CN202512978U - Power-type negative temperature coefficient thermistor and electronic device - Google Patents
Power-type negative temperature coefficient thermistor and electronic device Download PDFInfo
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- CN202512978U CN202512978U CN2012200127032U CN201220012703U CN202512978U CN 202512978 U CN202512978 U CN 202512978U CN 2012200127032 U CN2012200127032 U CN 2012200127032U CN 201220012703 U CN201220012703 U CN 201220012703U CN 202512978 U CN202512978 U CN 202512978U
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- thermistor
- temperature coefficient
- power
- negative temperature
- diaphragm
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Abstract
The utility model is suitable for the technical field of electronics and provides a power-type negative temperature coefficient thermistor and an electronic device. The power-type negative temperature coefficient thermistor comprises a left-end electrode and a right-end electrode corresponding to the left-end electrode, wherein a lower cover, multiple thermistor diaphragms and an upper cover are superposed between the left-end electrode and the right-end electrode in sequence. According to the utility model, by adoption of a superposed sheet structure, the superposed chip type thermistor with the same steady-state current is smaller than a plug-in resistor by more than 60% in area, so that the area of a complete machine can be saved greatly; double-surface mounting can be realized for a PCB (Printed Circuit Board), perforation is prevented and wires are convenient to arrange; and an SMD (Surface Mounted Device) structure is suitable for high-density surface mounting. In addition, the height of the superposed chip type thermistor is less than one fifth that of the plug-in resistor, and thus, the thinning of the electronic device is facilitated.
Description
Technical field
The utility model belongs to electronic technology field, relates in particular to a kind of power-type negative temperature coefficient thermistor and electronic installation.
Background technology
Along with communication, computer with and peripheral product and household electrical appliance constantly develop to chip type, miniaturization and digitlization direction, more and more urgent to the requirement of the chip type of components and parts, miniaturization.Surface mounting technology (SMT) emerges rapidly in recent years, and traditional plug-in mounting circuit is progressively substituted by the SMT circuit, and the electronic devices and components of overwhelming majority band lead-in wire are chip type all.
At electronic circuit power unit (LED drive plate, fluorescent lamp converter, heater etc.), the moment of start can produce a surge current that exceeds hundred times than running current.Resistance is bigger at normal temperatures for power-type negative temperature coefficient thermistor (being called for short PNTC); The surge current of moment can suppress to start shooting; And after accomplishing the effect of inhibition surge current, along with the thermistor body temperature raises, its resistance value will drop to very little degree; The power that consumes can be ignored, thereby guarantees the operate as normal of circuit.
For example, under the normal temperature, serial connection is during 10 Ω PNTC in boot-strap circuit, and the start surge current is: I=220 * 1.414/ (1+10)=28 (A), the 311A (I=220 * 1.414/1=311 (A)) when not using PNTC has reduced more than 10 times, has suppressed surge current effectively.
After the start; Because PNTC generates heat rapidly, temperature raises, its resistance value can quickly fall to a very little rank in the time of Millisecond, generally have only the size in several Europe at zero point; For traditional fixed resistance value current-limiting resistance; This means ohmically power consumption because the decline of resistance has decreased tens to hundreds of times, therefore this design is fit to conversion efficiency and the energy-conservation product that has higher requirements, like Switching Power Supply very much.
After the outage, PNTC is along with the cooling of self, and resistance value can return to nominal zero-power resistance gradually, needs recovery time do not wait to a few minutes in tens seconds.When starting, press the said process circulation again next time.
Traditional power type thermal resistance adopts plug-in unit pin-type structure, and product diameter volume is big, size is high, quality is heavy, is unfavorable for complete machine miniaturization, lightening; Artificial assembly cost is high, and packaging efficiency is low, is unfavorable for large-scale industrial production; Resistivity of material and thermo-responsive index are low, and approximate resistance is bigger when meaning maximum current.
The utility model content
The purpose of the utility model embodiment is to provide a kind of power-type negative temperature coefficient thermistor, is intended to solve the existing bulky problem of thermistor.
The utility model embodiment realizes like this; A kind of power-type negative temperature coefficient thermistor; Comprise left end electrode and the right-hand member electrode relative, be stacked with lower cover, multi-disc thermistor diaphragm and loam cake successively between said left end electrode and right-hand member electrode with said left end electrode.
Another purpose of the utility model embodiment is to provide electronic installation, and said electronic installation adopts above-mentioned power-type negative temperature coefficient thermistor.
