CN202623519U - Temperature-sensitive head and temperature-sensitive printer - Google Patents

Temperature-sensitive head and temperature-sensitive printer Download PDF

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Publication number
CN202623519U
CN202623519U CN 201220117743 CN201220117743U CN202623519U CN 202623519 U CN202623519 U CN 202623519U CN 201220117743 CN201220117743 CN 201220117743 CN 201220117743 U CN201220117743 U CN 201220117743U CN 202623519 U CN202623519 U CN 202623519U
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CN
China
Prior art keywords
total
thermal head
heater
substrate
electrode
Prior art date
Application number
CN 201220117743
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Chinese (zh)
Inventor
大泽光平
今枝千明
中岛聪
Original Assignee
精工爱普生株式会社
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Filing date
Publication date
Priority to JP2011071747A priority Critical patent/JP5765003B2/en
Priority to JP2011-071748 priority
Priority to JP2011-071747 priority
Priority to JP2011071748A priority patent/JP5765004B2/en
Application filed by 精工爱普生株式会社 filed Critical 精工爱普生株式会社
Application granted granted Critical
Publication of CN202623519U publication Critical patent/CN202623519U/en

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Abstract

The utility model provides a temperature-sensitive head and a temperature-sensitive printer. The temperature-sensitive head is characterized by comprising a substrate. A plurality of heating members are arranged along the arrangement shaft on the substrate; each heating member possesses a heating resistor, and an individual electrode and a common electrode connected with the heating resistor; the common electrode is connected with a common distribution cable arranged around the heating members; the common distribution wire possesses at least a convex portion at the portion intersected with the arrangement shaft; and the convex portion is extended to the side surface of the substrate.

Description

Thermal head and thermal printer

Technical field

The utility model relates to thermal head and thermal printer.

The application invents the 2011-071747 communique for the Japan that filed an application on March 29th, 2011 and Japan of filing an application on March 29th, 2011 invents the 2011-071748 communique and advocates priority, and its content is incorporated herein.

Background technology

A kind of as printing equipment, known have a thermal printer.Thermal printer has the thermal head (for example, with reference to patent documentation 1~4) with the configuration of heater element linearity ground.The heater element utilization that is disposed at thermal head is switched on and optionally heating.And this heat energy optionally reacts with the colour former that is contained in heat-sensitive paper, thereby on heat-sensitive paper, prints various information.This printing type is called as temperature-sensitive color development mode.

Patent documentation 1: japanese kokai publication hei 9-39282 communique

Patent documentation 2: japanese kokai publication hei 5-261957 communique

Patent documentation 3: japanese kokai publication hei 8-224901 communique

Patent documentation 4: japanese kokai publication hei 8-34132 communique

In the thermal printer shown in the above-mentioned document with thermal head; When printing; Thermal head and and the member cylindraceous that is called as platen of thermal head arranged opposite between print media such as clamping heat-sensitive paper; Platen is pivoted, and the conveying that prints medium thus also prints simultaneously.Therefore, the zone that contacts with print media in thermal head rubs all the time and between the print media, because of the wearing and tearing deterioration.

In structure in the past, if this kind deterioration constantly develops, then be arranged at the distribution wearing and tearing of thermal head, current capacity descends, and thus, possibly supply with necessary electric power to heater element, or broken string and can't continue energising again.Therefore, in thermal printer, when long-term the use, be difficult to guarantee the reliability printed, thereby pursue the long lifetime of parts.

The utility model content

Given this utility model is planted situation and is made, even its purpose is to provide a kind of long-term serviceability also to be difficult for the thermal head that descends.And its purpose is through having this kind thermal head a kind of thermal printer of high reliability to be provided.

(being suitable for example 1) in order to solve above-mentioned problem, the thermal head of the utility model is characterised in that to possess: substrate; Along a plurality of heater elements that are set in the arrangement axle setting on the said substrate; Said heater element has heating resistor and single electrode that is connected with this heating resistor and total electrode; Said total electrode is connected with the total distribution that is configured in around said a plurality of heater element; Said total distribution has protuberance with a said zone that intersects of arranging at least, and this protuberance extends the side that is arranged to said substrate.

According to this structure; In protuberance; Because total distribution extends to the side of substrate; Even therefore reduce, also can guarantee conducting easily, thereby can suppress the decline of the current capacity of total distribution owing to the friction with print media makes the thickness (height of the normal direction of substrate) of total distribution.Therefore, even can provide a kind of long-term serviceability also to be difficult for the thermal head that descends.

(being suitable for example 2) is in the utility model; Preferably; Said substrate has matrix and planarization layer; This planarization layer is arranged on an interarea of said matrix, and comprises Si oxide or silicon nitride as forming material, and said protuberance has: first wiring layer that on said planarization layer, is provided with at least a portion; On said first wiring layer, be provided with, and be second wiring layer that forms material with silver with the mode of not joining with said planarization layer.

According to this structure, can improve the current capacity of total distribution effectively, and can suppress to contact with silicon compound the deterioration of second wiring layer that produces because of silver.Therefore, can form the thermal head of high reliability.

In order to solve above-mentioned problem, the thermal head of the utility model is characterised in that to possess (be suitable for example 3): substrate, and it has matrix and planarization layer, and this planarization layer is arranged on an interarea of said matrix, and comprises Si oxide or silicon nitride as forming material; A plurality of heater elements; Its said interarea side at said substrate is provided with along predefined arrangement axle; Said heater element has heating resistor and single electrode that is connected with this heating resistor and total electrode; Said total electrode is connected with the total distribution that is configured in around said a plurality of heater element; Extending with a said arrangement zone that intersects at least of said total distribution is arranged to the end of said substrate, and has: first wiring layer that on said planarization layer, is provided with at least a portion; On said first wiring layer, be provided with, and be second wiring layer that forms material with silver with the mode of not joining with said planarization layer.

According to this structure; Because total distribution extends to the end of substrate; Even therefore reduce, also can guarantee conducting easily, thereby can suppress the decline of the current capacity of total distribution owing to the friction with print media makes the thickness (height of the normal direction of substrate) of total distribution.

And total distribution becomes double-decker, and second wiring layer separates with planarization layer through first wiring layer, therefore can improve the current capacity of total distribution effectively, and can suppress to contact with silicon compound because of silver the deterioration of second wiring layer that produces.

Thus, even can provide a kind of long-term serviceability also to be difficult for the thermal head that descends.

(being suitable for example 4) in the utility model, preferably, said first wiring layer is to form material with the gold.

According to this structure, can form the total distribution that current capacity can be improved effectively and suppress the deterioration of second wiring layer.

(being suitable for example 5) in addition, the thermal printer of the utility model is characterised in that to have: above-mentioned thermal head; With said thermal head opposite disposed, and said thermal head between clamping thermal sensitivity print media and carry the platen of this print media.

According to this structure, thermal printer is owing to possess above-mentioned thermal head, so reliability is high.

Description of drawings

Fig. 1 is the key diagram of the thermal printer of this embodiment of expression.

Fig. 2 is the enlarged drawing of the printing portion that has of printing mechanism portion.

Fig. 3 is the stereoscopic figure of thermal head.

Fig. 4 is the vertical view of head substrate of the thermal head of first embodiment.

Fig. 5 be first embodiment thermal head to looking cutaway view.

Fig. 6 is the vertical view of head substrate of the thermal head of second embodiment.

Fig. 7 be second embodiment thermal head to looking cutaway view.

The specific embodiment

Below, with reference to accompanying drawing, the thermal head of this embodiment is described and is possessed the thermal printer of this thermal head.Need to prove, in following whole accompanying drawing, in order to observe easily accompanying drawing, and appropriate change the size of each inscape, ratio etc.

(about thermal printer)

At first, with reference to Fig. 1 and Fig. 2, thermal printer is described.Fig. 1 is the key diagram of the thermal printer 100 of this embodiment of expression, in detail, is that the major part of expression thermal printer 100 is the side view cutaway drawing of the side-looking section of printing mechanism portion 300.Fig. 2 is the enlarged drawing of the printing portion 70 that has of printing mechanism portion 300.

As shown in Figure 1, printing mechanism portion 300 possesses: the main body frame 60 of accommodating roll web R; Cover framework 10; Roll web support 30; Be provided with the thermal head 1 of the utility model, the printing portion 70 that the heat-sensitive paper S that pulls out from roll web support 30 is printed; Be arranged on the paper feeding direction rear of printing portion 70, will be by the paper cutting part 20 of the printing unit's cut-out according to the rules of the heat-sensitive paper S after printing.

Heat-sensitive paper S has the printing surface that is made up of the chromonic layer that maintains colour former through base-material etc.In thermal printer 100, heat-sensitive paper S is outer surface with the printing surface, is accommodated in inside as the roll web R of coiling tubular, and is pulled out successively, carries and is printed to printing portion 70 (thermal head 1) simultaneously.

Below, along the paper feeding direction of heat-sensitive paper S, each formation of printing mechanism portion 300 is described.Main body frame 60 forms the box that has peristome up, and the mode with the peristome of main body covered framework 60 above main body frame 60 is provided with cover framework 10.And, be provided with roll web support 30 in the inside of main body frame 60.

It is that the center opens and closes freely that cover framework 10 is mounted to the fulcrum 68 that is provided with the end above main body frame 60.Be provided with closing cover at cover framework 10 and be used to avoid the circular-arc cap 15 that contacts with roll web R during framework 10.This cap 15 change thermal printer 100 angle is set the time, that is, and during for example vertical putting, also as the retaining member performance function of bearing roll web R.

Roll web support 30 is formed by resin etc.Roll web support 30 has the roughly circular-arc depression suitable with the maximum gauge of roll web R at central portion, and the mode of protruding down with roughly circular-arc depression is installed in the bottom of main body frame 60.

When the roll web support 30 configure volumes coil paper R that so are provided with, roll web support 30 remains rotation freely with roll web R.Simultaneously, the two sides of the inboard of main body frame 60 are as the side guiding portion of roll web R performance function, the moving of the width of restriction roll web R.

As shown in Figure 2, printing portion 70 possesses: thermal head 1; With thermal head 1 opposite disposed, and the platen 71 that heat-sensitive paper S and thermal head 1 are connected airtight; Keep thermal head 1, and to the maintaining body 77 of thermal head 1 to the platen 71 direction application of forces.

Thermal head 1 has: the head substrate (substrate) 110 that is provided with a plurality of heater elements that are used for heat-sensitive paper S is printed; Connect airtight setting with head substrate 110, the heat sink 106 that the heat that lodges in head substrate 110 is dispelled the heat; A bolster 102 that is provided with in the side of heat sink 106; Be connected with head substrate 110 and the FPC108 of input signal.Details about thermal head 1 is narrated in the back.

Platen 71 forms columnar roller shape through elastic components such as rubber, is supported to rotating by cover framework 10 via platen bearing 73.And, be provided with the paper advance mechanism (not shown) that is used for 71 rotations of drive pressure paper spool in the side of main body frame 60, under the state of having closed cover framework 10, this paper advance mechanism is connected with platen bearing 73,71 rotations of drive pressure paper spool.Thus, when platen 71 rotations, heat-sensitive paper S is carried by the downstream to transport path D.

Maintaining body 77 has the spring 75 that a pressing plate 72 and an end are fixed in the back side butt of a pressing plate 72 and the other end and thermal head 1, is arranged on the notch 62 that is formed at main body frame 60 with removable mode.

Be fixed in the spring 75 of a pressing plate 72 and the back side butt of thermal head 1, to thermal head 1 towards the platen 71 direction application of forces.Thus, thermal head 1 is pushed heat-sensitive paper S from printing surface S1 side towards the direction of platen 71.On the other hand, platen 71 from the back side S2 side heat-sensitive paper S is pushed towards the direction of thermal head 1.Thus, heat-sensitive paper S is clamped between thermal head 1 and the platen 71.Heat-sensitive paper S is printed by thermal head 1, and the heat-sensitive paper S after the printing is transported to the downstream of transport path D under the effect of platen 71 rotations.

Return Fig. 1, paper cutting part 20 have movable sword 21, with the fixed blade 24 of this movable sword 21 opposite disposed, the fixed blade cover 25 of covering fixed blade 24, and be arranged at the paper delivery G that the heat-sensitive paper S after the printing is passed through.In paper cutting part 20, be crossed as scissor through making movable sword 21 with fixed blade 24, and heat-sensitive paper S is cut off.

The summary that the thermal printer 100 of this embodiment has above that kind constitutes.

(about thermal head)

Next, with reference to Fig. 3, thermal head 1 is described.Fig. 3 is the stereoscopic figure of thermal head.

As shown in Figure 3, thermal head 1 has head substrate 110, heat sink 106, a bolster 102, driver IC 120 and FPC108.

Head substrate 110 is overlooked and is long rectangular shape.One of width on an interarea of head substrate 110 distolaterally is formed with a plurality of heater elements 145, and these a plurality of heater elements 145 are arranged and formed heater element row 145a along the length direction of head substrate 110.And, be equipped with a plurality of driver ICs 120 that heater element 145 is driven abreast with heater element row 145a.

Heat sink 106 forms through metal materials such as aluminium being drawn processing, and head substrate 110 is fixed on the locking surface 106a of heat sink 106.As the fixing means of head substrate 110, for example, can adopt the such method of stickup of having used double-sided belt.

In heat sink 106, the end in the side of the heater element row 145a that is provided with head substrate 110 is formed with lead-in chamfered portion 104 on the length direction of heat sink 106.When cover framework 10 shown in Figure 1 was closed, this lead-in chamfered portion 104 slided platen 71 and it is directed to the position of regulation.At this moment, the inclination of lead-in chamfered portion 104 has the angle that can not make the regulation that platen 71 and head substrate 110 bump.And the height that the end of head substrate 110 sides of lead-in chamfered portion 104 is set the normal direction that makes locking surface 106a for is roughly the same with the height of the head substrate 110 that is attached to locking surface 106a.

Bolster 102 is columned round pins, is pressed into the hole portion that the side surface part about heat sink 106 is provided with.

(about head substrate)

(first embodiment)

At this,, the head substrate 110 of first embodiment is described with reference to Fig. 4 and Fig. 5.Fig. 4 is the vertical view of head substrate of the thermal head of first embodiment, and Fig. 4 (a) is the head substrate overall diagram, and Fig. 4 (b) is the partial enlarged drawing of Fig. 4 (a).Fig. 5 be first embodiment thermal head to looking cutaway view, in detail, be Fig. 4 (b) line segment A-A to looking cutaway view.

Shown in Fig. 4 (a), on head substrate 110, the edge (a lateral margin 110a) of lead-in chamfered portion 104 sides in Fig. 3 is provided with banded heater (heating resistor) 140 in the longitudinal direction.

In addition, be provided with at another lateral margin 110b of head substrate 110 and be used for a plurality of external connection terminals 112 of being connected with external electric.And at the circumference of head substrate 110, banded total Wiring pattern (total distribution) 114 forms the frame shape.The both ends that should have Wiring pattern 114 are connected with external connection terminals 112 at another lateral margin 110b.And, the overlapping setting in end of total Wiring pattern 114 and heater 140.

And in the substantial middle of head substrate 110, the IC installation portion 120a of mounting driver IC 120 disposes with the heater 140 of band shape according to each driver IC 120 side by side.

Shown in Fig. 4 (b), be formed with a plurality of to the total electrode 114a of the broach shape of the face center direction extension of head substrate 110 from total Wiring pattern 114.Total electrode 114a is arranged in a crossed manner with banded heater 140.

In addition, the central portion at head substrate 110 is provided with a plurality of single electrodes 118.Each single electrode 118 is arranged in a crossed manner with banded heater 140, and the one of which end gets between the total electrode 114a of broach shape.The other end of each single electrode 118 extends to the IC installation portion 120a that on head substrate 110, is provided with, and is formed with the electronic pads 115 as mounting terminal in the end.

On the other hand, another lateral margin 110b side at the head substrate 110 of IC installation portion 120a is formed with the electronic pads 116 as mounting terminal.This electronic pads 116 and external connection terminals 112 conductings shown in Fig. 4 (a).

This external connection terminals 112 is connected with the main circuit substrate (not shown) that constitutes control part, and this control part is equipped with FPC108 shown in Figure 3 and controls thermal printer 100 via FPC108.And driver IC 120 shown in Figure 3 is installed on electronic pads 115, electronic pads 116, and never the control part of illustrated thermal printer is transfused to input signal, drive currents etc. such as print data.

Through these total electrode 114a that replace the broach shape of arranging adjacent one another are and single electrode 118 and the heater 140 separated by total electrode 114a and single electrode 118, limit heater element 145.That is, when selecteed single electrode 118 was connection by driver IC 120 drivings, electric current flow through the heater 140 by the total electrode 114a area surrounded of single electrode 118 and broach shape, and this part is as heater element 145 performance functions.Limited heater element 145 like this serves as to arrange axle with the heater 140 of band shape, along the bearing of trend configuration of heater 140.

In addition, shown in Fig. 4 (b), the following protuberance 114x that gives prominence to from the side 110c of head substrate 110 is overlooked in becoming with the overlapping part of regional AR of the total Wiring pattern 114 of thermal head 1, and wherein, regional AR is the zone that platen 71 contacts with thermal head 1.

Fig. 5 is the cutaway view of thermal head 1, is the cutaway view that contains protuberance 114x.Thermal head 1 has head substrate 110, total electrode 114a and single electrode 118, total Wiring pattern 114, heater 140, first diaphragm 170, second diaphragm 180.

Head substrate 110 has: the matrix 110x that ceramic materials such as use aluminium oxide ceramics form; The planarization layer 110y that on the interarea of matrix 110x, is provided with.Planarization layer 110y is provided with for the concave-convex surface planarization that makes matrix 110x.Planarization layer 110y uses Si oxide or silicon nitride (inorganic silicon compounds such as silica, silicon oxynitride, silicon nitride) to form.

On planarization layer 110y, be provided with total electrode 114a and single electrode 118, heater 140, this heater 140 and total electrode 114a, single electrode 118 and total Wiring pattern 114 overlapping settings.And, be provided with the total Wiring pattern 114 that extends to the side of matrix 110x from the end of the upper surface of planarization layer 110y.

Total Wiring pattern 114 has: extend first wiring layer 150 of the end that is set to matrix 110x from the end of the upper surface of planarization layer 110y; Be arranged on first wiring layer 150, and extend second wiring layer 160 of the side (the side 110c of head substrate 110) that is set to matrix 110x from the end of the upper surface of planarization layer 110y.

First wiring layer 150 uses gold (Au) as forming materials, is arranged on the layer identical with total electrode 114a and single electrode 118.

Second wiring layer 160 is arranged at first wiring layer 150 through range upon range of, and has the function of the resistance value that reduces total Wiring pattern 114 integral body.The formation material of second wiring layer 160 uses silver (Ag).

In addition, total Wiring pattern 114 is this kind stepped construction owing to becoming, and compares with structure in the past, and thermal capacity increases.Therefore, total Wiring pattern 114 is accumulated the heat that is produced by heater element 145, also can expect to carry out the auxiliary effect of intensification of heater element 145.

That is, in thermal head 1, in the time of will switching to dormant state to the energising of heater element 145, the heating of heater element 145 stops, and the heat that remains in heater element 145 is promptly by heat sink 106 heat radiations.Yet; When thermal head 1 possesses the big distribution of the such thermal capacity of the total Wiring pattern 114 of this embodiment; Can therefore when the heating again of heater element 145, can this accumulation of heat be used in the auxiliary of heating in advance to the accumulation of heat on every side that is not the heater element 145 of print area.

First diaphragm 170 and second diaphragm 180 all are inoranic membranes, have works such as the total Wiring pattern 114 of protection, heater 140 and avoid receiving the function with the caused damage of friction of heat-sensitive paper S.These first diaphragms 170 and second diaphragm 180 are given electric conductivity in order to suppress the frictional electrification with heat-sensitive paper S and can add conductive material, remove.

In the thermal head 1 of this kind structure, also be difficult for such effect that descends even can access the long-term performance of total Wiring pattern 114 of using.

All the time, total Wiring pattern 114 becomes the double-decker of first wiring layer 150 and second wiring layer 160.Therefore, as shown in Figure 5, the part that is provided with total Wiring pattern 114 is more outstanding to the normal direction of the upper surface of head substrate 110 than the part of total electrode 114a of being provided with of other and single electrode 118.

Therefore, clamping heat-sensitive paper S and when printing between thermal head 1 and platen 71 in the zone (the regional AR of Fig. 4 (b)) that platen 71 contacts with thermal head 1, is applied in the pressure higher than other part with total Wiring pattern 114 overlapping parts.Therefore, receive the caused damage of the friction with heat-sensitive paper S when printing with the overlapping part of total Wiring pattern 114 easily consumingly than other part, when the damage progress, total Wiring pattern 114 possibly break.

In addition; When making platen 71; The surface of cutting the platen 71 and cross section of platen 71 is adjusted into circular, but because platen 71 uses elastomeric materials to form, so the platen after the Adjusting Shape 71 is the coiling shape; That is, lean on the end of platen 71 more and radius increases more easily.When using the platen 71 of this kind shape, become strong more easily with the damage of the overlapping part of total Wiring pattern 114.

Yet in the thermal head 1 of this embodiment, at protuberance 114x place, second wiring layer 160 of total Wiring pattern 114 is around going into to the side 110c of head substrate 110 to form.Therefore, even make progress owing to the friction with heat-sensitive paper S makes the damage of total Wiring pattern 114, also can guarantee conducting, the current capacity of total Wiring pattern 114 is difficult for descending.

And, when the formation material of second wiring layer 160 promptly the formation material of silver and planarization layer 110y be inorganic silicon compound when coming in contact, the interface deterioration is being peeled off at the interface easily.Yet in this embodiment, first wiring layer 150 is arranged between the planarization layer 110y and second wiring layer 160, and the planarization layer 110y and second wiring layer 160 are separated with discontiguous mode, therefore can suppress the generation of this kind unfavorable condition.

Therefore, though more than thermal head 1 long-term use of such structure, the current capacity of total Wiring pattern 114 also is difficult for descending, reliability uprises.

In addition, more than the thermal printer 100 of such structure owing to possess above-mentioned thermal head 1, so reliability is high.

Need to prove that in this embodiment, protuberance 114x has first wiring layer 150 and second wiring layer 160 at least, even but only form the effect that the caused performance of wearing and tearing of the total Wiring pattern 114 that also can be inhibited descends by arbitrary layer.

In addition, in this embodiment, explained that the part of the 110c in the side is provided with the situation of protuberance 114x, but also can be in the side whole of 110c protuberance 114x is set.

(about head substrate)

(second embodiment)

At this,, the head substrate 110 of second embodiment is described with reference to Fig. 6 and Fig. 7.Fig. 6 is the vertical view of head substrate of the thermal head of second embodiment, and Fig. 6 (a) is the head substrate overall diagram, and Fig. 6 (b) is the partial enlarged drawing of Fig. 6 (a).Fig. 7 be second embodiment thermal head to looking cutaway view, in detail, be Fig. 6 (b) line segment A-A to looking cutaway view.Need to prove that to the structure identical with first embodiment etc., mark identical symbol, part is omitted repeat specification.

Shown in Fig. 6 (a), on head substrate 110, the edge (a lateral margin 110a) of lead-in chamfered portion 104 sides in Fig. 3 is provided with banded heater (heating resistor) 140 in the longitudinal direction.

In addition, be provided with at another lateral margin 110b of head substrate 110 and be used for a plurality of external connection terminals 112 of being connected with external electric.And at the circumference of head substrate 110, banded total Wiring pattern (total distribution) 114 forms the frame shape.The both ends that should have Wiring pattern 114 are connected with external connection terminals 112 at another lateral margin 110b.And, the overlapping setting in end of total Wiring pattern 114 and heater 140.

And in the substantial middle of head substrate 110, the IC installation portion 120a of mounting driver IC 120 disposes with the heater 140 of band shape according to each driver IC 120 side by side.

Shown in Fig. 6 (b), be formed with a plurality of to the total electrode 114a of the broach shape of the face center direction extension of head substrate 110 from total Wiring pattern 114.Total electrode 114a is arranged in a crossed manner with banded heater 140.

In addition, the central portion at head substrate 110 is provided with a plurality of single electrodes 118.Each single electrode 118 is arranged in a crossed manner with banded heater 140, and the one of which end gets between the total electrode 114a of broach shape.The other end of each single electrode 118 extends to the IC installation portion 120a that on head substrate 110, is provided with, and is formed with the electronic pads 115 as mounting terminal in the end.

On the other hand, another lateral margin 110b side at the head substrate 110 of IC installation portion 120a is formed with the electronic pads 116 as mounting terminal.This electronic pads 116 and external connection terminals 112 conductings shown in Fig. 6 (a).

This external connection terminals 112 is connected with the main circuit substrate (not shown) that constitutes control part, and this control part is equipped with FPC108 shown in Figure 3 and controls thermal printer 100 via FPC108.And driver IC 120 shown in Figure 3 is installed on electronic pads 115, electronic pads 116, and never the control part of illustrated thermal printer is transfused to input signal, drive currents etc. such as print data.

Through these total electrode 114a that replace the broach shape of arranging adjacent one another are and single electrode 118 and the heater 140 separated by total electrode 114a and single electrode 118, limit heater element 145.That is, when selecteed single electrode 118 was connection by driver IC 120 drivings, electric current flow through the heater 140 by the total electrode 114a area surrounded of single electrode 118 and broach shape, and this part is as heater element 145 performance functions.Limited heater element 145 like this serves as to arrange axle with the heater 140 of band shape, along the bearing of trend configuration of heater 140.

In addition, shown in Fig. 6 (b), the total Wiring pattern 114 of thermal head 1 extend below the side 110c that is arranged to head substrate 110 with the overlapping part of regional AR overlooking, wherein, regional AR is the zone that platen 71 contacts with thermal head 1.

Fig. 7 is the cutaway view of thermal head 1.Thermal head 1 has head substrate 110, total electrode 114a and single electrode 118, total Wiring pattern 114, heater 140, first diaphragm 170, second diaphragm 180.

Head substrate 110 has: the matrix 110x that ceramic materials such as use aluminium oxide ceramics form; The planarization layer 110y that on the interarea of matrix 110x, is provided with.Planarization layer 110y is provided with for the concave-convex surface planarization that makes matrix 110x.Planarization layer 110y uses Si oxide or silicon nitride (inorganic silicon compounds such as silica, silicon oxynitride, silicon nitride) to form.

On planarization layer 110y, be provided with total electrode 114a and single electrode 118, heater 140, this heater 140 and total electrode 114a, single electrode 118 and total Wiring pattern 114 overlapping settings.And, be provided with the total Wiring pattern 114 that extends to the side of matrix 110x from the end of the upper surface of planarization layer 110y.

Total Wiring pattern 114 has: extend first wiring layer 150 of the end that is set to matrix 110x from the end of the upper surface of planarization layer 110y; Be arranged on first wiring layer 150, and extend second wiring layer 160 of the side (the side 110c of head substrate 110) that is set to matrix 110x from the end of the upper surface of planarization layer 110y.

First wiring layer 150 uses gold (Au) as forming materials, is arranged on the layer identical with total electrode 114a and single electrode 118.

Second wiring layer 160 is arranged at first wiring layer 150 through range upon range of, and has the function of the resistance value that reduces total Wiring pattern 114 integral body.The formation material of second wiring layer 160 uses silver (Ag).

In addition, total Wiring pattern 114 is this kind stepped construction owing to becoming, and compares with structure in the past, and thermal capacity increases.Therefore, total Wiring pattern 114 is accumulated the heat that is produced by heater element 145, also can expect to carry out the auxiliary effect of intensification of heater element 145.

That is, in thermal head 1, in the time of will switching to dormant state to the energising of heater element 145, the heating of heater element 145 stops, and the heat that remains in heater element 145 is promptly by heat sink 106 heat radiations.Yet; When thermal head 1 possesses the big distribution of the such thermal capacity of the total Wiring pattern 114 of this embodiment; Can therefore when the heating again of heater element 145, can this accumulation of heat be used in the auxiliary of heating in advance to the accumulation of heat on every side that is not the heater element 145 of print area.

First diaphragm 170 and second diaphragm 180 all are inoranic membranes, have works such as the total Wiring pattern 114 of protection, heater 140 and avoid receiving the function with the caused damage of friction of heat-sensitive paper S.These first diaphragms 170 and second diaphragm 180 are given electric conductivity in order to suppress the frictional electrification with heat-sensitive paper S and can add conductive material, remove.

In the thermal head 1 of this kind structure, also be difficult for such effect that descends even can access the long-term performance of total Wiring pattern 114 of using.

All the time, total Wiring pattern 114 becomes the double-decker of first wiring layer 150 and second wiring layer 160.Therefore, as shown in Figure 7, the part that is provided with total Wiring pattern 114 is more outstanding to the normal direction of the upper surface of head substrate 110 than the part of total electrode 114a of being provided with of other and single electrode 118.

Therefore, clamping heat-sensitive paper S and when printing between thermal head 1 and platen 71 in the zone (the regional AR of Fig. 6 (b)) that platen 71 contacts with thermal head 1, is applied in the pressure higher than other part with total Wiring pattern 114 overlapping parts.Therefore, receive the caused damage of the friction with heat-sensitive paper S when printing with the overlapping part of total Wiring pattern 114 easily consumingly than other part, when the damage progress, total Wiring pattern 114 possibly break.

In addition; When making platen 71; The surface of cutting the platen 71 and cross section of platen 71 is adjusted into circular, but because platen 71 uses elastomeric materials to form, so the platen after the Adjusting Shape 71 is the coiling shape; That is, lean on the end of platen 71 more and radius increases more easily.When using the platen 71 of this kind shape, become strong more easily with the damage of the overlapping part of total Wiring pattern 114.

Yet in the thermal head 1 of this embodiment, the part of total Wiring pattern 114 extends to the end of head substrate 110 and forms.Therefore, even make progress owing to the friction with heat-sensitive paper S makes the damage of total Wiring pattern 114, also can guarantee conducting easily, the current capacity of total Wiring pattern 114 is difficult for descending.

And, when the formation material of second wiring layer 160 promptly the formation material of silver and planarization layer 110y be inorganic silicon compound when coming in contact, the interface deterioration is being peeled off at the interface easily.Yet in this embodiment, first wiring layer 150 is arranged between the planarization layer 110y and second wiring layer 160, and the planarization layer 110y and second wiring layer 160 are separated with discontiguous mode, therefore can suppress the generation of this kind unfavorable condition.

Therefore, though more than thermal head 1 long-term use of such structure, the current capacity of total Wiring pattern 114 also is difficult for descending, reliability uprises.

In addition, more than the thermal printer 100 of such structure owing to possess above-mentioned thermal head 1, so reliability is high.

Need to prove, in this embodiment, explained that the part extension of total Wiring pattern 114 is arranged to the situation of the end of head substrate 110; But be not limited thereto; For example, also can extend the end that is arranged to head substrate 110 at the complete cycle of total Wiring pattern 114.

More than, with reference to description of drawings the example preferred embodiment of the utility model, but the utility model is not defined as above-mentioned example certainly.Each shape of each structural elements of in above-mentioned example, representing or combination etc. are examples, can in the scope of the purport that does not break away from the utility model, carry out various changes based on designing requirement etc.

Claims (6)

1. thermal head is characterized in that possessing:
Substrate;
Along a plurality of heater elements that are set in the arrangement axle setting on the said substrate,
Said heater element has heating resistor and single electrode that is connected with this heating resistor and total electrode,
Said total electrode is connected with the total distribution that is configured in around said a plurality of heater element,
Said total distribution has protuberance with a said zone that intersects of arranging at least, and this protuberance extends the side that is arranged to said substrate.
2. thermal head according to claim 1 is characterized in that,
Said substrate has matrix and planarization layer, and this planarization layer is arranged on an interarea of said matrix, and comprises Si oxide or silicon nitride as forming material,
Said protuberance has:
On said planarization layer, be provided with first wiring layer of at least a portion;
On said first wiring layer, be provided with, and be second wiring layer that forms material with silver with the mode of not joining with said planarization layer.
3. thermal head according to claim 2 is characterized in that,
Said first wiring layer is to form material with the gold.
4. thermal head is characterized in that possessing:
Substrate, it has matrix and planarization layer, and this planarization layer is arranged on an interarea of said matrix, and comprises Si oxide or silicon nitride as forming material;
A plurality of heater elements, its said interarea side at said substrate is provided with along predefined arrangement axle,
Said heater element has heating resistor and single electrode that is connected with this heating resistor and total electrode,
Said total electrode is connected with the total distribution that is configured in around said a plurality of heater element,
Extending with a said arrangement zone that intersects at least of said total distribution is arranged to the end of said substrate, and has: first wiring layer that on said planarization layer, is provided with at least a portion; On said first wiring layer, be provided with, and be second wiring layer that forms material with silver with the mode of not joining with said planarization layer.
5. thermal head according to claim 4 is characterized in that,
Said first wiring layer is to form material with the gold.
6. thermal printer is characterized in that having:
Each described thermal head in the claim 1 to 5;
With said thermal head opposite disposed, and said thermal head between clamping thermal sensitivity print media and carry the platen of this print media.
CN 201220117743 2011-03-29 2012-03-26 Temperature-sensitive head and temperature-sensitive printer CN202623519U (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011071747A JP5765003B2 (en) 2011-03-29 2011-03-29 Thermal head and thermal printer
JP2011-071748 2011-03-29
JP2011-071747 2011-03-29
JP2011071748A JP5765004B2 (en) 2011-03-29 2011-03-29 Thermal head and thermal printer

Publications (1)

Publication Number Publication Date
CN202623519U true CN202623519U (en) 2012-12-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220117743 CN202623519U (en) 2011-03-29 2012-03-26 Temperature-sensitive head and temperature-sensitive printer

Country Status (1)

Country Link
CN (1) CN202623519U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106827824A (en) * 2012-12-28 2017-06-13 京瓷株式会社 Thermal head

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106827824A (en) * 2012-12-28 2017-06-13 京瓷株式会社 Thermal head

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