CN108806224A - Concentrator based on bandwidth carrier communication - Google Patents

Abstract

The invention provides a concentrator based on broadband carrier communication, which belongs to the circuit field and includes a system control module and a power supply module. The system control module includes an MCU main control module and a real-time clock module. The real-time clock module is connected to the MCU main control module through an IIC bus. The MCU main control module is also connected with a 4G remote uplink communication module, a broadband carrier downlink communication module and a storage module. By using broadband carrier communication technology in the downlink communication to collect the energy information of the broadband carrier energy meter, the uplink uses the remote 4G communication technology to return the collected energy meter information to the main power station for analysis and use in real time. It can effectively avoid power line acquisition signal interference and improve the success rate of carrier acquisition. With the help of 4G remote communication technology, the concentrator can communicate with the main station in real time and efficiently, with strong signal and strong communication ability, ensuring the success rate of one-time acquisition of the main station.

Description

Concentrator Based on Broadband Carrier Communication

technical field

The invention belongs to the field of circuits, in particular to a concentrator based on broadband carrier communication.

Background technique

At present, the downlink carrier communication mode of the on-site carrier concentrator used by the State Grid mostly adopts the narrowband carrier communication mode, and the long-distance communication adopts the 3G communication mode. The narrowband carrier communication method has weak anti-interference ability and low acquisition success rate. The 3G signal communication is unstable and the signal is susceptible to interference.

Contents of the invention

In order to solve the shortcomings and deficiencies in the prior art, the present invention provides a concentrator based on broadband carrier communication. With the help of 4G telecommunication technology, the concentrator can communicate with the main station in real time and efficiently, with strong signal and strong communication ability, ensuring The success rate of one acquisition by the master station.

In order to achieve the above-mentioned technical purpose, the present invention provides a concentrator based on broadband carrier communication, the concentrator includes a system control module and a power supply module connected to the system control module to supply power to the system control module, characterized in that the system control module modules, including:

The MCU main control module and the real-time clock module, the real-time clock module is connected with the MCU main control module through the IIC bus, and the MCU main control module is also connected with a 4G remote uplink communication module, a broadband carrier downlink communication module and a storage module;

Wherein, the real-time clock module includes:

Clock chip circuit and clock power control circuit;

Among them, the clock chip circuit includes the RX8025T chip, and the INTA, INTB, SCL and SDA pins of the RX8025T chip are all connected to the system power supply VDD33 through the resistor R12;

The clock power supply control circuit includes a battery BT1, the negative pole of the battery BT1 is connected to a 3.6V lithium battery, the positive pole of the battery BT1 is connected to the V_RT pin of the MCU main control module through the MOS transistor Q1 and the Zener diode D4, and the gate of the MOS transistor Q1 is connected to the resistor R17 Grounded, the negative pole of the Zener diode D4 is connected to the system power supply VDD50 through the diodes D3, D2 and D1 in turn, and connected to the ground through the parallel capacitors C8 and C10 in turn at the V_RT pin.

Optionally, the concentrator includes a 485 communication module, and the 485 communication module includes:

485 communication chip, the VCC end of the 485 communication chip is connected to the V485 port, the VCC end of the 485 communication chip is also connected to the DGND via the capacitor C5, and a resistor R35 and a voltage regulator diode are arranged in sequence between the GND end and the VCC end of the 485 communication chip TVS1 and resistor R34, pin 1 of the 485 communication chip are connected to the second control terminal of the optocoupler O6 through the parallel capacitor C20 and resistor R32, and pins 2 and 3 of the 485 communication chip are connected to the second control terminal of the optocoupler O7 at the same time The pin 4 of the 485 communication chip is connected to the second controlled terminal of the optocoupler O7 through the resistor R33 and grounded at the same time, and the first control terminal of the optocoupler O6 is connected to the first controlled terminal of the optocoupler O7 through the resistor R31 ;

The second controlled end of the optocoupler O6 is grounded, the first controlled end of the optocoupler O6 is connected to the system power supply VDD33 through the resistor R28, and is connected to the 485_RXD pin of the MCU main control module at the same time, and the first controlled end of the optocoupler O7 is connected to the The resistor R29 is connected to the system power supply VDD33, the second control terminal of the optocoupler O7 is connected to the 485_TXD pin of the MCU main control module through the resistor R30, and a capacitor C19 is connected in parallel at both ends of the resistor R30.

