CN202721679U - Loopback optical module of QSFP+ packaging - Google Patents
Loopback optical module of QSFP+ packaging Download PDFInfo
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- CN202721679U CN202721679U CN 201220372010 CN201220372010U CN202721679U CN 202721679 U CN202721679 U CN 202721679U CN 201220372010 CN201220372010 CN 201220372010 CN 201220372010 U CN201220372010 U CN 201220372010U CN 202721679 U CN202721679 U CN 202721679U
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- optical module
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Abstract
The utility model, which relates to the communication network equipment testing field, provides a loopback optical module suitable for a QSFP+ packaging interface. The loopback optical module comprises an MCU microcontrol unit. Because the loopback function is integrated to the standard module to realize the loopback function test of the QSFP+ packaging interface, during the equipment loopback performance test of a 40-G router and a switch in the high-low temperature environment, the test can be carried out conveniently; and the less resources are occupied, the consumed time is short, and the fault point can be determined easily.
Description
Technical field
The utility model relates to the communication network device field tests, particularly relates to the Loopback(local loopback of high speed communication equipment QSFP+ package interface) optical module.
Background technology
At present in the loopback Performance Detection of high-speed communicating network equipment such as 40G router and switch, must adopt module and cable to build special test macro, not only taken valuable test resource, and the length that expends time in, and during the equipment loopback performance test under doing high and low temperature environment, huge test macro also can bring inconvenience, is difficult to the failure judgement point when appearance is unusual in special-purpose test cable entrance, the test such as increasing in the incubator.
The utility model content
The purpose of this utility model is to provide that to be applicable to QSFP+(be a kind of compactness in the high-speed data communication, hot-swappable transceiver, often be used in the network equipment mainboard (switch of high speed optical cable interface, router, medium converter or similar device) on, the transmission rate up to 40Gbps can be supported.) the Loopback optical module of package interface, mainly comprise the MCU micro-control unit, loop fuction is integrated in the loop fuction test that realizes the QSFP+ package interface in the standard module, so that in 40G router and the switch equipment loopback performance test under high and low temperature environment, test more convenient, take resource few, the time consuming time is short, easier failure judgement point.
The technical scheme that the utility model or invention are adopted is as follows: the Loopback optical module of QSFP+ encapsulation, comprise the QSFP+ standard packaging shell, be packaged in the Loopback test module in the shell, it is characterized in that:
Described Loopback test module comprises the MCU micro-control unit;
Described Loopback test module also comprises Tx end, Rx end, I
2C bus end and feeder ear external interface, this external interface are the QSFP+ package interface;
Described MCU micro-control unit passes through I
2The C bus end is connected with Devices to test control Host.
As preferably, described Loopback test module comprises that also the high speed signal class of attenuation selects module, and the MCU micro-control unit is selected module and Tx end and Rx to hold by this high speed signal class of attenuation to link to each other.
As preferably, described Loopback test module also comprises temperature sensors of high precision, status indicator lamp and the power control switch that links to each other with the MCU micro-control unit respectively.
As preferably, described Loopback test module also comprises load resistance, and power control switch is connected to the ground by load resistance.
As preferably, described load resistance can be selected according to the load power consumption grade.
Described shell comprises mounting screw 7, lower cover 6, LED luminous tube 5, PCB assembly 4, protection plug 8, separates lock slide 2, drag hook 3 and loam cake 1;
Described solution lock slide 2 links to each other with the release chute of loam cake 1 with drag hook 3; the PCB assembly 4 that is mounted with the Loopback test module lies on the mounting platform of loam cake 1; be provided with salient point on the mounting platform; salient point snaps in the mounting groove of PCB assembly 4; LED luminous tube 5 snaps in loam cake 1 arc-shaped slot; mounting screw 7 passes loam cake 1, PCB assembly 4 and lower cover 6, and protection plug 8 inserts the end that whole shell is equipped with LED luminous tube 5.
