CN202794246U - SMD series packaged transistor clamp used for test - Google Patents
SMD series packaged transistor clamp used for test Download PDFInfo
- Publication number
- CN202794246U CN202794246U CN 201220501684 CN201220501684U CN202794246U CN 202794246 U CN202794246 U CN 202794246U CN 201220501684 CN201220501684 CN 201220501684 CN 201220501684 U CN201220501684 U CN 201220501684U CN 202794246 U CN202794246 U CN 202794246U
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- base plate
- packaged transistor
- pad
- smd
- pads
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- Expired - Fee Related
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Abstract
The utility model discloses a SMD series packaged transistor clamp used for tests. The SMD series packaged transistor clamp comprises a PCB switch base plate (3), and a big pad (1) and two small pads (7) welded on the PCB switch base plate (3). Middle positions of a left side and a right side of the PCB switch base plate (3) are respectively provided with a via (2). Three pads (4) connecting with contact pins are disposed on a lower side of the PCB switch base plate (3). The big pad (1) and the two small pads (7) are respectively connected with the three pads (4) connecting with the contact pins through leads. Leaf springs (6) are welded on the big pad (1) and the two small pads (7). A spring clip (5) is fixed on the PCB switch base plate (3) with screws through the vias. The SMD series packaged transistor clamp solves problems that using an upper closed cover type up-and-down compressing clamp in SMD series packaged transistor tests may cause bad device heat dissipation, and temperature of a housing cannot monitored, etc. Making cost of the clamps is reduced.
Description
Technical field
The utility model relates to the anchor clamps of transistor test usefulness, relates in particular to a kind of anchor clamps of SMD series packaged transistor test usefulness.
Background technology
SMD series packaged transistor is a kind of three electrode members, its three electrodes all are distributed in the one side of device rectangular parallelepiped ceramic shell, the aging clamp of SMD series packaged transistor adopts up and down compressing clamp of cover-closing type more at present, transistor is wrapped up by resin die fully when using this kind anchor clamps to do experiment, because transistor is wearing out, all can produce heat when instead partially testing, adopt cover-closing type up and down compressing clamp test transistor thermal and can't distribute, the heat accumulation of generation probably causes the transistor excess temperature to lose efficacy; Simultaneously, because transistor is wrapped up fully by anchor clamps, can't reasonably control transistorized aging power by the shell temperature of monitor transistor in process of the test.
Summary of the invention
The technical problems to be solved in the utility model: the anchor clamps that a kind of SMD series packaged transistor test usefulness is provided, adopt when solving the test of SMD series packaged transistor the device heat radiation that compressing clamp was brought up and down of upper cover-closing type bad, can't monitor the problem such as shell temperature, reduce simultaneously the cost of manufacture of anchor clamps, simplify production process.
Technical solutions of the utility model:
A kind of anchor clamps of SMD series packaged transistor test usefulness, it comprises PCB switching base plate, be welded with a large bonding pad and two little pads on the PCB switching base plate, respectively there is a through hole left and right sides middle part of PCB switching base plate, the downside of PCB switching base plate has the pad of three connecting contact pins, large bonding pad with are connected a little pad and are connected by wire with the pad of three connecting contact pins respectively, be welded with spring leaf on large bonding pad and two little pads, spring clip is screwed on PCB switching base plate by through hole.
Distance between the pad of three connecting contact pins is dual-in-line seat adjacent stitches spacing on the universal test plate.
Spring clip left and right sides shell fragment distance is greater than the broadband of measured device.
The spring leaf quantity of welding at large bonding pad and two little pads is greater than one.
The beneficial effects of the utility model:
Adopt the utility model, after SMD series packaged transistor is installed into anchor clamps, because bottom surface has spring leaf to fix on the transistor, therefore the reliability of the electrical connection of three electrodes of SMD series packaged transistor and whole device stationarity aspect all improves greatly, three metal ferrules on the anchor clamps link to each other with three electrodes of device, after only needing be inserted in three metal ferrules in the aging seat of dual-in-line of universal test plate, just realized the electrical connection of three electrodes of transistor and senile experiment plate.Do not need to make again the various tests that the Special test plate can be finished at general dual-in-line breadboard SMD series packaged transistor.Compressing clamp wraps up mode entirely about having replaced original cover-closing type by the fixed form of spring leaf in addition, adopt when effectively having solved the test of SMD series packaged transistor upper cover-closing type up and down the device heat radiation that brings of compressing clamp bad, can't monitor the problem such as shell temperature, lowered simultaneously the cost of manufacture of anchor clamps.
Description of drawings:
Fig. 1 is the utility model device arrangements synoptic diagram;
Fig. 2 is that the utility model spring leaf and spring clip are arranged synoptic diagram.
Embodiment:
A kind of anchor clamps (seeing Fig. 1 and Fig. 2) of SMD series packaged transistor test usefulness, it comprises PCB switching base plate 3, be welded with a large bonding pad 1 and two little pads 7 on the PCB switching base plate 3, respectively there is a through hole 2 the left and right sides middle part of PCB switching base plate 3, the downside of PCB switching base plate 3 has the pad 4 of three connecting contact pins, large bonding pad 1 with are connected a little pad 7 and are connected by wire with the pad 4 of three connecting contact pins respectively, be welded with spring leaf 6 on large bonding pad 1 and two little pads 7, spring clip 5 is screwed on PCB switching base plate 3 by through hole 2, distance between the pad 4 of three connecting contact pins is dual-in-line seat adjacent stitches spacing on the universal test plate, spring clip 5 left and right sides shell fragments distances is greater than the broadband of measured device, in spring leaf 6 quantity of large bonding pad 1 and two little pad 7 welding greater than one.
The size of large bonding pad 1 and two little pads 7 covers the size of these all device pin of SMD series, distance between two through holes 2 is consistent with the threaded hole spacing between the spring clip 5 with immobilising device, and greater than the full-size of SMD series packaged transistor shell; Distance between two shell fragments on the immobilising device usefulness spring clip 5 is greater than the width of device.
Claims (4)
1. the anchor clamps of SMD series packaged transistor test usefulness, it comprises PCB switching base plate (3), it is characterized in that: be welded with a large bonding pad (1) and two little pads (7) on the PCB switching base plate (3), respectively there is a through hole (2) the left and right sides middle part of PCB switching base plate (3), the downside of PCB switching base plate (3) has the pad (4) of three connecting contact pins, large bonding pad (1) with are connected a little pad (7) and are connected by wire with the pad (4) of three connecting contact pins respectively, be welded with spring leaf (6) on large bonding pad (1) and two the little pads (7), spring clip (5) is screwed on PCB switching base plate (3) by through hole (2).
2. a kind of SMD series packaged transistor according to claim 1 is tested the anchor clamps of usefulness, and it is characterized in that: the distance between the pad of three connecting contact pins (4) is dual-in-line seat adjacent stitches spacing on the universal test plate.
3. a kind of SMD series packaged transistor according to claim 1 is tested the anchor clamps of usefulness, and it is characterized in that: spring clip (5) left and right sides shell fragment distance is greater than the broadband of measured device.
4. the anchor clamps of a kind of SMD series packaged transistor test usefulness according to claim 1 is characterized in that: spring leaf (6) quantity of welding at large bonding pad (1) and two little pads (7) is greater than one.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220501684 CN202794246U (en) | 2012-09-27 | 2012-09-27 | SMD series packaged transistor clamp used for test |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220501684 CN202794246U (en) | 2012-09-27 | 2012-09-27 | SMD series packaged transistor clamp used for test |
Publications (1)
Publication Number | Publication Date |
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CN202794246U true CN202794246U (en) | 2013-03-13 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 201220501684 Expired - Fee Related CN202794246U (en) | 2012-09-27 | 2012-09-27 | SMD series packaged transistor clamp used for test |
Country Status (1)
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CN (1) | CN202794246U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108279323A (en) * | 2018-01-31 | 2018-07-13 | 广东欧珀移动通信有限公司 | Radio frequency testing tooling for electronic equipment |
CN108646063A (en) * | 2018-05-29 | 2018-10-12 | 贵州天义电器有限责任公司 | A kind of electric parameter for device in sealing contact detects fixture |
CN110927553A (en) * | 2019-12-13 | 2020-03-27 | 西安电子科技大学 | Experimental analysis method for total dose effect defect distribution of germanium-silicon heterojunction bipolar transistor |
CN113671336A (en) * | 2021-08-20 | 2021-11-19 | 上海瞻芯电子科技有限公司 | Power device testing device |
-
2012
- 2012-09-27 CN CN 201220501684 patent/CN202794246U/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108279323A (en) * | 2018-01-31 | 2018-07-13 | 广东欧珀移动通信有限公司 | Radio frequency testing tooling for electronic equipment |
CN108279323B (en) * | 2018-01-31 | 2023-09-19 | 深圳市欢太科技有限公司 | Radio frequency test fixture for electronic equipment |
CN108646063A (en) * | 2018-05-29 | 2018-10-12 | 贵州天义电器有限责任公司 | A kind of electric parameter for device in sealing contact detects fixture |
CN110927553A (en) * | 2019-12-13 | 2020-03-27 | 西安电子科技大学 | Experimental analysis method for total dose effect defect distribution of germanium-silicon heterojunction bipolar transistor |
CN113671336A (en) * | 2021-08-20 | 2021-11-19 | 上海瞻芯电子科技有限公司 | Power device testing device |
CN113671336B (en) * | 2021-08-20 | 2024-03-08 | 上海瞻芯电子科技有限公司 | Power device testing device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20190927 |