CN202671408U - Device for cutting toughened glass with dual-wavelength laser - Google Patents
Device for cutting toughened glass with dual-wavelength laser Download PDFInfo
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- CN202671408U CN202671408U CN 201220266387 CN201220266387U CN202671408U CN 202671408 U CN202671408 U CN 202671408U CN 201220266387 CN201220266387 CN 201220266387 CN 201220266387 U CN201220266387 U CN 201220266387U CN 202671408 U CN202671408 U CN 202671408U
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Abstract
The utility model relates to a device for cutting toughened glass with dual-wavelength laser. The device includes a laser generation device capable of generating green laser and ultraviolet laser, wherein the green laser emitted by the laser generation device sequentially passes through a beam expander II (6), a half wave plate I (7), a Glan prism I (8) and a focus lens I (10), and then enters a scanning filed lens I (11); the ultraviolet laser emitted by the laser generation device sequentially passes through a reflector I (4), a beam expander I (5), a half wave plate II (13), a Glan prism II (14) a reflector II (15) and a focus lens II (16), and then enters a scanning field lens II (17); and moreover, the green laser emitted from the scanning field lens I (11) and the ultraviolet laser emitted from the scanning field lens II (17) are respectively and uniformly emitted onto a machined workpiece (20) placed on an object platform (21). The utility model relates to the device for cutting the toughened glass with the dual-wavelength laser, which has high yield and high cutting efficiency.
Description
Technical field
The utility model relates to a kind of device of dual-wavelength laser cutting toughened glass, belongs to the little manufacture field of cover-plate glass, touch screen and glass laser.
Background technology
Because handset touch panel, wafer glassy product sustainable growth demand require constantly to increase for glass reinforced degree, strength of glass is mainly weighed with the tempering degree of depth, and the tempering layer depth mainly changes at 0um ~ 40um.
Toughened glass is a kind of prestressed glass, for improving the intensity of glass, usually uses the method for chemistry or physics, thereby has improved supporting capacity, reinforcing glass self anti-wind pressure, cold and heat, impact etc.General toughened glass exists difficult cutting and cutting effect poor, can't satisfy the requirement of touch-screen and wafer semicon industry.
Traditional toughened glass cutting mode is cut into the master with break bar, by numerically-controlled machine control break bar cutting position, utilizes the CCD contraposition, finishes the toughened glass cutting.Break bar and glass contact in the cutting owing to there is stress, make toughened glass easily cracked, and slicing yield is lower, and break bar is also fragile in wearing and tearing for a long time, needs often to change.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and the device of the high dual-wavelength laser cutting toughened glass of a kind of slicing yield height and cutting efficiency is provided.
The purpose of this utility model is achieved in that a kind of device of dual-wavelength laser cutting toughened glass, described device includes the laser generator of a generation green laser and Ultra-Violet Laser, the laser of the green wavelength that this laser generator penetrates is successively through beam expanding lens two, half-wave plate one, enter field mirror one behind Glan prism one and the laser line focus mirror one, the Ultra-Violet Laser that this laser generator penetrates is successively through speculum one, beam expanding lens one, half-wave plate two, Glan prism two, enter field mirror two behind speculum two and the condensing lens two, penetrate field mirror one green wavelength laser and penetrate field mirror two ultraviolet wavelength laser respectively all directive place processing object on the carrier table.
The device of a kind of dual-wavelength laser cutting of the utility model toughened glass, above-mentioned laser generator is one to send simultaneously the dual-wavelength laser producer of green laser and Ultra-Violet Laser, the laser that described laser apparatus sends directive behind optical gate full impregnated mirror that is all-trans, the full impregnated mirror that is all-trans all reflects green laser, with the whole transmissions of Ultra-Violet Laser, the green laser after the reflection and the Ultra-Violet Laser after the transmission are respectively two light paths and penetrate laser generator.
The device of a kind of dual-wavelength laser cutting of the utility model toughened glass, above-mentioned laser generator is for including two laser apparatus, and one is the laser apparatus that green laser occurs, and another is for producing the laser apparatus of Ultra-Violet Laser.
The device of a kind of dual-wavelength laser cutting of the utility model toughened glass, the wavelength of the green laser of generation is 515nm～532nm, the wavelength of the Ultra-Violet Laser of generation is 190nm～355nm.
The device of a kind of dual-wavelength laser cutting of the utility model toughened glass, described retouching is separately installed with CCD system one and CCD system two on field lens one and the field mirror two, and the camera lens of CCD system one and CCD system two is all towards the processing object.
The device of a kind of dual-wavelength laser cutting of the utility model toughened glass, the both sides of described carrier table are separately installed with blowing device and particle collector.
