CN202816899U - Semiconductor wire bonding pressure plate capable of improving wire bonding yield rate - Google Patents
Semiconductor wire bonding pressure plate capable of improving wire bonding yield rate Download PDFInfo
- Publication number
- CN202816899U CN202816899U CN2012204396038U CN201220439603U CN202816899U CN 202816899 U CN202816899 U CN 202816899U CN 2012204396038 U CN2012204396038 U CN 2012204396038U CN 201220439603 U CN201220439603 U CN 201220439603U CN 202816899 U CN202816899 U CN 202816899U
- Authority
- CN
- China
- Prior art keywords
- wire bonding
- pressure plate
- semiconductor
- lead frame
- row
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The utility model relates to the technical field of semiconductor component packaging, and specifically relates to a semiconductor wire bonding pressure plate capable of improving the wire bonding yield rate. The semiconductor wire bonding pressure plate comprises windows for a welding part exposed outsides a lead frame, wherein the windows are arranged in a single row. To match with the single-row lead frame, the single-row windows of the pressure plate is used instead of double-row windows, so that the vacuum pressure is increased, the adsorption capability of the welding part of the lead frame is improved, the shakes of the welding part are reduced, the wire bonding is strengthened and the wire bonding yield rate is significantly improved.
Description
Technical field
The utility model relates to semiconductor components and devices encapsulation technology field, particularly a kind of semiconductor Weld line pressure plate that improves the bonding wire yield.
Background technology
Semiconductor device needs wire rod and product are welded in encapsulation process, and general mode is that lead frame is put on the hot plate, re-uses to carry out bonding wire after pressing plate is fixed lead frame.
The lead frame of prior art, as shown in Figure 3 and Figure 4, be traditionally arranged to be biserial, its corresponding pressing plate also is provided with the biserial window, is used for exposing the weld part of biserial lead frame, and lead frame and the pressing plate of this kind design have reduced vacuum pressure, so that vacuum weakens the adsorption capacity of the weld part of lead frame, weld part rocks severity, makes bonding wire insecure, and the bonding wire fraction defective is high.
In order to improve above problem, lead frame is changed into single-row, therefore, need the pressing plate of prior art is improved.
Summary of the invention
The purpose of this utility model is to avoid above-mentioned weak point of the prior art and a kind of semiconductor Weld line pressure plate that improves the bonding wire yield is provided, this semiconductor Weld line pressure plate that can improve the bonding wire yield has increased vacuum pressure, thereby increase vacuum to the weld part adsorption capacity of lead frame, reduce rocking of weld part, make bonding wire more firm, greatly improved the bonding wire yield.
The purpose of this utility model is achieved through the following technical solutions:
A kind of semiconductor Weld line pressure plate that improves the bonding wire yield is provided, has comprised the window be used to the weld part that exposes lead frame, window is set to single-row arranging.
Preferably, window is set to rectangle.
Preferred, four angles of rectangular window are set to circular arc chamfering.
The beneficial effects of the utility model: in order to mate single-row lead frame, pressing plate changed into by original biserial window only have single-row window to cooperate with lead frame, can increase vacuum pressure, thereby increase vacuum to the weld part adsorption capacity of lead frame, reduce rocking of weld part, make bonding wire more firm, greatly improved the bonding wire yield.
Description of drawings
The utility model is described in further detail to utilize accompanying drawing, but the embodiment in the accompanying drawing does not consist of any restriction of the present utility model, for those of ordinary skill in the art, under the prerequisite of not paying creative work, can also obtain according to the following drawings other accompanying drawing.
Fig. 1 is the structural representation of the embodiment of a kind of semiconductor Weld line pressure plate that improves the bonding wire yield of the present utility model.
Fig. 2 is the structural representation of single column conductor frame of semiconductor Weld line pressure plate test that utilizes the improved bonding wire yield of Fig. 1.
Fig. 3 is the structural representation of the semiconductor Weld line pressure plate of prior art.
Fig. 4 is the structural representation of biserial lead frame that utilizes the semiconductor Weld line pressure plate test of Fig. 3.
In Fig. 1 to Fig. 4, include:
1---window,
2---weld part.
Embodiment
With the following Examples the utility model is further described.
A kind of embodiment that improves the semiconductor Weld line pressure plate of bonding wire yield of the present utility model as depicted in figs. 1 and 2, comprises that window 1 is set to single-row arranging be used to the window 1 of the weld part 2 that exposes lead frame.
The utility model is in order to mate single-row lead frame, pressing plate changed into by the window 1 of original biserial only have single-row window 1 to cooperate with lead frame, can increase vacuum pressure, thereby increase vacuum to weld part 2 adsorption capacities of lead frame, reduce rocking of weld part 2, make bonding wire more firm, greatly improved the bonding wire yield.
Concrete, window 1 is set to rectangle.Four angles of rectangular window 1 are set to circular arc chamfering.The shape of window 1 mainly is for the weld part 2 that exposes better lead frame, is that the size in conjunction with the weld part 2 of lead frame arranges, and also can be set to other shapes.
Should be noted that at last; above embodiment is only in order to illustrate the technical solution of the utility model; but not to the restriction of the utility model protection range; although with reference to preferred embodiment the utility model has been done to explain; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement the technical solution of the utility model, and not break away from essence and the scope of technical solutions of the utility model.
Claims (3)
1. the semiconductor Weld line pressure plate that can improve the bonding wire yield comprises be used to the window of the weld part that exposes lead frame, and it is characterized in that: window is set to single-row arranging.
2. a kind of semiconductor Weld line pressure plate that improves the bonding wire yield according to claim 1, it is characterized in that: window is set to rectangle.
3. a kind of semiconductor Weld line pressure plate that improves the bonding wire yield according to claim 2, it is characterized in that: four angles of rectangular window are set to circular arc chamfering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204396038U CN202816899U (en) | 2012-08-31 | 2012-08-31 | Semiconductor wire bonding pressure plate capable of improving wire bonding yield rate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204396038U CN202816899U (en) | 2012-08-31 | 2012-08-31 | Semiconductor wire bonding pressure plate capable of improving wire bonding yield rate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202816899U true CN202816899U (en) | 2013-03-20 |
Family
ID=47875740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012204396038U Expired - Fee Related CN202816899U (en) | 2012-08-31 | 2012-08-31 | Semiconductor wire bonding pressure plate capable of improving wire bonding yield rate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202816899U (en) |
-
2012
- 2012-08-31 CN CN2012204396038U patent/CN202816899U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130320 Termination date: 20140831 |
|
| EXPY | Termination of patent right or utility model |