CN202454611U - Light-emitting diode (LED) module and lamp comprising same - Google Patents
Light-emitting diode (LED) module and lamp comprising same Download PDFInfo
- Publication number
- CN202454611U CN202454611U CN2011205442433U CN201120544243U CN202454611U CN 202454611 U CN202454611 U CN 202454611U CN 2011205442433 U CN2011205442433 U CN 2011205442433U CN 201120544243 U CN201120544243 U CN 201120544243U CN 202454611 U CN202454611 U CN 202454611U
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- base material
- led module
- led
- line layer
- led chip
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Abstract
The utility model is suitable for the technical field of illumination and provides a light-emitting diode (LED) module and a lamp comprising the same. The LED module comprises a bottom base material, a line layer and an LED chip, a heat curing glue layer for fixedly connecting the line layer and the bottom base material is clamped between the bottom base material and the line layer, the LED chip is arranged on the bottom base material, the heat curing glue layer and the line layer are both provided with empty avoiding holes for accommodating the LED chip, and the LED chip is connected onto the line layer through a metal line. The lamp comprises a casing, and the LED module is arranged in the casing. The heat curing glue layer made of heat curing materials is not easy to yellow and age even if being heated. The LED module and the lamp comprising the LED module avoid adverse conditions of poor air tightness and the like, are high in product reliability, facilitate improvement of production efficiency, reduce production cost, facilitate improvement of luminous efficiency of products, reduce power consumption, are good in product quality, and conform to a development trend of low carbon and environment protection.
Description
Technical field
The utility model belongs to lighting technology or back light technical field, relates in particular to a kind of LED module and comprises the light fixture of this LED module.
Background technology
Present LED module, it is injection mo(u)lding one plastic cement bowl cup on its base material usually, and led chip is positioned in this bowl cup, through metal wire led chip is drawn again.LED module of the prior art, its injection molded bowl cup is easy to wear out, and causes a series of problems such as poor air-tightness, and product reliability is low and production efficiency is low, production cost is high.And in manufacture process, when carrying out technologies such as Reflow Soldering, the colloid in the LED module is easy to yellow, causes that the product luminous efficiency is low, power consumption is high, poor product quality.
The utility model content
The purpose of the utility model is to overcome the deficiency of above-mentioned prior art, a kind of LED module is provided and has comprised the light fixture of this LED module, and its product reliability is high; Production efficient is high, cost is low; And improved the luminous efficiency of product, reduced power consumption, product quality is good.
The utility model is achieved in that a kind of LED module; Comprise base material, line layer and led chip; Be folded with between said base material and the line layer and be used for fixing the hot curing glue-line that is connected said line layer and base material; Said led chip is arranged on the said base material, is provided with the emptiness avoiding hole that is used for ccontaining said led chip on said hot curing glue-line and the line layer, and said led chip is connected on the said line layer through metal wire.
Particularly, offer reflective depression on the said base material, said reflective depression is the enlarging shape, and said led chip is fixedly set in the bottom of said reflective depression.
Particularly, convex with reflector on the said base material, said reflector in the form of a ring, the angle between the side of said reflector and the said base material greater than 90 the degree.
Preferably, said base material adopts aluminium or copper or ceramic material to process.
Further, the surface coverage of said base material has silver coating.
Particularly, the emptiness avoiding hole on the said line layer is the poroid or enlarging shape of step.
Particularly, be coated with phosphor gel and/packaging plastic on the said led chip.
Particularly, said hot curing glue-line adopts thermosets to process.
Particularly, said base material is provided with a plurality of led chips, and said a plurality of led chips are arranged in matrix.
The utility model also provides a kind of light fixture, and said light fixture comprises housing, is provided with above-mentioned LED module in the said housing.
A kind of LED module that the utility model provides and the light fixture that comprises this LED module, its hot curing glue-line adopt thermosets to process, and being heated, it is aging also to be difficult for jaundice; Unfavorable conditions such as poor air-tightness can not appear; Product reliability is high, has improved production efficiency, has reduced production cost, and helped improving the luminous efficiency of product and reduce power consumption; Product quality is good, meets the development trend of low-carbon environment-friendly.