The device of a kind of dual-wavelength laser of the utility model cutting toughened glass, described speculum one, speculum two and speculum three respectively with incide its surperficial light path and be 45 °.
Compared with prior art, the beneficial effects of the utility model are:
Dual-wavelength laser of the present utility model cutting can improve the problem that traditional cutting mode exists, and laser has noncontact, nonpollution environment, the characteristic such as easy to control; Through experimental study, focus on lower glass surface with green glow first, glass-cutting is reserved 100um ~ 300um thickness from bottom to up, then uses Ultra-Violet Laser instead and focuses on surface on glass, from top to bottom cutting, green glow is cut the reserved part complete resection, and this cutting mode can overcome the difficult problem of traditional cutting mode, and when having avoided single wavelength laser cutting tempering glass, glass edge collapses the large problem in limit, is the difficult processing of toughened glass, the poor solution that given of processing effect.
Description of drawings
Fig. 1 is the structural representation of the device of a kind of dual-wavelength laser cutting of the utility model toughened glass.
Wherein:
Embodiment
Referring to Fig. 1, the method for a kind of dual-wavelength laser cutting toughened glass that the utility model relates to, described method includes following steps:
It is mobile at the lower surface of toughened glass that the focusing focus of step 2, laser is pressed cutting profile, in moving process, and the toughened glass gasification in motion track, thus form the required cutting raceway groove of cutting profile;
It is mobile at the upper surface of toughened glass that the focusing focus of step 5, laser is pressed cutting profile, in moving process, and the toughened glass gasification in motion track, thus form the required cutting raceway groove of cutting profile;
Dual wavelength cutting superiority is that this working method overcomes that single wavelength laser processing effect is poor, the low problem of yield rate.Research experiment finds, with single green glow (to be 515nm～532nm) up cut when wearing glass to lower wavelength, when cutting to surface on glass easily surperficial cut edge on glass place's formation larger collapse the limit, can't reach processing request; (wavelength is 190nm～355nm), add from top to down man-hour, cuts when wearing the surface when Ultra-Violet Laser, can stay the limit that collapses that can not put up with in the lower glass surface cut edge, causes the lower phenomenon of yield rate to utilize equally Ultra-Violet Laser.
Aforesaid method can be realized by the device of following a kind of dual-wavelength laser cutting toughened glass;
The device of a kind of dual-wavelength laser cutting toughened glass that the utility model relates to, described device includes laser apparatus 1, described laser apparatus 1 is dual wavelength high frequency short-pulse laser machine, be that can to send green laser and the wavelength that wavelength is 515nm～532nm be these two kinds of laser of 190nm～355nm Ultra-Violet Laser to laser apparatus 1, the laser that described laser apparatus 1 sends directive behind optical gate 2 full impregnated mirror 3 that is all-trans, the full impregnated mirror 3 that is all-trans is that the green laser of 515nm～532nm all reflects with wavelength, be 190nm～whole transmissions of 355nm Ultra-Violet Laser with wavelength, be mixed with the two-way laser of green wavelength and ultraviolet wavelength after the full impregnated mirror 3 that is all-trans reflects respectively and reflects, the laser of green wavelength and the laser of ultraviolet wavelength advance along two light paths respectively, the laser of green wavelength is through beam expanding lens 26, incide on the speculum 39 behind half-wave plate 1 and the Glan prism 1 and change optical path direction, enter field mirror 1 behind the laser line focus mirror 1 after speculum 39 changes light paths, by field mirror 1 the laser directive is placed processing object 20 on the carrier table 21 subsequently; The laser of another road ultraviolet wavelength enters field mirror 2 17 successively behind beam expanding lens 1, half-wave plate 2 13, Glan prism 2 14, speculum 2 15 and condensing lens 2 16 after speculum 1 changes optical path direction, by field mirror 2 17 the laser directive is processed object 20 subsequently, described retouching is separately installed with CCD system 1 and CCD system 2 18 on field lens 1 and the field mirror 2 17, and all towards processing object 20, the both sides of described carrier table 21 are separately installed with blowing device 19 and particle collector 22 to the camera lens of CCD system 1 and CCD system 2 18.
The utility model is by using the high-frequency green glow ultraviolet pulse laser of dual wavelength as laser source, grab the target position of target work material by CCD, determine that graphics processing is corresponding one by one with sample position on the platform, toughened glass is cut first with green glow, thickness is reserved in the cutting of recycling Ultra-Violet Laser secondary contraposition, the dust that produces is at process special scavenger system and large flow laying dust system control of dust, the cutting of realization toughened glass processes the electron trade products such as the touch-screen pollution-free, that cutting effect is good and wafer glass.