Optionally, the concentrator includes an infrared debugging module, and the infrared debugging module includes:

Infrared transmitting circuit and infrared receiving circuit;

Described infrared emission circuit comprises triode Q6, and the emitter of Q6 is connected with system power supply VDD33, and the base of Q6 is connected with the IrDA_TXD pin of MCU main control module through resistance, and the collector of Q6 is through first resistance R74, infrared emission diode DS1 , R75 is connected to the collector of the triode Q7, and a resistor R66 is arranged between the base and the collector of Q6;

The base of Q7 is connected to the IrDA_38 pin of the MCU main control module through the second resistor, and a resistor R67 is provided between the emitter of Q7 and the IrDA_38 pin of the MCU main control module.

Optionally, the infrared receiving circuit includes:

Infrared receiving diode U14, the VCC terminal of U14 is connected to the system power supply VDD33 through the resistor R72, the OUT terminal of U14 is connected to the rDA_RXD pin of the MCU main control module, and at the same time connected to the system power supply VDD33 through the resistor R73, and the GND terminal of U14 is grounded.

Optionally, the power module includes a step-down circuit, and the step-down circuit includes:

Step-down chip, the input end of the step-down chip is connected to the power supply end, the SHDN pin of the step-down chip is connected to the power supply end through the resistor R110, the CB pin of the step-down chip is grounded through the capacitor C74 and the diode D13, and the SW of the step-down chip is connected to the power supply end. The pin is connected to the system power supply VDD33 through the inductor L6, the FB pin of the step-down chip is connected to the system power supply VDD33 through the resistors R142 and R143, and the FB pin is also grounded to the GND pin of the step-down chip through the resistor R138.

The beneficial effects brought by the technical scheme provided by the invention are:

By using broadband carrier communication technology in the downlink communication to collect the energy information of the broadband carrier energy meter, the uplink uses the remote 4G communication technology to return the collected energy meter information to the main power station for analysis and use in real time. It can effectively avoid power line acquisition signal interference and improve the success rate of carrier acquisition. With the help of 4G remote communication technology, the concentrator can communicate with the main station in real time and efficiently, with strong signal and strong communication ability, ensuring the success rate of one-time acquisition of the main station.

Description of drawings

In order to illustrate the technical solution of the present invention more clearly, the accompanying drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. Ordinary technicians can also obtain other drawings based on these drawings on the premise of not paying creative work.

Fig. 1 is the structural representation of the concentrator based on broadband carrier communication provided by the present invention;

Fig. 2 (a) is the structural representation of clock chip circuit provided by the present invention;

Fig. 2 (b) is the structural representation of the clock power supply control circuit provided by the present invention;

Fig. 3 is a structural representation of the 485 communication module provided by the present invention;

Fig. 4 is a schematic structural diagram of an infrared emitting circuit provided by the present invention;

Fig. 5 is a schematic structural diagram of an infrared receiving circuit provided by the present invention;

Fig. 6 is a schematic structural diagram of the step-down circuit provided by the present invention.

Detailed ways

In order to make the structure and advantages of the present invention clearer, the structure of the present invention will be further described below in conjunction with the accompanying drawings.

Embodiment one

The present invention provides a concentrator based on broadband carrier communication. The concentrator includes a system control module and a power supply module connected to the system control module and powering the system control module. As shown in FIG. 1 , the system control module includes:

The MCU main control module and the real-time clock module, the real-time clock module is connected with the MCU main control module through the IIC bus, and the MCU main control module is also connected with a 4G remote uplink communication module, a broadband carrier downlink communication module and a storage module.

In implementation, the system control module includes MCU main control module, real-time clock module, 485 communication module, 4G remote uplink communication module, broadband carrier downlink communication module, USB communication module, Ethernet communication module, display module, storage module, indicator light Control module and infrared debugging module;

The MCU main control module is composed of CPU chip LPC1778 (U1), peripheral crystal oscillator circuit and power-down detection chip. The peripheral crystal oscillator Y1 adopts 12M crystal oscillator, and the power-down detection and watchdog chip U2 adopts CAT823, which can reset the MCU when the system voltage is lower than 2.93V, increasing system reliability.

The MCU chip is connected to the real-time clock module through the IIC bus; connected to the 485 communication circuit through the UART serial port; connected to the broadband carrier downstream communication module through the UART serial port; connected to the broadband carrier downstream communication module through the UART serial port; ; Connect to the Ethernet communication module through the Ethernet bus; Connect to the USB control communication module through the USB bus; Connect to the storage module through the SPI bus; Control circuit connections.

