CN202608256U - Temperature-sensitive head and temperature-sensitive printer - Google Patents
Temperature-sensitive head and temperature-sensitive printer Download PDFInfo
- Publication number
- CN202608256U CN202608256U CN 201220097613 CN201220097613U CN202608256U CN 202608256 U CN202608256 U CN 202608256U CN 201220097613 CN201220097613 CN 201220097613 CN 201220097613 U CN201220097613 U CN 201220097613U CN 202608256 U CN202608256 U CN 202608256U
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- Prior art keywords
- bus
- salient pole
- row
- driver
- electronic pads
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Abstract
The utility model provides a temperature-sensitive head and a temperature-sensitive printer. The temperature-sensitive head provided in the utility model comprises a head substrate having a first bus formed; a driver IC (120) having a second bus (139) formed and installed on the head substrate; and a connecting member (135a) making the first bus and the second bus (139) connected. By making a part (the second bus (139)) of the buses formed on the driver IC 120, the width of the bus (the first bus) formed on the head substrate can be reduced. In this way, the miniaturization of the driver IC (120) configured in a way to span the first bus is achieved. The miniaturization of the temperature-sensitive head is further achieved.
Description
Technical field
The utility model relates to thermal head and thermal printer.
Background technology
A kind of as printing equipment, known have a thermal printer.Thermal printer has the thermal head (for example, with reference to patent documentation 1,2) that heater element linearly disposes.Be disposed at heater element optionally heating of thermal head through energising.And this heat energy optionally reacts with the developer that is contained in the heat sensitive paper, thereby on heat sensitive paper, prints various information.This mode of printing is called as sensible heat colour developing mode.
[prior art document]
[patent documentation]
[patent documentation 1] japanese kokai publication hei 9-39282 communique
[patent documentation 2] japanese kokai publication hei 5-261957 communique
Thermal head possesses: head substrate, be arranged in a plurality of heater elements on the head substrate, be used to drive a plurality of driver ICs of a plurality of heater elements.A plurality of driver ICs are arranged along the orientation of a plurality of heater elements.Be connected with the FPC (flexible circuit board) that is used for supplying with the driving signal to driver IC at opposition side across driver IC and heater element.Be formed with first salient pole row from the FPC input drive signal on 1 limit of the FPC of driver IC side.Be formed with second salient pole row to the heater element output drive signal on 1 limit of the heater element side of driver IC.
On head substrate, the orientation of bus such as data wire and a plurality of driver ICs is extended abreast.A plurality of driver ICs are installed on the head substrate with the mode upside-down mounting (flip chip) that first salient pole row and second salient pole are listed as across bus.Therefore, the size of the driver IC intervals of second salient pole row (first salient pole row with) can not be less than bus, thereby has the problem that has difficulties aspect the miniaturization of the miniaturization of driver IC even thermal head.
The utility model content
The purpose of the utility model is to provide a kind of small-sized thermal head and thermal printer.
The thermal head of the utility model possesses: head substrate, and it is formed with first bus; Driver IC, it is formed with second bus and is installed on the said head substrate; Connecting elements, it is connected said first bus with said second bus.
Constitute according to this,, therefore can reduce to be formed on the width of the bus (first bus) on the head substrate because the part (second bus) of bus is formed on the driver IC.Thus, the miniaturization of the driver IC of first bus configuration can be realized striding, and then the miniaturization of thermal head can be realized.
Second salient pole row that first salient pole row that are made up of a plurality of first salient poles that are arranged in parallel with said second bus can be set on said driver IC and be made up of a plurality of second salient poles that are arranged in parallel with said second bus, said first salient pole row and said second salient pole are listed as across the said second bus arranged opposite.
Constitute according to this, can on the large tracts of land between first salient pole row and second salient pole row, form second bus.
Second electronic pads row that first electronic pads row that are made up of a plurality of first electronic padses that are arranged in parallel with said first bus can be set on said head substrate and constitute by a plurality of second electronic padses that are arranged in parallel with said first bus; Said first electronic pads row and said second electronic pads are listed as across the said first bus arranged opposite; Said first electronic pads row are connected with said first salient pole row, and said second electronic pads row are connected with said second salient pole row.
Constitute according to this, can on the large tracts of land between first electronic pads row and second electronic pads row, form first bus.
