CN202564336U - Single-base-island-exposed-type multi-circle multi-chip normally-equipped and normally-equipped packaging structure - Google Patents
Single-base-island-exposed-type multi-circle multi-chip normally-equipped and normally-equipped packaging structure Download PDFInfo
- Publication number
- CN202564336U CN202564336U CN201220204451.3U CN201220204451U CN202564336U CN 202564336 U CN202564336 U CN 202564336U CN 201220204451 U CN201220204451 U CN 201220204451U CN 202564336 U CN202564336 U CN 202564336U
- Authority
- CN
- China
- Prior art keywords
- pin
- chip
- dao
- formal dress
- normally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model relates to a single-base-island-exposed-type multi-circle multi-chip normally-equipped and normally-equipped packaging structure, comprising a base island (1), the pins (2), a first chip (3) and a second chip (4), wherein the first chip (3) is arranged on fronts of the base island (1) and the pins (2) and the second chip (4) is disposed on the first chip (3). The metal wires (6) connect between fronts of the first chip (3) and the second chip (4) and fronts of the pins (2). The holes (8) are opened on the surface of plastic package materials (7) on a lower part of the base island (1) and the pins (2) and connected with back surfaces of the base island (1) or the pins (2). Metal balls (10) are disposed in the holes (8) and contacted with back surfaces of the base island (1) or the pins (2). There are multiple circles of the pins (2). The beneficial effects of the utility model are that manufacturing cost is reduced, security and reliability of the packaging structure are raised, environmental pollution is reduced and the multi-circle multi-chip normally-equipped and normally-equipped packaging structure can really achieve design and manufacturing of a high-density circuit.
Description
Technical field
The utility model relates to the base island exposed type of a kind of list and encloses multicore sheet formal dress formal dress encapsulating structure more, belongs to the semiconductor packaging field.
Background technology
The manufacturing process flow of traditional high-density base board encapsulating structure is as follows:
Step 11, referring to Figure 13, need carry out load and the zone of routing bonding of back operation at anti-welding lacquer and window,
Step 12, referring to Figure 14, electroplate in the zone that step 11 is windowed, form Ji Dao and pin relatively,
Step 13, accomplish follow-up load, routing, seal, concerned process steps such as cutting.
Above-mentioned traditional high-density base board encapsulating structure exists following deficiency and defective:
1, many glass fiber materials of one deck, same also many costs of layer of glass;
2, because must use glass fiber, so with regard to many thickness space of about 100 ~ 150 μ m of layer of glass thickness;
3, glass fiber itself is exactly a kind of foaming substance, so easily because time of placing and environment suck moisture and moisture, directly have influence on the security capabilities of reliability or the grade of reliability;
4, the fiberglass surfacing Copper Foil metal layer thickness of about 50 ~ 100 μ m of one deck that has been covered; And the etching of metal level circuit and circuit distance also because the etched gap that the characteristic of etching factor can only be accomplished 50 ~ 100 μ m (referring to Figure 15; Best making ability is that etched gap is equal to the thickness that is etched object approximately), so the design of accomplishing high-density line and manufacturing that can't be real;
5, because must use the Copper Foil metal level, and the Copper Foil metal level is the mode that the employing high pressure is pasted, so the thickness of Copper Foil is difficult to be lower than the thickness of 50 μ m, otherwise just is difficult to operation like out-of-flatness or Copper Foil breakage or Copper Foil extension displacement or the like;
6, also because the whole base plate material is to adopt glass fiber material, thus significantly increased thickness 100 ~ 150 μ m of glass layer, can't be real accomplish ultra-thin encapsulation;
7, the traditional glass fiber stick on Copper Foil technology because material property difference very big (coefficient of expansion) causes stress deformation easily in the operation of adverse circumstances, directly have influence on precision and element and substrate adherence and reliability that element loads.
