CN104864374A - Heat dissipation conductor device of LED lamp panel - Google Patents
Heat dissipation conductor device of LED lamp panel Download PDFInfo
- Publication number
- CN104864374A CN104864374A CN201510292878.1A CN201510292878A CN104864374A CN 104864374 A CN104864374 A CN 104864374A CN 201510292878 A CN201510292878 A CN 201510292878A CN 104864374 A CN104864374 A CN 104864374A
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- CN
- China
- Prior art keywords
- heat dissipation
- led lamp
- wafer
- lamp panel
- conductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
Abstract
The invention relates to an LED lamp, in particular to a heat dissipation conductor device of an LED lamp panel. The heat dissipation conductor device of the LED lamp panel is characterized in that an insulating substrate is included; metal wire sections are arranged in the insulating substrate, the diameter of a metal wire ranges from 2 mm to 5 mm, and the intervals among the metal wires range from 0.1 mm to 5 mm; the metal wire sections are wafer carriers and wafer heat dissipation conductors, and an LED lamp cup is formed in the center of each metal wire section through stamping. The heat dissipation conductor device of the LED lamp panel is small in lamp panel size, good in manufacturability and heat dissipation performance and low in cost.
Description
Technical field
The application relates to a kind of LED, particularly a kind of heat dissipation conductor device of LED lamp panel.
Background technology
Affect life-span and the brightness constancy of LED, on the one hand relevant with manufacturing process, whether constant current is relevant with temperature and electric current on the other hand.The former belongs to production link, and the latter belongs to use link.Operation and technology bad, life-span and brightness will be had a strong impact on.
High-powered LED lamp is the electric current by more than 300ma on very little wafer, and as operating voltage 3.3v, its power, at 1w, therefore needs good radiator to dispel the heat to tube core.Otherwise the life-span of LED will be affected.
Low power LED operating current is at 20ma, therefore just can well dispel the heat with the support by itself, but a lot of low-power LED serial or parallel connection of the high-power needs reaching use, as the white light LEDs that operating voltage is 3.3v, its single power is at 0.06W, and the luminous power that reach 5w needs 84 LED.This just brings production link quality Control.Lamp plate volume increases on the other hand.
Application content
The object of the application is to provide that a kind of lamp plate volume is little, the heat dissipation conductor device of good manufacturability and thermal diffusivity is good, cost is low a kind of LED lamp panel.
The object of the application is achieved in that and it is characterized in that a kind of heat dissipation conductor device of LED lamp panel: comprise insulated substrate, and have metal guide line segment in insulated substrate, plain conductor diameter, between 2-5mm, is interposed between 0.1mm-5mm therebetween.
Described metal guide line segment is the heat dissipation conductor of wafer carrier and wafer.
Described metal guide line segment center forms LED lamp cup by punching press.
Described wafer electrode is fixed in Lamp cup by conducting resinl, and another electrode of wafer is connected with the second wafer by side alignment, and lamp plate places LED wafer face by light-transmissive resin or the process of blue white light process seal.
The advantage of the application is: due to lamp plate be by insulator and insulator uniformly across conductor form, conductor center forms LED lamp cup by punching press, wafer electrode is fixed in Lamp cup by conducting resinl, like this can integrated up to a hundred LED in a little area, be 0.06W by a LED, 100 LED are 6W.The LED of each 0.06W, in one section of diameter 5mm-2mm cylindrical body, reaches its cooling requirements far away.
Accompanying drawing explanation
Fig. 1 is the embodiment of the present application 1 structural representation;
Fig. 2 is the embodiment of the present application 1 structural representation;
Fig. 3 is the embodiment of the present application 1 structural representation.
Detailed description of the invention
As shown in Figure 1, a kind of heat dissipation conductor device of LED lamp panel, is characterized in that: comprise insulated substrate 1, has metal guide line segment in insulated substrate 1, and plain conductor diameter, between 2-5mm, is interposed between 0.1mm-5mm therebetween.
As shown in Figures 2 and 3, metal guide line segment is the heat dissipation conductor 2 of wafer 4 carrier and wafer 4; Metal guide line segment center forms LED lamp cup 3 by punching press.Wafer 4 one electrodes are fixed in Lamp cup 3 by conducting resinl, and another electrode of wafer 4 is connected with the second wafer by side alignment 5, and lamp plate places LED wafer face by light-transmissive resin or the process of blue white light process seal.
Plain conductor is spaced apart at insulating materials, is interposed between 0.1mm-5mm therebetween, and its concrete interval determines with wafer 4 watt level and designing requirement.
Plain conductor diameter is between 2-5mm, and plain conductor diameter determines with wafer 4 watt level and designing requirement.
Claims (4)
1. a heat dissipation conductor device for LED lamp panel, is characterized in that: comprise insulated substrate, has metal guide line segment in insulated substrate, and plain conductor diameter, between 2-5mm, is interposed between 0.1mm-5mm therebetween.
2. the heat dissipation conductor device of a kind of LED lamp panel according to claim 1, is characterized in that: described metal guide line segment is the heat dissipation conductor of wafer carrier and wafer.
3. the heat dissipation conductor device of a kind of LED lamp panel according to claim 1, is characterized in that: described metal guide line segment center forms LED lamp cup by punching press.
4. the heat dissipation conductor device of a kind of LED lamp panel according to claim 2, it is characterized in that: described wafer electrode is fixed in Lamp cup by conducting resinl, another electrode of wafer is connected with the second wafer by side alignment, and lamp plate places LED wafer face by light-transmissive resin or the process of blue white light process seal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510292878.1A CN104864374A (en) | 2015-05-26 | 2015-05-26 | Heat dissipation conductor device of LED lamp panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510292878.1A CN104864374A (en) | 2015-05-26 | 2015-05-26 | Heat dissipation conductor device of LED lamp panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104864374A true CN104864374A (en) | 2015-08-26 |
Family
ID=53910392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510292878.1A Pending CN104864374A (en) | 2015-05-26 | 2015-05-26 | Heat dissipation conductor device of LED lamp panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104864374A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102518967A (en) * | 2011-12-20 | 2012-06-27 | 西安福安创意咨询有限责任公司 | High-power LED assembly high in heat dissipation |
| CN102913878A (en) * | 2012-10-19 | 2013-02-06 | 西安信唯信息科技有限公司 | Heat dissipation conductor structure of LED (Light Emitting Diode) lamp panel |
| CN102997074A (en) * | 2011-09-08 | 2013-03-27 | 上海新凯元照明科技有限公司 | Three-dimensional heat-dissipating light-emitting diode (LED) lighting device |
| CN202884857U (en) * | 2012-10-19 | 2013-04-17 | 西安信唯信息科技有限公司 | Heat dissipation conductor device of light emitting diode (LED) lamp panel |
| CN203298006U (en) * | 2013-06-08 | 2013-11-20 | 杭州杭科光电股份有限公司 | LED light source module illuminating in circular face mode |
| CN103912808A (en) * | 2014-03-19 | 2014-07-09 | 江苏日月照明电器有限公司 | LED (light emitting diode) luminous subassembly and lamp thereof |
-
2015
- 2015-05-26 CN CN201510292878.1A patent/CN104864374A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102997074A (en) * | 2011-09-08 | 2013-03-27 | 上海新凯元照明科技有限公司 | Three-dimensional heat-dissipating light-emitting diode (LED) lighting device |
| CN102518967A (en) * | 2011-12-20 | 2012-06-27 | 西安福安创意咨询有限责任公司 | High-power LED assembly high in heat dissipation |
| CN102913878A (en) * | 2012-10-19 | 2013-02-06 | 西安信唯信息科技有限公司 | Heat dissipation conductor structure of LED (Light Emitting Diode) lamp panel |
| CN202884857U (en) * | 2012-10-19 | 2013-04-17 | 西安信唯信息科技有限公司 | Heat dissipation conductor device of light emitting diode (LED) lamp panel |
| CN203298006U (en) * | 2013-06-08 | 2013-11-20 | 杭州杭科光电股份有限公司 | LED light source module illuminating in circular face mode |
| CN103912808A (en) * | 2014-03-19 | 2014-07-09 | 江苏日月照明电器有限公司 | LED (light emitting diode) luminous subassembly and lamp thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150826 |