CN202485993U - 多场耦合加载微纳米压入测试系统 - Google Patents
多场耦合加载微纳米压入测试系统 Download PDFInfo
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102589984A (zh) * | 2012-02-14 | 2012-07-18 | 北京大学 | 多场耦合加载微纳米压入测试系统和测试方法 |
CN104198286A (zh) * | 2014-09-11 | 2014-12-10 | 浙江工业大学 | 一种多压头仪器化压入测试系统 |
CN104931335A (zh) * | 2015-06-05 | 2015-09-23 | 北京大学 | 导电功能材料力电耦合效应测试系统及其测试方法 |
CN107422068A (zh) * | 2017-04-21 | 2017-12-01 | 西安交通大学 | 一种用于微纳材料多场联合表征的应变加载系统 |
CN108287220A (zh) * | 2018-01-11 | 2018-07-17 | 天津大学 | 一种用于透明基底薄膜表界面力学特性测量的实验装置 |
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2012
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102589984A (zh) * | 2012-02-14 | 2012-07-18 | 北京大学 | 多场耦合加载微纳米压入测试系统和测试方法 |
CN102589984B (zh) * | 2012-02-14 | 2014-04-09 | 北京大学 | 多场耦合加载微纳米压入测试系统和测试方法 |
CN104198286A (zh) * | 2014-09-11 | 2014-12-10 | 浙江工业大学 | 一种多压头仪器化压入测试系统 |
CN104198286B (zh) * | 2014-09-11 | 2016-09-07 | 浙江工业大学 | 一种多压头仪器化压入测试系统 |
CN104931335A (zh) * | 2015-06-05 | 2015-09-23 | 北京大学 | 导电功能材料力电耦合效应测试系统及其测试方法 |
CN107422068A (zh) * | 2017-04-21 | 2017-12-01 | 西安交通大学 | 一种用于微纳材料多场联合表征的应变加载系统 |
CN107422068B (zh) * | 2017-04-21 | 2019-08-23 | 西安交通大学 | 一种用于微纳材料多场联合表征的应变加载系统 |
CN108287220A (zh) * | 2018-01-11 | 2018-07-17 | 天津大学 | 一种用于透明基底薄膜表界面力学特性测量的实验装置 |
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Owner name: CHANGCHUN MACROPOUND PRECISION TECHNOLOGY CO., LTD Effective date: 20130916 |
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Inventor after: Fang Daining Inventor after: Zhou Hao Inventor after: Pei Yongmao Inventor after: Li Hongsheng Inventor after: Zhao Hongwei Inventor after: Huang Hu Inventor after: Li Faxin Inventor after: Li Yingwei Inventor before: Fang Daining Inventor before: Zhou Hao Inventor before: Pei Yongmao Inventor before: Li Faxin Inventor before: Li Yingwei |
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Free format text: CORRECT: INVENTOR; FROM: FANG DAINING ZHOU HAO PEI YONGMAO LI FAXIN LI YINGWEI TO: FANG DAINING ZHOU HAO PEI YONGMAO LI HONGSHENG ZHAO HONGWEI HUANG HU LI FAXIN LI YINGWEI |
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Effective date of registration: 20130916 Address after: 100871 Beijing the Summer Palace Road, Haidian District, No. 5 Patentee after: Peking University Patentee after: Changchun bamda Precision Technology Co. Ltd. Patentee after: Jilin University Address before: 100871 Beijing the Summer Palace Road, Haidian District, No. 5 Patentee before: Peking University |
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