CN202757892U - Online detection module set for silicon slice appearance defects - Google Patents

Online detection module set for silicon slice appearance defects Download PDF

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Publication number
CN202757892U
CN202757892U CN 201220424811 CN201220424811U CN202757892U CN 202757892 U CN202757892 U CN 202757892U CN 201220424811 CN201220424811 CN 201220424811 CN 201220424811 U CN201220424811 U CN 201220424811U CN 202757892 U CN202757892 U CN 202757892U
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CN
China
Prior art keywords
silicon chip
scanning
light source
scanning light
appearance defect
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Expired - Fee Related
Application number
CN 201220424811
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Chinese (zh)
Inventor
刘夏初
苗新利
潘加永
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KUTTLER AUTOMATION SYSTEMS (SUZHOU) CO Ltd
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KUTTLER AUTOMATION SYSTEMS (SUZHOU) CO Ltd
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Priority to CN 201220424811 priority Critical patent/CN202757892U/en
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Publication of CN202757892U publication Critical patent/CN202757892U/en
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Abstract

The utility model discloses an online detection module set for silicon slice appearance defects. The online detection module for the silicon slice appearance defects is used for detecting a silicon slice transmitted on a transmission belt and comprises a scanning light source shone on the silicon slice and a scanning camera. Scanning beams of the scanning light source shine on the silicon slice with an incident angle which is an acute angle between the scanning beams and the silicon. The scanning camera is fixed on an optical path wherein the peak value of an emergent light of a scanning beam of the scanning light source reaches a maximum value. The scanning light source need not improve output power and ensures that the scanning camera can induct adequate light for imaging and detecting the silicon slice appearance defects. Thus, the online detection module set for the silicon slice appearance defects is low in cost and long in service life.

Description

The silicon chip appearance defect detects module online
Technical field
The utility model relates to photovoltaic apparatus optical detective technology field, particularly relates to a kind of silicon chip appearance defect and detects online module.
Background technology
In the classification and Detection process of silicon chip, silicon falls, edge breakage, slight crack etc. are the important parameter that characterizes product hierarchy, and the undetected meeting of defective produces fatal impact to follow-up battery processing.Legacy equipment adopts camera and LED(Light Emitting Diode, light emitting diode usually) combination of light sources detects silicon and falls.
In silicon chip detected, conventional art adopted light source incline illumination and camera to take perpendicular to silicon chip usually, and such combination can make light source improve output power for the brightness that reaches camera imaging, thereby caused the decay of led light source life-span.As online detection instrument, the led light source that frequent was lost because of the life-span will be extremely inconvenient uneconomic.
The utility model content
Based on this, provide the silicon chip appearance defect that a kind of cost is lower, the life-span is long to detect online module.
A kind of silicon chip appearance defect detects module online, for detection of the silicon chip that transmits at transport tape, comprises the scanning light source that is radiated on the described silicon chip, and scanning camera; Wherein the scanning light beam of scanning light source shines on the described silicon chip with the incident angle that is acute angle with described silicon chip, and described scanning camera is fixed in the scanning light beam of described scanning light source on the opticpath of emergent light peak value maximum.
Among embodiment, described scanning light source is highlighted line sweep led light source therein.
Among embodiment, described incident angle is greater than 0 degree and less than or equal to 45 degree therein.
Among embodiment, described incident angle is more than or equal to 30 degree and less than or equal to 45 degree therein.
Among embodiment, described scanning light source is 3 centimetres to the minor increment of described silicon chip therein.
Among embodiment, the scanning light beam direction of illumination of described scanning light source and the shooting direction of described scanning camera are 90 degree angles therein.
Among embodiment, described scanning camera is high resolving power line sweep CCD therein.
Among embodiment, described scanning camera is the line scan camera of 4096 pixels therein.
Among embodiment, described silicon chip appearance defect detects the adjustable gib that module also comprises fixing described scanning camera online therein.
Above-mentioned silicon chip appearance defect detects module online, the scanning light beam of scanning light source shines on the silicon chip with the incident angle that is acute angle with silicon chip, scanning camera is fixed in the scanning light beam of scanning light source on the opticpath of emergent light peak value maximum, scanning light source need not to improve output power and can make scanning camera sense enough light to carry out the appearance defect that imaging detects silicon chip, and the module cost is lower, the life-span is longer so that the silicon chip appearance defect detects online.
Description of drawings
Fig. 1 is the structural representation that present embodiment silicon chip appearance defect detects module online.
Embodiment
Please refer to the drawing 1, present embodiment disclose a kind of silicon chip appearance defect and detect online module, and the silicon chip 4 for detection of in transport tape 3 transmission comprises the scanning light source 2 that is radiated on the silicon chip 4, and scanning camera 1.The scanning light beam of scanning light source 2 shines on the silicon chip 4 with the incident angle that is acute angle with silicon chip 4, and scanning camera 1 is fixed in the scanning light beam of scanning light source 2 on the opticpath of emergent light peak value maximum.Scanning light source 2 need not to improve output power and can make scanning camera 1 sense enough light to carry out the appearance defect that imaging detects silicon chip, and the module cost is lower, the life-span is longer so that the silicon chip appearance defect detects online.
Concrete, scanning light source 2 is highlighted line sweep led light source.Incident angle is greater than 0 degree and less than or equal to 45 degree.Preferably, incident angle equals 30 degree and less than or equal to 45 degree, and in this range of tilt angles, the easy for installation and illumination brightness of scanning light source 2 can be satisfied the detection needs with lower output power.Scanning light source 2 is 3 centimetres to the minor increment of silicon chip 4 and guarantees illumination with the most suitable mounting distance.The light direction of illumination of scanning light source 2 and the shooting direction of scanning camera 1 are 90 degree angles, and this makes the maximum light of scanning camera 1 induction.
Scanning camera 1 is high resolving power line sweep CCD(Charge-coupled Device, charge coupled cell).Preferably, scanning camera 1 is the line scan camera of 4096 pixels.To be enhanced about more than once in the resolution on monolateral than 5,000,000 pixel faces array cameras commonly used.
The silicon chip appearance defect detects the adjustable gib (not shown) that module also comprises scanning constant camera 1 online.Make scanning camera 1 suitably adjust the position and finally be fixed on the optimum position according to the emergent light of scanning light source 2 when mounted.
Present embodiment adopts scanning light source 2 oblique illuminations, and the design of at the opticpath of emergent light peak value maximum scanning camera 1 shooting being installed at the scanning light beam of scanning light source 2 detects the silicon chip breakage, silicon falls and slight crack.Use the area array CCD imaging to judge the problem that will produce if solved damaged detection: broken penetrating if silicon chip 4 does not have, scanning camera will be difficult to capture faint grey scale change, fail to judge thereby produce; If silicon chip 4 broken areas are less, 5,000,000 pixel area array CCDs commonly used on the market can only provide limited resolution, if use by force the camera of larger resolution, it is slow to cause the system diagram picture to process computing, and cost is high.And solved light source incline illumination and camera is vertically taken, can make light source improve output power for the brightness that reaches camera imaging, thereby cause the problem that the LED life-span decays.Thereby improve the serviceable life of scanning light source 2, thereby cost is lower.
When scanning light source 2 illumination was on silicon chip 4, the highlighted reflected light on the Width reflected and the light of scattering will reach peak value in exit direction, and the chip of scanning camera 1 will be sensed enough light and carry out imaging like this.If use vertical the shooting, being the one-component of whole emergent lights perpendicular to the light on the chip transmission direction, for reaching shooting effect, the light-source brightness of will having to tune up, thus make scanning light source 2 long-time running of loading slowly, cause the decay of 1 life-span of scanning light source to be accelerated.In the process of taking, the light of accepting by fault location will be scattered to the principle that other directions cause the gray scale on the image space to reduce, and can obtain the visibly different image of a width of cloth gray scale.The image processing algorithm of being optimized can be demarcated position and the size of defective exactly.
The silicon chip appearance defect of present embodiment detects the serviceable life that module has prolonged scanning light source 2 online, and can more accurately detect rapidly damaged, the defectives such as silicon falls, slight crack.Rational in infrastructure, easy for installation, and can save a large amount of shutdown maintenance times and device design and production cost.
The above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.

