CN202884857U - Heat dissipation conductor device of light emitting diode (LED) lamp panel - Google Patents

Heat dissipation conductor device of light emitting diode (LED) lamp panel Download PDF

Info

Publication number
CN202884857U
CN202884857U CN2012205367719U CN201220536771U CN202884857U CN 202884857 U CN202884857 U CN 202884857U CN 2012205367719 U CN2012205367719 U CN 2012205367719U CN 201220536771 U CN201220536771 U CN 201220536771U CN 202884857 U CN202884857 U CN 202884857U
Authority
CN
China
Prior art keywords
heat dissipation
wafer
led lamp
led
dissipation conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012205367719U
Other languages
Chinese (zh)
Inventor
刘珉恺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Xinwei Information Technology Co Ltd
Original Assignee
Xian Xinwei Information Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xian Xinwei Information Technology Co Ltd filed Critical Xian Xinwei Information Technology Co Ltd
Priority to CN2012205367719U priority Critical patent/CN202884857U/en
Application granted granted Critical
Publication of CN202884857U publication Critical patent/CN202884857U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The utility model relates to a light emitting diode (LED) lamp, in particular to a heat dissipation conductor device of an LED lamp panel. The heat dissipation conductor device of the LED lamp panel is characterized by comprising an insulating baseplate, a metal wire section is arranged inside the insulating baseplate, the diameter of the metal wires are between 2-5 millimeters, and the intervals are between 0.1-5millimeters; the metal wires section are a wafer carrier and a heat dissipation conductor of the wafer; and an LED lamp cup is formed in the center of the metal wires section by stamping. The heat dissipation conductor device of the LED lamp panel has the advantages of being small in size, good in manufacturability and heat dissipation performance and low in cost.

Description

A kind of heat dissipation conductor device of LED lamp plate
Technical field
The utility model relates to the heat dissipation conductor device of a kind of LED lamp, particularly a kind of LED lamp plate.
Background technology
Affect life-span and the brightness constancy of LED lamp, on the one hand relevant with manufacturing process, whether constant current is relevant with temperature and electric current on the other hand.The former belongs to production link, and the latter belongs to the use link.Use technique and technology bad, will have a strong impact on life-span and brightness.
High-powered LED lamp is at the electric current of very little wafer by more than the 300ma, and such as operating voltage 3.3v, therefore its power need good radiator that tube core is dispelled the heat at 1w.Otherwise the life-span of LED lamp will be affected.
Low power LED operating current is at 20ma, therefore just can well dispel the heat with the support by itself, but a lot of low-power LED serial or parallel connections of the high-power needs that reach use, the white light LEDs of 3.3v such as operating voltage, its single power is at 0.06W, and the luminous power that reach 5w needs 84 LED.This just brings the production link quality Control.The lamp plate volume increases on the other hand.
The utility model content
The purpose of this utility model provides that a kind of lamp plate volume is little, the heat dissipation conductor device of good manufacturability and a kind of LED lamp plate that thermal diffusivity is good, cost is low.
The purpose of this utility model is achieved in that a kind of heat dissipation conductor device of LED lamp plate, it is characterized in that: comprise insulated substrate, the metal guide line segment is arranged in the insulated substrate, the plain conductor diameter is between 2-5mm, and its interval is between 0.1mm-5mm.
Described metal guide line segment is the heat dissipation conductor of wafer carrier and wafer.
Described metal guide line segment center forms the LED Lamp cup by punching press.
Electrode of described wafer is fixed in the Lamp cup by conducting resinl, and another electrode of wafer is connected with the second wafer by the side alignment, and lamp plate is placed LED wafer face and processed by light-transmissive resin or blue white light process seal.
The utility model has the advantages that: because lamp plate is to be made of the conductor that evenly passes in insulator and the insulator, the conductor center forms the LED Lamp cup by punching press, electrode of wafer is fixed in the Lamp cup by conducting resinl, like this can integrated up to a hundred LED in a little area, be 0.06W by a LED, 100 LED are 6W.The LED of each 0.06W reaches its heat radiation requirement far away on one section diameter 5mm-2mm cylindrical body.
Description of drawings
The utility model is described in further detail below in conjunction with the embodiment accompanying drawing:
Fig. 1 is the utility model embodiment 1 structural representation;
Fig. 2 is the utility model embodiment 1 structural representation;
Fig. 3 is the utility model embodiment 1 structural representation.
Among the figure: 1, insulated substrate; 2, heat dissipation conductor; 3, Lamp cup; 4, wafer; 5, side alignment.
The specific embodiment
As shown in Figure 1, a kind of heat dissipation conductor device of LED lamp plate is characterized in that: comprise insulated substrate 1, the metal guide line segment is arranged in the insulated substrate 1, the plain conductor diameter is between 2-5mm, and its interval is between 0.1mm-5mm.
As shown in Figures 2 and 3, the metal guide line segment is the heat dissipation conductor 2 of wafer 4 carriers and wafer 4; Metal guide line segment center forms LED Lamp cup 3 by punching press.4 one electrodes of wafer are fixed in the Lamp cup 3 by conducting resinl, and wafer 4 another electrodes are connected with the second wafer by side alignment 5, and lamp plate is placed LED wafer face and processed by light-transmissive resin or blue white light process seal.
Plain conductor is spaced apart at insulating materials, and its interval is between 0.1mm-5mm, and its concrete interval determines with wafer 4 watt levels and designing requirement.
The plain conductor diameter is between 2-5mm, and the plain conductor diameter determines with wafer 4 watt levels and designing requirement.

Claims (4)

1. the heat dissipation conductor device of a LED lamp plate, it is characterized in that: comprise insulated substrate, the metal guide line segment is arranged in the insulated substrate, the plain conductor diameter is between 2-5mm, and its interval is between 0.1mm-5mm.
2. the heat dissipation conductor device of a kind of LED lamp plate according to claim 1, it is characterized in that: described metal guide line segment is the heat dissipation conductor of wafer carrier and wafer.
3. the heat dissipation conductor device of a kind of LED lamp plate according to claim 1 is characterized in that: described metal guide line segment center forms the LED Lamp cup by punching press.
4. the heat dissipation conductor device of a kind of LED lamp plate according to claim 2, it is characterized in that: electrode of described wafer is fixed in the Lamp cup by conducting resinl, another electrode of wafer is connected with the second wafer by the side alignment, and lamp plate is placed LED wafer face and processed by light-transmissive resin or blue white light process seal.
CN2012205367719U 2012-10-19 2012-10-19 Heat dissipation conductor device of light emitting diode (LED) lamp panel Expired - Fee Related CN202884857U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012205367719U CN202884857U (en) 2012-10-19 2012-10-19 Heat dissipation conductor device of light emitting diode (LED) lamp panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012205367719U CN202884857U (en) 2012-10-19 2012-10-19 Heat dissipation conductor device of light emitting diode (LED) lamp panel

Publications (1)

Publication Number Publication Date
CN202884857U true CN202884857U (en) 2013-04-17

Family

ID=48076281

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012205367719U Expired - Fee Related CN202884857U (en) 2012-10-19 2012-10-19 Heat dissipation conductor device of light emitting diode (LED) lamp panel

Country Status (1)

Country Link
CN (1) CN202884857U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104864374A (en) * 2015-05-26 2015-08-26 陈莹莹 Heat dissipation conductor device of LED lamp panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104864374A (en) * 2015-05-26 2015-08-26 陈莹莹 Heat dissipation conductor device of LED lamp panel

Similar Documents

Publication Publication Date Title
CN103353098A (en) High-power LED lamp cooling device and manufacturing method thereof
CN202884857U (en) Heat dissipation conductor device of light emitting diode (LED) lamp panel
CN102913878A (en) Heat dissipation conductor structure of LED (Light Emitting Diode) lamp panel
CN202719394U (en) Ceramic seat light-emitting diode (LED) illuminating lamp
CN205402603U (en) LED packaging structure with double -colored temperature filament strip
CN202419611U (en) Heat dissipation device of light-emitting diode (LED) light source
CN102162593B (en) Lighting device
CN102903711A (en) Lamp panel technology of LED (Light Emitting Diode) lamp
CN202948977U (en) Light emitting diode (LED) lamp board device with good radiation and low cost
CN202839606U (en) Lamp panel of light-emitting diode (LED) lamp
CN201396621Y (en) High-power LED light source structure
CN104864374A (en) Heat dissipation conductor device of LED lamp panel
CN102916119A (en) LED (light-emitting diode) lamp panel with good heat dissipation property and low cost
CN102913803A (en) Light emitting diode (LED) lamp strip
US20150345713A1 (en) Illumination lamp
CN203192847U (en) Light emitting diode device
CN207298823U (en) A kind of safe LED integrated light source boards
US20080272390A1 (en) Led apparatus
CN201877427U (en) Integrated high-power LED (light-emitting diode)
CN100557300C (en) The led lamp substrate of high-cooling property
CN201680301U (en) LED light source of double-side copper-applying ceramic plate
CN103307470A (en) Light emitting device
CN203192848U (en) Light emitting diode device
CN202423286U (en) Integrated LED point light source
CN202268385U (en) Efficient heat-conducting high-power aluminum substrate

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130417

Termination date: 20131019