As preferably, described shell also comprises conduction conductive rubber press strip 9, and conductive rubber press strip 9 is embedded in loam cake 1 mounting groove.
Compared with prior art, the beneficial effects of the utility model are:
1, optical module use in the Loopback of the QSFP+ standard port that provides of the utility model test, for the 40G network device manufacturers has been saved complicated test wire system, reduces the test macro difficulty, saves testing cost, the raising testing efficiency;
2, the loop fuction that carries of the utility model inside is suitable as the port loopback Performance Detection of the network equipment very much; Can support all standard speeds up to 40Gbps, satisfy all standard speeds of the present 40G network equipment and use;
3, the utility model adopts the standard packaging that satisfies the QSFP+ multi-source agreement, is widely used in the QSFP+ port of the 40G network equipment;
4, the utility model carries the precision temperature detector, real-time and accurately the acquisition module internal temperature; Carry status indicator lamp, show easily operating state of living in; Have self-protection and port protection function, issuable risk control is to minimum in will using;
5, the utility model power consumption has the multiple choices such as 1.5W, 2W, 2.5W, 3.5W and customization, satisfying different network equipment detection requirements, but during such as network apparatus test maximum load capacity, needs all of the port all with the work of highly energy-consuming state;
6, the utility model high speed signal decay rank has the multiple choices such as 3dB, 5dB and customization, to satisfy different network equipment detection requirements;
7, the digital diagnosis function that carries of the utility model meets SFF 8472 multi-source agreement standards, can read relevant diagnostic information by the I2C bus easily.
Description of drawings
Fig. 1 is the utility model built-in function principle schematic.
Fig. 2 is the inner automatically Loopback Mode schematic diagram of the utility model.
Fig. 3 is the wherein apparatus structure schematic diagram of an embodiment of the utility model.
Fig. 4 is that device embodiment illustrated in fig. 3 is finished schematic diagram.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described.
Disclosed arbitrary feature in this specification (comprising any accessory claim, summary and accompanying drawing) is unless special narration all can be replaced by other equivalences or the alternative features with similar purpose.That is, unless special narration, each feature is an example in a series of equivalences or the similar characteristics.
The Loopback optical module of QSFP+ encapsulation, comprise the QSFP+ standard packaging shell, be packaged in the Loopback test module in the shell.
As shown in Figure 1, described Loopback test module comprises the MCU micro-control unit;
Described Loopback test module also comprises Tx end, Rx end, I
2C bus end and feeder ear external interface, this external interface are the QSFP+ package interface;
Described MCU micro-control unit passes through I
2The C bus end is connected with Devices to test control Host.
Described Loopback test module also comprises high speed signal class of attenuation selection module, and the MCU micro-control unit selects module and Tx end to link to each other with the Rx end by this high speed signal class of attenuation.High speed signal class of attenuation module is made of a plurality of adjustable digital resistors, by MCU the resistance of these resistors is controlled, with the purpose that realizes high speed signal (Tx and Rx signal) is decayed in various degree.But concrete attenuation range has 3dB, 5dB and other the class of attenuation all can realize customization at present.
Described Loopback test module also comprises temperature sensors of high precision, status indicator lamp and the power control switch that links to each other with the MCU micro-control unit respectively.
Described Loopback test module also comprises load resistance, and power control switch is connected to the ground by load resistance.
Described load resistance can be selected according to the load power consumption grade.Load resistance is a network resistor, and MCU microcontroller module is set the resistance of load resistance according to the switch that links to each other with the utility model and router even load power consumption.
During test, the utility model is inserted in the tested port device, but the Tx on the connecting-disconnecting interface be connected with Rx automatically and be connected with the high speed signal interface of port device, the control Host of port device passes through I
2The C bus is communicated by letter with the control unit (MCU) of module.
