CN202626320U - Vertical continuous electroplating device - Google Patents
Vertical continuous electroplating device Download PDFInfo
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- CN202626320U CN202626320U CN 201220187258 CN201220187258U CN202626320U CN 202626320 U CN202626320 U CN 202626320U CN 201220187258 CN201220187258 CN 201220187258 CN 201220187258 U CN201220187258 U CN 201220187258U CN 202626320 U CN202626320 U CN 202626320U
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- treatment
- via hole
- buried via
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Abstract
The utility model discloses a vertical continuous electroplating device, comprising a device stand (1). The device stand (1) is provided with a pre-treatment groove (2), an buried-hole copper plating groove (4), a post-treatment groove (5), a moving device and a flash-plating groove (3), wherein the pre-treatment groove (2) is used for carrying out plating pre-treatment on a plating piece, the buried-hole copper plating groove (4) is used for carrying out buried-hole copper plating treatment on the plating piece, the post-treatment groove (5) is used for carrying out copper plating post-treatment on the plating piece, the moving device is used for conveying the plating piece, the flash-plating groove (3) is used for carrying out flash-plating treatment on the plating piece, and the moving device firstly conveys the plating piece which is subjected to the plating pre-treatment in the pre-treatment groove (2) to the flash-plating groove (3) to be subjected to the flash-plating treatment, secondly conveys the plating piece to the buried-hole copper plating groove (4) to be subjected to the buried-hole copper plating treatment and finally conveys the plating piece to the post-treatment groove (5) to be subjected to the post-treatment. The vertical continuous electroplating device disclosed by the utility model can improve the continuity of electroplating treatment on products and the quality of electroplated buried holes, and reduce the machining cost.
Description
Technical field
The utility model relates to a kind of electroplating device, a kind of vertical continuous electroplating device of more specifically saying so.
Background technology
Along with the continuous development of Information technology, the microminiaturization of electronic product, highly integrated degree is increasingly high, and HDI plate market is constantly developed, and the processing in HDI hole also develops into present high-order buried via hole plate by simple blind buried via hole.As shown in Figure 1; The mechanism of Laser Induced Hole Filling that makes progress from the blind hole bottom at present is mainly: fill up blind hole in order to electroplate with the continuity high-quality copper; Copper facing speed in the blind hole must be local faster than other; In order to avoid opening part is closed in advance, cause the empty eye of filling perforation or locate fissured generation, the acceleration filling perforation that makes progress from the blind hole bottom is owing to the effect of organic additive system; Form barrier layer by suppressor factor on the surface of copper, because the high density of suppressor factor, this tunic is created on all positions uniformly, thereby can guarantee filling up on the basis in hole, thereby makes the thinner realization that helps the buried via hole operation of plate face copper plating as far as possible; Quicken the effect of filling up through in blind hole, increasing gloss-imparting agent realization bottom; Also convergent is little owing to the hole basal surface; Make gloss-imparting agent be compressed on the narrow and small surface-area; Thereby the rate of deposition that the gloss-imparting agent of this high local concentrations has quickened in the blind hole can guarantee to realize buried via hole copper facing under the thin situation of the copper plating making plate; And pass through the rate of deposition that smoothing agent suppresses the blind hole corner, thus the mechanism of Laser Induced Hole Filling that realization makes progress from the blind hole bottom, it is bad to prevent buried via hole, as: empty, bad product such as slit.
A mode to electroplating the buried via hole quality improvement is that the Chemical Composition that relates in the above-mentioned buried via hole mechanism is improved; At present electroplating device manufacturers just with liquid medicine merchant enthusiastic cooperation; Be devoted to the development of high quality buried via hole technology; But this really is not can be once kicking promptly, improve and start with from factor that the buried via hole quality is electroplated in other influence, and then be can accomplish and need accomplish in a hurry at present.
And the principal element of influence plating buried via hole quality goes out outside the Chemical Composition, also comprises physics composition and plate factor.Wherein, the physics composition comprises: anode type, and the distance of anode and cathode, current density, the liquid medicine temperature can produce factors such as impact type mobile nozzle on the plate face; The plate factor mainly comprises: the medium layer material, and pore size, the footpath is deeply than, chemical plating copper layer, and little erosion of filling perforation pre-treatment, pickling effect.
Wherein, set about improving the mode of electroplating the buried via hole quality from chemical plating copper layer and mainly be: before the copper facing buried via hole, if hole wall is even and smooth, the protruding outstanding and glass of no face copper is knitted protrusion, can promote crystal seed to generate constantly and the buried via hole of strengthening subsequent shows.Therefore plate product merchant can carry out the chemical plating copper layer processing to product before the copper facing buried via hole, promptly can to guarantee the evenly smooth of blind hole hole wall, strengthen follow-up copper facing buried via hole ability earlier at the thin copper of product surface plating one deck.