The utility model embodiment adopts the lamination sheet type structure, and the lamination sheet type thermistor area with identical steady-state current is little more than 60% than the plug-in mounting resistor, can save the complete machine area greatly; Realize that the PCB two sides mounts, avoid perforation, convenient wiring; The SMD structure, suitable high density surface mounts.In addition, this lamination sheet type thermistor height is not as good as 1/5 of plug-in mounting resistor height, and it is lightening to help electronic installation.
Description of drawings
Fig. 1 is the structural representation (otch section) of the thermistor that provides of the embodiment of the invention;
Fig. 2 is the structural representation (major axis section) of the thermistor that provides of the embodiment of the invention;
Fig. 3 is the equivalent circuit theory figure of the thermistor that provides of the embodiment of the invention;
Fig. 4 is the structural representation of blank diaphragm;
Fig. 5 is the structural representation of thermistor diaphragm;
Fig. 6 is the realization flow figure of the manufacturing approach of the power-type negative temperature coefficient thermistor that provides of the embodiment of the invention;
Fig. 7 is the structural representation of the diaphragm of band line of cut.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
The utility model embodiment adopts the lamination sheet type structure, and the lamination sheet type thermistor area with identical steady-state current is little more than 60% than the plug-in mounting resistor, can save the complete machine area greatly; Realize that the PCB two sides mounts, avoid perforation, convenient wiring; The SMD structure, suitable high density surface mounts.In addition, this lamination sheet type thermistor height is not as good as 1/5 of plug-in mounting resistor height, and it is lightening to help electronic installation.
Be described in detail below in conjunction with the realization of specific embodiment the utility model.
Like Fig. 1, shown in 2; The power-type negative temperature coefficient thermistor that the utility model embodiment provides comprises left end electrode 11 and the right-hand member electrode 12 relative with said left end electrode 11, and 12 at said left end electrode 11 and right-hand member electrode are stacked with lower cover 13, multi-disc thermistor diaphragm 14 and loam cake 15 successively.Because of adopting the lamination sheet type structure, the lamination sheet type thermistor area with identical steady-state current is little more than 60% than the plug-in mounting resistor, can save the complete machine area greatly; Realize that the PCB two sides mounts, avoid perforation, convenient wiring; The SMD structure, suitable high density surface mounts.In addition, this lamination sheet type thermistor height is not as good as 1/5 of plug-in mounting resistor height, and it is lightening to help electronic installation.
In addition, for reducing sintering temperature, protection thermistor diaphragm also can be with the thermal sensitive ceramics diaphragm that is mixed with vitreum, bismuth oxide, cobaltosic oxide, manganese dioxide, nickel oxide and alundum (Al as blank diaphragm 10.Increase at this and to have mixed vitreum and bismuth oxide, also help to strengthen porcelain body intensity, wherein said vitreum: bismuth oxide (mass ratio) is preferably 1:2, and it is 5～15% that said vitreum and bismuth oxide quality sum account for thermal sensitive ceramics powder total mass ratio.
Usually, said thermistor diaphragm 14 has the blank diaphragm 10 of interior electrode 16 for double exposure, and is as shown in Figure 5.When stacked, make the interior electrode of adjacent temperature-sensitive resistive film sheet staggered, its equivalent electric circuit parallel connection, as shown in Figure 3.Help to reduce the resistance of this thermistor of start back like this, more energy-conservation.
The utility model embodiment forms the overcoat 17 of even compact, moisture-proof on thermistor all the other porcelain bodies except that termination electrode; Efficiently solve the diffusion that product causes and the problem of degradation in electroplating process; Make product be easier to carry out electronickelling, tin processing, improved the product soldering reliability greatly.
Certainly, adopt the electronic installation volume of above-mentioned thermistor little, in light weight, power consumption is littler.
Fig. 6 shows the realization flow of the manufacturing approach of the power-type negative temperature coefficient thermistor that the utility model embodiment provides, and details are as follows.
In step S101, allotment thermal sensitive ceramics powder, make cobaltosic oxide in the said thermal sensitive ceramics powder: manganese dioxide: nickel oxide: alundum (Al is 30～60%:40～70%:10～30%:5～20% (mol ratio);
The utility model embodiment makes Co in the said thermal sensitive ceramics powder through allotment thermal sensitive ceramics powder
3O
4: MnO
2: NiO:AL
2O
3(mol ratio) is 30～60%:40～70%:10～30%:5～20%.The thermal sensitive ceramics powder of this proportioning is high resistivity, high B value material, and approximate resistance improves the maximum steady state electric current in the time of effectively reducing made lamination sheet type thermistor maximum current.
For reducing the sintering temperature of thermistor monomer, protection thermistor diaphragm also can mix above-mentioned thermal sensitive ceramics powder with vitreum and bismuth oxide.Increase vitreum and the bismuth oxide mixed here and also help to strengthen porcelain body intensity, wherein said vitreum: bismuth oxide (mass ratio) is preferably 1:2, and it is 5～15% that said vitreum and bismuth oxide quality sum account for thermal sensitive ceramics powder total mass ratio.Certainly, above-mentioned thermal sensitive ceramics powder also comprises some components commonly used, like SiO
2Deng.
In step S102, thermal sensitive ceramics powder that allotment is good and adhesive, solvent, plasticizer, dispersant, and wear into slurry;
The utility model embodiment will allocate good thermal sensitive ceramics powder and adhesive, solvent, plasticizer, dispersant, and ball milling to become viscosity be the slurry of 50～1500Pas.Wherein, said thermal sensitive ceramics powder: adhesive: solvent: plasticizer: dispersant (mass ratio) is 100: (5～20): (80～150): (5～20): (0.5～4); Said adhesive is polyvinyl butyral resin (B-7856); Said solvent is positive third fat of acetic acid and isobutanol by weight (50～90): the mixture of (20～50) preparation; Said plasticizer is o-phthalic acid dibutyl ester (DOP); Said dispersant is ethanedioic acid two formicesters (DMH).Above-mentioned each component is outsourcing, is easy to get.
In step S103, the said slurry of curtain coating makes it to be shaped to the film band, cuts out the blank diaphragm of required size from said film band;
The utility model embodiment vacuumized 200～350 eye mesh screen particle-removing and bubbles with prepared slurry earlier, left standstill 15～24 hours.Then slurry is placed in the system band bucket, on the PET carrier band, carry out flow casting molding, through baking oven 10～20min oven dry of 50～85 ℃, obtaining thickness is 10～60 μ m film bands.Cut out the blank diaphragm of required size then from the film band that makes, as cut out 200*200mm
2Blank diaphragm.Wherein, the PET carrier band is beneficial to the film band that obtains thin thickness than other carrier band (like steel band).
In step S104, electrode in the printing is processed the thermistor diaphragm on said blank film band;
The blank diaphragm 10 that the utility model embodiment will cut is printed as the diaphragm (see figure 7) of power type thermal resistance diaphragm 14 (see figure 5)s and band line of cut 18.Particularly, by high accuracy screen printer electrode 16 in the printing on said blank film band 10 on request, through the interior electrode 16 of baking oven 10～30min of 50～80 ℃ oven dry.The interior electrode resistance accuracy of so printing out is high, and cost is low.
Wherein, the interior electrodes use Ag-Pt slurry of this power type thermal resistance diaphragm 14, Ag:Pt in this slurry (mass ratio) is (30～90): (10～70).This adopt the Ag-Pt slurry print in electrode 16, help to improve the reliability of each thermistor diaphragm 14.
In step S 105, the blank diaphragm of earlier stacked multi-disc as loam cake is followed stacked multi-disc thermistor diaphragm, and the blank diaphragm of the stacked again multi-disc as lower cover constitutes the thermistor green compact by blank diaphragm after stacked and thermistor diaphragm;
The utility model embodiment laminates into power type thermal resistance green compact with blank diaphragm 10 of multi-disc and thermistor diaphragm 14, laminates to refer to whenever folded one deck pressing diaphragm once here.Particularly, earlier folded one deck is printed on the diaphragm of line of cut 18, so that follow-up cutting; Follow the blank diaphragm to 0.30 of stacked multi-disc～0.60mm as loam cake 13; Folded on request then multi-disc thermistor diaphragm 14; The blank diaphragm of the stacked again multi-disc as lower cover 15 is to design height.Constitute the thermistor green compact at this by blank diaphragm after stacked and thermistor diaphragm.
Should be noted in the discussion above that when multi-disc thermistor diaphragm 14 stacked together, make the interior electrode of adjacent temperature-sensitive resistive film sheet staggered, even its equivalent electric circuit is a parallel circuits, the circuit of this structure is beneficial to the power consumption that reduces after the start.
In step S106, said thermistor green compact are cut into a plurality of thermistor monomers, to sintering behind the said thermistor monomer binder removal;
The utility model embodiment cuts into a plurality of thermistor monomers with aforementioned thermistor green compact, to sintering behind each thermistor monomer binder removal.Wherein, dump temperature is preferably 300～400 ℃, and sintering temperature is preferably 900～1000 ℃, and electrode was difficult for impaired in so low sintering temperature made.
For ease of surface treatment of thermistor monomer and upper end electrode, need that the thermistor monomer behind the sintering is carried out chamfered and promptly remove corner angle and burr, make its smooth surface.After the thermistor monomer chamfering, also can apply overcoat in its side.This overcoat can be one or more of glass, insulating ceramic materials, phenolic resins, epoxy resin, silicones etc., for example after the coated glass of thermistor monomer side, promptly forms the glass encapsulating layer.
In step S107, the upper end electrode in said thermistor monomer two ends;
The utility model embodiment needs at thermistor monomer two ends upper end electrode, and it is coated with silver-colored machine by special use and accomplishes.Select the suitable silver-colored silica gel plate that is coated with according to product size earlier, termination electrode is coated with is imprinted on thermistor monomer two ends, accomplish termination electrode through silver ink firing then and make, this layer termination electrode is called " silver-colored termination " 21 at this.Be protection thermistor internal structure, in plating one nickel barrier layer 22, " silver-colored termination " 21 surface.In addition, also can plate a soldering layer 23 in 22 surfaces, be convenient to the welding of this thermistor in the nickel barrier layer, as shown in Figure 2.Hence one can see that, and said left end electrode and right-hand member electrode are respectively by the silver-colored termination 21 that is printed on said thermistor end face, and the nickel barrier layer 22 and the soldering layer 23 that are plated on said silver-colored cross cut end (of a beam) successively constitute.
The utility model embodiment adopts the lamination sheet type structure, and the lamination sheet type thermistor area with identical steady-state current is little more than 60% than the plug-in mounting resistor, can save the complete machine area greatly; Realize that the PCB two sides mounts, avoid perforation, convenient wiring; The SMD structure, suitable high density surface mounts.Meanwhile; Through allotment thermal sensitive ceramics powder; Make cobaltosic oxide in the said thermal sensitive ceramics powder: manganese dioxide: nickel oxide: alundum (Al is 30～60%:40～70%:10～30%:5～20% (mol ratio); Constitute high resistivity, high B value material thus, approximate resistance improves the maximum steady state electric current when effectively reducing maximum current.In addition, for reducing sintering temperature, protection thermistor diaphragm also can increase in said thermal sensitive ceramics powder and mix vitreum and bismuth oxide, also helps strengthen porcelain body intensity.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection range of the utility model.
Claims (7)
1. a power-type negative temperature coefficient thermistor comprises left end electrode and the right-hand member electrode relative with said left end electrode, it is characterized in that, is stacked with lower cover, multi-disc thermistor diaphragm and loam cake successively between said left end electrode and right-hand member electrode.
2. power-type negative temperature coefficient thermistor as claimed in claim 1 is characterized in that, blank diaphragm is stacked successively forms by multi-disc for said loam cake and lower cover, and said blank diaphragm is the thermal sensitive ceramics diaphragm.
3. power-type negative temperature coefficient thermistor as claimed in claim 2 is characterized in that, said thermistor diaphragm is the blank diaphragm that double exposure has interior electrode.
4. power-type negative temperature coefficient thermistor as claimed in claim 3 is characterized in that, the interior electrode of adjacent temperature-sensitive resistive film sheet is staggered, its equivalent electric circuit parallel connection.
5. power-type negative temperature coefficient thermistor as claimed in claim 3 is characterized in that the side of said thermistor is coated with overcoat.
6. like claim 4 or 5 described power-type negative temperature coefficient thermistors; It is characterized in that; Said left end electrode and right-hand member electrode are respectively by the silver-colored termination that is printed on said thermistor end face, and the nickel barrier layer and the soldering layer that are plated on said silver-colored cross cut end (of a beam) successively constitute.
7. an electronic installation is characterized in that, said electronic installation adopts each described power-type negative temperature coefficient thermistor in the claim 1～6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200127032U CN202512978U (en) | 2012-01-12 | 2012-01-12 | Power-type negative temperature coefficient thermistor and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200127032U CN202512978U (en) | 2012-01-12 | 2012-01-12 | Power-type negative temperature coefficient thermistor and electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN202512978U true CN202512978U (en) | 2012-10-31 |
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ID=47065442
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200127032U Expired - Lifetime CN202512978U (en) | 2012-01-12 | 2012-01-12 | Power-type negative temperature coefficient thermistor and electronic device |
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| CN (1) | CN202512978U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104361963A (en) * | 2014-11-19 | 2015-02-18 | 广州天极电子科技有限公司 | Surface mount thin-film resistor and manufacture method thereof |
-
2012
- 2012-01-12 CN CN2012200127032U patent/CN202512978U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104361963A (en) * | 2014-11-19 | 2015-02-18 | 广州天极电子科技有限公司 | Surface mount thin-film resistor and manufacture method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121031 |