CN202587599U - Via hole hole-filling thin film circuit - Google Patents
Via hole hole-filling thin film circuit Download PDFInfo
- Publication number
- CN202587599U CN202587599U CN 201220174587 CN201220174587U CN202587599U CN 202587599 U CN202587599 U CN 202587599U CN 201220174587 CN201220174587 CN 201220174587 CN 201220174587 U CN201220174587 U CN 201220174587U CN 202587599 U CN202587599 U CN 202587599U
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- CN
- China
- Prior art keywords
- via hole
- hole
- electrically conductive
- thin film
- conductive ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a via hole hole-filling thin film circuit. The circuit comprises a base material, a via hole and an electrically conductive ink, wherein the via hole and the electrically conductive ink are arranged on the base material. The diameter of the via hole is less than 0.5mm, and the via hole is filled with the electrically conductive ink. According to the via hole hole-filling thin film circuit provided in the utility model, by arranging the via hole whose diameter is less than 0.5mm on the base material, the electrically conductive ink flows into the via hole naturally to fill the space in the via hole in the process of electrically conductive ink printing, so advantages of stable electrical conductivity and low resistance are realized, and the electrically conductive ink will not fall off.
Description
Technical field
The utility model relates to electronic technology field, relates in particular to a kind of via hole consent thin film circuit.
Background technology
See also Fig. 1, at present aperture two-sided or multilayer film circuit conductive via 2 is about 1mm, on base material 1 during printing conductive inks 3; Electrically conductive ink 3 has only on a small amount of hole wall attached to via hole 2; Electric conductivity instability and resistance are higher, very easily come off, and cause the thin film circuit fraction defective higher.
The utility model content
To the weak point that exists in the above-mentioned technology, the utility model provides a kind of via hole consent thin film circuit, reduces resistance when can strengthen electric conductivity, improves the conduction reliability of thin film circuit.
For realizing above-mentioned purpose, the utility model provides a kind of via hole consent thin film circuit, comprises base material and is arranged on via hole and the electrically conductive ink on the base material, and the aperture of said via hole is less than 0.5mm, and said electrically conductive ink fills up said via hole.
Wherein, said via hole is through hole or blind hole.
Wherein, said via hole is the acupuncture via hole.
The beneficial effect of the utility model is: compared with prior art, the via hole consent thin film circuit that the utility model provides is through being provided with the via hole of aperture less than 0.5mm on base material; When printing conductive inks; In the electrically conductive ink spontaneous current hand-hole, fill up space in the hole, electric conductivity is stable; Can not come off, resistance is low.
Description of drawings
Fig. 1 is the structure chart of the thin film circuit of prior art;
Fig. 2 is the preceding structure chart of printing conductive inks of the via hole consent thin film circuit of the utility model;
Fig. 3 is the structure chart behind the printing conductive inks of via hole consent thin film circuit of the utility model.
The main element symbol description is following:
1, base material 2, via hole
3, electrically conductive ink 11, base material
12, via hole 13, electrically conductive ink
Embodiment
In order more clearly to explain the utility model, the utility model is done to describe further below in conjunction with accompanying drawing.
See also Fig. 1, the via hole consent thin film circuit of the utility model comprises base material 11 and is arranged on via hole 12 and the electrically conductive ink 13 on the base material 11 that the aperture of via hole 12 is less than 0.5mm, and electrically conductive ink 13 fills up via hole 12.
Compared to the situation of prior art, the via hole consent thin film circuit that the utility model provides is through being provided with the via hole 12 of aperture less than 0.5mm on base material 11; When printing conductive inks 13, in the electrically conductive ink 13 spontaneous current hand-holes, fill up space in the hole; Electric conductivity is stable, can not come off, and resistance is low.
In the present embodiment, above-mentioned via hole 12 is through hole or blind hole.Certainly, according to actual needs, blind hole or through hole can be set on base material; The utility model is not limited to the type of via hole 12; So long as, utilize electrically conductive ink 13 to fill in the hole, reach the execution mode that strengthens the conduction ability through the hole of aperture less than 0.5mm is set; All belong to simple deformation or conversion, fall into the protection range of the utility model the utility model.
In the present embodiment, above-mentioned via hole 12 is the acupuncture via hole.In the processing procedure of reality, the aperture obtains through machining less than the via hole of 0.5mm is difficult, adopts laser technology to obtain via hole or obtain via hole through the mould mode all can produce higher processing charges.Therefore, in a preferred embodiment, can adopt the technology of acupuncture via hole to obtain the via hole of aperture less than 0.5mm, and handling ease, cost is lower, and the thin film circuit electric conductivity that obtains is excellent.
It is understandable that; The utility model is not limited to the acquisition mode of via hole 12; So long as, utilize electrically conductive ink 13 to fill in the hole, reach the execution mode that strengthens the conduction ability through the hole of aperture less than 0.5mm is set; All belong to simple deformation or conversion, fall into the protection range of the utility model the utility model.
More than the disclosed several specific embodiments that are merely the utility model, but the utility model is not limited thereto, any those skilled in the art can think variation all should fall into the protection range of the utility model.
Claims (3)
1. a via hole consent thin film circuit is characterized in that, comprises base material and is arranged on via hole and the electrically conductive ink on the base material, and the aperture of said via hole is less than 0.5mm, and said electrically conductive ink fills up said via hole.
2. via hole consent thin film circuit according to claim 1 is characterized in that said via hole is through hole or blind hole.
3. via hole consent thin film circuit according to claim 1 and 2 is characterized in that said via hole is the acupuncture via hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220174587 CN202587599U (en) | 2012-04-23 | 2012-04-23 | Via hole hole-filling thin film circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220174587 CN202587599U (en) | 2012-04-23 | 2012-04-23 | Via hole hole-filling thin film circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202587599U true CN202587599U (en) | 2012-12-05 |
Family
ID=47256946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220174587 Expired - Fee Related CN202587599U (en) | 2012-04-23 | 2012-04-23 | Via hole hole-filling thin film circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202587599U (en) |
-
2012
- 2012-04-23 CN CN 201220174587 patent/CN202587599U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121205 Termination date: 20140423 |