CN202514177U - Integrated integrated-circuit device housing - Google Patents
Integrated integrated-circuit device housing Download PDFInfo
- Publication number
- CN202514177U CN202514177U CN2011205348304U CN201120534830U CN202514177U CN 202514177 U CN202514177 U CN 202514177U CN 2011205348304 U CN2011205348304 U CN 2011205348304U CN 201120534830 U CN201120534830 U CN 201120534830U CN 202514177 U CN202514177 U CN 202514177U
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- film
- integrated circuit
- integrated
- circuit film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
The utility model relates to the field of a printed circuit and in particular relates to a printed circuit board. An integrated integrated-circuit device housing comprises a device housing and a printed circuit film, wherein the printed circuit film is provided with an integrated circuit and mounted in the device housing. Because the above technology scheme is adopted, the printed circuit film is glued on the device housing in the utility model. The film and plastic gluing technology is once completed in an injection mould. The printed circuit film and the plastic housing are firmly integrated, thereby guaranteeing the printed circuit film not to desquamate and not to be oxidated without escaping of small solvent molecules.
Description
Technical field
The utility model relates to the printed circuit technique field, is specifically related to a kind of printed circuit board (PCB).
Background technology
The layout of electronic circuit to the relatively harsher situation of space requirement in, commonly used to thick-film printed circuit.The widely used thick-film printed circuit of electron trade generally adopts double faced adhesive tape and plastics main part bonding at present.The bonding problem that exists adhesive surface not to be convinced of this mode, is moulded stick portion and is had local gap film, and easy oxidation of long duration is come unstuck, and volatile in air, the generation of adhesive solvent micromolecule polluted.
In manufacturing process, exist the cost human cost bigger, production efficiency is lower, and percent defective is high, problems such as production cost height.Moreover the limitation of a large amount of miniature electrical equipment inner spaces makes thick-film printed circuit very little with the bonding operation possibility of double faced adhesive tape and plastics main part.
The utility model content
The purpose of the utility model is, a kind of integrated circuit arrangement shell is provided, and solves above technical problem.
The technical problem that the utility model solved can adopt following technical scheme to realize:
Integrated circuit arrangement shell comprises a device housings, it is characterized in that, also comprises a printed circuit film, and said printed circuit film is one to be provided with the printed circuit film of integrated circuit, and said printed circuit film is arranged in the said device housings;
Variation along with said device housings surface structure; Said integrated circuit printed circuit film can be broken through the limitation of planar circuit pattern and present different three-dimensional shape structures; So that make full use of the device interior arrangement space; Reach the rationalization layout of electronic circuit, make device structure obtain maximum using.
Said device housings preferably adopts the plastic casing of a plastic material, and said printed circuit film adopts integrated through injection molding to change into the type technology and is embedded in said device housings inside.Plastic plasticity is strong, can realize conveniently that the integrated through injection molding of printed circuit film and plastic casing changes into type.
The printed circuit film of the utility model adopts injection molding process to be arranged in the device housings.The utility model with film, mould adhesion technique disposable completion in injection mold, printed circuit film and device housings are combined into one securely, do not come off, not oxidation, solvent-free micromolecule overflow; And printed circuit film is integrated adhesion-molded in the process procedure of plastic parts moulding, need not the bonding again operating space of double faced adhesive tape, makes electronic devices and components possess the broad space to further miniaturization, microminiaturized development.The utility model had both overcome printed circuit film with double faced adhesive tape and the bonding all drawbacks of plastic casing, had also simplified operation, had reduced production cost.
Said printed circuit film comprises a thin layer, and said thin layer is provided with an integrated circuit component layer, and said integrated circuit component layer top also is coated with a protective film layer.
The thickness of said thin layer is 0.05～0.25mm.
Can on said integrated circuit component layer, print additional one deck dielectric ink layer according to different purposes.On said edge ink lay, can also print one deck hot-melt adhesive layer.
One side surface of said device housings is provided with at least two streamlined convexities; Said streamlined convexity is arranged along the plastics pouring direction in the plastic parts moulding technology; Being arranged under the prerequisite that does not change the plastic structural dimensions of said streamlined convexity sponges the part that printed circuit film is stretched and prolongs in injection moulding process, and then eliminates fold; Particularly eliminate the sharp-pointed wrinkle angle of fold place, avoided the integrated circuit component fault rupture that causes because of said sharp-pointed wrinkle angle;
At least two said streamlined protruding connections, form a waveform bending structure.So that absorb the extension elongation part of printed circuit film better, make printed circuit film smoothly paste clothes on the whole, and be combined as a whole securely with plastic.So both guaranteed circuit clear, guaranteed again that printed circuit film does not come off, not oxidation, solvent-free micromolecule overflow environmental protection and durable.
The utility model also comprise one with said printed circuit film in the Wiring port that is connected of integrated circuit component layer, said Wiring port is arranged on outside the said device housings.Integrated circuit component layer in the said printed circuit film can be comparatively flexible the said Wiring port that passes through be connected with external devices or circuit.
Beneficial effect: owing to adopted technique scheme; The utility model is inner at device housings with integrated circuit printed circuit film plastic packaging; Film, mould adhesion technique disposable completion in injection mold; Printed circuit film and device housings are combined into one securely, have do not come off, advantage such as not oxidation, solvent-free micromolecule effusion.
Description of drawings
Fig. 1 is the schematic cross-section of the utility model;
Fig. 2 is the partial cross section sketch map of the utility model.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and be easy to understand with effect and understand, below in conjunction with the further elaboration the utility model of concrete diagram.
With reference to Fig. 1; Integrated circuit arrangement shell; Comprise a device housings 1, also comprise a printed circuit film 2, printed circuit film 2 is arranged on the inside of device housings 1; Along with the variation of the surface structure of device housings, printed circuit film 2 no longer is confined to the pattern of planar circuit and presents different stereochemical structures.The device housings 1 preferred plastic casing that adopts plastics to process, printed circuit film 2 adopts integrated through injection molding to change into the type technology and is arranged on the device housings 1.Plastic plasticity is strong, can realize conveniently that the printed circuit film 2 and the integrated through injection molding of device housings 1 change into type.The printed circuit film 2 of the utility model adopts injection molding process to be arranged on the surface of device housings 1.The utility model with film, mould adhesion technique disposable completion in injection mold, printed circuit film 2 is combined into one with device housings 1 securely, does not come off, not oxidation, solvent-free micromolecule overflow; And printed circuit film 2 is integrated adhesion-molded in the process procedure of plastic parts moulding, need not the bonding again operating space of double faced adhesive tape, makes electronic devices and components possess the broad space to further miniaturization, microminiaturized development.The utility model had both overcome the bonding all drawbacks of printed circuit film 2 usefulness double faced adhesive tapes and device housings 1, had also simplified operation, had reduced production cost.
Printed circuit film 2 comprises that a thickness is the thin layer of 0.05～0.25mm;, be provided with above that with nanometer silver paste printing ink and print the printed circuit that generates as circuit substrate with this thin layer, on printed circuit, can be provided with integrated circuit component; Like surface mount elements, process the integrated circuit component layer.Integrated circuit component layer top also is coated with a protective film layer.Can above the integrated circuit component layer, print additional one deck dielectric ink layer according to different purposes, in order to the electrical characteristic of accentuator.On the dielectric ink layer, can also print one deck hot-melt adhesive layer.
With reference to Fig. 1, Fig. 2; One side surface of device housings 1 is provided with at least two streamlined protruding 21, the streamlined protruding 21 plastics pouring directions in the plastic parts moulding technology and arranges, streamlined protruding 21 be arranged under the prerequisite that does not change the plastic structural dimensions; Sponge the part that printed circuit film 2 is stretched and prolongs in injection moulding process; And then the elimination fold, the integrated circuit component fault rupture that causes because of said sharp-pointed wrinkle angle is avoided at the sharp-pointed wrinkle angle of particularly having eliminated fold place.Be connected to form a waveform bending structure at least two streamlined protruding 21,, make level and smooth on the whole subsides of printed circuit film 2 obey, and be combined as a whole securely with device housings 1 so that absorb the extension elongation part of printed circuit film 2 better.So both guaranteed circuit clear, guaranteed again that printed circuit film 2 does not come off, not oxidation, solvent-free micromolecule overflow environmental protection and durable.
The utility model also comprise one with printed circuit film 2 in the Wiring port 3 that is connected of integrated circuit component layers, Wiring port 3 is arranged on outside the device housings 1.Integrated circuit component layer in the printed circuit film 2 can be comparatively flexible the Wiring port 3 that passes through be connected with external devices or circuit.
Thin layer preferably adopts transparent thin film layer.The device housings 1 preferred transparent equipment shell that adopts transparent plastic to process is so that make the integrated circuit on the printed circuit film transparent visible.
The utility model can adopt that following Shooting Technique is one-body molded to be processed:
1) manufacturing process of integrated circuit printed circuit film 2; Comprise: adopt silk screen printing on 0.05～0.25 film of coupling the nanometer-level silver paste printing ink; Form silver medal slurry face, and use the two-layer thin layer that silver-colored slurry face arranged that the paster circuit of integrated circuit etc. is clamped the formation thick-film printed circuit.Can print additional one deck dielectric ink at silver slurry face according to different purposes, form an insulating barrier.Can also the printing heat hot melt adhesive on insulating barrier.
2) shaping process of integrated circuit printed circuit film 2 comprises: the geometry according to electronic devices and components adopts laser or shearing die to cut into the integrated circuit printed circuit film 2 of required form; Again according to the geometry of electronic devices and components; After in the die cavity of the integrated circuit printed circuit film 2 embedding injection molds after employing gas or hydraulic pressure tool will be sheared; The plastics that adopt 200～300 ℃ of molten conditions are under the pressure that is not higher than 100pa, through being not more than 1mm
2Cast gate and in 1～3 second, inject in the die cavity, carry out injection mo(u)lding.
3) film is moulded integral process, comprising: the interior plastics with molten condition of die cavity that orthopedic integrated circuit printed circuit film 2 are embedded into injection mold carry out injection mo(u)lding.
The wall inboard, die cavity chamber of injection mold is through calculating film elongatedness direction, again along at least two streamlined convexities of elongatedness direction setting.At least two streamlined convexities are connected to form a waveform bending structure.Can be under the constant situation of plastic contour structures; Prolong the surface area of printed circuit film 2 and plastic stick portion; And then can in forming process, absorb the part of printed circuit film 2 extension elongations; Eliminate fold, make printed circuit film 2 whole level and smooth subsides obey, and be combined as a whole securely with device housings 1.So both guaranteed circuit clear, guaranteed again that printed circuit film 2 does not come off, not oxidation, solvent-free molecule overflow environmental protection and durable.
Step 2) in; Printed circuit film 2 after shaping process is sheared comprises a terminals film, and in step 3), the terminals film stretches out die cavity and forms Wiring port 3 outward; Do not participate in injection molding process, so that the printed circuit part can be connected with external devices through terminals.
More than show and described basic principle of the utility model and the advantage of principal character and the utility model.The technical staff of the industry should understand; The utility model is not restricted to the described embodiments; The principle of describing in the foregoing description and the specification that the utility model just is described; Under the prerequisite that does not break away from the utility model spirit and scope, the utility model also has various changes and modifications, and these variations and improvement all fall in the utility model scope that requires protection.The utility model requires protection range to be defined by appending claims and equivalent thereof.
Claims (6)
1. integrated circuit arrangement shell comprises a device housings, it is characterized in that, also comprises a printed circuit film, and said printed circuit film is one to be provided with the printed circuit film of integrated circuit, and said printed circuit film is arranged in the said device housings.
2. integrated circuit arrangement shell according to claim 1 is characterized in that said device housings adopts the plastic casing of a plastic material, and it is inner that said printed circuit film is embedded in said device housings.
3. integrated circuit arrangement shell according to claim 2; It is characterized in that; Said printed circuit film comprises a thin layer, and said thin layer is provided with an integrated circuit component layer, and said integrated circuit component layer top also is coated with a protective film layer.
4. integrated circuit arrangement shell according to claim 3 is characterized in that the thickness of said thin layer is 0.05～0.25mm.
5. according to claim 1,2,3 or 4 described integrated circuit arrangement shells, it is characterized in that a side surface of said device housings is provided with at least two streamlined convexities, at least two said streamlined protruding connections, form a waveform bending structure.
6. integrated circuit arrangement shell according to claim 5 is characterized in that, also comprise one with said printed circuit film in the Wiring port that is connected of integrated circuit component layer, said Wiring port is arranged on outside the said device housings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205348304U CN202514177U (en) | 2011-12-19 | 2011-12-19 | Integrated integrated-circuit device housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205348304U CN202514177U (en) | 2011-12-19 | 2011-12-19 | Integrated integrated-circuit device housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202514177U true CN202514177U (en) | 2012-10-31 |
Family
ID=47066626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205348304U Expired - Fee Related CN202514177U (en) | 2011-12-19 | 2011-12-19 | Integrated integrated-circuit device housing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202514177U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112476947A (en) * | 2020-09-27 | 2021-03-12 | 苏州胜利精密制造科技股份有限公司 | In-mold injection molding printed circuit technology |
-
2011
- 2011-12-19 CN CN2011205348304U patent/CN202514177U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112476947A (en) * | 2020-09-27 | 2021-03-12 | 苏州胜利精密制造科技股份有限公司 | In-mold injection molding printed circuit technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4548199B2 (en) | Method for manufacturing electronic circuit device | |
| CN104270892B (en) | A kind of flexible printed circuit board manufacturing process | |
| EP3250013B1 (en) | Three-dimensional circuit structure body | |
| CN106817846A (en) | Liquid metal three-dimensional circuit based on 3D printing process and manufacturing method thereof | |
| CN103345317A (en) | Touch screen | |
| CN102202477A (en) | Electronic device shell | |
| CN202514178U (en) | Integrated stereo circuit device housing | |
| US20240051202A1 (en) | Molded article, electrical product and method for producing molded article | |
| CN106507579A (en) | Integrated circuit board manufacturing method and device based on 3D printing technique | |
| CN202514177U (en) | Integrated integrated-circuit device housing | |
| CN202503814U (en) | Heavy copper printed circuit board with inner layer and outer layer | |
| CN202353923U (en) | Composite covering film | |
| CN202838642U (en) | Ultra-thin type wireless remote controller | |
| CN103158228B (en) | The manufacturing process of embedding and injection molding circuit in mould | |
| CN215264745U (en) | Intra-mold electronic panel with double-layer thin film structure | |
| CN202474178U (en) | Integrated card reader antenna injection molding plate | |
| CN108000800A (en) | Sub-assembly is touched in a kind of inserted film | |
| CN207983850U (en) | A kind of inserted film is interior to touch sub-assembly | |
| CN203313521U (en) | Flexible circuit connector | |
| CN103511890A (en) | LED injection molding module | |
| CN203104949U (en) | Double-sided PCB (Printed Circuit Board) | |
| CN202841754U (en) | Apparatus panel | |
| TWI728528B (en) | Memory card structure and method for manufacturing the same | |
| CN103057208B (en) | Composite cover film | |
| TWI781702B (en) | In-mold electronics manufacturing process made electronic component and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121031 Termination date: 20171219 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |