CN208136377U - A kind of plating line - Google Patents
A kind of plating line Download PDFInfo
- Publication number
- CN208136377U CN208136377U CN201820599393.6U CN201820599393U CN208136377U CN 208136377 U CN208136377 U CN 208136377U CN 201820599393 U CN201820599393 U CN 201820599393U CN 208136377 U CN208136377 U CN 208136377U
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- plating
- sucker
- section
- loading board
- pcb board
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Abstract
The utility model discloses a kind of plating lines, for to pcb board electroplating surface, the electroplanting device and blanking loading board mechanism of plating vehicle, realization plating including feeding loading board mechanism, reception pcb board to be plated for transporting pcb board to be plated, feeding loading board mechanism, including moveable for grabbing the mechanical hand sucker and loading board sucker of pcb board to be plated, the mechanical hand sucker and loading board sucker can closed butt joint so that pcb board to be plated is transferred to loading board sucker from mechanical hand sucker；The plating vehicle slidably connects sliding rail；The electroplanting device including the thrust gear for pushing the plating vehicle level to slide and pushes the elevating mechanism that vehicle elevating movement is electroplated；By mechanical hand sucker and loading board sucker can closed butt joint setting, pcb board is unclamped in the deflation of mechanical hand sucker and loading board sucker air-breathing is sucked pcb board while carrying out, so that pcb board to be plated is transferred to loading board sucker from mechanical hand sucker, the position deviation problem generated by transporting P CB plate is avoided.
Description
Technical field
The utility model relates to electroplating technology more particularly to a kind of plating lines.
Background technique
Plating is exactly to plate the process of the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, is
The technique of the surface of metal or other materials product attachment layer of metal film is set to prevent metal oxygen to play using electrolysis
The effects of changing (as corroded), improving wearability, electric conductivity, reflective, corrosion resistance (copper sulphate etc.) and having improved aesthetic appearance.It is many hard
The outer layer of coin is also plating.
Plating need one to electroplating bath power low-voltage high-current power source and by electroplate liquid, part to be plated (cathode) and
The electrolysis unit that anode is constituted.Wherein electroplating bath components view coating is different and different, but contains the main salt for being provided with metal ion,
The complexing agent that metal ion in main salt forms complex compound can be complexed, for the buffer of stablizing solution pH value, anode activation agent
With special additive (such as brightener, grain refiner, leveling agent, wetting agent, stress elimination agent and fog inhibitor).Electroplating process
It is the metal ion in plating solution under the action of external electric field, is reduced into metallic atom through electrode reaction, and carries out gold on cathode
Belong to the process of deposition.Therefore, this be one include mass transfer in liquid phase, electrochemical reaction and electrocrystallization and etc. metal electrodeposition mistake
Journey.
Existing plating line pcb board is sucked by mechanical hand sucker, then directly when transporting pcb board to be plated
It is placed in feeding loading board mechanism, but this is easy to cause the position of pcb board to generate deviation.
Utility model content
The purpose of this utility model is to provide a kind of plating lines, can be close by mechanical hand sucker and loading board sucker
The setting of docking, so that pcb board to be plated is transferred to loading board sucker from mechanical hand sucker, to solve the above technical problem.
For this purpose, the utility model uses following technical scheme：
A kind of plating line is used for pcb board electroplating surface, including the feeding loader for transporting pcb board to be plated
Structure, the plating vehicle for receiving pcb board to be plated, the electroplanting device and blanking loading board mechanism for realizing plating, feeding loading board mechanism, packet
It includes moveable for grabbing the mechanical hand sucker and loading board sucker of pcb board to be plated, the mechanical hand sucker and loading board sucker
Can closed butt joint so that pcb board to be plated is transferred to loading board sucker from mechanical hand sucker；
The plating vehicle slidably connects sliding rail；
The electroplanting device including the thrust gear for pushing the plating vehicle level to slide and pushes the plating vehicle
The elevating mechanism of elevating movement.
Optionally, the electroplanting device further include the oil removing section set gradually, cleaning section, copper facing section and after wash section, it is described
Thrust gear can push the plating vehicle successively by oil removing section, cleaning section, copper facing section and after wash section, the oil removing section, cleaning
Section, copper facing section and after wash section and be provided with the elevating mechanism.
Optionally, pcb board is connected to the wireless control cathode of the plating vehicle, and the anode of electroplating power supply is connected to the electricity
The wireless control anode of vehicle is plated, so that copper ion moves on pcb board when plating.
Optionally, passback chain is connected between feeding loading board mechanism and blanking loading board mechanism.
Optionally, the cleaning section includes the washing section set gradually and pickling section.
The utility model embodiment has the advantages that：
It, compared to existing technologies, can be close right by mechanical hand sucker and loading board sucker in the utility model embodiment
The setting connect, pcb board is unclamped in the deflation of mechanical hand sucker and loading board sucker air-breathing is sucked pcb board while carrying out, so that pcb board to be plated
It is transferred to loading board sucker from mechanical hand sucker, avoids the position deviation problem generated by transporting P CB plate.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, before not making the creative labor property
It puts, can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is the first half structural schematic diagram of plating line provided by the embodiment of the utility model.