The concentrator downlink carrier solution adopts the power line broadband carrier module. Power line broadband communication adopts OFDM technology, which can effectively resist multipath interference, so that the interfered signal can still be received reliably. Even when the distribution network is severely disturbed, it can provide high bandwidth and ensure bandwidth transmission efficiency, so as to realize high-speed and reliable communication of data. The main idea of OFDM technology is to divide a given channel into dozens or even thousands of independent and different orthogonal sub-channels in the 2-34MHz frequency domain, use a sub-carrier for modulation on each sub-channel, and transmit each sub-carrier in parallel data. During the transmission process, the power line broadband carrier equipment will continuously detect the interference status of each sub-channel. If it is found that there is sudden interference (such as harmonics) or the electromagnetic interference in some sub-channels is very serious, the power line broadband carrier equipment can intelligently make adjustments, that is, transfer to other non-interference sub-channels for transmission to avoid frequency range with sources of interference on power lines,

The uplink remote communication module adopts 4G communication mode, which has faster communication speed, wider network spectrum, more flexible communication, higher intelligence performance, smoother compatibility performance, higher frequency band usage efficiency, and more favorable communication charges.

The present invention adopts 485 communication mode and broadband carrier communication mode for downlink communication, 4G remote communication for uplink communication; 376.1 master station protocol and object-oriented 698 communication protocol for uplink communication; 645 protocol for electric energy meter and 698 object-oriented protocol for downlink communication.

Broadband carrier downlink communication module: The broadband carrier downlink communication module adopts BD-KDZB_012 concentrator broadband carrier module. This module is a broadband OFDM power line carrier communication module designed specifically for power line media as a communication channel. The broadband carrier processing chip used in this module is a highly integrated Soc chip, which adopts a 65-nanometer manufacturing process and integrates analog front-end, baseband modulation and demodulation, Digital signal processing, CPU core and rich functional peripherals are perfectly integrated, providing physical layer (PHY), medium access control layer (MAC), adaptation layer (ADP), network layer (NET), application layer (APP) and other complete power line communication solutions. The broadband carrier communication chip realizes the reliable data exchange core module between electronic terminal equipment based on the power line communication network, and has frame relay forwarding strategy, signal strength indication, phase detection, automatic rate/power adjustment, adaptive message framing, Complete network data communication protocol set and other functions, and has the characteristics of fast communication speed, high communication reliability, low cost, low power consumption, and few peripheral devices.

Module advantages: high-frequency point, away from power line interference; support 512 sub-carriers, can automatically switch sub-carriers, automatically avoid interference; intelligent identification and elimination of carrier interference; adaptive pulse interference, active suppression; synchronous detection with strong anti-noise ability Engine; the overall design of the algorithm architecture greatly improves the overall system performance; it supports AES128 encryption and WAPI encryption transmission protocol, and the data transmission is safe and reliable.

4G remote uplink communication module: the remote communication of the concentrator of the present invention adopts 4G communication technology. Module model L710-CN is a highly integrated 4G wireless communication module that supports LTE FDD/LTE TDD/WCDMA/TD-SCDMA/GSM (5-mode and 8-frequency); power supply voltage 3.3V ~ 4.4V, operating temperature: -40 ℃～+85°

This module supports hardware reset and software reset, supports SIM card heating at low temperature according to environmental requirements, and can feed back the operation status in real time through the indicator light of the module itself. Working in a wide temperature environment, it can be installed and used throughout the country without being affected by high cold and high temperature. There are many advantages such as faster communication speed, wider network spectrum, more flexible communication, higher intelligence performance, smoother compatibility performance, higher frequency band usage efficiency, and more favorable communication tariffs.

Ethernet communication module: The Ethernet chip uses LAN8720AI (U16) to communicate with the CPU through the Ethernet bus, and uses a 25M plug-in crystal oscillator (Y2) for frequency modulation. As a concentrator maintenance port, it is used for product debugging and testing. At the same time, it can be used as an uplink communication port, and uplink communication supports object-oriented 698 protocol and 376.1 master station communication protocol.

USB control module: the USB control module is provided with 5V power input by the power supply module; the USB control module is connected with the CPU through the USB bus, and J31 is a USBA interface for installing a U disk. This module can be used as a system program upgrade debugging port, which is different from on-site debugging and upgrading.

