CN202855718U - Automatic wafer etching cleaning machine - Google Patents

Automatic wafer etching cleaning machine Download PDF

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Publication number
CN202855718U
CN202855718U CN 201220040831 CN201220040831U CN202855718U CN 202855718 U CN202855718 U CN 202855718U CN 201220040831 CN201220040831 CN 201220040831 CN 201220040831 U CN201220040831 U CN 201220040831U CN 202855718 U CN202855718 U CN 202855718U
Authority
CN
China
Prior art keywords
cleaning machine
wafer etching
etching cleaning
automatic
machine according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220040831
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Chinese (zh)
Inventor
王晓雁
王斌
尚保卫
马白云
马志勇
何思英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xi'an Pona Automatic Engineering Co Ltd
Original Assignee
Xi'an Pona Automatic Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xi'an Pona Automatic Engineering Co Ltd filed Critical Xi'an Pona Automatic Engineering Co Ltd
Priority to CN 201220040831 priority Critical patent/CN202855718U/en
Application granted granted Critical
Publication of CN202855718U publication Critical patent/CN202855718U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses an automatic wafer etching cleaning machine, which is characterized in that a liftable anticorrosion machinery arm capable of being rotated with 360 DEG is employed, a clamping head capable of loading the workpieces is arranged on the machinery arm; when the workpiece is arranged behind the clamping head, the machine drives the workpiece under PC control according to a technology route input in a human-computer interface for automatic operation. The automatic wafer etching cleaning machine has the beneficial effect that the whole process is automatically completed by the machinery arm, the hidden trouble of the product quality and the safe production brought by manual operation can be avoided; and the technology line and parameter are automatically changed and the technology requirements can be satisfied through the human-computer interface.

Description

Full-automatic wafer sheet etching cleaning machine
Technical field:
The utility model belongs to led chip and makes the equipment field, relates to the device of a kind of LED wafer etching and cleaning, the especially a kind of equipment that can realize the automatic etching of multistation and cleaning.
Background technology:
Wafer cleaning machine on the domestic market is manually operated cleaning machine, namely needs manually workpiece to be carried out multistation etching and cleaning successively according to process sequence; And so not only have production safety hidden danger, more be unfavorable for the conforming assurance of technological requirement, and then affect the quality of product.
The utility model content:
The above problem that exists in order to overcome existing wafer cleaning machine, the utility model provides a kind of equipment that can realize the automatic etching of multistation and cleaning.
The technical scheme that its technical problem that solves the utility model adopts is: adopt liftable and anticorrosion mechanical arm that can 360 degree rotations, but mechanical arm is provided with the clamping head of workpiece loading and unloading; After workpiece was installed to clamping head, equipment drove the process route that workpiece inputs in according to man-machine interface and automatically moves under PC control, after finishing successively, and alarm.
The beneficial effects of the utility model are: whole technical process is finished automatically by mechanical arm, has avoided product quality that manual operation brings and the hidden danger of safety in production; And by man-machine interface, can freely change technique circuit and parameter, can satisfy more Alternative requirement.
Description of drawings:
Fig. 1 is the structural representation of the utility model full-automatic wafer etching cleaning machine.
Wherein: 1 is body frame; 2 is operation interface; 3 is control system; 4 is mechanical arm; 5 is the QDR rinse bath; 6 is the heating process groove; 7 is the Ultrasonic Heating technology groove;
Fig. 2 is the mechanical arm schematic diagram of the utility model full-automatic wafer etching cleaning machine.
Wherein: 1 is the gaily decorated basket; 2 is pivoted arm; 3 is sealing shroud; 4 is support; 5 is loop bar; 6 is guide rod; 7 is shift fork; 8 is ball-screw; 9 is servomotor; 10 is bearing pin; 11 is shaft coupling; 12 is servomotor
Embodiment:
Below in conjunction with accompanying drawing the utility model is done and to be described in further detail:
Equipment of the present utility model is the domestic equipment of realizing at first the automatic etching of LED wafer multistation and cleaning, is better than domestic traditional manual operating equipment.
In Fig. 1, body frame 1 is made by corrosion-resistant material; Mechanical arm 4 can rotate freely by 360 degree, and the flow process ordering of each technology groove can arbitrarily be set by operation interface 2, makes the mechanical arm pivoted arm drive gaily decorated basket rotating operation; But simultaneously mechanical arm 4 oscilaltion campaigns can arbitrarily arrange process data in each technology groove by operation interface 2, comprise amplitude vibration frequency etc., and the mechanical arm pivoted arm drive gaily decorated basket is moved up and down.But heating process groove 6 Automatic-heatings, and have the automatic liquid level detected temperatures to detect the functions such as overload protection, have simultaneously the automatic liquid supply draining function; But Ultrasonic Heating technology groove 7 Automatic-heatings also have ultrasonic cleaning function simultaneously, and have the automatic liquid level detected temperatures to detect function and the automatic liquid supply draining functions such as overload protection; QDR rinse bath 5 has the spray bubbling and automatically detects the functions such as water resistance value.
In Fig. 2, servomotor 9 is by ball-screw 8 and shift fork 7 drives loop bar 5 pivoted arms 2 and the gaily decorated basket 1 moves up and down; Servomotor 12 is by shaft coupling 11 and guide rod 6 drives loop bar 5 pivoted arms 2 and the gaily decorated basket 1 rotates.Flexible sealing shroud 3 can be done lifting and be rotatablely moved.
Above content is the further description of the present invention being done in conjunction with concrete preferred implementation; can not assert that the specific embodiment of the present invention only limits to this; for the general technical staff of the technical field of the invention; without departing from the inventive concept of the premise; can also make some simple deduction or replace, all should be considered as belonging to claims of submitting on mountain of the present invention and determine scope of patent protection.