As shown in Figure 2, evenly smooth inadequately when adopting legacy equipment directly to carry out buried via hole copper facing because of the blind hole hole wall as if the client, can influence buried via hole copper facing quality, produce more emptying aperture, bad product such as slit.For solving the problem that adopts the legacy equipment defective products many, in the prior art, the client can be before the copper facing of product buried via hole; On miscellaneous equipment, carrying out earlier copper coating handles; Promptly plate the thin copper plate of one deck earlier, be called the plate plating, to obtain evenly smooth blind hole inwall in plate surface; Improve follow-up copper facing buried via hole ability, can improve the performance of follow-up equipment buried via hole.
The setting about improving the mode of electroplating the buried via hole quality from chemical plating copper layer and mainly have following shortcoming of prior art:
1, when plate being carried out the buried via hole processing, need on a kind of copper facing equipment, carry out earlier copper plate and handle, again it is carried out buried via hole and handle.Increase customer equipment quantity, increased production process, strengthened client's production cost.
2, carry out on two kinds of equipment because of copper plating treatment and buried via hole copper facing, elongated the copper-plated time difference of copper plating treatment and buried via hole, interrupted the continuity of products production of the same race.More be prone to cause the pollution and the oxidation of plate surface, for the copper-plated pretreatment procedure of postorder buried via hole has increased difficulty.
The utility model content
The purpose of the utility model provides a kind of vertical continuous electroplating device, can improve continuity and plating buried via hole quality that product is electroplated processing, cuts down finished cost.
The purpose of the utility model realizes through following technical measures:
A kind of vertical continuous electroplating device; Comprise equipment rack; Said equipment rack be provided be used for to plating piece plate pre-treatment the pre-treatment groove, be used for to plating piece carry out the buried via hole copper plating treatment the buried via hole copper plating groove, be used for plating piece is carried out the rear treating groove of copper facing aftertreatment and is used to transport the transfer device of plating piece; It is characterized in that also being provided with on the described equipment rack and be used for plating piece is carried out the flash groove that flash is handled; Said transfer device will be at the plating piece after said pre-treatment groove plates pre-treatment; Be transported to said flash groove earlier and carry out the flash processing, deliver to said buried via hole copper plating groove again and carry out the buried via hole copper plating treatment, deliver to said rear treating groove at last and carry out post-processed.
In order to reduce the floor space of the utility model vertical continuous electroplating device, said pre-treatment groove, flash groove, buried via hole copper plating groove and rear treating groove are successively set on the said equipment rack along rectilinear path.
Compared with prior art, the utlity model has following beneficial effect:
(1) the vertical continuous electroplating device of the utility model adopts the flash groove that plating piece is carried out the flash operation earlier before buried via hole copper facing, has reduced client's production process like this, carries out buried via hole copper facing again and need not on other a kind of equipment, to plate earlier layer of copper.
(2) the vertical continuous electroplating device of the utility model need not the cooperation of miscellaneous equipment, has practiced thrift client's factory building land used, need not to put two or more equipment.
(3) the vertical continuous electroplating device of the utility model integrates functions such as copper facing pre-treatment, flash, buried via hole copper facing, copper facing aftertreatment; Increased the continuity that the client produces; Because of copper plating treatment and buried via hole copper facing interval time shorter; Significantly reduced the oxidation that the plate face occurs, contaminated problem has alleviated the copper-plated pretreatment procedure of buried via hole.
Description of drawings
Below in conjunction with accompanying drawing and specific embodiment the utility model is done further to specify:
Fig. 1 is the plating piece blind hole bottom synoptic diagram of mechanism of Laser Induced Hole Filling upwards in the prior art;
Fig. 2 is to the technological process figure of plating piece in the prior art;
Fig. 3 is the structural representation of the utility model vertical continuous electroplating device;
Fig. 4 is the technological process figure of the utility model vertical continuous electroplating device to plating piece.
Embodiment
As shown in Figure 3; The vertical continuous electroplating device of the utility model; Comprise equipment rack 1; This equipment rack 1 be provided be used for to plating piece plate pre-treatment pre-treatment groove 2, be used for to plating piece carry out the buried via hole copper plating treatment buried via hole copper plating groove 4, be used for to plating piece carry out the copper facing aftertreatment rear treating groove 5, be used to transport the transfer device of plating piece and be used for plating piece is carried out the flash groove 3 that flash is handled, transfer device will be at the plating piece after pre-treatment groove 2 plates pre-treatment, is transported to flash groove 3 earlier and carries out flash and handle; Deliver to buried via hole copper plating groove 4 again and carry out the buried via hole copper plating treatment, deliver to rear treating groove 5 at last and carry out post-processed.
