CN106817846B - Liquid metal stereo circuit and its manufacturing method based on 3D printing technique - Google Patents
Liquid metal stereo circuit and its manufacturing method based on 3D printing technique Download PDFInfo
- Publication number
- CN106817846B CN106817846B CN201510857645.1A CN201510857645A CN106817846B CN 106817846 B CN106817846 B CN 106817846B CN 201510857645 A CN201510857645 A CN 201510857645A CN 106817846 B CN106817846 B CN 106817846B
- Authority
- CN
- China
- Prior art keywords
- liquid metal
- stereo circuit
- printing
- printing technique
- circuit manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000010146 3D printing Methods 0.000 title claims abstract description 39
- 238000007639 printing Methods 0.000 claims abstract description 34
- 239000007787 solid Substances 0.000 claims abstract description 24
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 12
- 229910052733 gallium Inorganic materials 0.000 claims description 12
- 229910052738 indium Inorganic materials 0.000 claims description 9
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 9
- 238000000520 microinjection Methods 0.000 claims description 9
- MPZNMEBSWMRGFG-UHFFFAOYSA-N bismuth indium Chemical compound [In].[Bi] MPZNMEBSWMRGFG-UHFFFAOYSA-N 0.000 claims description 8
- 229910001369 Brass Inorganic materials 0.000 claims description 6
- 229910000846 In alloy Inorganic materials 0.000 claims description 6
- 239000010951 brass Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 4
- PSMFTUMUGZHOOU-UHFFFAOYSA-N [In].[Sn].[Bi] Chemical compound [In].[Sn].[Bi] PSMFTUMUGZHOOU-UHFFFAOYSA-N 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 14
- 238000005516 engineering process Methods 0.000 abstract description 8
- 238000011161 development Methods 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 18
- 230000008569 process Effects 0.000 description 11
- 230000010412 perfusion Effects 0.000 description 7
- 230000004913 activation Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000013049 sediment Substances 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 229920006352 transparent thermoplastic Polymers 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1344—Spraying small metal particles or droplets of molten metal
Abstract
The liquid metal stereo circuit manufacturing method based on 3D printing technique that the present invention relates to a kind of, the following steps are included: S1: establishing threedimensional model corresponding with the three-dimensional structure of stereo circuit to be manufactured, and establish hollow duct inside the threedimensional model according to the line alignment of the stereo circuit；S2: by 3D printing technique, the three dimensional model printing that the step S1 is obtained is at 3D solid；S3: liquid metal is filled in the hollow duct of the 3D solid.The cost of manufacture of stereo circuit can not only be greatly reduced in provided manufacturing method through the invention, and simplifies installation, production process, can realize free, quick, economic personalized designs, the manufacture of stereo circuit at normal temperatures and pressures.There is greater advantage on making full use of liquid metal and 3D printing manufacturing process and Development of Novel flexible stereo circuit technology of preparing.
Description
Technical field
The present invention relates to electronic circuit manufacturing fields, and in particular to a kind of liquid metal stereoscopic electric based on 3D printing technique
Road and its manufacturing method.
Background technique
With the fast development of electronics and information industry, the electronic circuit as electronics and information industry basis just enters can hold
The flexible electronic (Flexible Electronics) of the large deformation such as Tensile, compression, bending and directly in three-dimensional plastic carrier
Surface adhered with electronic component stereo circuit (Three-dimensional Moulded Interconnect Devices:
Three dimensional mold interconnecting device) be main body of development new era.Such extending, curved flexible electronic device and design freely,
Complicated stereo circuit has non-in fields such as solar battery, dynamic pickup, health monitoring systems, wearable devices
Often extensive and good application prospect.
As traditional integrated circuit manufacturing technology, basis material and preparation process are the development of these new electronic technologies
Main drive.With being constantly progressive for materialogy, mechanics and manufacturing technology level, it is desirable that break through traditional silicon electronic device
Manufacturing process and methods, manufactured using the new material of energy conservation and environmental protection and flexible intelligent and manufacturing process deformable, easy processing,
The individual electronic product of new generation that can be customized.
Traditional chemical subtractive process circuit production technique mainly passes through substrate preparation, route etching, element welding and insulation
The process such as encapsulation prepare circuit.This kind of processing technology is primarily adapted for use in the forming of planar circuit, can be used for preparing flexible electrical
Sub-circuit, but cannot achieve the preparation of 3 D stereo circuit, and operating process very complicated, it needs to make dedicated circuit and covers
Film, metal material waste is serious, needs using various chemical medicaments and special raw material, chemical sewage, the huge sum of money generated after etching
It is serious to belong to waste liquid environmental pollution.
It is at present a kind of non-contact, no pressure using spray printing, laser direct forming as the addition manufacturing process of representative, without printing plate
Circuit reproduction technology, it can be achieved that complex three-dimensional circuit structure it is quick design and processing.Its process flow be by injection molding or
Die-casting process forming three-dimensional structure carrier first forms conduction in carrier surface by spray printing conductive ink or laser activation processing
Then route increases the metal layer thickness of conducting wire, finally in three-dimensional structure surface adhered with electronic by plating or chemical plating
Element is formed three-dimensional space and the combined stereo circuit of electric function.Due to needing to prepare using special material
Three-dimensional structure carrier, and carry out plating or chemical plating, manufacturing cost it is high；The injection molding of carrier and line pattern
It generates and needs dedicated mold and equipment and stringent environmental condition, energy consumption is high and equipment manufacturing cost and maintenance cost are high；This
Outer laser activation and metal plating process can have an impact circuit precision, to cause the qualification rate of product low.
Either " subtractive process " still " addition process ", equipment investment, material selection, in terms of all exist one
Determine defect, can not realize that inexpensive, easy to operate, to have both flexible circuit and stereo circuit special under environmental condition at room temperature and atmospheric ionization
The personalized circuit customization of sign.
Summary of the invention
The technical problem to be solved by the present invention is to how realize the manufacture of stereo circuit at normal temperatures and pressures.
For this purpose, the present invention provides a kind of liquid metal stereo circuit manufacturing method based on 3D printing technique, packet
Include following steps:
S1: threedimensional model corresponding with the three-dimensional structure of stereo circuit to be manufactured is established, and according to the stereo circuit
Line alignment establish hollow duct inside the threedimensional model；
S2: by 3D printing technique, the three dimensional model printing that the step S1 is obtained is at 3D solid；
S3: liquid metal is filled in the hollow duct of the 3D solid.
Preferably, after the step S3 further include:
S4: electronic component pin is inserted into the corresponding position for the 3D solid that the step S3 is obtained.
Preferably, the step S1 further include: according to the line alignment of the stereo circuit on the threedimensional model surface
Electronic component pin jack is set.
Preferably, the step S1 further include: the liquid metal is set in the intersection point of the hollow duct and/or turning
Perfusing hole and/or exhaust outlet.
Preferably, after the step S4 further include: to the electronic component pin jack, the liquid metal
Perfusing hole and/or exhaust outlet are blocked.
Preferably, the step S2 includes:
The threedimensional model is layered according to the STL formatted file of the threedimensional model, slicing treatment；
Printing head and forming board are preheated；
The three dimensional model printing that control printing head successively obtains the step S1 is at 3D solid.
Preferably, the step S3 includes: that the liquid metal is filled the hollow duct using micro-injection system.
Preferably, the liquid metal include: gallium, gallium-indium alloy, gallium-indium-tin alloy, gallium indium red brass, bismuth indium alloy,
Bismuth indium stannum alloy, bismuth indium red brass.
Preferably, the liquid metal be gallium indium bianry alloy, gallium indium mass ratio range be 75.5%: 24.5%~
90%: 10%.
On the other hand, the present invention also provides a kind of liquid metal using any one of the above based on 3D printing technique is vertical
Liquid metal stereo circuit made of the manufacturing method of body circuit.