Claims (6)

1. a wafer etching cleaning machine is characterized in that: adopt liftable and anticorrosion mechanical arm that can 360 degree rotations, but mechanical arm is provided with the clamping head of workpiece loading and unloading; Mechanical arm drives the process route that workpiece inputs in according to man-machine interface and automatically moves under PC control.
2. wafer etching cleaning machine according to claim 1 is characterized in that: servomotor (9) drives loop bar (5) pivoted arm (2) by ball-screw (8) and shift fork (7) and the gaily decorated basket (1) moves up and down.
3. wafer etching cleaning machine according to claim 1 is characterized in that: servomotor (12) drives loop bar (5) pivoted arm (2) by shaft coupling (11) and guide rod (6) and the gaily decorated basket (1) rotates.
4. wafer etching cleaning machine according to claim 1 is characterized in that: flexible sealing shroud (3) can be done lifting and be rotatablely moved.
5. wafer etching cleaning machine according to claim 1 is characterized in that: heating process groove (6) but Automatic-heating and has the automatic liquid level detected temperatures to detect the functions such as overload protection, have simultaneously the automatic liquid supply draining function.
6. wafer etching cleaning machine according to claim 1; it is characterized in that: Ultrasonic Heating technology groove (7) but Automatic-heating and have simultaneously ultrasonic cleaning function and has the automatic liquid level detected temperatures to detect function and the automatic liquid supply draining functions such as overload protection.
CN 201220040831 2012-02-08 2012-02-08 Automatic wafer etching cleaning machine Expired - Fee Related CN202855718U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220040831 CN202855718U (en) 2012-02-08 2012-02-08 Automatic wafer etching cleaning machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220040831 CN202855718U (en) 2012-02-08 2012-02-08 Automatic wafer etching cleaning machine

Publications (1)

Publication Number Publication Date
CN202855718U true CN202855718U (en) 2013-04-03

Family

ID=47986886

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220040831 Expired - Fee Related CN202855718U (en) 2012-02-08 2012-02-08 Automatic wafer etching cleaning machine

Country Status (1)

Country Link
CN (1) CN202855718U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104779187A (en) * 2015-04-16 2015-07-15 常州市科沛达超声工程设备有限公司 Single-polished wafer scrubbing machine
CN108325930A (en) * 2018-02-26 2018-07-27 上海提牛机电设备有限公司 A kind of lift Wafer Cleaning auxiliary device and its cleaning method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104779187A (en) * 2015-04-16 2015-07-15 常州市科沛达超声工程设备有限公司 Single-polished wafer scrubbing machine
CN104779187B (en) * 2015-04-16 2017-11-28 常州市科沛达超声工程设备有限公司 It is single to throw piece scrubbing unit
CN108325930A (en) * 2018-02-26 2018-07-27 上海提牛机电设备有限公司 A kind of lift Wafer Cleaning auxiliary device and its cleaning method

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DD01 Delivery of document by public notice

Addressee: Xi'an Bona Automation Engineering Co., Ltd. Wang Xiaoyan

Document name: Notification to Go Through Formalities of Registration

C14 Grant of patent or utility model
GR01 Patent grant
DD01 Delivery of document by public notice

Addressee: Xi'an Pona Automatic Engineering Co., Ltd.

Document name: Notification of Decision on Request for Restoration of Right

DD01 Delivery of document by public notice

Addressee: Xi'an Pona Automatic Engineering Co., Ltd.

Document name: Notification of Termination of Patent Right

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130403

Termination date: 20150208

EXPY Termination of patent right or utility model