CN202749412U - 一种贴片式led - Google Patents

一种贴片式led Download PDF

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Publication number
CN202749412U
CN202749412U CN201220289514XU CN201220289514U CN202749412U CN 202749412 U CN202749412 U CN 202749412U CN 201220289514X U CN201220289514X U CN 201220289514XU CN 201220289514 U CN201220289514 U CN 201220289514U CN 202749412 U CN202749412 U CN 202749412U
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CN
China
Prior art keywords
ppa support
wafer
surface mounted
led
support
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Expired - Lifetime
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CN201220289514XU
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English (en)
Inventor
龚文
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SHENZHEN JINGTAI CO Ltd
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Shenzhen Jingtai Optoelectronics Co Ltd
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Priority to CN201220289514XU priority Critical patent/CN202749412U/zh
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Publication of CN202749412U publication Critical patent/CN202749412U/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Led Device Packages (AREA)

Abstract

本实用新型提供一种贴片式LED，包括：PPA支架、晶片、金线和底座，所述PPA支架上设置有散热片，所述晶片固定在所述PPA支架上，所述晶片与所述PPA支架之间连接有金线，所述PPA支架设置在所述底座上。本实用新型提供的贴片式LED，其结构简单方便安装、高流明、成本低，出光效率高，驱动功率大。

Description

一种贴片式LED
技术领域
本实用新型涉及LED技术领域，特别涉及一种贴片式LED。
背景技术
LED(发光二极管)应用非常广泛，由于现有技术提供的白光SMD(表面贴装型，Surface Mounted Devices)流明低，并且散热性差，热量没有及时散出来，随着温度上升，荧光粉量子效率降低，出光减少，辐射波长也会发生变化，从而引起白光LED色温、色度的变化，较高的温度还会加速荧光粉的老化。导致发光均匀性，一致性变差，寿命降低，只能应用于对产品性能要求不高的照明领域。SMD LED带散热片结构，流明高，散热性能越好，越能够提高产品的整体视觉效果和使用寿命，但现有的白光SMD LED无法满足要求。
实用新型内容
本实用新型提供一种贴片式LED，其结构简单方便安装、高流明、成本低，出光效率高，驱动功率大。
为了实现上述目的，本实用新型提供以下技术方案：
一种贴片式LED，其包括：
PPA支架101、晶片104、金线103和底座107，所述PPA支架101上设置有散热片106，所述晶片104固定在所述PPA支架101上，所述晶片104与所述PPA支架101之间连接有金线103，所述PPA支架101设置在所述底座107上。
优选地，所述晶片104通过固晶胶105固定在所述PPA支架101上。
优选地，所述晶片104通过封装胶体102密封在所述PPA支架101上。
优选地，所述PPA支架的整体长度为3.5毫米，宽度为2.8毫米，厚度为0.8毫米。
通过实施以上技术方案，具有以下技术效果：本实用新型提供的贴片式LED，其结构简单方便安装、高流明、成本低，出光效率高，驱动功率大。
附图说明
图1为本实用新型提供的LED结构示意图。
具体实施方式
为了更好的理解本实用新型的技术方案，下面结合附图详细描述本实用新型提供的实施例。
本实用新型实施例提供一种贴片式LED，如图1所示，包括PPA支架101、晶片104、金线103和底座107，所述PPA支架101上设置有散热片106，所述晶片104固定在所述PPA支架101上，所述晶片104与所述PPA支架101之间连接有金线103，所述PPA支架101设置在所述底座107上。该晶片104为发光体，该底座107用于电热分离。金线103将将晶片104表面的电极和PPA支架101连接起来
在上述实施例中，优选地，所述晶片104通过固晶胶105固定在所述PPA支架101上。
在上述实施例中，优选地，所述晶片104通过封装胶体102密封在所述PPA支架101上。该封装胶体102用于保护晶片104和金线103不受损害。
在上述实施例中，优选地，所述PPA支架的整体长度为3.5毫米，宽度为2.8毫米，厚度为0.8毫米。
以上对本实用新型实施例所提供的一种贴片式LED进行了详细介绍，对于本领域的一般技术人员，依据本实用新型实施例的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本实用新型的限制。

Claims (4)

1.一种贴片式LED，其特征在于，包括：
PPA支架、晶片、金线和底座，所述PPA支架上设置有散热片，所述晶片固定在所述PPA支架上，所述晶片与所述PPA支架之间连接有金线，所述PPA支架设置在所述底座上。
2.如权利要求1所述贴片式LED，其特征在于，所述晶片通过固晶胶固定在所述PPA支架上。
3.如权利要求2所述贴片式LED，其特征在于，所述晶片通过封装胶体密封在所述PPA支架上。
4.如权利要求1或2所述贴片式LED，其特征在于，所述PPA支架的整体长度为3.5毫米，宽度为2.8毫米，厚度为0.8毫米。
CN201220289514XU 2012-06-19 2012-06-19 一种贴片式led Expired - Lifetime CN202749412U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201220289514XU CN202749412U (zh) 2012-06-19 2012-06-19 一种贴片式led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201220289514XU CN202749412U (zh) 2012-06-19 2012-06-19 一种贴片式led

Publications (1)

Publication Number Publication Date
CN202749412U true CN202749412U (zh) 2013-02-20

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Country Status (1)

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CN (1) CN202749412U (zh)

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: SHENZHEN KINGLIGHT CO., LTD.

Free format text: FORMER NAME: JINGTAI OPTOELECTRONICS CO., LTD.

CP03 Change of name, title or address

Address after: 518000, Guangdong, Baoan District, Fuyong Shenzhen Street (west side of Fu Garden Road) run Heng Industrial plant 4, plant third, fourth, fifth floor

Patentee after: SHENZHEN JINGTAI CO., LTD.

Address before: 518000 Guangdong city of Shenzhen province Baoan District Xixiang Baoan Avenue Fisheries Industrial Park Building 4 floor B measurements

Patentee before: Shenzhen Jingtai Optoelectronics Co., Ltd.

CX01 Expiry of patent term

Granted publication date: 20130220

CX01 Expiry of patent term