CN202712265U - 一种防潮型贴片式led结构 - Google Patents

一种防潮型贴片式led结构 Download PDF

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CN202712265U
CN202712265U CN2012201397166U CN201220139716U CN202712265U CN 202712265 U CN202712265 U CN 202712265U CN 2012201397166 U CN2012201397166 U CN 2012201397166U CN 201220139716 U CN201220139716 U CN 201220139716U CN 202712265 U CN202712265 U CN 202712265U
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injection
lead frame
led chip
cavity
moulded housing
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钟志杰
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JINGZHOU HONGSHENG OPTOELECTRONICS TECHNOLOGY Co Ltd
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JINGZHOU HONGSHENG OPTOELECTRONICS TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball

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Abstract

本实用新型提供了一种防潮型贴片式LED结构，包括LED芯片、导线、透镜、两个相对放置的引线架、包覆所述引线架的注塑壳体，所述注塑壳体在所述引线架上方设有一空腔，所述LED芯片置于所述空腔内，所述引线架在所述注塑壳体内的侧边为凹凸结构，在所述引线架上方的注塑壳体内侧设有一环形防水槽。本实用新型提供了一种防潮型贴片式LED结构，一是将引线架的侧边设计为凹凸结构，该结构能够增加接触面积，减缓潮气对LED芯片以及导线的侵入；二是在注塑壳体上增加一环形防水槽，该防水槽也降低了外界潮气对封装体的侵入，起到双重防潮的作用，尽量减少LED灯受潮而死灯的现象。

Description

一种防潮型贴片式LED结构
技术领域
本实用新型涉及发光二极管领域，尤其是涉及一种防潮型贴片式LED结构。 
背景技术
发光二极管LED是一种固态的半导体器件，它可以直接把电转化为光。表面贴装技术是目前LED组装行业里最流行的一种技术和工艺。采用这种工艺无需对印制板钻插装孔，直接将LED贴、焊到印制板表面规定位置上即可。因此贴片式LED目前被市场广泛应用。但是目前市场上使用的贴片式发光二极管都采用PLCC（塑料带引线片式载体）结构，采用PPA塑胶料作为封装体，因PPA塑胶料本身的吸湿特性，导致该结构防潮性能差，经常会出现死灯的不良现象。 
实用新型内容
本实用新型的目的在于解决现有贴片式发光二极管防潮防水效果不理想的缺点，提供一种防潮型贴片式LED结构。 
本实用新型解决其技术问题采用的技术方案是：一种防潮型贴片式LED结构，包括LED芯片、导线、透镜、两个相对放置的引线架、包覆所述引线架的方形注塑壳体，所述注塑壳体在所述引线架上方设有一空腔，所述LED芯片置于所述空腔内，所述引线架在所述注塑壳体内的侧边为凹凸结构，在所述引线架上方的注塑壳体内侧设有一防水槽。 
进一步地，所述LED芯片置于所述引线架上，所述LED芯片通过所述导 线与另一引线架连接。 
进一步地，所述防水槽为环形结构。 
进一步地，所述透镜密封所述注塑壳体空腔。 
具体地，所述注塑壳体空腔为喇叭形结构。 
本实用新型的有益效果在于：本实用新型提供了一种防潮型贴片式LED结构，一是将引线架的侧边设计为凹凸结构，该结构能够增加接触面积，减缓潮气对LED芯片以及导线的侵入；二是在注塑壳体上增加一环形防水槽，该防水槽也降低了外界潮气对封装体的侵入，当水汽通过注塑外壳空腔的内壁与透镜的接合处进入空腔内时，会聚集在所述环形防水槽中，而不会进入注塑壳体空腔内，从而影响置于空腔内的LED芯片，与引线架的凹凸结构起到双重防潮的作用，尽量减少LED灯受潮而死灯的现象。因此本实用新型所提供的贴片式LED结构具有优良的密封性能，防止LED芯片以及导线受到外界水分和湿气的影响，防潮性能佳。 
附图说明
图1是本实用新型实施例提供的防潮型贴片式LED结构的全剖视图； 
图2是本实用新型实施例提供的两个引线架相对放置的结构示意图； 
图中：1-引线架、11-引线架凹凸结构、2-注塑壳体、21-防水槽、22-注塑壳体空腔、3-透镜、4-导线、5-LED芯片。 
具体实施方式
为了使本实用新型的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本实用新型进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。 
参见图1，本实用新型提供了一种防潮型贴片式LED结构，包括LED芯 片5、导线4、透镜3、两个相对放置的引线架1、包覆所述引线架的注塑壳体2，所述注塑壳体2在所述引线架1上方设有一空腔22，所述LED芯片置于所述空腔22内，所述引线架1在所述注塑壳体2内的侧边为凹凸结构11，在所述引线架1上方的注塑壳体2内侧设有一防水槽21。参见图2，为本实用新型提供的引线架1相对放置的结构示意图。由图可以看出本实用新型的引线架1侧边为凹凸结构11，该结构能够增加接触面积，可减缓潮气对LED芯片以及导线的侵入. 
同时在注塑壳体2上增加一防水槽21，所述防水槽21为环形结构，该防水槽21也降低了外界潮气对封装体的侵入，水汽通过注塑外壳2空腔22的内壁与透镜3的接合处进入空腔22内时，会聚集在所述环形防水槽21中，而不会进入注塑壳体空腔22内，从而影响置于空腔22内的LED芯片5，与引线架1凹凸结构11一并起到双重防潮的作用，尽量减少LED灯受潮而死灯的现象。因此本实用新型所提供的贴片式LED结构具有优良的密封性能，防止LED芯片以及导线受到外界水分和湿气的影响，防潮性能佳。 
请再参看图1，本实用新型实施例提供的贴片式LED结构中，LED芯片5置于注塑壳体2的空腔22内，并且所述LED芯片5置于所述引线架1上，所述LED芯片5通过所述导线4与另一引线架1连接。 
在本实施例中，所述透镜3为发光层胶体，采用环氧树脂加入荧光粉制成。所述透镜3密封所述注塑壳体空腔22。制作过程中，先点入的发光层胶体注入注塑壳体2的空腔22内，然后再注入环形防水槽中，将整个注塑壳体2的空腔22填满，从而起到密封的作用。 
从图1中可以看出，所述注塑壳体空腔22为喇叭形结构。该结构尽量的大的增加LED芯片5的出光角度，提高LED灯的出光率，增加LED灯的使用效率。 
以上仅为本实用新型的较佳实施例而已，并不用以限制本实用新型，凡在 本实用新型的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本实用新型的保护范围之内。 

Claims (5)

1.一种防潮型贴片式LED结构，包括LED芯片、导线、透镜、两个相对放置的引线架、包覆所述引线架的注塑壳体，其特征在于：所述注塑壳体在所述引线架上方设有一空腔，所述LED芯片置于所述空腔内，所述引线架在所述注塑壳体内的侧边为凹凸结构，在所述引线架上方的注塑壳体内侧设有一防水槽。
2.如权利要求1所述的一种防潮型贴片式LED结构，其特征在于：所述LED芯片置于所述引线架上，所述LED芯片通过所述导线与另一引线架连接。
3.如权利要求1所述的一种防潮型贴片式LED结构，其特征在于：所述防水槽为环形结构。
4.如权利要求1所述的一种防潮型贴片式LED结构，其特征在于：所述透镜密封所述注塑壳体空腔。
5.如权利要求1或4所述的一种防潮型贴片式LED结构，其特征在于：所述注塑壳体空腔为喇叭形结构。 
CN2012201397166U 2012-04-05 2012-04-05 一种防潮型贴片式led结构 Expired - Lifetime CN202712265U (zh)

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