CN202514178U - Integrated stereo circuit device housing - Google Patents
Integrated stereo circuit device housing Download PDFInfo
- Publication number
- CN202514178U CN202514178U CN2011205352545U CN201120535254U CN202514178U CN 202514178 U CN202514178 U CN 202514178U CN 2011205352545 U CN2011205352545 U CN 2011205352545U CN 201120535254 U CN201120535254 U CN 201120535254U CN 202514178 U CN202514178 U CN 202514178U
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- China
- Prior art keywords
- printed circuit
- film
- circuit film
- apparatus casing
- utility
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- Expired - Fee Related
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Abstract
The utility model relates to the field of a printed circuit and in particular relates to a printed circuit board. An integrated stereo circuit device housing comprises a device housing and a printed circuit film, wherein the printed circuit film is mounted in the device housing. Because the above technology scheme is adopted, the printed circuit film is glued on the device housing in the utility model. The film and plastic gluing technology is once completed in an injection mould. The printed circuit film and the plastic housing are firmly integrated, thereby guaranteeing the printed circuit film not to desquamate and not to be oxidated without escaping of small solvent molecules.
Description
Technical field
The utility model relates to the printed circuit technique field, is specifically related to a kind of printed circuit board (PCB).
Background technology
The widely used thick-film printed circuit of electron trade generally adopts double faced adhesive tape and plastics main part bonding at present.The bonding existence of this mode problem of not being convinced, is moulded stick portion and is had local gap film, is prone to oxidation, and volatile in air, the generation of adhesive solvent micromolecule polluted, and of long duration is prone to come unstuck.
In manufacturing process, exist the cost human cost bigger, production efficiency is lower, and percent defective is high, problems such as production cost height.Moreover the limitation of a large amount of miniature electrical equipment inner spaces makes thick-film printed circuit very little with the bonding operation possibility of double faced adhesive tape and plastics main part.
The utility model content
The purpose of the utility model is, a kind of integrated stereo circuit device housings is provided, and solves above technical problem.
The technical problem that the utility model solved can adopt following technical scheme to realize:
Integrated stereo circuit device housings comprises an apparatus casing, it is characterized in that, also comprises a printed circuit film, and said printed circuit film is arranged in the said apparatus casing;
Along with the variation of said apparatus casing profile, said printed circuit film no longer is confined to the pattern of planar circuit and presents different three-dimensional shape structures.
Said apparatus casing preferably adopts the plastic casing of a plastic material, and said printed circuit film adopts integrated through injection molding to change into the type technology and is embedded in said device housings inside.Plastic plasticity is strong, can realize conveniently that the integrated through injection molding of printed circuit film and plastic casing changes into type.
The printed circuit film of the utility model adopts injection molding process to be arranged in the apparatus casing.The utility model with film, mould adhesion technique disposable completion in injection mold, printed circuit film and apparatus casing are combined into one securely, do not come off, not oxidation, solvent-free micromolecule overflow; And printed circuit film is integrated adhesion-molded in the process procedure of plastic parts moulding, need not the bonding again operating space of double faced adhesive tape, makes electronic devices and components possess the broad space to further miniaturization, microminiaturized development.The utility model had both overcome printed circuit film with double faced adhesive tape and the bonding all drawbacks of apparatus casing, had also simplified operation, had reduced production cost.
Said printed circuit film comprises a thin layer, and said thin layer internal layer is provided with the circuit layer that nanometer silver paste constitutes.
The thickness of said thin layer is 0.05～0.25mm.
Can on said circuit layer, print additional one deck dielectric ink layer according to different purposes.On said dielectric ink layer, can also print one deck hot-melt adhesive layer.
One side surface of said device housings is provided with at least two streamlined convexities; Said streamlined convexity is arranged along the plastics pouring direction in the plastic parts moulding technology; Being arranged under the prerequisite that does not change the plastic structural dimensions of said streamlined convexity sponges the part that printed circuit film is stretched and prolongs in injection moulding process, and then eliminates fold; Particularly eliminate the sharp-pointed wrinkle angle of fold place, avoided the circuit layer fracture that causes because of said sharp-pointed wrinkle angle;
At least two said streamlined protruding connections, form a waveform bending structure.So that absorb the extension elongation part of printed circuit film better, make printed circuit film smoothly paste clothes on the whole, and be combined as a whole securely with plastic.So both guaranteed circuit clear, guaranteed again that printed circuit film does not come off, not oxidation, solvent-free micromolecule overflow environmental protection and durable.
The utility model also comprise one with printed circuit film in the Wiring port that is connected of circuit, said Wiring port stretches out outside the said apparatus casing, directly is not connected with said apparatus casing.Circuit in the printed circuit film can be comparatively flexible the said Wiring port that passes through be connected with external devices.
Beneficial effect: owing to adopted technique scheme; The utility model is bonded in printed circuit film on the apparatus casing; Film, mould adhesion technique disposable completion in injection mold; Printed circuit film and main body plastic are combined into one securely, have do not come off, advantage such as not oxidation, solvent-free micromolecule effusion.
Description of drawings
Fig. 1 is the overall structure sketch map of the utility model;
Fig. 2 is the part-structure sketch map of the utility model.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and be easy to understand with effect and understand, below in conjunction with the further elaboration the utility model of concrete diagram.
With reference to Fig. 1, Fig. 2; Integrated stereo circuit device housings; Comprise an apparatus casing 1, also comprise a printed circuit film 2, printed circuit film 2 is arranged in the apparatus casing 1; Along with the variation of apparatus casing 1 profile, printed circuit film 2 no longer is confined to the pattern of planar circuit and presents different three-dimensional shape structures.The apparatus casing 1 preferred plastic casing that adopts plastics to process, printed circuit film 2 adopts integrated through injection molding to change into the type technology and is arranged on apparatus casing 1 inside.Plastic plasticity is strong, can realize conveniently that the printed circuit film 2 and the integrated through injection molding of apparatus casing 1 change into type.The printed circuit film 2 of the utility model adopts injection molding process to be arranged on apparatus casing 1 inside.The utility model with film, mould adhesion technique disposable completion in injection mold, printed circuit film 2 is combined into one with apparatus casing 1 securely, does not come off, not oxidation, solvent-free micromolecule overflow; And printed circuit film 2 is integrated adhesion-molded in the process procedure of plastic parts moulding, need not the bonding again operating space of double faced adhesive tape, makes electronic devices and components possess the broad space to further miniaturization, microminiaturized development.The utility model had both overcome the bonding all drawbacks of printed circuit film 2 usefulness double faced adhesive tapes and apparatus casing 1, had also simplified operation, had reduced production cost.
Printed circuit film 2 comprises that a thickness is the thin layer of 0.05～0.25mm, and the thin layer internal layer is provided with the circuit layer that the printing of nanometer silver paste ink screen is processed.Thin layer can be bilayer, is provided with circuit layer in the thin layer.Also can above circuit layer, also be coated with a protective film layer.Can print additional one deck dielectric ink layer at circuit layer according to different purposes.On the dielectric ink layer, can also print one deck hot-melt adhesive layer.
With reference to Fig. 1, Fig. 2; One side surface of apparatus casing 1 is provided with at least two streamlined protruding 21, the streamlined protruding 21 plastics pouring directions in the plastic parts moulding technology and arranges, streamlined protruding 21 be arranged under the prerequisite that does not change the plastic structural dimensions; Sponge the part that printed circuit film 2 is stretched and prolongs in injection moulding process; And then the elimination fold, the circuit layer fracture that causes because of said sharp-pointed wrinkle angle is avoided at the sharp-pointed wrinkle angle of particularly having eliminated fold place.Be connected to form a waveform bending structure at least two streamlined protruding 21,, make level and smooth on the whole subsides of printed circuit film 2 obey, and be combined as a whole securely with apparatus casing 1 so that absorb the extension elongation part of printed circuit film 2 better.So both guaranteed circuit clear, guaranteed again that printed circuit film 2 does not come off, not oxidation, solvent-free micromolecule overflow environmental protection and durable.
The utility model also comprise one with printed circuit film 2 in the Wiring port 3 that is connected of circuit layers, Wiring port 3 is arranged on outside the apparatus casing 1.Circuit layer in the printed circuit film 2 can be comparatively flexible the Wiring port 3 that passes through be connected with external devices or circuit.
Thin layer preferably adopts transparent thin film layer.The apparatus casing 1 preferred transparent equipment housing that adopts transparent plastic to process is so that make the circuit on the printed circuit film transparent visible.
The utility model can adopt that following Shooting Technique is one-body molded to be processed:
1) manufacturing process of printed circuit film 2 comprises: adopt silk screen printing on 0.05～0.25 film of coupling the nanometer-level silver paste printing ink, form a circuit layer.Can print additional one deck dielectric ink at silver slurry face according to different purposes, form an insulating barrier.Can also the printing heat hot melt adhesive on insulating barrier.
2) shaping process of printed circuit film 2 comprises: the geometry according to electronic devices and components adopts laser or shearing die to cut into the printed circuit film of required form; According to the geometry of electronic devices and components, after the die cavity of the printed circuit film embedding injection mold after employing gas or hydraulic pressure tool will be sheared was interior, the plastics that adopt 200～300 ℃ of molten conditions were under the pressure that is not higher than 100pa, through being not more than 1mm again
2Cast gate and in 1～3 second, inject in the die cavity, carry out injection mo(u)lding.