Compared with prior art, the present invention its main distinction and beneficial effect are:
The present invention can prepare flexible 3 D knot using 3D printing technique using thermoplastic polyurethane elastomer as processing object
Structure entity and the hollow duct being consistent with predetermined conducting wire can be free without using special equipments such as mold, injection molding machines
The personalized three-dimensional structure entity of design, manufacture and the conducting wire for moving towards complexity；In addition, the present invention is by three-dimensional structure
The mode for carrying perfusion liquid metal in intracorporal hollow duct constitutes three-dimensional conducting wire, does not need to use and contains special catalyst
Or the modified material of the special compositions such as laser activation metal, and then eliminate the works such as modified surface, laser activation and metal deposition
Skill process；Since conducting wire is constituted in three-dimensional structure carrier inside, insulation-encapsulated step can be removed from；It is inserted by pin
Mode disposes electronic component in three-dimensional structure solid object surface and carries out encapsulating encapsulation to pin interface, without welding or pastes behaviour
Make.
Compared with existing preparation process, the cost of manufacture of stereo circuit can not only be greatly reduced, and simplify installation,
Production process can realize free, quick, economic personalized designs, the manufacture of stereo circuit at normal temperatures and pressures.It is filling
Divide to utilize and there is greater advantage in liquid metal and 3D printing manufacturing process and Development of Novel flexible stereo circuit technology of preparing.
Detailed description of the invention
The features and advantages of the present invention will be more clearly understood by referring to the accompanying drawings, and attached drawing is schematically without that should manage
Solution is carries out any restrictions to the present invention, in the accompanying drawings:
Fig. 1 shows the process signal of the manufacturing method of the liquid metal stereo circuit the present invention is based on 3D printing technique
Figure；
Fig. 2 shows the multi-panel LED flexible stereo lamp holders using the manufacturing method of the present invention manufacture of the offer of embodiment 2
Structural schematic diagram；
Fig. 3 shows the flexible mobile phone containing built-in antenna of the offer of embodiment 3 manufactured using the manufacturing method of the present invention
The structural schematic diagram of shell
Specific embodiment
Below in conjunction with attached drawing, embodiments of the present invention is described in detail.
Embodiment 1
As shown in Figure 1, a kind of liquid metal stereo circuit manufacturing method based on 3D printing technique, comprising the following steps:
S1: threedimensional model corresponding with the three-dimensional structure of stereo circuit to be manufactured is established, and according to the stereo circuit
Line alignment establishes hollow duct inside the threedimensional model；
S2: by 3D printing technique, the three dimensional model printing that the step S1 is obtained is at 3D solid；
S3: liquid metal is filled in the hollow duct of the 3D solid；
Specifically, step S1: according to the design requirement of stereo circuit, using UG NX, Solidworks, ProE
The Computerized three-dimensionals modeling software such as Wildfire establishes threedimensional model corresponding with the three-dimensional structure of stereo circuit to be manufactured, and root
Hollow duct is established inside the threedimensional model according to the line alignment of the stereo circuit, a STL file is exported and is used for
3D printing system is instructed to print the threedimensional model.Wherein, the cross sectional shape of hollow duct can be square or round, and section is just
Rectangular side length or round diameter range are more excellent in 0.5~1.5mm.It wherein preferably, can if using rigid printed material
Electronic component pin jack is arranged on the threedimensional model surface according to the line alignment of the stereo circuit, if using
Be flexible print material, then can not have to setting electronic component pin jack, electronic component is directly inserted through 3D
On the 3D solid of printing.Furthermore it is possible to which the perfusion of the liquid metal is arranged in the intersection point of the hollow duct and/or turning
Mouth and/or exhaust outlet.The perfusing hole and/or exhaust outlet of the liquid metal and electronic component pin jack it is direct preferably
For 2mm.Wherein, to avoid that infiltration, short circuit occur between the too small liquid metal conducting wire that may cause perfusion of runner spacing, so
The distance between adjacent hollow duct should be greater than 2mm.
Specifically, the STL formatted file of the obtained stereo circuit threedimensional model of step S1 step S2: is imported into 3D printing control
In system Repetier-Host processed, layer high parameter range is set as 0.25~0.4mm, according to the STL format of the threedimensional model
File is layered the threedimensional model, slicing treatment, specifically, passing through dedicated Slice Software in 3D printing control system
Slic3r is layered threedimensional model, slicing treatment, and every layer of data conversion is become motion profile code, to instruct
The printing-forming of subsequent 3D solid.