Said first salient pole, said second salient pole and said connecting elements possess the resin projection and cover the wiring film on the surface of said resin projection.
Constitute according to this, can form first salient pole, second salient pole and connecting elements through common manufacturing procedure.
The said wiring film of the said wiring film of said first salient pole, the said wiring film of said second salient pole and said connecting elements can be by forming with the identical conductive material of said second bus.
Constitute according to this, can form second bus, first salient pole, second salient pole and connecting elements through common manufacturing procedure.
Said first electronic pads and said second electronic pads can be by forming with the identical conductive material of said first bus.
Constitute according to this, can form said first bus, first electronic pads and second electronic pads through common manufacturing procedure.
The thermal printer of the utility model possesses the thermal head of the utility model.
Constitute according to this, a kind of small-sized thermal printer that possesses small-sized thermal head can be provided.
Description of drawings
Fig. 1 is that the major part of thermal printer is the side view cutaway drawing of printing mechanism portion.
Fig. 2 is the enlarged drawing of the Printing Department that has of printing mechanism portion.
Fig. 3 is the stereoscopic figure of thermal head.
Fig. 4 is the vertical view of the head substrate of thermal head.
Fig. 5 is the figure of the structure of explanation driver IC.
Fig. 6 is the upward view of driver IC.
The specific embodiment
Below, with reference to Fig. 1～Fig. 6, the thermal head of this embodiment is described and is possessed the thermal printer of this thermal head.Need to prove, in following whole accompanying drawings, in order easily to observe accompanying drawing appropriate change the size of each inscape, ratio etc.Need to prove that in Fig. 1～Fig. 6, directions X is the width of the heat sensitive paper that is printed, the Z direction is the paper feeding direction of the heat sensitive paper at temperature-sensitive head place, and the Y direction is the direction with directions X and Z direction quadrature.
Fig. 1 is the key diagram of the thermal printer 100 of this embodiment of expression, is that the major part of expression thermal printer 100 is the side view cutaway drawing of the side-looking section of printing mechanism portion 300.Fig. 2 is the enlarged drawing of the Printing Department 70 that has of printing mechanism portion 300.
As shown in Figure 1, printing mechanism portion 300 possesses: main body frame 60, and it accommodates roll web R; Cover framework 10; Roll web support 30; Printing Department 70, it is provided with the thermal head 1 of the utility model, and the heat sensitive paper S that pulls out from roll web support 30 is printed; Paper cutting part 20, it is arranged on the paper feeding direction rear of Printing Department 70, and the printing unit according to the rules of the heat sensitive paper S after being printed is cut off.
Heat sensitive paper S has the printing surface that is made up of the color layer that maintains developer through binding agent etc.In thermal printer 100, heat sensitive paper S is outer surface with the printing surface, and it is accommodated in inside as the roll web R of coiling tubular, and is pulled out successively and carry and be printed to Printing Department 70 (thermal head 1) simultaneously.
Below, along the paper feeding direction of heat sensitive paper S, each component part of printing mechanism portion 300 is described.
During configure volumes coil paper R, roll web support 30 remains rotation freely with roll web R on the roll web support 30 that so is provided with.Simultaneously, the two sides of the inboard of main body frame 60 play a role as the side guiding portion of roll web R, restriction roll web R moving at width.
As shown in Figure 2, Printing Department 70 possesses: thermal head 1; Platen 71, itself and thermal head 1 opposite disposed and make heat sensitive paper S and thermal head 1 connects airtight; Maintaining body 77, its keep thermal head 1 and to thermal head 1 to the platen 71 direction application of forces.
Maintaining body 77 has that a pressing plate 72 and an end are fixed in a pressing plate 72 and spring 75 that the back side of the other end and thermal head 1 connects, and it is arranged on the notch 62 that is formed on the main body frame 60 with removable mode.
The back side of being fixed in spring 75 and thermal head 1 on the pressing plate 72 connects, to thermal head 1 towards the platen 71 direction application of forces.Thus, thermal head 1 is pushed heat sensitive paper S from printing surface S1 side to the direction of platen 71.On the other hand, platen 71 from the back side S2 side heat sensitive paper S is pushed towards the direction of thermal head 1.Thus, heat sensitive paper S is clamped between thermal head 1 and the platen 71.Heat sensitive paper S is by thermal head 1 printing, and the heat sensitive paper S after the printing is transported to the downstream of transport path D under the turning effort of platen 71.
Return Fig. 1, paper cutting part 20 have movable sword 21, with the fixed blade 24 of this movable sword 21 opposite disposed, the fixed blade cover 25 of covering fixed blade 24, and be provided with the paper delivery G that the heat sensitive paper S after the printing is passed through.In paper cutting part 20, through making movable sword 21 be crossed as scissor and heat sensitive paper S being cut off with fixed blade 24.
The thermal printer 100 of this embodiment has the schematic configuration of above that kind.
(about thermal head)
Next, with reference to Fig. 3 and Fig. 4 thermal head 1 is described.Fig. 3 is the stereoscopic figure of thermal head.Fig. 4 is the vertical view of the head substrate of thermal head, is the head substrate overall diagram (a), (b) is the partial enlarged drawing of (a).
As shown in Figure 3, thermal head 1 has heat sink 106, a bolster 102, the head substrate 110 as substrate, driver IC 120 and FPC108.Head substrate 110 is long rectangular shape, and the heater element row 145a that is made up of a plurality of heater elements 145 forms Z direction top in the drawings along its length.And, being equipped with a plurality of driver ICs 120 abreast with heater element row 145a, 120 pairs of heater elements 145 of said driver IC drive.Heat sink 106 draws material by aluminium etc. and forms, and head substrate 110 sticks on the locking surface 106a of heat sink 106 through double-sided adhesive band etc.
Above the Z direction of the head substrate 110 of heat sink 106, lead-in chamfered portion 104 forms on the whole length direction of heat sink 106.When cover framework 10 shown in Figure 1 was closed, this lead-in chamfered portion 104 slided platen 71 and it is directed to the position of regulation.At this moment, the inclination of lead-in chamfered portion 104 has the predetermined angular that platen 71 and head substrate 110 are bumped.And, the inclined-plane of lead-in chamfered portion 104 set for this lead-in chamfered portion 104 near the roughly the same height of the head substrate of setting up 110.Bolster 102 is columned round pins, and it is pressed in the hole portion that the side surface part about heat sink 106 is provided with.
Here, with reference to Fig. 4 head substrate is described.Shown in Fig. 4 (a), head substrate 110 is made up of aluminium oxide ceramics etc., and near the position of a lateral margin 110a alongst, the heater 140 of wire that the current conversion of energising is become heat is to be arranged to linearity by the state of diaphragm protection.Be provided with at another lateral margin 110b of head substrate 110 and be used for a plurality of external connection terminals 112 of being connected with external electric.Belt-like zone between a lateral margin 110a of heater 140 and head substrate 110 is formed with total Wiring pattern 114.The both ends that should have Wiring pattern 114 extend to external connection terminals 112 places.At the substantial middle place of head substrate 110, be provided with the IC installation portion 120a of mounting driver IC 120 by each driver IC 120, it is configured to the row shape arranged side by side with the heater of wire 140.
Shown in Fig. 4 (b), the total electrode 114a of broach shape extends from above-mentioned total Wiring pattern 114, and on the other hand, an end of individual electrode 118 extends and gets between the total electrode 114a of this broach shape.The other end of each individual electrode 118 extends to the IC installation portion 120a that is arranged on the head substrate 110, is formed with first electronic pads 115 as mounting terminal in this end.Electronic pads 115 with after the heater element 145 stated corresponding one by one.In this embodiment, for example each can make electric current flow through the individual electrode 118 corresponding with 128 heater element 145 to the driver IC of being installed 120.Therefore, electronic pads 115 forms more than 128 at least.Electronic pads 115 more than 128 forms linearity and constitutes the first electronic pads row 115a as first mounting terminal row.
Another lateral margin 110b side at the head substrate 110 of IC installation portion 120a is formed with second electronic pads 116 as mounting terminal.This second electronic pads 116 and external connection terminals 112 conductings shown in Fig. 4 (a).Need to prove that this external connection terminals 112 is connected with main circuit substrate (not shown), this main circuit substrate is equipped with FPC108 (with reference to Fig. 3), and constitutes the control part of controlling thermal printer 100 via FPC108.From the input signal of the control part of thermal printer 100 input printed data etc., drive current etc.Therefore, this electronic pads 116 is formed with for example dozens of.Dozens of electronic pads 116 forms linearity and constitutes the second electronic pads row 116a as second mounting terminal row.