Simultaneously, the utility model also can be realized by the device of following a kind of dual-wavelength laser cutting toughened glass;
The device of a kind of dual-wavelength laser cutting toughened glass that the utility model relates to, described device includes two laser apparatus, a laser apparatus sends the green laser that wavelength is 515nm～532nm, it is that (and the pulsewidth of green laser and Ultra-Violet Laser is 100ps～100ns to 190nm～355nm Ultra-Violet Laser that another laser apparatus sends wavelength, frequency is 1KHz～1000KHz), green laser is successively through beam expanding lens, half-wave plate, Glan prism, enter field mirror behind speculum and the condensing lens, Ultra-Violet Laser is equally through beam expanding lens, half-wave plate, Glan prism, enter another field mirror behind speculum and the condensing lens, on two field mirrors the CCD system is installed all, and penetrates the equal directive processing of the laser object of two field mirrors.
Claims (7)
1. a dual-wavelength laser cuts device for tempering glass products, it is characterized in that: described device includes the laser generator of a generation green laser and Ultra-Violet Laser, the laser of the green wavelength that this laser generator penetrates is successively through beam expanding lens two (6), half-wave plate one (7), enter field mirror one (11) behind Glan prism one (8) and the laser line focus mirror one (10), the Ultra-Violet Laser that this laser generator penetrates is successively through speculum one (4), beam expanding lens one (5), half-wave plate two (13), Glan prism two (14), enter field mirror two (17) behind speculum two (15) and the condensing lens two (16), penetrate field mirror one (11) green wavelength laser and penetrate field mirror two (17) ultraviolet wavelength laser respectively all directive place processing object (20) on the carrier table (21).
2. a kind of dual-wavelength laser cuts device for tempering glass products as claimed in claim 1, it is characterized in that: above-mentioned laser generator is one to send simultaneously the dual-wavelength laser producer (1) of green laser and Ultra-Violet Laser, the laser that described laser apparatus (1) sends directive behind optical gate (2) full impregnated mirror (3) that is all-trans, the full impregnated mirror (3) that is all-trans all reflects green laser, with the whole transmissions of Ultra-Violet Laser, the green laser after the reflection and the Ultra-Violet Laser after the transmission are respectively two light paths and penetrate laser generator.
3. a kind of dual-wavelength laser cuts device for tempering glass products as claimed in claim 1, it is characterized in that: above-mentioned laser generator is for including two laser apparatus, and one is the laser apparatus that green laser occurs, and another is for producing the laser apparatus of Ultra-Violet Laser.
4. such as a kind of dual-wavelength laser cutting device for tempering glass products as described in claim 1 or 2 or 3, it is characterized in that: the wavelength of the green laser of generation is 515nm～532nm, and the wavelength of the Ultra-Violet Laser of generation is 190nm～355nm.
5. such as a kind of dual-wavelength laser cutting device for tempering glass products as described in claim 1 or 2 or 3, it is characterized in that: described retouching is separately installed with CCD system one (12) and CCD system two (18) on field lens one (11) and the field mirror two (17), and the camera lens of CCD system one (12) and CCD system two (18) is all towards processing object (20).
6. such as a kind of dual-wavelength laser cutting device for tempering glass products as described in claim 1 or 2 or 3, it is characterized in that: the both sides of described carrier table (21) are separately installed with blowing device (19) and particle collector (22).
7. such as the device of a kind of dual-wavelength laser cutting toughened glass as described in claim 1 or 2 or 3, it is characterized in that: described speculum one (4), speculum two (15) and speculum three (9) respectively with incide its surperficial light path and be 45 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220266387 CN202671408U (en) | 2012-06-07 | 2012-06-07 | Device for cutting toughened glass with dual-wavelength laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220266387 CN202671408U (en) | 2012-06-07 | 2012-06-07 | Device for cutting toughened glass with dual-wavelength laser |
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| Publication Number | Publication Date |
|---|---|
| CN202671408U true CN202671408U (en) | 2013-01-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220266387 Expired - Lifetime CN202671408U (en) | 2012-06-07 | 2012-06-07 | Device for cutting toughened glass with dual-wavelength laser |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111604582A (en) * | 2020-06-05 | 2020-09-01 | 青岛昆仑天峰航空科技有限公司 | Three-band laser double-focusing-head laser processing system and method |
-
2012
- 2012-06-07 CN CN 201220266387 patent/CN202671408U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111604582A (en) * | 2020-06-05 | 2020-09-01 | 青岛昆仑天峰航空科技有限公司 | Three-band laser double-focusing-head laser processing system and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130116 |