Wherein preferably, fusion sediment 3D printing system can be used and use thermoplastic polyurethane elastomer for material
Material, the three dimensional model printing that the step S1 is obtained is at 3D solid.Specifically, printing diameter of meeting and discussing can be used being
The fusion sediment 3D printing system of 0.5mm and use the transparent thermoplastic polyurethane elastomer of diameter 1.75mm for material, if
Determining print speed is 10~15mm/s.
Printing head and forming board are preheated, specifically, printing head is preheating to 220 by temperature control system~
250 DEG C, forming board is preheating to 60~80 DEG C, and then controlling printing head according to the motion profile code of generation successively will be described
The three dimensional model printing that step S1 is obtained is at 3D solid.Specifically, print speed is setting in the print procedure of first layer
The 80% of value is to guarantee that it is effectively Nian Jie that first floor printed material can be formed between forming board.Complete the printing of first layer structure
Afterwards, spray head rises 0.25~0.4mm according to the high setting value of layer, then carries out the printing of second layer structure, and layer-by-layer duplicate printing is straight
To the manufacture for completing entire stereo circuit three-dimensional structure carrier.
Specifically, step S3: liquid metal is filled in the hollow duct of the 3D solid；Wherein preferably, it uses
The liquid metal is filled the hollow duct by micro-injection system.Specifically, can be used by micro-injection pump, 20ml mono-
Secondary property syringe, internal diameter 1.65mm dispensing needle head (outer diameter 2.1mm), 1.6mm female Luer and the PVC transparent of internal diameter 1.5mm are soft
Liquid metal is injected the hollow flow in three-dimensional structure entity by perfusing hole by the flux controllable micro-injection system of pipe composition
Road.Wherein, the liquid metal of perfusion include: gallium, gallium-indium alloy, gallium-indium-tin alloy, gallium indium red brass, bismuth indium alloy,
Bismuth indium stannum alloy, bismuth indium red brass.Wherein preferred, the liquid metal is gallium indium bianry alloy, gallium indium mass ratio model
Enclose is 75.5%: 24.5%~90%: 10%.It, can be according to the complexity and actual perfusion of flow passage structure in filling process
Effect converts exhaust outlet for component pin jack, exhaust outlet or perfusing hole uses, it is ensured that liquid metal fills all runners
Space.The liquid metal of spilling is cleared up after liquid metal fills entire flow passage system.The liquid metal of injection can be by fluid
Circuit state work.Optionally, it is reused after can also being solidified, at this point, need to only be carried out using cold air to printing filling piece
It is cooling, it can be obtained the stereo circuit after solidifying.
Preferably, it can also include step S4: electronic component pin is inserted into the 3D solid that the step S3 is obtained
Corresponding position.Wherein preferably, according to circuit design requirements, each independent electronic component pin is inserted into three-dimensional structure entity
In specify installation connecting hole, using 705 silicon rubber to all pin jacks, perfusing hole and/or exhaust outlet carry out block and electricity
The fixation of sub- component.
Embodiment 2
On the other hand, the present invention also provides a kind of stereo circuits that the manufacturing method using embodiment 1 makes, such as:
Multi-panel LED flexible stereo lamp holder as shown in Figure 2
Wherein, the step of making multi-panel LED flexible stereo lamp holder using the manufacturing method of embodiment 1 is as follows:
Step 1: according to the design requirement of multi-panel LED flexible stereo lamp holder, using Computerized three-dimensional modeling software UG
NX10.0 constructs corresponding with multi-panel LED flexibility lamp holder 2A three-dimensional structure shown in Fig. 2 three-dimensional model, and according to lamp holder inside
The trends of design of conducting wire creates cross sectional shape inside model as circle, and diameter of section is the hollow duct of 1mm, while
The perfusing hole and LED lamp bead pin jack that diameter is 2mm is respectively set in the two-end-point of runner, obtains and predetermined three-dimensional circuit pattern
And the corresponding threedimensional model of physical form and STL formatted file is exported, for instructing 3D printing system to prepare flexible liquid gold
Belong to stereo circuit.
Step 2: stl file is imported in 3D printing control system Repetier-Host, sets layer high parameter as 0.3mm,
Threedimensional model is layered by Slice Software Slic3r dedicated in control system, slicing treatment, and by every layer of data
It is converted into motion profile code, to instruct the printing-forming of subsequent 3D solid.
Step 3: the fusion sediment 3D printing system that starting jet diameters are 0.4mm, with the transparent thermoplastic of diameter 1.75mm
Property polyurethane silk material be printed material, set print speed as 10mm/s, printing head be preheating to 250 by temperature control system
DEG C, forming board is preheating to 60 DEG C, and the printing of 3D solid is then carried out according to the motion profile code of generation.In first layer
In print procedure, print speed is setting value 80% to guarantee that first floor printed material can be formed effectively between forming board
Bonding.After the printing for completing first layer structure, spray head rises 0.3mm according to the high setting value of layer, then carries out second layer structure
Printing, layer-by-layer duplicate printing is until complete the manufacture of entire stereo circuit three-dimensional structure carrier.
Step 4: use is by micro-injection pump, 20ml disposable syringe, internal diameter 1.65mm dispensing needle head (outer diameter
2.1mm), the flux controllable micro-injection system that the PVC transparent hose of 1.6mm female Luer and internal diameter 1.5mm form passes through
Perfusing hole 2E is by Liquid metal Ga In10It injects hollow duct and forms conducting wire 2D.It, can be according to flow passage structure in filling process
Complexity and actual perfusion effect convert exhaust outlet for component pin jack or perfusing hole use, it is ensured that liquid gold
Category fills all flow channel spaces.The liquid metal of spilling is cleared up after liquid metal fills entire flow passage system.
Step 5: according to the design requirement of multi-panel LED flexible stereo lamp holder, by LED lamp bead 2B pin insertion holder surface
Pin jack 2C blocks all perfusing hole 2E and pin jack 2C using 705 silicon rubber, completes all operations step.
Embodiment 3
The present invention also provides a kind of stereo circuits that the manufacturing method using embodiment 1 makes, such as: as shown in figure 3,
Flexible hand casing containing built-in antenna.
Wherein, the step of making the flexible hand casing containing built-in antenna using the manufacturing method of embodiment 1 is as follows:
Step 1: according to the design requirement of the flexible hand casing containing built-in antenna, using Computerized three-dimensional modeling software UG
NX10.0 constructs stereoscopic three-dimensional model corresponding with the form flexible mobile phone casing 3A three-dimensional structure shown in Fig. 3 containing built-in antenna, and
It creates cross sectional shape inside model according to the route trends of design of built-in antenna to be square, sectional dimension is the hollow of 1mm
Runner, while the perfusing hole and exhaust outlet that diameter is 2mm is respectively set in the two-end-point of runner, it obtains and predetermined stereo circuit figure
Case and the corresponding threedimensional model of physical form simultaneously export STL formatted file, for instructing 3D printing system to prepare flexible liquid
Cubic metal characters or patterns circuit.
Step 2: will stl file import 3D printing control system Repetier-Host in, set layer high parameter as
0.25mm is layered threedimensional model by Slice Software Slic3r dedicated in control system, slicing treatment, and by every layer
Data conversion become motion profile code, to instruct the printing-forming of subsequent 3D solid.
Step 3: the fusion sediment 3D printing system that starting jet diameters are 0.5mm, with the transparent thermoplastic of diameter 1.75mm
Property polyurethane silk material be printed material, set print speed as 12mm/s, printing head be preheating to 250 by temperature control system
DEG C, forming board is preheating to 60 DEG C, and the printing of 3D solid is then carried out according to the motion profile code of generation.In first layer
In print procedure, print speed is setting value 80% to guarantee that first floor printed material can be formed effectively between forming board
Bonding.After the printing for completing first layer structure, spray head rises 0.25mm according to the high setting value of layer, then carries out second layer structure
Printing, layer-by-layer duplicate printing is until complete the manufacture of entire stereo circuit three-dimensional structure carrier.
Step 4: use is by micro-injection pump, 20ml disposable syringe, internal diameter 1.65mm dispensing needle head (outer diameter
2.1mm), the flux controllable micro-injection system that the PVC transparent hose of 1.6mm female Luer and internal diameter 1.5mm form passes through
Perfusing hole 3C is by Liquid metal Ga In24.5It injects hollow duct and forms built-in antenna 3B.Entire runner system is filled to liquid metal
The liquid metal that spilling is cleared up after system is blocked all perfusing hole 3C and exhaust outlet 3D using 705 silicon rubber, completes all operations
Step.
The present invention can prepare flexible 3 D knot using 3D printing technique using thermoplastic polyurethane elastomer as processing object
Structure entity and the hollow duct being consistent with predetermined conducting wire can be free without using special equipments such as mold, injection molding machines
The personalized three-dimensional structure entity of design, manufacture and the conducting wire for moving towards complexity；In addition, the present invention is by three-dimensional structure
The mode for carrying perfusion liquid metal in intracorporal hollow duct constitutes three-dimensional conducting wire, does not need to use and contains special catalyst
Or the modified material of the special compositions such as laser activation metal, and then eliminate the works such as modified surface, laser activation and metal deposition
Skill process；Since conducting wire is constituted in three-dimensional structure carrier inside, insulation-encapsulated step can be removed from；It is inserted by pin
Mode disposes electronic component in three-dimensional structure solid object surface and carries out encapsulating encapsulation to pin interface, without welding or pastes behaviour
Make.
Compared with existing preparation process, the cost of manufacture of stereo circuit can not only be greatly reduced, and simplify installation,
Production process can realize free, quick, economic personalized designs, the manufacture of stereo circuit at normal temperatures and pressures.It is filling
Divide to utilize and there is greater advantage in liquid metal and 3D printing manufacturing process and Development of Novel flexible stereo circuit technology of preparing.
Although the embodiments of the invention are described in conjunction with the attached drawings, but those skilled in the art can not depart from this hair
Various modifications and variations are made in the case where bright spirit and scope, such modifications and variations are each fallen within by appended claims
Within limited range.
Claims (10)
1. a kind of liquid metal stereo circuit manufacturing method based on 3D printing technique, which comprises the following steps:
S1: threedimensional model corresponding with the three-dimensional structure of stereo circuit to be manufactured is established, and according to the line of the stereo circuit
Road trend establishes hollow duct inside the threedimensional model；
S2: by 3D printing technique, the three dimensional model printing that the step S1 is obtained is at 3D solid；
S3: liquid metal is filled in the hollow duct of the 3D solid.
2. the liquid metal stereo circuit manufacturing method according to claim 1 based on 3D printing technique, which is characterized in that
After the step S3 further include:
S4: electronic component pin is inserted into the corresponding position for the 3D solid that the step S3 is obtained.
3. the liquid metal stereo circuit manufacturing method according to claim 2 based on 3D printing technique, which is characterized in that
The step S1 further include: electronic component pipe is arranged on the threedimensional model surface according to the line alignment of the stereo circuit
Foot socket.
4. the liquid metal stereo circuit manufacturing method according to claim 3 based on 3D printing technique, which is characterized in that
The step S1 further include: perfusing hole and/or the row of the liquid metal are set in the intersection point of the hollow duct and/or turning
Port.
5. the liquid metal stereo circuit manufacturing method according to claim 4 based on 3D printing technique, which is characterized in that
After the step S4 further include: perfusing hole and/or exhaust to the electronic component pin jack, the liquid metal
Mouth is blocked.
6. the liquid metal stereo circuit manufacturing method described in -5 any one based on 3D printing technique according to claim 1,
It is characterized in that, the step S2 includes:
The threedimensional model is layered according to the STL formatted file of the threedimensional model, slicing treatment；
Printing head and forming board are preheated；
The three dimensional model printing that control printing head successively obtains the step S1 is at 3D solid.
7. the liquid metal stereo circuit manufacturing method according to any one of claims 1-5 based on 3D printing technique,
It is characterized in that, the step S3 includes: that the liquid metal is filled the hollow duct using micro-injection system.
8. the liquid metal stereo circuit manufacturing method according to any one of claims 1-5 based on 3D printing technique,
It is characterized in that, the liquid metal includes: gallium, gallium-indium alloy, gallium-indium-tin alloy, gallium indium red brass, bismuth indium alloy, bismuth indium
Tin alloy, bismuth indium red brass.
9. the liquid metal stereo circuit manufacturing method according to claim 8 based on 3D printing technique, which is characterized in that
The liquid metal is gallium indium bianry alloy, and gallium indium mass ratio range is 75.5%:24.5%~90%:10%.
10. a kind of liquid metal stereo circuit based on 3D printing technique, which is characterized in that by any in claim 1~9
Liquid metal stereo circuit manufacturing method described in one based on 3D printing technique is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510857645.1A CN106817846B (en) | 2015-11-30 | 2015-11-30 | Liquid metal stereo circuit and its manufacturing method based on 3D printing technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510857645.1A CN106817846B (en) | 2015-11-30 | 2015-11-30 | Liquid metal stereo circuit and its manufacturing method based on 3D printing technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106817846A CN106817846A (en) | 2017-06-09 |
| CN106817846B true CN106817846B (en) | 2019-02-15 |
Family
ID=59156500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510857645.1A Active CN106817846B (en) | 2015-11-30 | 2015-11-30 | Liquid metal stereo circuit and its manufacturing method based on 3D printing technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106817846B (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109927288B (en) * | 2017-12-18 | 2021-12-03 | 上海微电子装备（集团）股份有限公司 | Additive manufacturing device and manufacturing method |
| CN108112188A (en) * | 2017-12-20 | 2018-06-01 | 深圳大学 | A kind of welding method based on liquid metal |
| CN108462019A (en) * | 2018-05-04 | 2018-08-28 | 北京梦之墨科技有限公司 | A kind of conducting connecting part and its manufacturing method |
| CN108507455A (en) * | 2018-05-23 | 2018-09-07 | 浙江大学 | A kind of multifunction flexible sensor, production method and application |
| CN109014208B (en) * | 2018-09-21 | 2023-06-30 | 北京梦之墨科技有限公司 | Liquid metal printer |
| CN109605356B (en) * | 2018-11-16 | 2021-06-25 | 中国科学院理化技术研究所 | Self-driven snake-shaped motion-imitating liquid metal flexible machine |
| CN109270629A (en) * | 2018-11-27 | 2019-01-25 | 苏州席正通信科技有限公司 | A kind of three-dimensional optical waveguide of 3D printing |
| CN110186487B (en) * | 2019-06-03 | 2020-10-27 | 北京航空航天大学 | Variable-resistance flexible sensing unit and manufacturing method thereof |
| CN112388977A (en) * | 2019-08-15 | 2021-02-23 | 杜晖 | 3d printing and post-processing method for manufacturing three-dimensional circuit |
| CN112165766B (en) | 2020-10-30 | 2021-05-04 | 哈尔滨工业大学（深圳） | Liquid metal flexible electron and preparation method and application thereof |
| CN112519210A (en) * | 2020-12-02 | 2021-03-19 | 临沂大学 | 3D printing device and method for repairing circuit board fault |
| CN113078453B (en) * | 2021-04-07 | 2022-12-02 | 中南大学 | Wrist strap |
| CN114126254A (en) * | 2021-12-14 | 2022-03-01 | 江西制造职业技术学院 | Preparation method of three-dimensional circuit substrate |
| CN115139511B (en) * | 2022-07-04 | 2023-06-02 | 北京航空航天大学 | Microfluidic antenna based on liquid metal and preparation method |
| CN115084836B (en) * | 2022-07-04 | 2023-05-26 | 北京航空航天大学 | Liquid metal driving injection method of micro-fluid antenna |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AUPR399101A0 (en) * | 2001-03-27 | 2001-04-26 | Silverbrook Research Pty. Ltd. | An apparatus and method(ART105) |
| GB2404929A (en) * | 2003-08-14 | 2005-02-16 | Pixie Developments Ltd | Handrail |
| CN102802346B (en) * | 2011-05-27 | 2015-08-05 | 中国科学院理化技术研究所 | A kind of liquid metal printed circuit board (PCB) and preparation method thereof |
| US20140029215A1 (en) * | 2012-07-27 | 2014-01-30 | Logitech Europe S.A. | Wireless communications apparatus |
| CN104108248A (en) * | 2013-04-19 | 2014-10-22 | 中国科学院理化技术研究所 | Liquid metal ink-jet printing equipment and printing method |
| CN105033256B (en) * | 2015-08-06 | 2017-06-16 | 中国科学院理化技术研究所 | A kind of low-melting-point metal freezes print system and method |
| CN105282981B (en) * | 2015-11-11 | 2018-02-23 | 华中科技大学 | A kind of circuit board 3D printing method with space multistory circuit |
| CN105365223B (en) * | 2015-12-08 | 2017-10-20 | 浙江展邦电子科技有限公司 | A kind of method that utilization 3D printing technique prepares wiring board |
-
2015
- 2015-11-30 CN CN201510857645.1A patent/CN106817846B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106817846A (en) | 2017-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106817846B (en) | Liquid metal stereo circuit and its manufacturing method based on 3D printing technique | |
| CN105592640B (en) | A kind of preparation method of flexible printed circuit | |
| Yu et al. | 3D printing for functional electronics by injection and package of liquid metals into channels of mechanical structures | |
| CN102280390B (en) | Assembling has the method for the semiconductor device of radiator | |
| CN107803504A (en) | A kind of suspension printing-forming method of liquid metal three-dimensional macro structure | |
| CN101507377A (en) | An embedded electronic device and method for manufacturing an embedded electronic device | |
| CN116872434A (en) | Method for producing an electromechanical structure and device for carrying out the method | |
| CN107251664B (en) | Stereo circuit tectosome | |
| CN103426995A (en) | Substrate for optical semiconductor apparatus, method for manufacturing the same, optical semiconductor apparatus, and method for manufacturing the same | |
| CN106793536A (en) | A kind of flexible electronic preparation method based on microflow control technique | |
| CN108381903A (en) | A kind of flexible circuit 3 D-printing method that macromolecule liquid metal prints altogether | |
| CN106507579A (en) | Integrated circuit board manufacturing method and device based on 3D printing technique | |
| CN108770220A (en) | A kind of circuit preparation method | |
| KR20210003906A (en) | Microfluidic device and its manufacturing method, microfluidic system | |
| CN109712955A (en) | A kind of package module and preparation method thereof going out pin based on PCB ontology | |
| CN103334021A (en) | Manufacturing process of micro-channel core body | |
| CN204067330U (en) | A kind of substrate chip support C SP packaging part | |
| CN110024116A (en) | The encapsulation of stacked tubes core cavity | |
| CN110449194A (en) | A kind of micro-electrode chip manufacture craft | |
| CN202514178U (en) | Integrated stereo circuit device housing | |
| CN109231149A (en) | A kind of preparation method and product of fatigue durability flexible electronic device | |
| CN103511890A (en) | LED injection molding module | |
| CN102476458B (en) | Metamaterial preparation method | |
| CN103413888A (en) | Pouring-type thermoelectric device and manufacturing method thereof | |
| CN106168862B (en) | Wire pattern forming method, fingerprint sensing circuit board and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20170609 Assignee: BEIJING DREAM INK TECHNOLOGIES Co.,Ltd. Assignor: TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY OF THE CHINESE ACADEMY OF SCIENCES Contract record no.: X2021110000040 Denomination of invention: Liquid metal stereo circuit based on 3D printing process and its manufacturing method Granted publication date: 20190215 License type: Exclusive License Record date: 20210924 |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240222 Address after: 100081 room 9009, 9 / F, 65 North Fourth Ring Road West, Haidian District, Beijing Patentee after: BEIJING DREAM INK TECHNOLOGIES Co.,Ltd. Country or region after: China Address before: No. 29 East Zhongguancun Road, Haidian District, Beijing 100190 Patentee before: TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY OF THE CHINESE ACADEMY OF SCIENCES Country or region before: China |