The innovation of the USB control module: an ESD protection chip PRTR5V0U2X (Q17) is added to the USB bus, which can protect the USB bus from external static interference during data transmission or plug and unplug the U disk, and improve bus reliability and data integrity.

Among them, the real-time clock module includes:

The clock chip circuit shown in Figure 2 (a) and the clock power supply control circuit shown in Figure 2 (b);

Among them, the clock chip circuit includes the RX8025T chip, and the INTA, INTB, SCL and SDA pins of the RX8025T chip are all connected to the system power supply VDD33 through the resistor R12;

The clock power supply control circuit includes a battery BT1, the negative pole of the battery BT1 is connected to a 3.6V lithium battery, the positive pole of the battery BT1 is connected to the V_RT pin of the MCU main control module through the MOS transistor Q1 and the Zener diode D4, and the gate of the MOS transistor Q1 is connected to the resistor R17 Grounded, the negative pole of the Zener diode D4 is connected to the system power supply VDD50 through the diodes D3, D2 and D1 in turn, and connected to the ground through the parallel capacitors C8 and C10 in turn at the V_RT pin.

The performance of the real-time clock module: the daily timing error of the timing unit is ≤±0.5s/d. The converter can receive clock recall and time synchronization commands from the concentrator or local handheld devices.

The data and clock can be maintained for at least two months after the power supply to the converter is interrupted. When the power is restored, the saved data will not be lost, and the internal clock will run normally.

The advantages of this circuit are: high clock accuracy, small daily timing error, and normal operation of the clock when power is off. In the case of 220V power supply, the clock power is provided by the system 5V (VDD50) power supply through three diodes (D1, D2, D3) step-down, and in the case of power failure, it is provided by 3.6V lithium battery BT1. The normal clock operation period is not less than 10 years year.

The storage module uses serial FLASH, and the selected chip is MX25L51235E, which has a storage capacity of 512M-BIT. The chip is connected to the CPU through the SPI bus.

Optionally, as shown in Figure 3, the concentrator includes a 485 communication module, and the 485 communication module includes:

485 communication chip, the VCC end of the 485 communication chip is connected to the V485 port, the VCC end of the 485 communication chip is also connected to the DGND via the capacitor C5, and a resistor R35 and a voltage regulator diode are arranged in sequence between the GND end and the VCC end of the 485 communication chip TVS1 and resistor R34, pin 1 of the 485 communication chip are connected to the second control terminal of the optocoupler O6 through the parallel capacitor C20 and resistor R32, and pins 2 and 3 of the 485 communication chip are connected to the second control terminal of the optocoupler O7 at the same time The pin 4 of the 485 communication chip is connected to the second controlled terminal of the optocoupler O7 through the resistor R33 and grounded at the same time, and the first control terminal of the optocoupler O6 is connected to the first controlled terminal of the optocoupler O7 through the resistor R31 ;

The second controlled end of the optocoupler O6 is grounded, the first controlled end of the optocoupler O6 is connected to the system power supply VDD33 through the resistor R28, and is connected to the 485_RXD pin of the MCU main control module at the same time, and the first controlled end of the optocoupler O7 is connected to the The resistor R29 is connected to the system power supply VDD33, the second control terminal of the optocoupler O7 is connected to the 485_TXD pin of the MCU main control module through the resistor R30, and a capacitor C19 is connected in parallel at both ends of the resistor R30.

The 485 communication module adopts the 485 chip ISL3152, and exchanges data with the CPU through the UART serial port.

The advantages of the 485 circuit, the baud rate supports 2400-115200, supports the parity bit configuration, can configure the corresponding parity bit and baud rate according to different phenotype parameters, and can be in the width of -40 degrees to +75 degrees Collect data in a warm environment, and the success rate of data collection is not less than 99.9%. The 485 communication interface belongs to the downlink communication interface, and supports the energy meter 645 protocol and the object-oriented 698 energy meter communication protocol.

Indicator light control circuit: The indicator light control circuit includes 485 communication lights, alarm lights, running lights, active light, and reactive light. The CPU controls the IO output high and low levels to turn on or off the indicator light.