Summary of the invention
The purpose of the utility model is to overcome above-mentioned deficiency, provides the base island exposed type of a kind of list to enclose multicore sheet formal dress formal dress encapsulating structure more, and its technology is simple; Need not use glass layer; Reduce manufacturing cost, improved the fail safe and the reliability of packaging body, reduced the environmental pollution that glass fiber material brings; And the metal substrate line layer adopts is electro-plating method, can really accomplish the design and the manufacturing of high-density line.
The purpose of the utility model is achieved in that the base island exposed type of a kind of list encloses multicore sheet formal dress formal dress encapsulating structure more; It comprises Ji Dao, pin, first chip and second chip; Said first chip is arranged at Ji Dao through conduction or non-conductive bonding material and pin is positive; Said second chip is arranged on first chip through conduction or non-conductive bonding material; Be connected with metal wire between said first chip, second chip front side and the pin front, zone and first chip, second chip and the metal wire of zone, Ji Dao and the pin bottom on zone, Ji Dao and pin top between zone, pin and the pin between peripheral zone, Ji Dao and the pin in said basic island all are encapsulated with plastic packaging material outward, offer aperture on the plastic packaging material surface of said Ji Dao and pin bottom; Said aperture is connected with the Ji Dao or the pin back side; Be provided with metal ball in the said aperture, said metal ball contacts with the Ji Dao or the pin back side, and said pin has many circles.
Be provided with coat of metal between said metal ball and Ji Dao or the pin back side.
Said Ji Dao comprises Ji Dao top, Ji Dao bottom and intermediate barrier layers, and said Ji Dao top and Ji Dao bottom form by the single or multiple lift metal plating, and said intermediate barrier layers is nickel dam, titanium layer or copper layer.
Said pin comprises pin top, pin bottom and intermediate barrier layers, and said pin top and pin bottom form by the single or multiple lift metal plating, and said intermediate barrier layers is nickel dam, titanium layer or copper layer.
Compared with prior art, the utlity model has following beneficial effect:
1, the utility model need not use glass layer, so can reduce the cost that glass layer brings;
2, the utility model does not use the foaming substance of glass layer, so the grade of reliability can improve again, the fail safe to packaging body will improve relatively;
3, the utility model need not use the glass layer material, so just can reduce the environmental pollution that glass fiber material brings;
What 4, the two-dimensional metallic substrate circuit layer of the utility model was adopted is electro-plating method; And the gross thickness of electrodeposited coating is about 10 ~ 15 μ m; And the gap between circuit and the circuit can reach the gap below the 25 μ m easily, so can accomplish the technical capability of pin circuit tiling in the high density veritably;
5, the two-dimensional metallic substrate of the utility model is the metal level galvanoplastic because of what adopt; So the technology than glass fiber high pressure Copper Foil metal level is come simply, and do not have metal level because high pressure produces bad or puzzled that metal level out-of-flatness, metal level breakage and metal level extend and be shifted;
6, the two-dimensional metallic substrate circuit layer of the utility model is to carry out metal plating on the surface of metal base; So the material characteristic is basic identical; So the internal stress of coating circuit and metal base is basic identical, can carries out the back engineering (like the surface mount work of high temperature eutectic load, high temperature tin material scolder load and high temperature passive device) of adverse circumstances easily and be not easy to produce stress deformation.
Description of drawings
Fig. 1 encloses the sketch map of multicore sheet formal dress formal dress encapsulating structure more for the base island exposed type of a kind of list of the utility model.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 ~ Figure 14 is each operation sketch map of the manufacturing process flow of traditional high-density base board encapsulating structure.
Figure 15 is the etching situation sketch map of fiberglass surfacing Copper Foil metal level.
Wherein:
Base island 1
Conduction or non-conductive bonding material 5
Coat of metal 9
Embodiment
Referring to Fig. 1, Fig. 2; The base island exposed type of a kind of list of the utility model encloses multicore sheet formal dress formal dress encapsulating structure more; It comprises basic island 1, pin 2, first chip 3 and second chip 4; Said first chip 3 is arranged at basic island 1 and pin 2 fronts through conduction or non-conductive bonding material 5; Said second chip 4 is arranged on first chip 3 through conduction or non-conductive bonding material 5; Said first chip 3, second chip 4 is positive with pin 2 fronts between be connected with metal wire 6, all be encapsulated with plastic packaging materials 7 outside zone, basic island 1 and pin 2 bottoms on zone, basic island 1 and pin 2 tops between zone, pin 2 and the pin 2 between peripheral zone, basic island 1 and the pin 2 in said basic island 1 regional and first chip 3, second chip 4 and the metal wire 6, offer aperture 8 on plastic packaging material 7 surfaces of said basic island 1 and pin 2 bottoms; Said aperture 8 is connected with the basic island 1 or pin 2 back sides; Be provided with metal ball 10 in the said aperture 8, said metal ball 10 contacts with the basic island 1 or pin 2 back sides, and said pin 2 has many circles.
Be provided with coat of metal 9 between said metal ball 10 and basic island 1 or pin 2 back sides, said coat of metal 9 is an oxidation inhibitor.
Said metal ball 10 materials adopt tin or ashbury metal.
Said basic island 1 comprises Ji Dao top, Ji Dao bottom and intermediate barrier layers, and said Ji Dao top and Ji Dao bottom form by the single or multiple lift metal plating, and said intermediate barrier layers is nickel dam, titanium layer or copper layer.
Said pin 2 comprises pin top, pin bottom and intermediate barrier layers, and said pin top and pin bottom form by the single or multiple lift metal plating, and said intermediate barrier layers is nickel dam, titanium layer or copper layer.
Claims (4)
1. the base island exposed type of list encloses multicore sheet formal dress formal dress encapsulating structure more; It is characterized in that: it comprises Ji Dao (1), pin (2), first chip (3) and second chip (4); Said first chip (3) is arranged at Ji Dao (1) and pin (2) front through conduction or non-conductive bonding material (5); Said second chip (4) is arranged on first chip (3) through conduction or non-conductive bonding material (5); Said first chip (3), second chip (4) positive with pin (2) front between be connected with metal wire (6); The outer plastic packaging material (7) that all is encapsulated with of the zone of zone, Ji Dao (1) and pin (2) bottom on zone, Ji Dao (1) and pin (2) top between zone, pin (2) and the pin (2) between zone, Ji Dao (1) and the pin (2) of said Ji Dao (1) periphery and first chip (3), second chip (4) and metal wire (6); Offer aperture (8) on plastic packaging material (7) surface of said Ji Dao (1) and pin (2) bottom; Said aperture (8) is connected with the Ji Dao (1) or pin (2) back side; Be provided with metal ball (10) in the said aperture (8), said metal ball (10) contacts with the Ji Dao (1) or pin (2) back side, and said pin (2) has many circles.
2. the base island exposed type of a kind of list according to claim 1 encloses multicore sheet formal dress formal dress encapsulating structure more, it is characterized in that: be provided with coat of metal (9) between said metal ball (10) and Ji Dao (1) or pin (2) back side.
3. the base island exposed type of a kind of list according to claim 1 encloses multicore sheet formal dress formal dress encapsulating structure more; It is characterized in that: said Ji Dao (1) comprises Ji Dao top, Ji Dao bottom and intermediate barrier layers; Said Ji Dao top and Ji Dao bottom form by the single or multiple lift metal plating, and said intermediate barrier layers is nickel dam, titanium layer or copper layer.