Description of drawings
Fig. 1 is the generalized section of a kind of LED module of providing of the utility model embodiment;
Fig. 2 is the generalized section of a kind of LED module of providing of the utility model embodiment
Fig. 3 is the floor map of a kind of rectangular LED module that provides of the utility model embodiment;
Fig. 4 is a kind of floor map that is the LED module of bar shaped that the utility model embodiment provides.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
As depicted in figs. 1 and 2; A kind of LED module that the utility model embodiment provides; Comprise base material 100, line layer 300 and led chip 400, be folded with between said base material 100 and the line layer 300 and be used for fixing the hot curing glue-line 200 that is connected said line layer 300 and base material 100.But base material 100 aluminium or copper isoreflectance are high, the good material of heat conductivility is processed.Said hot curing glue-line 200 adopts thermosets to process.So-called thermosets can soften mobilely when it heats for the first time, be heated to uniform temperature, produces chemical reaction and solidifies and hardening, and this variation is irreversible, and after this, when heating once more, deliquescing has been flowed again.In concrete the application, can adopt phenolic resins, Lauxite, melmac, unsaturated polyester resin etc., all belong to the protection range of the utility model as thermosets.The TG temperature (glass transition temperature) of thermosets is higher, and line layer 300 is fixed on the base material 100 reliably.
Particularly, as depicted in figs. 1 and 2, said led chip 400 is arranged on the said base material 100; Be provided with the emptiness avoiding hole 301 that is used for ccontaining said led chip 400 on said hot curing glue-line 200 and the line layer 300; And formed the space that is used to hold fluorescent material, packaging plastic, and need not to be provided with plastic cement bowl cup, avoided that plastic cement jaundice is aging unfavorable conditions such as poor air-tightness to occur with product; Product reliability is high, and is beneficial to and enhances productivity, reduce production costs.Said led chip 400 is connected on the said line layer 300 through metal wire 410.Through such design; Solved deficiency of the prior art, line layer 300 can directly be adhered on the base material 100 through thermosets, after its curing of thermosets; Form insulating barrier; On the one hand up to the effect of connection line layer 300 and base material 100, availablely on the other hand avoid line layer 300 short circuits, be beneficial to and enhance productivity and structural reliability.
Particularly, as shown in Figure 1, convex with reflector 110 on the said base material 100, said reflector 110 in the form of a ring, the angle between the side of said reflector 110 and the said base material 100 helps improving the utilance of light greater than 90 degree.But reflector 110 integrated punchings take shape on the said base material 100, and it can improve light efficiency on the one hand, can be used for holding fluorescent material and packaging plastic on the other hand; Structural reliability is high; And the end face of base material 100 is smooth, and it can be fitted reliably with radiating module and contact, and helps improving radiating effect.
Perhaps, as shown in Figure 2, offer reflective depression 101 on the said base material 100; Said reflective depression 101 is the enlarging shape; The reflective depression 101 that is the enlarging shape more helps improving the utilance of light, thereby obtains better illuminating effect, and it is inverted round table-like etc. that reflective depression 101 can be; The relative base material 100 in its side tilts, to improve reflecting effect.Said led chip 400 is fixedly set in the bottom of said reflective depression 101, and reflective depression 101 also can be used for holding fluorescent material and packaging plastic, and structural reliability is high.But base material 100 and the integrated punching moulding of going up reflective depression 101 thereof, the part evenness is high, and any surface finish can reach the effect of direct reflection.
Preferably, said base material 100 adopts aluminium or copper or ceramic material to process.
Further, the surface coverage of said base material 100 has silver coating, helps further improving light efficiency and reduces power consumption, compares with conventional art, and light efficiency can improve 20% to 30%.
Preferably, as depicted in figs. 1 and 2, the emptiness avoiding hole 301 on the said line layer 300 is the poroid or enlarging shape of step, and it is convenient to connect metal wire 410 and some glue.