Claims (9)

1. a silicon chip appearance defect detects module online, and the silicon chip for detection of transmitting at transport tape is characterized in that, comprises the scanning light source that is radiated on the described silicon chip, and scanning camera; Wherein the scanning light beam of scanning light source shines on the described silicon chip with the incident angle that is acute angle with described silicon chip, and described scanning camera is fixed in the scanning light beam of described scanning light source on the opticpath of emergent light peak value maximum.
2. silicon chip appearance defect according to claim 1 detects module online, it is characterized in that, described scanning light source is highlighted line sweep led light source.
3. silicon chip appearance defect according to claim 1 detects module online, it is characterized in that, described incident angle is greater than 0 degree and less than or equal to 45 degree.
4. silicon chip appearance defect according to claim 3 detects module online, it is characterized in that, described incident angle is more than or equal to 30 degree and less than or equal to 45 degree.
5. silicon chip appearance defect according to claim 1 detects module online, it is characterized in that, described scanning light source is 3 centimetres to the minor increment of described silicon chip.
6. silicon chip appearance defect according to claim 1 detects module online, it is characterized in that, the scanning light beam direction of illumination of described scanning light source and the shooting direction of described scanning camera are 90 degree angles.
According to claim 1 in 6 each described silicon chip appearance defect detect online module, it is characterized in that described scanning camera is high resolving power line sweep CCD.
8. silicon chip appearance defect according to claim 7 detects module online, it is characterized in that, described scanning camera is the line scan camera of 4096 pixels.
9. silicon chip appearance defect according to claim 7 detects module online, it is characterized in that, also comprises the adjustable gib of fixing described scanning camera.
CN 201220424811 2012-08-24 2012-08-24 Online detection module set for silicon slice appearance defects Expired - Fee Related CN202757892U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220424811 CN202757892U (en) 2012-08-24 2012-08-24 Online detection module set for silicon slice appearance defects

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220424811 CN202757892U (en) 2012-08-24 2012-08-24 Online detection module set for silicon slice appearance defects

Publications (1)

Publication Number Publication Date
CN202757892U true CN202757892U (en) 2013-02-27

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CN 201220424811 Expired - Fee Related CN202757892U (en) 2012-08-24 2012-08-24 Online detection module set for silicon slice appearance defects

Country Status (1)

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CN (1) CN202757892U (en)

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Granted publication date: 20130227

Termination date: 20130824