Fig. 2 is the latter half structural schematic diagram of plating line provided by the embodiment of the utility model.
It illustrates：
Feeding loading board mechanism 10；Transverse-moving mechanism 20；Upper plate position 30；Oil removing section 40；Washing section 50；Pickling section 60；Copper facing section
70；After wash section 80；Blanking loading board mechanism 90；Return chain 100.
Specific embodiment
It, below will knot to enable the purpose of utility model, feature, advantage of the utility model more obvious and understandable
The attached drawing in the utility model embodiment is closed, the technical scheme in the utility model embodiment is clearly and completely described,
Obviously, the embodiments described below are only the utility model a part of the embodiment, and not all embodiment.Based on this reality
It is obtained by those of ordinary skill in the art without making creative efforts all other with the embodiment in novel
Embodiment is fallen within the protection scope of the utility model.
It please refers to shown in Fig. 1 and Fig. 2, the utility model embodiment provides a kind of plating line, for pcb board table
Face plating, plating vehicle, realization plating including feeding loading board mechanism 10, reception pcb board to be plated for transporting pcb board to be plated
Electroplanting device and blanking loading board mechanism 90.
Specifically, feeding loading board mechanism 10 is used for for receiving and transporting the pcb board to be plated from a upper process, plating vehicle
Receive the pcb board to be plated transported from feeding loading board mechanism 10.Then the plating vehicle of pcb board to be plated is mounted with from electroplanting device
Front end is moved to its rear end, and the plating work of pcb board is completed with this.Then, plating vehicle will be completed by blanking loading board mechanism 90
The pcb board of plating is sent out.
Further, passback chain 100 is connected between feeding loading board mechanism 10 and blanking loading board mechanism 90, plating vehicle is logical
Passback chain 100 is crossed, the side of upper plate position 30 is back to, to receive next pcb board to be plated.
Further, feeding loading board mechanism 10, including the moveable mechanical hand sucker for grabbing pcb board to be plated and
Loading board sucker, mechanical hand sucker and loading board sucker can closed butt joint so that pcb board to be plated from mechanical hand sucker be transferred to loading board inhale
Disk.Specifically, mechanical hand sucker receives the pcb board to be plated from a upper process, it is then moved to docking at loading board sucker,
At this point, mechanical hand sucker, which is deflated, unclamps pcb board, at the same time, pcb board is sucked in loading board sucker air-breathing.
Therefore, plating line provided by the embodiment of the utility model passes through mechanical hand sucker compared to existing technologies
With loading board sucker can closed butt joint setting, mechanical hand sucker, which is deflated, to be unclamped pcb board and loading board sucker air-breathing pcb board is sucked simultaneously
It carries out, so that pcb board to be plated is transferred to loading board sucker from mechanical hand sucker, it is inclined to avoid the position generated by transporting P CB plate
Poor problem.
Further, plating vehicle slidably connects sliding rail, and sliding rail extends to electroplanting device from the front end of electroplanting device
Rear end.Electroplanting device includes for pushing the thrust gear 20 of plating vehicle level sliding and pushing the liter of plating vehicle elevating movement
Descending mechanism.Therefore, thrust gear 20, which can push, is electroplated the rear end that vehicle slides into always electroplanting device from the front end of electroplanting device.
Specifically, electroplanting device further include the oil removing section 40 set gradually, be made of washing section 50 and pickling section 60 it is clear
Wash section, copper facing section 70 and after wash section 80, thrust gear 20 can push plating vehicle successively to pass through oil removing section 40, cleaning section, copper facing section
70 and after wash section 80, oil removing section 40, cleaning section, copper facing section 70 and after wash section 80 and be provided with elevating mechanism, these elevating mechanisms
Vehicle is electroplated for going up and down, so that pcb board completes plating work.
Specifically, pcb board is connected to the wireless control cathode of plating vehicle, the anode of electroplating power supply is connected to the nothing of plating vehicle
Line traffic control anode, so that copper ion moves on pcb board when plating.
Further, cleaning section includes the washing section 50 set gradually and pickling section 60.
Plating line provided in this embodiment, specific workflow are：
1, mechanical hand sucker moves back pcb board leveling to be plated to feeding loader structure 10；
2, loading board sucker and mechanical hand sucker are in the closed butt joint of loading board position, and mechanical hand sucker is deflated, loading board sucker air-breathing, to
Plating pcb board is transferred to feeding loading board mechanism 10；
3, feeding loading board mechanism 10 installs plate and moves to upper plate position 30, and pcb board to be plated is loaded into plating vehicle in upper plate position 30
On；
4, vehicle will be electroplated by thrust gear 20 to elapse to oil removing section 40, the elevating mechanism of oil removing section 40 drives PCB to be plated
Plate, which enters, removes oil cylinder, carries out oil removal treatment to pcb board to be plated；
5, pcb board to be plated after oil removing is sent to washing section 50 and pickling section by the elevating mechanism and thrust gear of oil removing section 40
60, respectively enter water washing cylinder and the cleaning of pickling cylinder；
6, by thrust gear 20, the plating vehicle equipped with pcb board to be plated is sent into copper slot by the elevating mechanism of cleaning section；
7, plating vehicle slides on the sliding rail on copper slot, it is ensured that pcb board to be plated steadily moves in copper slot；
8, pcb board is connected with the wireless control cathode on plating vehicle, the motor-generator set anode of plating with the wireless of vehicle is electroplated
It controls anode to be connected, so that copper buried copper ion, which moves to, completes plating on pcb board；
9, it will be electroplated to wash in section 80 after vehicle moves to by the elevating mechanism of copper facing section and thrust gear 20 and clean, by electroplate
Upper liquid medicine cleans up；
10, the elevating mechanism and thrust gear 20 that section is washed after passing through will be electroplated vehicle and be pushed into lower material position completion blanking；
11, the dummy plating vehicle under after complete material moves to the side of passback chain 100 by discharging end Horizontal shifting platform, passes through passback
Chain 100 drags to the other side of passback chain 100 by vehicle is electroplated；
12, at this point, dummy plating vehicle is by feeding end Horizontal shifting platform, thrust gear 20 is transported to upper plate position 30, completes an electricity
Plating circulation.
Plating line provided by the embodiment of the utility model, structure is simple, can by mechanical hand sucker and loading board sucker
The setting of closed butt joint, pcb board is unclamped in the deflation of mechanical hand sucker and loading board sucker air-breathing is sucked pcb board while carrying out, so as to
It plates pcb board and is transferred to loading board sucker from mechanical hand sucker, avoid the position deviation problem generated by transporting P CB plate.
The above, above embodiments are only to illustrate the technical solution of the utility model, rather than its limitations；Although ginseng
The utility model is described in detail according to previous embodiment, those skilled in the art should understand that：It is still
It is possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is equally replaced
It changes；And these are modified or replaceed, various embodiments of the utility model technical solution that it does not separate the essence of the corresponding technical solution
Spirit and scope.
Claims (5)
1. a kind of plating line, for pcb board electroplating surface, including for transporting pcb board to be plated feeding loading board mechanism,
It receives the plating vehicle of pcb board to be plated, realize the electroplanting device and blanking loading board mechanism of plating, it is characterised in that：
Feeding loading board mechanism, including moveable for grabbing the mechanical hand sucker and loading board sucker of pcb board to be plated, institute
State mechanical hand sucker and loading board sucker can closed butt joint so that pcb board to be plated is transferred to loading board sucker from mechanical hand sucker；
The plating vehicle slidably connects sliding rail；
The electroplanting device including the thrust gear for pushing the plating vehicle level to slide and pushes the plating vehicle lifting
The elevating mechanism of movement.
2. plating line according to claim 1, which is characterized in that the electroplanting device further includes removing of setting gradually
Oily section, cleaning section, copper facing section and after wash section, the thrust gear can push the plating vehicle successively pass through oil removing section, cleaning section,
Copper facing section and after wash section, the oil removing section, cleaning section, copper facing section and after wash section and be provided with the elevating mechanism.
3. plating line according to claim 1, which is characterized in that pcb board is connected to the wireless controlled of the plating vehicle
Cathode processed, the anode of electroplating power supply is connected to the wireless control anode of the plating vehicle, so that copper ion moves to PCB when plating
On plate.
4. plating line according to claim 1, which is characterized in that feeding loading board mechanism and blanking loading board mechanism
Between be connected with passback chain.
5. plating line according to claim 2, which is characterized in that the cleaning section includes the washing section set gradually
With pickling section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820599393.6U CN208136377U (en) | 2018-04-25 | 2018-04-25 | A kind of plating line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820599393.6U CN208136377U (en) | 2018-04-25 | 2018-04-25 | A kind of plating line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208136377U true CN208136377U (en) | 2018-11-23 |
Family
ID=64310167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820599393.6U Active CN208136377U (en) | 2018-04-25 | 2018-04-25 | A kind of plating line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208136377U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110913597A (en) * | 2019-12-03 | 2020-03-24 | 江西威力固智能设备有限公司 | Full-automatic heavy copper production line of PCB |
| CN112795970A (en) * | 2020-12-30 | 2021-05-14 | 安徽持恒电子科技有限公司 | Copper plating device for circuit board printing |
-
2018
- 2018-04-25 CN CN201820599393.6U patent/CN208136377U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110913597A (en) * | 2019-12-03 | 2020-03-24 | 江西威力固智能设备有限公司 | Full-automatic heavy copper production line of PCB |
| CN112795970A (en) * | 2020-12-30 | 2021-05-14 | 安徽持恒电子科技有限公司 | Copper plating device for circuit board printing |
| CN112795970B (en) * | 2020-12-30 | 2021-12-21 | 安徽持恒电子科技有限公司 | Copper plating device for circuit board printing |
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