Because buried via hole copper plating groove 4 often reaches 20 meters; And other cell bodies also have one meter to several meters length that does not wait; The vertical continuous electroplating device need occupy the sizable land area of factory building; In order to reduce the floor space of the utility model vertical continuous electroplating device, above-mentioned pre-treatment groove 2, flash groove 3, buried via hole copper plating groove 4 and rear treating groove 5 are successively set on the equipment rack 1 along rectilinear path, and wherein buried via hole copper plating groove 4 can be arranged on separately on the long limit of this rectilinear path.
As shown in Figure 4; When the vertical continuous electroplating device of employing the utility model is electroplated plate; Plate at first carries out the copper facing pretreatment procedure from the upper plate entering pre-treatment groove 2 of vertical continuous electroplating device; This operation is in order to remove the dirt of plate surface, to reach zone of oxidation, for copper plating treatment is prepared; Carry out the buried via hole pretreatment procedure at flash groove 3 then, i.e. flash operation, this operation are in order to increase one deck chemical plating copper layer to plate, to make the blind hole inwall evenly smooth, being beneficial to the copper-plated realization of buried via hole; Be only at last and in buried via hole copper plating groove 4, carry out buried via hole copper facing operation and in rear treating groove 5, carry out the copper facing postprocessing working procedures, the plate that machines is transplanted on the lower plate place of vertical continuous electroplating device.
The embodiment of the utility model is not limited thereto; According to foregoing; Ordinary skill knowledge and customary means according to this area; Do not breaking away under the above-mentioned basic fundamental thought of the utility model prerequisite, equivalent modifications, replacement or change that the utility model can also be made other various ways all can realize the utility model purpose.
Claims (2)
1. vertical continuous electroplating device; Comprise equipment rack (1); Said equipment rack (1) be provided be used for to plating piece plate pre-treatment pre-treatment groove (2), be used for to plating piece carry out the buried via hole copper plating treatment buried via hole copper plating groove (4), be used for plating piece is carried out the rear treating groove (5) of copper facing aftertreatment and is used to transport the transfer device of plating piece; It is characterized in that: also be provided with the flash groove (3) that is used for plating piece is carried out the flash processing on the described equipment rack (1); Said transfer device will be at the plating piece after said pre-treatment groove (2) plates pre-treatment; Be transported to said flash groove (3) earlier and carry out the flash processing, deliver to said buried via hole copper plating groove (4) again and carry out the buried via hole copper plating treatment, deliver to said rear treating groove (5) at last and carry out post-processed.
2. vertical continuous electroplating device according to claim 1 is characterized in that: said pre-treatment groove (2), flash groove (3), buried via hole copper plating groove (4) and rear treating groove (5) are successively set on the said equipment rack (1) along rectilinear path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220187258 CN202626320U (en) | 2012-04-27 | 2012-04-27 | Vertical continuous electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220187258 CN202626320U (en) | 2012-04-27 | 2012-04-27 | Vertical continuous electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202626320U true CN202626320U (en) | 2012-12-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220187258 Expired - Lifetime CN202626320U (en) | 2012-04-27 | 2012-04-27 | Vertical continuous electroplating device |
Country Status (1)
| Country | Link |
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| CN (1) | CN202626320U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103074656A (en) * | 2013-01-28 | 2013-05-01 | 福建浔兴拉链科技股份有限公司 | Oxidation device for protecting zippers |
| CN103243375A (en) * | 2013-05-24 | 2013-08-14 | 无锡市崇安区科技创业服务中心 | Electroplating monitoring and detecting system |
| CN103984253A (en) * | 2014-05-21 | 2014-08-13 | 赣州市深联电路有限公司 | VCP line section starting and stopping energy-saving device |
| CN105063732A (en) * | 2015-08-27 | 2015-11-18 | 天津佰金隆金属制品有限公司 | Device for cyanide-free copper plating |
-
2012
- 2012-04-27 CN CN 201220187258 patent/CN202626320U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103074656A (en) * | 2013-01-28 | 2013-05-01 | 福建浔兴拉链科技股份有限公司 | Oxidation device for protecting zippers |
| CN103074656B (en) * | 2013-01-28 | 2015-07-15 | 福建浔兴拉链科技股份有限公司 | Oxidation device for protecting zippers |
| CN103243375A (en) * | 2013-05-24 | 2013-08-14 | 无锡市崇安区科技创业服务中心 | Electroplating monitoring and detecting system |
| CN103984253A (en) * | 2014-05-21 | 2014-08-13 | 赣州市深联电路有限公司 | VCP line section starting and stopping energy-saving device |
| CN103984253B (en) * | 2014-05-21 | 2017-03-01 | 赣州市深联电路有限公司 | VCP plating line segmentation is opened, is shut down energy saver |
| CN105063732A (en) * | 2015-08-27 | 2015-11-18 | 天津佰金隆金属制品有限公司 | Device for cyanide-free copper plating |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121226 |
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| CX01 | Expiry of patent term |