4. the base island exposed type of a kind of list according to claim 1 encloses multicore sheet formal dress formal dress encapsulating structure more; It is characterized in that: said pin (2) comprises pin top, pin bottom and intermediate barrier layers; Said pin top and pin bottom form by the single or multiple lift metal plating, and said intermediate barrier layers is nickel dam, titanium layer or copper layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201220204451.3U CN202564336U (en) | 2012-05-09 | 2012-05-09 | Single-base-island-exposed-type multi-circle multi-chip normally-equipped and normally-equipped packaging structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201220204451.3U CN202564336U (en) | 2012-05-09 | 2012-05-09 | Single-base-island-exposed-type multi-circle multi-chip normally-equipped and normally-equipped packaging structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202564336U true CN202564336U (en) | 2012-11-28 |
Family
ID=47213962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201220204451.3U Expired - Lifetime CN202564336U (en) | 2012-05-09 | 2012-05-09 | Single-base-island-exposed-type multi-circle multi-chip normally-equipped and normally-equipped packaging structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202564336U (en) |
-
2012
- 2012-05-09 CN CN201220204451.3U patent/CN202564336U/en not_active Expired - Lifetime
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN202564323U (en) | Multi-base-island-exposed type multi-circle multi-chip normally-equipped and normally-equipped packaging structure | |
CN202564244U (en) | Multi-base-island exposed type single-circle multi-chip normally-equipped packaging structure | |
CN202564336U (en) | Single-base-island-exposed-type multi-circle multi-chip normally-equipped and normally-equipped packaging structure | |
CN202564344U (en) | Single-base-island-exposed-type single-circle multi-chip normally-equipped and normally-equipped packaging structure | |
CN202564236U (en) | Multi-base-island-exposed type multi-circle multi-chip normally-equipped packaging structure | |
CN202564370U (en) | Single-base-island-exposed-type multi-circle single-chip normally-equipped packaging structure | |
CN202564355U (en) | Multi-base-island-exposed type multi-circle single-chip normally-equipped packaging structure | |
CN202564368U (en) | Single-base-island-exposed-type single-circle multi-chip normally-equipped packaging structure | |
CN202564254U (en) | Single-base-island-exposed-type single-circle multi-chip normally-equipped passive-component packaging structure | |
CN202564333U (en) | Multi-base-island-exposed type multi-circle multi-chip normally-equipped and normally-equipped passive-component packaging structure | |
CN202564372U (en) | Single-base-island-exposed type single-circle single-chip normally-equipped packaging structure | |
CN202564329U (en) | Single-substrate exposed packaging structure with multi-circle pins, multiple normal chips and passive devices | |
CN202564356U (en) | Face-up passive device packaging structure having exposed single die pad, multi-circle leads and single chip | |
CN202564334U (en) | Multi-base-island exposed type single-circle multi-chip normally-equipped passive-component packaging structure | |
CN202564350U (en) | Face-up passive device packaging structure having exposed single die pad, multi-circle leads and multiple chips | |
CN202564365U (en) | Multi-base-island-exposed type multi-circle single-chip normally-equipped passive-component packaging structure | |
CN202564324U (en) | Multi-base-island uncovering type single-circle multi-chip upward-arranged upward-arranged package structure | |
CN202564358U (en) | Single-base-island-exposed-type multi-circle multi-chip normally-equipped electrostatic discharge-ring packaging structure | |
CN202564371U (en) | Single-base-island uncovering type single-circle single-chip upward-arranged passive device package structure | |
CN202564362U (en) | Single-base-island-exposed-type single-circle multi-chip normally-equipped electrostatic discharge-ring packaging structure | |
CN202564251U (en) | Single base island exposed type single-circle multi-chip positive-and-inverse packaging passive device packaging structure | |
CN202564354U (en) | Single-pad exposed type single-loop multi-chip horizontal and horizontal passive device package structure | |
CN202564369U (en) | Single-base-island-exposed-type single-circle multi-chip flip and normally-equipped packaging structure | |
CN202564242U (en) | Multi-base-island exposed type single-circle single-chip normally-equipped passive-component packaging structure | |
CN202564335U (en) | Multi-base-island-exposed type multi-circle multi-chip flip and normally-equipped packaging structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20121128 |