CN202631105U - 光亮度和接近度多芯片集成传感器 - Google Patents
光亮度和接近度多芯片集成传感器 Download PDFInfo
- Publication number
- CN202631105U CN202631105U CN2012201582862U CN201220158286U CN202631105U CN 202631105 U CN202631105 U CN 202631105U CN 2012201582862 U CN2012201582862 U CN 2012201582862U CN 201220158286 U CN201220158286 U CN 201220158286U CN 202631105 U CN202631105 U CN 202631105U
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- infrared light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2012201582862U CN202631105U (zh) | 2012-04-16 | 2012-04-16 | 光亮度和接近度多芯片集成传感器 |
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CN2012201582862U CN202631105U (zh) | 2012-04-16 | 2012-04-16 | 光亮度和接近度多芯片集成传感器 |
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CN202631105U true CN202631105U (zh) | 2012-12-26 |
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CN2012201582862U Expired - Fee Related CN202631105U (zh) | 2012-04-16 | 2012-04-16 | 光亮度和接近度多芯片集成传感器 |
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CN (1) | CN202631105U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102620822A (zh) * | 2012-04-16 | 2012-08-01 | 昆山同心金属塑料有限公司 | 光亮度和接近度多芯片集成传感器及其封装的方法 |
CN116233286A (zh) * | 2022-12-30 | 2023-06-06 | 哈尔滨海格科技发展有限责任公司 | 一种光接收模组、光电传感装置和电子设备 |
-
2012
- 2012-04-16 CN CN2012201582862U patent/CN202631105U/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102620822A (zh) * | 2012-04-16 | 2012-08-01 | 昆山同心金属塑料有限公司 | 光亮度和接近度多芯片集成传感器及其封装的方法 |
CN116233286A (zh) * | 2022-12-30 | 2023-06-06 | 哈尔滨海格科技发展有限责任公司 | 一种光接收模组、光电传感装置和电子设备 |
CN116233286B (zh) * | 2022-12-30 | 2023-12-01 | 哈尔滨海格科技发展有限责任公司 | 一种光接收模组、光电传感装置和电子设备 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: YAO YUYUN Free format text: FORMER OWNER: KUNSHAN TONGXIN METAL + PLASTIC CO., LTD. Effective date: 20140801 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140801 Address after: 215300, No. 28, Suzhou Tong, Yushan Town, Kunshan City, Jiangsu, Suzhou Patentee after: Yao Yuyun Address before: Suzhou City, Jiangsu province 215300 hole Lujia Kunshan Xiang Lu Patentee before: Kunshan Tongxin Metal Plastic Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20160416 |