CN202564324U - Multi-base-island uncovering type single-circle multi-chip upward-arranged upward-arranged package structure - Google Patents
Multi-base-island uncovering type single-circle multi-chip upward-arranged upward-arranged package structure Download PDFInfo
- Publication number
- CN202564324U CN202564324U CN201220204417.6U CN201220204417U CN202564324U CN 202564324 U CN202564324 U CN 202564324U CN 201220204417 U CN201220204417 U CN 201220204417U CN 202564324 U CN202564324 U CN 202564324U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201220204417.6U CN202564324U (en) | 2012-05-09 | 2012-05-09 | Multi-base-island uncovering type single-circle multi-chip upward-arranged upward-arranged package structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201220204417.6U CN202564324U (en) | 2012-05-09 | 2012-05-09 | Multi-base-island uncovering type single-circle multi-chip upward-arranged upward-arranged package structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202564324U true CN202564324U (en) | 2012-11-28 |
Family
ID=47213950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201220204417.6U Expired - Lifetime CN202564324U (en) | 2012-05-09 | 2012-05-09 | Multi-base-island uncovering type single-circle multi-chip upward-arranged upward-arranged package structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202564324U (en) |
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2012
- 2012-05-09 CN CN201220204417.6U patent/CN202564324U/en not_active Expired - Lifetime
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Changjiang Electronics Technology (Suqian) Co., Ltd. Assignor: Jiangsu Changjiang Electronics Technology Co., Ltd. Contract record no.: 2014320000296 Denomination of utility model: Multi-base-island uncovering type single-circle multi-chip upward-arranged upward-arranged package structure Granted publication date: 20121128 License type: Exclusive License Record date: 20140409 |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
CX01 | Expiry of patent term |
Granted publication date: 20121128 |
|
CX01 | Expiry of patent term |