When control Host told that module is carried out loopback test, the Tx of MCU control module was connected with Rx and sets up virtual logic connection, realizes that namely Tx sends packet to the Rx direction.Simultaneously, in test process, MCU is by constantly gathering the information from temperature sensor, judge whether to surpass the temperature range (in the present embodiment, negative 40 ℃ of the temperature range lowest order that can bear, positive 85 ℃ of highest order) that to bear, when overruning, MCU state of a control indicator light sends alarm, and by the control switch autoshutdown module of cutting off the electricity supply, to protect tested port device and module; When temperature in normal range (NR) when (being the withstand temperature scope), MCU state of a control indicator light shows and is in normal operating conditions.
As shown in Figure 2, the utility model adopts the automatic Loopback Mode in inside of QSFP+ package interface, can satisfy all standard application speed of the present 40G network equipment, power consumption has the multiple choices such as 1.5 watts, 2W, 2.5W, 3.5 watts and customization, and high speed signal decay rank has the multiple choices such as 3dB, 5dB and customization.Be particularly suitable for the loopback Performance Detection under dispatch from the factory test, the especially high and low temperature environment of the network equipment such as switch and router.
The utility model carries precision temperature detector and status indicator lamp, shows easily operating state of living in, comprises a red light and a green light, and the indicator light operating state is as shown in table 1, and indicator light position, state and color are not limited to the mode shown in the application.After detecting temperature and surpassing its limiting value that can bear, red, the automatically flicker of green light of status indicator lamp, the main circuit of inside modules automatically shuts down realizes self-protection and to the protection of port.
Table 1: indicator light operating state
In the present embodiment, the state conversion can according to the instruction of tested equipment, be carried out also from the carrier state update functions in the utility model inside between the objects such as pin status and MCU microcontroller inside modules memory.The state that includes but not limited to following object upgrades:
1) between module shuts down signal, pin and the internal storage;
2) between low power consumption control pin and the internal storage;
3) restart between control pin and the internal storage;
4) between model selection control pin and the internal storage.
The utility model carries digital diagnosis function, and the diagnostic message form meets QSFP+ multi-source agreement standard, can pass through easily I
2The C bus reads relevant diagnostic information, such as supply power voltage and temperature etc.
As shown in Figure 3, described shell comprises mounting screw 7, lower cover 6, LED luminous tube 5, PCB assembly 4, protection plug 8, separates lock slide 2, drag hook 3 and loam cake 1.
Described solution lock slide 2 links to each other with the release chute of loam cake 1 with drag hook 3; the PCB assembly 4 that is mounted with the Loopback test module lies on the mounting platform of loam cake 1; be provided with salient point on the mounting platform; salient point snaps in the mounting groove of PCB assembly 4; LED luminous tube 5 snaps in loam cake 1 arc-shaped slot; mounting screw 7 passes loam cake 1, PCB assembly 4 and lower cover 6, and protection plug 8 inserts the end that whole shell is equipped with LED luminous tube 5.
Described shell also comprises conduction conductive rubber press strip 9, and conductive rubber press strip 9 is embedded in loam cake 1 mounting groove.Conductive rubber press strip 9 can be eliminated the fit clearance between pcb board and cover plate, prevents the pcb board vibration and makes the pcb board effective grounding.
Loam cake 1 is the important component that supports integral structure component, is used for assembling and separates lock slide 2, drag hook 3, conductive rubber press strip 9, PCB assembly 4, LED luminous tube 5, lower cover 6, protection plug 8.To separate first lock slide 2 and drag hook 3 during installation and pack in the loam cake 1 release chute, rotate drag hook 3 smooth and easy clog-free when guaranteeing release slip release; Then conductive rubber strip is embedded in loam cake 1 mounting groove; PCB assembly 4 is lain on the mounting platform of loam cake 1, the salient point on loam cake 1 mounting platform snaps in PCB assembly 4 mounting grooves, and PCB assembly 4 is finished the location, and LED luminous tube 5 snaps in location in loam cake 1 arc-shaped slot; Lower cover 6 closes.
