CN202652694U

CN202652694U - Improved structure of a multilayer circuit board

Info

Publication number: CN202652694U
Application number: CN 201220269123
Authority: CN
Inventors: 李涛; 吴少晖
Original assignee: Guangzhou Mei Wei Electronics Co Ltd
Current assignee: Guangzhou Mei Wei Electronics Co Ltd
Priority date: 2012-06-07
Filing date: 2012-06-07
Publication date: 2013-01-02
Anticipated expiration: 2022-06-07

Abstract

The utility model discloses improved structure of a multilayer circuit board. The multilayer circuit board successively comprises a top line layer, an insulating layer, an inner line layer, a substrate layer, an inner line layer, an insulating layer, and a bottom line layer from top to bottom. The inner line layer includes copper lines and a line blind area where copper blocks are arranged. Gap of 2 mm between the copper blocks and the lines is filled with a corresponding insulating layer. Filling area of the insulating layer is reduced by the copper blocks arranged in the line blind area and the gap of 2 mm between the copper blocks and the lines. When the circuit board is produced, the gap is easy to be fully filled with melted resin so that phenomenon of recessed lines and uneven thickness of the integral board is prevented, quality of the product is increased, and fraction defective is substantially reduced.

Description

A kind of improvement structure of multilayer circuit board

Technical field

The utility model relates to a kind of circuit board structure, relates in particular to a kind of improvement structure of multilayer circuit board.

Background technology

In multilayer circuit board, interior line map layer is extremely important part, existing multilayer circuit board in it line map layer generally formed by copper wire and circuit blind area without copper, when making multilayer circuit board, need the bonding by prepreg (main component is resin), solidify, pressing and interior line map layer and outside line map layer are linked into an integrated entity, prepreg then forms the insulating barrier between interior line map layer and outside line figure layer, prepreg experiences softening when pressing, melt, flow, arrive again the process of solidifying, finally make resin filling in the circuit blind area and with the copper wire good combination.Yet; the figure of copper wire often is pockety; interior line map layer will have large stretch of circuit blind area; and the circuit blind area is under-voltage position in the pressing process; prepreg was difficult to it is filled full in melting the gummosis process when area was excessive; the problem that wrinkling depression often can occur, the thickness of slab of position, circuit blind area also can be corresponding partially thin simultaneously.Therefore, circuit depression and the even phenomenon of integral slab thickness ununiformity often appear in existing multilayer circuit board, and the fraction defective of product is higher.

The utility model content

For the deficiencies in the prior art, the purpose of this utility model is intended to provide a kind of improvement structure of multilayer circuit board, and it can avoid occurring circuit depression and the even phenomenon of integral slab thickness ununiformity, has improved quality, greatly reduces fraction defective.

The utility model adopts following technical scheme for achieving the above object:

A kind of improvement structure of multilayer circuit board, comprise successively from top to bottom line map layer on, an insulating barrier, an interior line map layer, a substrate layer, an interior line map layer, an insulating barrier, line map layer once, interior line map layer comprises copper wire and circuit blind area, and, circuit is provided with copper billet in the blind area, gap between copper billet and the copper wire is 2mm, and the gap is filled by corresponding insulating barrier.

The improvement structure of a kind of multilayer circuit board that the utility model is set forth, its beneficial effect is: this product passes through at circuit blind area design copper billet, and the gap between copper billet and the copper wire is 2mm, dwindled the filling area of insulating barrier, the resin that melts during production is easy to just that gap-fill is full, thereby avoid occurring circuit depression and the even phenomenon of integral slab thickness ununiformity, improved the quality of product, greatly reduce fraction defective.

Description of drawings

Fig. 1 is the configuration diagram of the utility model embodiment;

Fig. 2 is the configuration diagram of interior line map layer among the utility model embodiment.

Description of reference numerals:

10, upper line map layer; 20, insulating barrier; 30, interior line map layer; 31, copper wire; 32, circuit blind area; 40, substrate layer; 33, copper billet; 50, lower line map layer.

Embodiment

Come the utility model is further described below in conjunction with accompanying drawing and specific embodiment.

Please refer to illustrated in figures 1 and 2, it has demonstrated the concrete structure of the utility model preferred embodiment, a kind of improvement structure of multilayer circuit board, comprise successively from top to bottom line map layer 10 on, an insulating barrier 20, an interior line map layer 30, a substrate layer 40, an interior line map layer 30, an insulating barrier 20, line map layer 50 once, interior line map layer 30 comprises copper wire 31 and circuit blind area 32, and, be provided with copper billet 33 in the circuit blind area 32, gap between copper billet 33 and the copper wire 31 is 2mm, and the gap is filled by corresponding insulating barrier 20.

This product is by arranging copper billet 33 in circuit blind area 32, and the gap between copper billet 33 and the copper wire 31 is 2mm, dwindled the filling area of insulating barrier 20, the resin that melts during production is easy to just that gap-fill is full, thereby avoid occurring circuit depression and the even phenomenon of integral slab thickness ununiformity, improve the quality of product, greatly reduced fraction defective.Be pointed out that the area when circuit blind area 32 surpasses 0.25FT ²The time, it is just more remarkable that 33 pairs of action effects that improve the quality of products of copper billet are set, and, the best results when gap is 2mm, excesssive gap has then reduced the effect of copper billet 33, and the too small then copper billet 33 in gap might have influence on the electric property of copper wire 31.

The above, it only is the utility model preferred embodiment, be not that technical scope of the present utility model is imposed any restrictions, so every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any trickle modification, equivalent variations and modification that above embodiment does.

Claims

1. the improvement structure of a multilayer circuit board, it is characterized in that: comprise successively from top to bottom line map layer on, an insulating barrier, an interior line map layer, a substrate layer, an interior line map layer, an insulating barrier, line map layer once, interior line map layer comprises copper wire and circuit blind area, and, circuit is provided with copper billet in the blind area, gap between copper billet and the copper wire is 2mm, and the gap is filled by corresponding insulating barrier.