3) film is moulded integral process, comprising: the interior plastics with molten condition of die cavity that orthopedic printed circuit film 2 are embedded into injection mold carry out injection mo(u)lding.
The die cavity chamber wall of injection mold is along at least two the streamlined convexities of length direction that embed printed circuit film 2 wherein, and at least two streamlined convexities are connected to form a waveform bending structure.Can be under the constant situation of plastic contour structures; Prolong the surface area of printed circuit film 2 and plastic stick portion; And then can in forming process, absorb the part of printed circuit film 2 extension elongations; Eliminate fold, make printed circuit film 2 whole level and smooth subsides obey, and be combined as a whole securely with device housings 1.So both guaranteed circuit clear, guaranteed again that printed circuit film 2 does not come off, not oxidation, solvent-free molecule overflow environmental protection and durable.
Step 2) in; Printed circuit film after the shaping process of printed circuit film is sheared comprises a terminals film, and in step 3), the terminals film stretches out outside the die cavity; Do not participate in injection molding process, so that the printed circuit part can be connected with external devices through terminals.
More than show and described basic principle of the utility model and the advantage of principal character and the utility model.The technical staff of the industry should understand; The utility model is not restricted to the described embodiments; The principle of describing in the foregoing description and the specification that the utility model just is described; Under the prerequisite that does not break away from the utility model spirit and scope, the utility model also has various changes and modifications, and these variations and improvement all fall in the utility model scope that requires protection.The utility model requires protection range to be defined by appending claims and equivalent thereof.
Claims (6)
1. integrated stereo circuit device housings comprises an apparatus casing, it is characterized in that, also comprises a printed circuit film, and said printed circuit film is arranged in the said apparatus casing.
2. integrated stereo circuit device housings according to claim 1 is characterized in that, it is inner that the plastic casing that said apparatus casing adopts plastics to process, said printed circuit film are embedded in said apparatus casing.
3. integrated stereo circuit device housings according to claim 2 is characterized in that said printed circuit film comprises a thin layer, and said thin layer internal layer is provided with the circuit layer that nanometer silver paste constitutes.
4. integrated stereo circuit device housings according to claim 3 is characterized in that the thickness of said thin layer is 0.05～0.25mm.
5. according to claim 1,2,3 or 4 described integrated stereo circuit device housings, it is characterized in that a side surface of said apparatus casing is provided with at least two streamlined convexities, at least two said streamlined protruding connections, form a waveform bending structure.
6. integrated stereo circuit device housings according to claim 5 is characterized in that, also comprise one with printed circuit film in the Wiring port that is connected of circuit layer, said Wiring port is arranged on outside the said apparatus casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205352545U CN202514178U (en) | 2011-12-19 | 2011-12-19 | Integrated stereo circuit device housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205352545U CN202514178U (en) | 2011-12-19 | 2011-12-19 | Integrated stereo circuit device housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202514178U true CN202514178U (en) | 2012-10-31 |
Family
ID=47066627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205352545U Expired - Fee Related CN202514178U (en) | 2011-12-19 | 2011-12-19 | Integrated stereo circuit device housing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202514178U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104363534A (en) * | 2014-10-20 | 2015-02-18 | 广东佳禾声学科技有限公司 | Novel headset cord control and production method thereof |
| WO2015049425A1 (en) * | 2013-10-04 | 2015-04-09 | Tactotek Oy | Illuminated indicator structures for electronic devices |
-
2011
- 2011-12-19 CN CN2011205352545U patent/CN202514178U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015049425A1 (en) * | 2013-10-04 | 2015-04-09 | Tactotek Oy | Illuminated indicator structures for electronic devices |
| US9297675B2 (en) | 2013-10-04 | 2016-03-29 | Tactotek Oy | Illuminated indicator structures for electronic devices |
| CN105850230A (en) * | 2013-10-04 | 2016-08-10 | 塔图科技有限公司 | Illuminated indicator structures for electronic devices |
| US9945700B2 (en) | 2013-10-04 | 2018-04-17 | Tactotek Oy | Illuminated indicator structures for electronic devices |
| CN105850230B (en) * | 2013-10-04 | 2019-02-15 | 塔图科技有限公司 | Illuminated indicator structure for electronic device |
| CN104363534A (en) * | 2014-10-20 | 2015-02-18 | 广东佳禾声学科技有限公司 | Novel headset cord control and production method thereof |
| CN104363534B (en) * | 2014-10-20 | 2019-03-29 | 佳禾智能科技股份有限公司 | A kind of Novel earphone line traffic control and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121031 Termination date: 20171219 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |