CN202652731U - Semiconductor memory bank connecting finger protection jig - Google Patents
Semiconductor memory bank connecting finger protection jig Download PDFInfo
- Publication number
- CN202652731U CN202652731U CN 201220183220 CN201220183220U CN202652731U CN 202652731 U CN202652731 U CN 202652731U CN 201220183220 CN201220183220 CN 201220183220 CN 201220183220 U CN201220183220 U CN 201220183220U CN 202652731 U CN202652731 U CN 202652731U
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- China
- Prior art keywords
- tool
- jig
- lower cover
- golden finger
- semiconductor memory
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a semiconductor memory bank connecting finger protection jig. The protection jig comprises a jig upper cover and a jig lower cover which are closed in a matching manner. The memory bank is placed between the jig upper cover and the jig lower cover. Metal bars which are arranged regularly are arranged on the inner surface of the jig upper cover and the inner surface of the jig lower cover separately, wherein the two inner surfaces are opposite to each other. The connecting fingers on the memory bank printed circuit board are covered by the metal bars. According to the utility model, the semiconductor memory bank connecting finger protection jig can be used repeatedly after cleaning, so the generation of a large number of industrial waste is avoided, and the advantage of environmental protection is facilitated. Moreover, the automatic operation mode can be adopted by the jig in the process of operation, so the consumption of manpower resources is reduced, and the production efficiency is improved. Furthermore, multiple sets of fixation components are arranged on the jig upper cover and the jig lower cover separately, and the firm closing of the jig upper cover and the jig lower cover can be realized, so the stability of the memory bank is ensured.
Description
Technical field
The utility model relates to semiconductor device, particularly relates to a kind of semiconductor memory bar golden finger protection tool.
Background technology
Process in the forming process at memory bar, Tab Cover Load (golden finger covers and loads) operation mainly is PCB (the Printed Circuit Board that will print, printed circuit board (PCB)) places in the middle of the tool, golden finger on the pcb board is exposed in the external environment at this moment, melt flux during welding is splashed on the golden finger easily or tin cream is splashed on the golden finger, cause golden finger bad, affect memory bar and normally use.Wherein, golden finger is a kind of computer hardware, as on the memory bar and between the memory bank, between video card and the card slot etc., all signals all transmit by golden finger, golden finger is comprised of numerous flavous conductive contact blades, because its surface gold-plating and conductive contact blade are arranged such as finger-shaped, so be called " golden finger ".
The utility model content
The technical problem that (one) will solve
The technical problems to be solved in the utility model is that melt flux is splashed on the golden finger or tin cream is splashed on the golden finger when how to avoid the pcb board of memory bar to place tool, causes golden finger bad, affects the normal phenomenon of using of memory bar.
(2) technical scheme
In order to solve the problems of the technologies described above, the utility model provides a kind of semiconductor memory bar golden finger protection tool, and it comprises tool loam cake and the tool lower cover that is complementary and covers, and described memory bar is placed between described tool loam cake and the tool lower cover; Be respectively arranged with the metal bar that rule is arranged on described tool loam cake two inner surfaces relative with the tool lower cover, described metal bar hides the golden finger on the described memory bar pcb board.
Wherein, cover on the described tool and be provided with a plurality of tool location holes, cover under the described tool and be provided with a plurality of tool pilot pins, described a plurality of tool location holes and a plurality of tool pilot pins are corresponding mutually fit one by one.
Wherein, cover on the described tool and be provided with a plurality of magnetites, cover under the described tool and be provided with a plurality of metal derbies, described a plurality of magnetites and the one by one corresponding mutually adhesive of a plurality of metal derbies.
Wherein, cover on the described tool and be provided with a plurality of tool location-plates, described tool location-plate protrudes the edge setting of tool loam cake; Cover under the described tool and be provided with a plurality of tool location notchs, described tool location geosynclinal concave is in the setting of the edge of tool lower cover; Described a plurality of tool location-plate and a plurality of tool location notch one by one correspondence fasten.
Wherein, described tool location hole and described tool pilot pin be separately positioned on tool loam cake and tool lower cover around.
Wherein, described magnetite and described metal derby be separately positioned on tool loam cake and tool lower cover around.
(3) beneficial effect
The semiconductor memory bar golden finger protection tool that technique scheme provides is reused after can cleaning, and avoids a large amount of industrial refuses to produce, and is conducive to environmental protection; Tool can adopt automated job when operation process, save human resources, enhances productivity; Cover under tool loam cake and the tool and be respectively arranged with many group fixtures, can realize firmly covering of tool loam cake and tool lower cover, guarantee the stability of memory bar.
Description of drawings
Fig. 1 is the lower cover structure schematic diagram of the SO-DIMM memory bar golden finger protection tool of the utility model embodiment;
Fig. 2 is the superstructure schematic diagram of the SO-DIMM memory bar golden finger protection tool of the utility model embodiment;
Fig. 3 is the lower cover structure schematic diagram of the UB-DIMM memory bar golden finger protection tool of the utility model embodiment;
Fig. 4 is the superstructure schematic diagram of the UB-DIMM memory bar golden finger protection tool of the utility model embodiment.
Wherein, 1:PCB plate pilot pin; 2: the tool pilot pin; 3: metal derby; 4: the tool location notch; 5: the tool location hole; 6: magnetite; 7: the tool location-plate; 8: metal bar.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is described in further detail.Following examples are used for explanation the utility model, but are not used for limiting scope of the present utility model.
Existing memory bar commonly used mostly is SO-DIMM (Small Outline Dual In-line Memory Module; little profile biserial memory modules) and UB-DIMM (Unbuffered Dual In-Line Memory Modules; without buffering dual access memory module), the technical scheme of the semiconductor memory bar golden finger protection tool that therefore correspondingly provides in follow-up embodiment is applicable to SO-DIMM and UB-DIMM simultaneously.Fig. 1 and Fig. 2 show respectively the lower cover that is applicable to SO-DIMM memory bar golden finger protection tool and the structural representation of loam cake; Fig. 3 and Fig. 4 show respectively the lower cover that is applicable to UB-DIMM memory bar golden finger protection tool and the structural representation of loam cake; both almost do not have difference; different according to the structure of SO-DIMM and UB-DIMM only, the corresponding generation minor variations of the setting position of each parts.
The semiconductor memory bar golden finger protection tool that is applicable to simultaneously SO-DIMM and UB-DIMM comprises tool loam cake and the tool lower cover that is complementary and covers, and described memory bar is placed between described tool loam cake and the tool lower cover; Be respectively arranged with the metal bar 8 that rule is arranged on described tool loam cake two inner surfaces relative with the tool lower cover, the golden finger that described metal bar 8 hides on the described memory bar pcb board.
For the stability that realizes that tool loam cake and tool lower cover cover, cover on the described tool and be provided with a plurality of tool location holes 5, cover under the described tool and be provided with a plurality of tool pilot pins 2, described a plurality of tool location holes 5 and a plurality of tool pilot pins 2 are corresponding mutually fit one by one.And, cover on the described tool and be provided with a plurality of magnetites 6, cover under the described tool and be provided with a plurality of metal derbies 3, described a plurality of magnetites 6 and the one by one corresponding mutually adhesive of a plurality of metal derbies 3.Further, cover on the described tool and be provided with a plurality of tool location-plates 7, the edge setting that described tool location-plate 7 protrudes the tool loam cake; Cover under the described tool and be provided with a plurality of tool location notchs 4, described tool location notch 4 is recessed in the setting of the edge of tool; Described a plurality of tool location-plate 7 and a plurality of tool location notch 4 one by one correspondence fasten.
Memory bar is placed on the middle part of tool, therefore described tool location hole 5 and described tool pilot pin 2 be separately positioned on tool loam cake and tool lower cover around; Described magnetite 6 and described metal derby 3 be separately positioned on tool loam cake and tool lower cover around.