Particularly, be coated with phosphor gel and/packaging plastic etc. on the said led chip 400, so that product is suitable for different occasions, as as illumination or backlight etc.
Particularly, like Fig. 3 and shown in Figure 4, said base material 100 is provided with a plurality of led chips 400, and said a plurality of led chips 400 are arranged in matrix.Particularly; The LED module that the utility model provided can be applied to the led light source module of single, rectangular or arranged in matrix or the like form; Led chip can be that single setting, strip spacing arrangement are provided with or with suitable arranged modes such as 2 * 2,3 * 2,3 * 3,4 * 4,5 * 5,6 * 6,8 * 8, all belong to the protection range of the utility model.Base material 100 can be rectangular, circular, polygon, abnormity etc., can be cut into suitable module by big young pathbreaker LED module as required in the production process, to satisfy different application.For example, can be cut into bar, being applied on the LED fluorescent tube, perhaps, can be cut into rectangle or single 's LED module, specifically can decide on Down lamp or the shot-light being applied to, all belong to the protection range of the utility model according to actual conditions.
The LED module that the utility model provided, it can be applicable to field of illuminating lamps, also can be applicable to the back light field of products such as display screen etc., all belongs to the protection range of the utility model.
The utility model embodiment also provides a kind of light fixture, is provided with above-mentioned LED module in the said housing.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement or improvement etc., all should be included within the protection range of the utility model.
Claims (10)
1. LED module; Comprise base material, line layer and led chip; It is characterized in that be folded with between said base material and the line layer and be used for fixing the hot curing glue-line that is connected said line layer and said base material, said led chip is arranged on the said base material; Be provided with the emptiness avoiding hole that is used for ccontaining said led chip on said hot curing glue-line and the line layer, said led chip is connected on the said line layer through metal wire.
2. LED module as claimed in claim 1 is characterized in that, offers reflective depression on the said base material, and said reflective depression is the enlarging shape, and said led chip is fixedly set in the bottom of said reflective depression.
3. LED module as claimed in claim 1 is characterized in that, convexes with reflector on the said base material, said reflector in the form of a ring, the angle between the side of said reflector and the said base material greater than 90 the degree.
4. LED module as claimed in claim 1 is characterized in that, said base material adopts aluminium or copper or ceramic material to process.
5. like each described LED module in the claim 1 to 4, it is characterized in that the surface coverage of said base material has silver coating.
6. like each described LED module in the claim 1 to 4, it is characterized in that the emptiness avoiding hole on the said line layer is the poroid or enlarging shape of step.
7. like each described LED module in the claim 1 to 4, it is characterized in that, be coated with phosphor gel and/packaging plastic on the said led chip.
8. like each described LED module in the claim 1 to 4, it is characterized in that said hot curing glue-line adopts thermosets to process.
9. like each described LED module in the claim 1 to 4, it is characterized in that said base material is provided with a plurality of led chips, said a plurality of led chips are arranged in matrix.
10. light fixture, said light fixture comprises housing, it is characterized in that, is provided with in the said housing like each described LED module in the claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205442433U CN202454611U (en) | 2011-12-22 | 2011-12-22 | Light-emitting diode (LED) module and lamp comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205442433U CN202454611U (en) | 2011-12-22 | 2011-12-22 | Light-emitting diode (LED) module and lamp comprising same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202454611U true CN202454611U (en) | 2012-09-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205442433U Expired - Fee Related CN202454611U (en) | 2011-12-22 | 2011-12-22 | Light-emitting diode (LED) module and lamp comprising same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202454611U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106385768A (en) * | 2016-04-26 | 2017-02-08 | 深圳市环基实业有限公司 | Transparent medium circuit board and manufacturing method therefor |
-
2011
- 2011-12-22 CN CN2011205442433U patent/CN202454611U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106385768A (en) * | 2016-04-26 | 2017-02-08 | 深圳市环基实业有限公司 | Transparent medium circuit board and manufacturing method therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120926 Termination date: 20161222 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |