CN202651189U - Inverse trapezium LED support - Google Patents
Inverse trapezium LED support Download PDFInfo
- Publication number
- CN202651189U CN202651189U CN2011203526222U CN201120352622U CN202651189U CN 202651189 U CN202651189 U CN 202651189U CN 2011203526222 U CN2011203526222 U CN 2011203526222U CN 201120352622 U CN201120352622 U CN 201120352622U CN 202651189 U CN202651189 U CN 202651189U
- Authority
- CN
- China
- Prior art keywords
- led
- conducting bracket
- support
- reflecting wall
- led support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides an inverse trapezium LED support. A conductive support (6) is connected with an inverse trapezium reflecting wall (1). An LED chip (3) is positioned at a protruding part in the center of the conductive support (6). The package base (5) is protected by a silica gel lens (4). An included angle between the inverse trapezium reflecting wall (1) and a horizontal plane (7) is 40 degrees. The whole LED support is made of metal material or metal ceramic composite material.
Description
Technical field
The utility model relates to a kind of light-emitting diode (LED) technical field, especially a kind of New LED encapsulation.
Background technology
Light-emitting diode (LED) is response current and be excited to produce the semiconductor device of versicolor light.The color of the light that is produced by LED is mainly determined by the semi-conductive chemical composition of LED.This LED compares with the traditional luminescent device that uses filament has a plurality of advantages, such as longer life-span, lower driving voltage, better initial exciting characteristic, higher freedom from vibration and the anti-electrical source exchange repeatedly of Geng Gao.Therefore, the demand of this LED increased just gradually.
In recent years, LED has all been adopted in large scale liquid crystal display (LCD) fast development in its light-emitting device and the back lighting device.But be not 100% be utilized by the light that chip sends, this mainly is because the cause that the light of chip sides is wasted.
The utility model content
In order to solve the problems referred to above of existing LED encapsulation technology, the utility model provides a kind of LED encapsulating structure and manufacturing way thereof, in order to improving light output efficiency, and improves light efficiency, reduces loss.
Another purpose of the present utility model proposes a reflecting wall exactly, by accommodation reflex wall and conducting bracket angle, and the needed lighting angle of easier acquisition.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of inverted trapezoidal led support comprises an encapsulation base, a conducting bracket, and a reflecting wall that links to each other with conducting bracket.Encapsulation base has a special zone of placing led chip in the central authorities of support.The conducting bracket material mainly is selected from the group that gold, silver, copper, iron, aluminium and alloy thereof form.Trapezoidal reflecting wall inclined-plane and 0 °＜α of conducting bracket angle＜90 °, for led chip provides a reflection approach.This plane reflection wall selected materials is the highly reflective material, can effectively concentrate on required light-emitting zone to sidelight, then can effectively eliminate dazzle if reflecting surface is fold plane.
The beneficial effects of the utility model are: reduce the light energy loss, have High Light Output efficient, have more the function of easy control rising angle.Its manufacture method must special extra equipment, only forms simultaneously reflecting wall in the same step that forms conducting bracket, without the cost burden on the additional materials.
Description of drawings
Below in conjunction with accompanying drawing the utility model is further specified.
Accompanying drawing 1 is light source irradiation schematic diagram of the present utility model.
Accompanying drawing 2 is structural representations of the present utility model.
Embodiment
As shown in Figure 1: the utility model is fully used sidelight by the sidelight that inverted trapezoidal reflecting wall refraction luminous element sends.
In Fig. 2: 1. inverted trapezoidal reflecting wall; 2. conductive gold wire; 3.LED chip; 4. silica-gel lens; 5. encapsulation base; 6. conducting bracket; 7. horizontal plane
The conducting bracket of the utility model support (6) links to each other with inverted trapezoidal reflecting wall (1), led chip (3) is in the protruding part of conducting bracket (6) central authorities, encapsulation base (5) is by silica-gel lens (4) protection, and inverted trapezoidal reflecting wall (1) is 40 ° with horizontal plane (7) angle; Whole led support material is that metal material or ceramic-metal composite are made.
Claims (1)
1. inverted trapezoidal led support, comprise an encapsulation base, one conducting bracket, an and reflecting wall that links to each other with conducting bracket, it is characterized by: encapsulation base is in the central authorities of support, a special zone of placing led chip is arranged, the conducting bracket material mainly is selected from the group that gold, silver, copper, iron, aluminium and alloy thereof form, trapezoidal reflecting wall inclined-plane and 0 °＜α of conducting bracket angle＜90 °, for led chip provides a reflection approach, this plane reflection wall selected materials is the highly reflective material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203526222U CN202651189U (en) | 2011-09-20 | 2011-09-20 | Inverse trapezium LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203526222U CN202651189U (en) | 2011-09-20 | 2011-09-20 | Inverse trapezium LED support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202651189U true CN202651189U (en) | 2013-01-02 |
Family
ID=47420246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203526222U Expired - Fee Related CN202651189U (en) | 2011-09-20 | 2011-09-20 | Inverse trapezium LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202651189U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103296185A (en) * | 2012-03-02 | 2013-09-11 | 河南森源电气股份有限公司 | Inverted trapezoidal LED support and LED light source thereof |
-
2011
- 2011-09-20 CN CN2011203526222U patent/CN202651189U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103296185A (en) * | 2012-03-02 | 2013-09-11 | 河南森源电气股份有限公司 | Inverted trapezoidal LED support and LED light source thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHENGZHOU SENYUAN NEW ENERGY TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: HENAN SENYUAN ELECTRIC CO., LTD. Effective date: 20131119 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 461500 XUCHANG, HENAN PROVINCE TO: 450000 ZHENGZHOU, HENAN PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20131119 Address after: 450000, the Third Avenue of Zhengzhou Economic Development Zone, Henan Province, is south of six North of longitude Road Patentee after: ZHENGZHOU SENYUAN NEW ENERGY TECHNOLOGY CO., LTD. Address before: 461500 north section of Renmin Road, Henan, Changge Patentee before: Henan Senyuan Electric Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130102 Termination date: 20150920 |
|
| EXPY | Termination of patent right or utility model |