CN202549803U - Silicon wafer transfer system based on image detection and positioning - Google Patents
Silicon wafer transfer system based on image detection and positioning Download PDFInfo
- Publication number
- CN202549803U CN202549803U CN2012200427060U CN201220042706U CN202549803U CN 202549803 U CN202549803 U CN 202549803U CN 2012200427060 U CN2012200427060 U CN 2012200427060U CN 201220042706 U CN201220042706 U CN 201220042706U CN 202549803 U CN202549803 U CN 202549803U
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- sheet
- charging tray
- silicon chip
- slide plate
- image detection
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a silicon wafer transfer system based on image detection and positioning, which comprises a transfer tray and wafer picking robots which are arranged above the transfer tray. A wafer loading device, a wafer loading slide plate, an image detection and positioning device, a waste box, a wafer unloading slide plate and a wafer unloading device are sequentially arranged on one side of the transfer tray along a direction opposite to the running direction of the transfer tray. The silicon wafer transfer system based on image detection and positioning realizes the detection of silicon wafers during transfer and has the advantages of simple structure and compact equipment.
Description
Technical field
The utility model belongs to photovoltaic silicon chip manufacturing equipment technical field, relates in particular to a kind of silicon chip movement system that detects and locate based on image.
Background technology
Board-like plasma reinforced chemical vapour deposition (PECVD method) is that two kinds of crystal-silicon solar cells using always reduce one of method of emissivity and passivation: be about to the multi-disc silicon chip and be placed on graphite or the carbon fiber support; Put into the deposition chambers of a metal; Plate electrode is arranged in the chamber; Form a discharge loop with sample holder, the process gas in chamber forms plasma in the space under the effect of the AC field between two pole plates, decompose SiH
4In Si and H, and NH
3The N that plants forms SiNx and deposits to silicon face.For this technology, automation has progressively replaced manual work and has carried out sheet up and down.But present method is to use mechanical device once to transport the multi-disc silicon chip, thereby can not detect silicon chip, and structure is not compact, and equipment is huge.
The utility model content
For this reason, the utility model technical problem to be solved provides a kind of can the detection silicon chip, and the silicon chip movement system based on image detection and location simple in structure, facility compact, to overcome the existing deficiency that exists.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of silicon chip movement system that detects and locate based on image; It is characterized in that: comprise transmit charging tray, be positioned at transmit the charging tray top get the sheet robot, a side of said transmission charging tray is disposed with last slice device, last slice slide plate, image detection and location device, waste material box, sheet slide plate and sheet device down down along transmitting charging tray operation rightabout.
In order to improve transport efficacy; Said transmission charging tray top is provided with two and gets the sheet robot, and said transmission charging tray is positioned at opposite side and also is disposed with last slice device, last slice slide plate, image detection and location device, waste material box, sheet slide plate and sheet device down down along transmitting charging tray operation rightabout.
The said artificial hanging of the sheet machine robot of getting.Artificial cross shape four arm robots of said hanging machine.
Said last slice the device and following sheet device all be placed with magazine.
In the utility model, transmit charging tray and can below robot, transmit, thereby practiced thrift horizontal space.The utility model is also quoted the flying-vision method and is carried out silicon chip detection and location.In addition on the one hand, also adopted the vacuum of suitable high speed transhipment to add the mechanical structure slide plate.Thereby robot can be placed into the high speed transhipment that detection is realized having in the perhaps correct technology position of useless film magazine with silicon chip based on the testing result and the positional information of each silicon chip like this.
Therefore, when having realized transhipment, the utility model, and also has an advantage simple in structure, facility compact to the detection of silicon chip.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is elaborated:
Fig. 1 is the structural representation of the utility model;
Among the figure:
1-gets sheet robot, last device of 2-, sheet device under the 3-, and last slide plate of 4-, sheet slide plate under the 41-, 5-image detection and location device, 6-waste material box, 7-transmits charging tray.
Embodiment
As shown in Figure 1; The silicon chip movement system based on image detection and location of the utility model; Comprise and transmit charging tray 7; Be positioned at two of transmitting charging tray 7 tops and get sheet robot 1, all be disposed with last slice device 2, last slice slide plate 4, image detection and location device 5, waste material box 6, sheet slide plate 41 and sheet device 3 down down along transmitting charging tray 7 operation rightabouts in the both sides of transmitting charging tray 7.Last slice the device and following sheet device all be placed with magazine.
Get sheet robot 1 and be the hanging robot, and be cross shape four arm robots.
More than be exactly the silicon chip movement system based on image detection and location of the utility model, its working method is following:
Before bringing into operation, by the material loading place of the two-layer last slice device 2 that constitutes up and down placing the magazine of filling silicon chip, and by the material loading place of the two-layer following device 3 that constitutes up and down placing empty magazine.When initial; When empty transmission charging tray 7 passed to loading and unloading place, the last slice slide plate 4 of last slice device 2 was got sheet from magazine, robot gripping's silicon chip through image detection and location device 5 detect and the location after; Put into waste material box 6 with defective, qualified then puts to transmitting charging tray 7.Carry out coating film treatment in the main process equipment when transmitting to import into after charging tray 7 is piled silicon chip.After plated film is accomplished; When transmission charging tray 7 transfers back to loading and unloading place again; Robot grasps silicon chip earlier from transmit charging tray 7, through 5 detections of image detection and location device and location, put into waste material box 6 with defective; Qualified then puts to following slide plate 4 of following sheet device 3, by slide plate 4 silicon chip is inserted in the magazine of sheet device 3 under the material.When transmit on the charging tray 7 got through the silicon chip of plated film after, robot can get sheet from last slice device again and carry out foregoing last slice operation, so circulates.The placement of last slice device full magazine of 2 and empty magazine take away and the placement and full the taking away by the operator of magazine of the empty magazine of sheet device 3 are accomplished by hand down.
Can find out to the detection of silicon chip, and to have an advantage simple in structure, facility compact when the utility model has been realized transhipment through above-mentioned detailed description.
But; Those of ordinary skill in the art will be appreciated that; Above embodiment is used for explaining the utility model; And be not the qualification that is used as the utility model, as long as in the connotation scope of the utility model, all will drop in claims scope of the utility model variation, the modification of the above embodiment.
Claims (5)
1. one kind is detected based on image and the silicon chip movement system of location; It is characterized in that: comprise the transmission charging tray; Be positioned at transmit the charging tray top get the sheet robot, a side of said transmission charging tray is disposed with last slice device, last slice slide plate, image detection and location device, waste material box, sheet slide plate and sheet device down down along transmitting charging tray operation rightabout.
2. the silicon chip movement system that detects and locate based on image according to claim 1; It is characterized in that: said transmission charging tray top is provided with two and gets the sheet robot, and said transmission charging tray is positioned at opposite side and also is disposed with last slice device, last slice slide plate, image detection and location device, waste material box, sheet slide plate and sheet device down down along transmitting charging tray operation rightabout.
3. the silicon chip movement system that detects and locate based on image according to claim 1 and 2 is characterized in that: the said artificial hanging of the sheet machine robot of getting.
4. describedly detect and the silicon chip movement systems of location based on image based on claim 1 or 2, it is characterized in that: said last slice device and following sheet device all are placed with magazine.
5. the silicon chip movement system that detects and locate based on image according to claim 3 is characterized in that: artificial cross shape four arm robots of said hanging machine.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012200427060U CN202549803U (en) | 2012-02-10 | 2012-02-10 | Silicon wafer transfer system based on image detection and positioning |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012200427060U CN202549803U (en) | 2012-02-10 | 2012-02-10 | Silicon wafer transfer system based on image detection and positioning |
Publications (1)
Publication Number | Publication Date |
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CN202549803U true CN202549803U (en) | 2012-11-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2012200427060U Expired - Lifetime CN202549803U (en) | 2012-02-10 | 2012-02-10 | Silicon wafer transfer system based on image detection and positioning |
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CN (1) | CN202549803U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107424950A (en) * | 2017-08-21 | 2017-12-01 | 罗博特科智能科技股份有限公司 | A kind of transfer mechanism for silicon chip image positioner |
CN110488751A (en) * | 2018-08-29 | 2019-11-22 | 中山大学 | A kind of graphite charging tray vision positioning system of automation process line |
-
2012
- 2012-02-10 CN CN2012200427060U patent/CN202549803U/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107424950A (en) * | 2017-08-21 | 2017-12-01 | 罗博特科智能科技股份有限公司 | A kind of transfer mechanism for silicon chip image positioner |
CN110488751A (en) * | 2018-08-29 | 2019-11-22 | 中山大学 | A kind of graphite charging tray vision positioning system of automation process line |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: Suzhou City, Jiangsu province 215122 Suzhou Industrial Park Weiting Fengting Avenue No. 598 Patentee after: Robert C intelligent Polytron Technologies Inc Address before: Suzhou City, Jiangsu province 215000 Suzhou Industrial Park Weiting Chunhui Road No. 5 kuachun industrial plant No. 6 Patentee before: Suzhou Roboteko Automation equipment Co., Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20121121 |