As shown in Figure 4, the mounting screw 7 of packing into, mounting screw 7 pass lower cover 6, PCB assembly 4, tighten mounting screw 7, compress lower cover 6 and conductive rubber press strip 9; Insert protection plug 8, whole device is finished.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (7)
1.QSFP+ the Loopback optical module of encapsulation, comprise the QSFP+ standard packaging shell, be packaged in the Loopback test module in the shell, it is characterized in that:
Described Loopback test module comprises the MCU micro-control unit;
Described Loopback test module also comprises Tx end, Rx end, I
2C bus end and feeder ear external interface, this external interface are the QSFP+ package interface;
Described MCU micro-control unit passes through I
2The C bus end is connected with Devices to test control Host.
2. the Loopback optical module of described QSFP+ encapsulation according to claim 1 is characterized in that:
Described Loopback test module also comprises high speed signal class of attenuation selection module, and the MCU micro-control unit selects module and Tx end to link to each other with the Rx end by this high speed signal class of attenuation.
3. the Loopback optical module of described QSFP+ encapsulation according to claim 1 is characterized in that:
Described Loopback test module also comprises temperature sensors of high precision, status indicator lamp and the power control switch that links to each other with the MCU micro-control unit respectively.
4. the Loopback optical module of described QSFP+ encapsulation according to claim 3 is characterized in that:
Described Loopback test module also comprises load resistance, and power control switch is connected to the ground by load resistance.
5. the Loopback optical module of described QSFP+ encapsulation according to claim 3 is characterized in that:
Described load resistance is selected according to the load power consumption grade.
6. according to claim 1 to the Loopback optical module of one of 5 described QSFP+ encapsulation, it is characterized in that:
Described shell comprises mounting screw (7), lower cover (6), LED luminous tube (5), PCB assembly (4), protection plug (8), separates lock slide (2), drag hook (3) and loam cake (1);
Described solution lock slide (2) links to each other with the release chute of drag hook (3) with loam cake (1); the PCB assembly (4) that is mounted with the Loopback test module lies on the mounting platform of loam cake (1); be provided with salient point on the mounting platform; salient point snaps in the mounting groove of PCB assembly (4); LED luminous tube (5) snaps in loam cake (1) arc-shaped slot; mounting screw (7) passes loam cake (1), PCB assembly (4) and lower cover (6), and protection plug (8) inserts the end that whole shell is equipped with LED luminous tube (5).
7. the Loopback optical module of described QSFP+ encapsulation according to claim 6 is characterized in that:
Described shell also comprises conductive rubber press strip (9), and conductive rubber press strip (9) is embedded in loam cake (1) mounting groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220372010 CN202721679U (en) | 2012-07-30 | 2012-07-30 | Loopback optical module of QSFP+ packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220372010 CN202721679U (en) | 2012-07-30 | 2012-07-30 | Loopback optical module of QSFP+ packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202721679U true CN202721679U (en) | 2013-02-06 |
Family
ID=47623482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220372010 Expired - Lifetime CN202721679U (en) | 2012-07-30 | 2012-07-30 | Loopback optical module of QSFP+ packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202721679U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104917563A (en) * | 2015-05-08 | 2015-09-16 | 大连藏龙光电子科技有限公司 | Optical module high/low-temperature test system |
| CN106301549A (en) * | 2016-09-30 | 2017-01-04 | 成都新易盛通信技术股份有限公司 | A kind of 100G loopback module based on QSFP28 encapsulation |
-
2012
- 2012-07-30 CN CN 201220372010 patent/CN202721679U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104917563A (en) * | 2015-05-08 | 2015-09-16 | 大连藏龙光电子科技有限公司 | Optical module high/low-temperature test system |
| CN104917563B (en) * | 2015-05-08 | 2017-08-11 | 大连藏龙光电子科技有限公司 | Optical module high/low temperature test system |
| CN106301549A (en) * | 2016-09-30 | 2017-01-04 | 成都新易盛通信技术股份有限公司 | A kind of 100G loopback module based on QSFP28 encapsulation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130206 |