When the CPU_LED_RUN pin outputs a high level, the running light is off, and when the pin outputs a low level, the running light is on;

When the CPU_LED_GAOJING pin outputs a high level, the warning light is off, and when the pin outputs a low level, the warning light is on;

When the CPU_485I_TXD_LED pin outputs a high level, the 485 sending indicator is off, and when the pin outputs a low level, the 485 sending indicator is on;

When the CPU_485I_RXD_LED pin outputs a high level, the 485 receiving indicator is off, and when the pin outputs a low level, the 485 receiving indicator is on;

The CF1 active indicator light and the CF2 reactive indicator light are metering chip outputs, not controlled by the CPU. When CF1 is on, there is an active pulse output, and when CF2 is on, there is a reactive pulse output;

The advantage of this circuit is that it can provide real-time feedback on the current operation of the concentrator, and can judge abnormal faults according to the indicator light. It is convenient for on-site application debugging and analysis.

Optionally, the concentrator includes an infrared debugging module, and the infrared debugging module includes:

Infrared transmitting circuit and infrared receiving circuit;

As shown in Figure 4, the infrared emission circuit includes a triode Q6, the emitter of Q6 is connected with the system power supply VDD33, the base of Q6 is connected with the IrDA_TXD pin of the MCU main control module through the first resistor, and the collector of Q6 is connected with the IrDA_TXD pin of the MCU main control module through the resistor. R74, infrared emitting diode DS1, R75 are connected to the collector of the triode Q7, and a resistor R66 is arranged between the base and the collector of Q6;

The base of Q7 is connected to the IrDA_38 pin of the MCU main control module through the second resistor, and a resistor R67 is provided between the emitter of Q7 and the IrDA_38 pin of the MCU main control module.

As shown in Figure 6, the infrared receiving circuit includes:

Infrared receiving diode U14, the VCC terminal of U14 is connected to the system power supply VDD33 through the resistor R72, the OUT terminal of U14 is connected to the rDA_RXD pin of the MCU main control module, and at the same time connected to the system power supply VDD33 through the resistor R73, and the GND terminal of U14 is grounded.

The infrared debugging circuit supports the handheld device to read the data of the converter. Can read the data of the electric energy meter in real time. As a supplement to the reading data of the master station, it is convenient for on-site installation and debugging, and can flexibly test the installation effect and the success rate of reading.

The power supply module provides power to the system control module. The power module is powered by 220V AC input and outputs 2 sets of isolated independent power supplies through the transformer. The power supply of loop one outputs 17V voltage, and the loop two outputs 17V voltage.

As shown in Figure 6, the power module includes a step-down circuit, and the step-down circuit includes:

Step-down chip, the input end of the step-down chip is connected to the power supply end, the SHDN pin of the step-down chip is connected to the power supply end through the resistor R110, the CB pin of the step-down chip is grounded through the capacitor C74 and the diode D13, and the SW of the step-down chip is connected to the power supply end. The pin is connected to the system power supply VDD33 through the inductor L6, the FB pin of the step-down chip is connected to the system power supply VDD33 through the resistors R142 and R143, and the FB pin is also grounded to the GND pin of the step-down chip through the resistor R138.

The step-down circuit power supply is converted by LDO voltage, and the step-down chip AOZ1282CI chip step-down outputs 12V power supply to provide broadband carrier downlink communication module power; the AOZ1282CI chip step-down output 5V provides USB control module power; the AOZ1282CI chip step-down output 4V provides 4G Remote communication module power supply; through AOZ1282CI chip step-down output 3.3V to provide MCU main control module, indicator light module, storage module, real-time clock module, ESMA module, Ethernet module, metering acquisition module power supply.

The invention provides a concentrator based on broadband carrier communication, including a system control module and a power supply module. The system control module includes an MCU main control module and a real-time clock module. The real-time clock module is connected with the MCU main control module through an IIC bus. The module is also connected with a 4G remote uplink communication module, a broadband carrier downlink communication module and a storage module. By using broadband carrier communication technology in the downlink communication to collect the energy information of the broadband carrier energy meter, the uplink uses the remote 4G communication technology to return the collected energy meter information to the main power station for analysis and use in real time. It can effectively avoid power line acquisition signal interference and improve the success rate of carrier acquisition. With the help of 4G remote communication technology, the concentrator can communicate with the main station in real time and efficiently, with strong signal and strong communication ability, ensuring the success rate of one-time acquisition of the main station.

The serial numbers in the above embodiments are for description only, and do not represent the sequence of the components during assembly or use.

The above description is only an embodiment of the present invention, and is not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention Inside.

Claims (5)

1. based on bandwidth carrier communication concentrator, which is characterized in that the concentrator include system control module and be The power module that control module of uniting is connected, powered for system control module, which is characterized in that the system control module, including：

MCU main control modules and real-time clock module, real-time clock module is connect by iic bus with MCU main control modules, in MCU 4G remote up-links communication module, bandwidth carrier downgoing communication module and memory module are also associated on main control module；

Wherein, the real-time clock module includes：

Clock chip circuit and clock power control circuit；

Wherein, clock chip circuit includes RX8025T chips, and INTA, INTB, SCL and SDA pin of RX8025T chips are equal It is connect with system power supply VDD33 through resistance R12；

Clock power control circuit includes battery BT1, and the cathode of battery BT1 connects 3.6V lithium batteries, the anode warp of battery BT1 Metal-oxide-semiconductor Q1, zener diode D4 are connect with MCU main control module V_RT pins, and the grid of metal-oxide-semiconductor Q1 is grounded through resistance R17, voltage stabilizing The cathode of diode D4 is successively through diode D3, D2, D1 and system power supply VDD50 connections, in V_RT pins successively through parallel connection Capacitance C8, C10 ground connection.

2. the concentrator according to claim 1 based on bandwidth carrier communication, which is characterized in that the concentrator includes 485 communication modules, the 485 logical modeling block include：

The ends VCC of 485 communication chips, 485 communication chips are connected with the ports V485, and the ends VCC of 485 communication chips are also through capacitance C5 Connect with DGND, between the ends GND and the ends VCC of 485 communication chips successively be equipped with resistance R35, zener diode TVS1 and The pin 1 of resistance R34,485 communication chips is connect through capacitance C20, resistance R32 in parallel with the second control terminal of optocoupler O6, and 485 The pin 2,3 of communication chip is connected with the second controlled end of optocoupler O7 simultaneously, and the pin 4 of 485 communication chips is through resistance R33 and light The second controlled end of coupling O7 is connected while being grounded, first controlled end of first control terminal through resistance R31 Yu optocoupler O7 of optocoupler O6 It is connected；

The second controlled end of optocoupler O6 is grounded, and the first controlled end of optocoupler O6 connect with system power supply VDD33 through resistance R28, is same When connect with the 485_RXD pins of MCU main control modules, the first control terminal of optocoupler O7 connects through resistance R29 and system power supply VDD33 Connect, the second control terminal of optocoupler O7 is connect through resistance R30 with the 485_TXD pins of MCU main control modules, the both ends resistance R30 simultaneously It is associated with capacitance C19.

3. the concentrator according to claim 1 based on bandwidth carrier communication, which is characterized in that the concentrator includes red Outer debugging module, the infrared debugging module, including：

Infrared transmitting circuit and infrared receiving circuit；

The infrared transmitting circuit includes triode Q6, and the emitter of Q6 is connect with system power supply VDD33, and the base stage of Q6 is through resistance It is connect with the IrDA_TXD pins of MCU main control modules, the collector of Q6 is through first resistor R74, infrared-emitting diode DS1, R75 It is connect with the collector of triode Q7, resistance R66 is equipped between the base stage and collector of Q6；

The IrDA_38 pins that the base stage of Q7 is connected to MCU main control modules through second resistance connect, in emitter and the MCU master of Q7 It is equipped with resistance R67 between the IrDA_38 pins of control module.

4. the concentrator according to claim 1 based on bandwidth carrier communication, which is characterized in that the infrared receiver electricity Road, including：

The ends VCC of infrared receiving diode U14, U14 are connect through resistance R72 with system power supply VDD33, the OUT terminal and MCU of U14 The rDA_RXD pins of main control module are connected while being connect with system power supply VDD33 through resistance R73, the ends the GND ground connection of U14.

5. the concentrator according to claim 1 based on bandwidth carrier communication, which is characterized in that the power module includes Reduction voltage loop, the reduction voltage loop include：

It is depressured chip, the input terminal for being depressured chip is connect with feeder ear, is depressured the SHDN pins of chip through resistance R110 and power supply End connection, the CB for being depressured chip draw foot meridian capacitor C74, diode D13 ground connection, are depressured the SW pins of chip through inductance L6 and system Power vd D33 connections are depressured the FB pins of chip through resistance R142, R143 and system power supply VDD33 connections, while FB pins are also It is grounded through resistance R138 and the GND pin of decompression chip.