Shown in Fig. 4 (b) double dot dash line, above-mentioned heater 140 forms with the total electrode 114a of above-mentioned broach shape and the individual electrode 118 that gets between the total electrode 114a with overlapping.Therefore, total electrode 114a and the individual electrode 118 through adjacent broach shape limits heater element 145.Promptly; When selected individual electrode 118 by after the driver IC 120 stated connect when driving; Electric current flows through the heater 140 in the zone that the total electrode 114a by this individual electrode 118 and broach shape surrounds, and this part plays a role as heater element 145.
(about driver IC)
At this,, driver IC is described with reference to Fig. 5 and Fig. 6.Fig. 5 is the figure of the structure of explanation driver IC, (a) is the cutaway view of splicing ear portion, (b) is the figure of the observed splicing ear portion from the bottom surface of driver IC, (c) is the stereogram from the observed splicing ear of the oblique upper portion of Fig. 5 (b).Fig. 6 is the upward view of driver IC.
Driver IC 120 is IC chips that drive circuit of for example on the silicon substrate 120b as semiconductor chip, suitably being formed with thermal head 1 etc. forms.On the movable surface 120c of driver IC 120, form the electrode 124 that constitutes by aluminium etc.This electrode 124 is arranged along the long leg of driver IC 120 and is formed.Surface at electrode 124 is formed with the diaphragms such as passivating film 126 that are made up of insulating materials such as SiN.And, through be formed on opening 127 on this diaphragm 126 constitute with electrode 124 with after the electrical connection section 132 that is connected of the wiring film 130 stated.
In addition, be formed with resin projection 131 on the surface of diaphragm 126.Through elastic resin materials such as polyimides being coated in the surface of diaphragm 126, and carrying out pattern such as photoetching and form and handle, thereby form said resin projection 131 continuously along the orientation (arrow directions X) of electrode 124.And resin projection 131 is in the zone that forms wiring film 130 and do not form between the zone of wiring film 130 and have difference of height.And the cross sectional shape of the f-f line of Fig. 5 (b) of resin projection 131 and orientation quadrature electrode 124 forms roughly semicircular in shape.
Need to prove; Material as resin projection 131; Except polyimide resin, also can use silicone modified polyimide resin, epoxy resin, silicone modified epoxy, acrylic resin, phenolic resins, silicone resin, modified polyimide resin, benzocyclobutene, polyphenyl and uh resins such as azoles.
And, be formed with wiring film 130 on the surface of resin projection 131.This wiring film 130 is through carrying out vapor deposition, sputter etc. and film forming to conductive metal such as Au, TiW, Cu, Ni, Pd, Al, Cr, Ti, W, NiV, lead-free solders, and forms to handle and form through being suitable for suitable pattern.And, the surface of the wiring film 130 of the substrate that further constitutes by Cu, Ni, Al etc. through covering such as plating Au etc., thus the conduction contact can be improved.Be shaped as the essentially rectangular shape under the overlooking of wiring film 130, it is crossed resin projection 131 from electrical connection section 132 and sets on the surface of diaphragm 126 of opposition side.
Through the resin projection 131 and wiring film 130 that constitutes as stated, on the diaphragm 126 of driver IC 120, form the cross section and be the roughly salient pole 135 as splicing ear of semicircular in shape.
As shown in Figure 6, this salient pole 135 forms the row shape along the long limit of the movable surface 120c of driver IC 120, thereby constitutes as first salient pole row 137a of first splicing ear row and the second salient pole row 137b that is listed as as second splicing ear.The first salient pole row 137a is made up of a plurality of salient poles 135; Said salient pole 135 comprises at least 128 first salient pole 135a as splicing ear that are electrically connected with electronic pads 115, this electronic pads 115 and 128 heater element 145 conductings shown in Figure 4.
The second salient pole row 137b is made up of the second salient pole 135b of the for example dozens of that is electrically connected with electronic pads 116 as splicing ear, external connection terminals shown in Figure 4 112 conductings of input signal such as this electronic pads 116 and input printed data and drive current etc.In other words, on the movable surface 120c of driver IC 120, be formed with the extremely different first salient pole row 137a and the second salient pole row 137b of salient pole 135a, 135b number of formation.
Here, in the thermal head 1 of this embodiment, like Fig. 4 (b) and shown in Figure 6, bus from data to a plurality of driver ICs 120 that supply with is divided into first bus 119 and second bus 139 and forms.First bus 119 is formed on the face that is formed with electronic pads 115,116 of head substrate 110, and second bus 139 is formed on the movable surface 120c of driver IC 120.
In the thermal head 1 of above-mentioned formation,, therefore can reduce to be formed on the width of the bus (first bus 119) on the head substrate 110 because the part (second bus 139) of bus is formed on the driver IC 120.Thus, the miniaturization of the driver IC 120 of first bus, 119 configurations can be realized striding, and then the miniaturization of thermal head 1 and thermal printer 100 can be realized.
Claims (7)
1. thermal head, it possesses:
Head substrate, it is formed with first bus;
Driver IC, it is formed with second bus and is installed on the said head substrate;
Connecting elements, it is connected said first bus with said second bus.
2. thermal head according to claim 1 is characterized in that,
Second salient pole row that said driver IC is provided with first salient pole row that are made up of a plurality of first salient poles that are arranged in parallel with said second bus and is made up of a plurality of second salient poles that are arranged in parallel with said second bus, said first salient pole row and said second salient pole are listed as across the said second bus arranged opposite.
3. thermal head according to claim 2 is characterized in that,
Second electronic pads row that said head substrate is provided with first electronic pads row that are made up of a plurality of first electronic padses that are arranged in parallel with said first bus and is made up of a plurality of second electronic padses that are arranged in parallel with said first bus; Said first electronic pads row and said second electronic pads are listed as across the said first bus arranged opposite; Said first electronic pads row are connected with said first salient pole row, and said second electronic pads row are connected with said second salient pole row.
4. thermal head according to claim 3 is characterized in that,
Said first salient pole, said second salient pole and said connecting elements possess the resin projection and cover the wiring film on the surface of said resin projection.
5. thermal head according to claim 4 is characterized in that,
The said wiring film of the said wiring film of said first salient pole, the said wiring film of said second salient pole and said connecting elements is by forming with the identical conductive material of said second bus.
6. thermal head according to claim 5 is characterized in that,
Said first electronic pads and said second electronic pads are by forming with the identical conductive material of said first bus.
7. thermal printer, it possesses each described thermal head in the claim 1～6.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-068217 | 2011-03-25 | ||
| JP2011068217A JP5834441B2 (en) | 2011-03-25 | 2011-03-25 | Thermal head and thermal printer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202608256U true CN202608256U (en) | 2012-12-19 |
Family
ID=47182476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220097613 Expired - Fee Related CN202608256U (en) | 2011-03-25 | 2012-03-15 | Temperature-sensitive head and temperature-sensitive printer |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5834441B2 (en) |
| CN (1) | CN202608256U (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59164158A (en) * | 1983-03-08 | 1984-09-17 | Ricoh Co Ltd | Thermal head |
| JP2503898Y2 (en) * | 1988-05-31 | 1996-07-03 | 京セラ株式会社 | Thermal head |
| JPH0480051A (en) * | 1990-07-23 | 1992-03-13 | Sharp Corp | Thermal head |
| JP2788562B2 (en) * | 1990-10-31 | 1998-08-20 | 京セラ株式会社 | Thermal head |
| JPH0611683A (en) * | 1992-06-25 | 1994-01-21 | Seiko Epson Corp | Mutural connection structure for integrated circuit, electrooptical device and electronic printing device |
| JP5375198B2 (en) * | 2008-03-07 | 2013-12-25 | セイコーエプソン株式会社 | Head substrate and thermal head substrate |
| JP5056579B2 (en) * | 2008-05-21 | 2012-10-24 | セイコーエプソン株式会社 | Thermal head manufacturing method, thermal head, and thermal printer |
| JP5003592B2 (en) * | 2008-05-21 | 2012-08-15 | セイコーエプソン株式会社 | Thermal head and thermal printer |
-
2011
- 2011-03-25 JP JP2011068217A patent/JP5834441B2/en not_active Expired - Fee Related
-
2012
- 2012-03-15 CN CN 201220097613 patent/CN202608256U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP5834441B2 (en) | 2015-12-24 |
| JP2012201010A (en) | 2012-10-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121219 Termination date: 20190315 |