The tool loam cake or under cover and also be provided with pilot pin, with the fixing PCB of PCB location hole fit; Use magnetic principles, make tool loam cake or lower cover rely on the high temperature magnetite to hold to guarantee that PCB does not produce in process of production rocks; This tool has independently handling facilities, and equipment uses the light-seeking principle, and installation accuracy has been brought up to ± 0.1mm, effectively prevents because cause bad not in place is installed; In addition, in order to ensure loading precision, abnormal detector and alarm are installed on the equipment.
As can be seen from the above embodiments, the utility model embodiment reuses after can cleaning, and avoids a large amount of industrial refuses to produce, and is conducive to environmental protection; Tool can adopt automated job when operation process, save human resources, enhances productivity; Cover under tool loam cake and the tool and be respectively arranged with many group fixtures, can realize firmly covering of tool loam cake and tool lower cover, guarantee the stability of memory bar.
The above only is preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model know-why; can also make some improvement and replacement, these improvement and replacement also should be considered as protection range of the present utility model.
Claims (6)
1. a semiconductor memory bar golden finger protection tool is characterized in that the tool loam cake that comprising is complementary covers and tool lower cover, described memory bar are placed between described tool loam cake and the tool lower cover; Be respectively arranged with the metal bar that rule is arranged on described tool loam cake two inner surfaces relative with the tool lower cover, described metal bar hides the golden finger on the described memory bar pcb board.
2. semiconductor memory bar golden finger as claimed in claim 1 is protected tool; it is characterized in that; cover on the described tool and be provided with a plurality of tool location holes, cover under the described tool and be provided with a plurality of tool pilot pins, described a plurality of tool location holes and a plurality of tool pilot pins are corresponding mutually fit one by one.
3. semiconductor memory bar golden finger protection tool as claimed in claim 1 is characterized in that, covers on the described tool and is provided with a plurality of magnetites, covers under the described tool and is provided with a plurality of metal derbies, described a plurality of magnetites and the one by one corresponding mutually adhesive of a plurality of metal derbies.
4. semiconductor memory bar golden finger protection tool as claimed in claim 1 is characterized in that cover on the described tool and be provided with a plurality of tool location-plates, described tool location-plate protrudes the edge setting of tool loam cake; Cover under the described tool and be provided with a plurality of tool location notchs, described tool location geosynclinal concave is in the setting of the edge of tool lower cover; Described a plurality of tool location-plate and a plurality of tool location notch one by one correspondence fasten.
5. semiconductor memory bar golden finger as claimed in claim 2 protection tool is characterized in that, described tool location hole and described tool pilot pin be separately positioned on tool loam cake and tool lower cover around.
6. semiconductor memory bar golden finger as claimed in claim 3 protection tool is characterized in that, described magnetite and described metal derby be separately positioned on tool loam cake and tool lower cover around.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220183220 CN202652731U (en) | 2012-04-27 | 2012-04-27 | Semiconductor memory bank connecting finger protection jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220183220 CN202652731U (en) | 2012-04-27 | 2012-04-27 | Semiconductor memory bank connecting finger protection jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202652731U true CN202652731U (en) | 2013-01-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220183220 Expired - Fee Related CN202652731U (en) | 2012-04-27 | 2012-04-27 | Semiconductor memory bank connecting finger protection jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202652731U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109116592A (en) * | 2018-07-19 | 2019-01-01 | 合肥福映光电有限公司 | A kind of novel LB glue assembled fixture and its application method |
| CN112379730A (en) * | 2020-11-24 | 2021-02-19 | 南通大学 | Computer memory bank with air cooling device and computer |
-
2012
- 2012-04-27 CN CN 201220183220 patent/CN202652731U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109116592A (en) * | 2018-07-19 | 2019-01-01 | 合肥福映光电有限公司 | A kind of novel LB glue assembled fixture and its application method |
| CN112379730A (en) * | 2020-11-24 | 2021-02-19 | 南通大学 | Computer memory bank with air cooling device and computer |
| CN112379730B (en) * | 2020-11-24 | 2022-04-01 | 南通大学 | Computer memory bank with air cooling device and computer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130102 Termination date: 20180427 |