3, Lamp cup; 4, wafer; 5, side alignment.
The specific embodiment
As shown in Figure 1, a kind of heat dissipation conductor device of LED lamp plate is characterized in that: comprise insulated substrate 1, the metal guide line segment is arranged in the insulated substrate 1, the plain conductor diameter is between 2-5mm, and its interval is between 0.1mm-5mm.
As shown in Figures 2 and 3, the metal guide line segment is the heat dissipation conductor 2 of wafer 4 carriers and wafer 4; Metal guide line segment center forms LED Lamp cup 3 by punching press.4 one electrodes of wafer are fixed in the Lamp cup 3 by conducting resinl, and wafer 4 another electrodes are connected with the second wafer by side alignment 5, and lamp plate is placed LED wafer face and processed by light-transmissive resin or blue white light process seal.
Plain conductor is spaced apart at insulating materials, and its interval is between 0.1mm-5mm, and its concrete interval determines with wafer 4 watt levels and designing requirement.
The plain conductor diameter is between 2-5mm, and the plain conductor diameter determines with wafer 4 watt levels and designing requirement.
Claims (4)
1. the heat dissipation conductor device of a LED lamp plate, it is characterized in that: comprise insulated substrate, the metal guide line segment is arranged in the insulated substrate, the plain conductor diameter is between 2-5mm, and its interval is between 0.1mm-5mm.
2. the heat dissipation conductor device of a kind of LED lamp plate according to claim 1, it is characterized in that: described metal guide line segment is the heat dissipation conductor of wafer carrier and wafer.
3. the heat dissipation conductor device of a kind of LED lamp plate according to claim 1 is characterized in that: described metal guide line segment center forms the LED Lamp cup by punching press.
4. the heat dissipation conductor device of a kind of LED lamp plate according to claim 2, it is characterized in that: electrode of described wafer is fixed in the Lamp cup by conducting resinl, another electrode of wafer is connected with the second wafer by the side alignment, and lamp plate is placed LED wafer face and processed by light-transmissive resin or blue white light process seal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012205367719U CN202884857U (en) | 2012-10-19 | 2012-10-19 | Heat dissipation conductor device of light emitting diode (LED) lamp panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012205367719U CN202884857U (en) | 2012-10-19 | 2012-10-19 | Heat dissipation conductor device of light emitting diode (LED) lamp panel |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202884857U true CN202884857U (en) | 2013-04-17 |
Family
ID=48076281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012205367719U Expired - Fee Related CN202884857U (en) | 2012-10-19 | 2012-10-19 | Heat dissipation conductor device of light emitting diode (LED) lamp panel |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202884857U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104864374A (en) * | 2015-05-26 | 2015-08-26 | 陈莹莹 | Heat dissipation conductor device of LED lamp panel |
-
2012
- 2012-10-19 CN CN2012205367719U patent/CN202884857U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104864374A (en) * | 2015-05-26 | 2015-08-26 | 陈莹莹 | Heat dissipation conductor device of LED lamp panel |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103353098A (en) | High-power LED lamp cooling device and manufacturing method thereof | |
CN202884857U (en) | Heat dissipation conductor device of light emitting diode (LED) lamp panel | |
CN102913878A (en) | Heat dissipation conductor structure of LED (Light Emitting Diode) lamp panel | |
CN202719394U (en) | Ceramic seat light-emitting diode (LED) illuminating lamp | |
CN205402603U (en) | LED packaging structure with double -colored temperature filament strip | |
CN202419611U (en) | Heat dissipation device of light-emitting diode (LED) light source | |
CN102162593B (en) | Lighting device | |
CN102903711A (en) | Lamp panel technology of LED (Light Emitting Diode) lamp | |
CN202948977U (en) | Light emitting diode (LED) lamp board device with good radiation and low cost | |
CN202839606U (en) | Lamp panel of light-emitting diode (LED) lamp | |
CN201396621Y (en) | High-power LED light source structure | |
CN104864374A (en) | Heat dissipation conductor device of LED lamp panel | |
CN102916119A (en) | LED (light-emitting diode) lamp panel with good heat dissipation property and low cost | |
CN102913803A (en) | Light emitting diode (LED) lamp strip | |
US20150345713A1 (en) | Illumination lamp | |
CN203192847U (en) | Light emitting diode device | |
CN207298823U (en) | A kind of safe LED integrated light source boards | |
US20080272390A1 (en) | Led apparatus | |
CN201877427U (en) | Integrated high-power LED (light-emitting diode) | |
CN100557300C (en) | The led lamp substrate of high-cooling property | |
CN201680301U (en) | LED light source of double-side copper-applying ceramic plate | |
CN103307470A (en) | Light emitting device | |
CN203192848U (en) | Light emitting diode device | |
CN202423286U (en) | Integrated LED point light source | |
CN202268385U (en) | Efficient heat-conducting high-power aluminum substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130417 Termination date: 20131019 |