CN202439291U - Heat-conduction compound wood board - Google Patents

Heat-conduction compound wood board Download PDF

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Publication number
CN202439291U
CN202439291U CN2012200865686U CN201220086568U CN202439291U CN 202439291 U CN202439291 U CN 202439291U CN 2012200865686 U CN2012200865686 U CN 2012200865686U CN 201220086568 U CN201220086568 U CN 201220086568U CN 202439291 U CN202439291 U CN 202439291U
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CN
China
Prior art keywords
layer
heat
heat conduction
graphite heat
balance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012200865686U
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Chinese (zh)
Inventor
徐衡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU SOCARE TIMBER CO LTD
JIANGSU SOCARE TIMBER CO Ltd
Original Assignee
CHANGZHOU SOCARE TIMBER CO LTD
JIANGSU SOCARE TIMBER CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU SOCARE TIMBER CO LTD, JIANGSU SOCARE TIMBER CO Ltd filed Critical CHANGZHOU SOCARE TIMBER CO LTD
Priority to CN2012200865686U priority Critical patent/CN202439291U/en
Application granted granted Critical
Publication of CN202439291U publication Critical patent/CN202439291U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to compound boards in wood industry, in particular to a heat-conduction compound wood board which sequentially comprises a wear-resistant layer, a decoration layer, a base material and a balance layer. A layer of graphite heat conduction layer is positioned under the balance layer. Due the fact that the graphite heat conduction layer is arranged at the lowest layer, the board is good in heat conduction performance, has fireproof and radiation protection functions, and is simple in structure, convenient to manufacture and suitable for various occasions.

Description

A kind of heat conduction composite wood sheet material
Technical field
The utility model relates to a kind of composite, is specially the good composite wood sheet material of a kind of heat conductivility.
Background technology
Composite wooden material is the material that a kind of multilayer compacting forms, and is usually used in the substitute of solid wood material, is widely used in fields such as home decoration, furniture manufacturing.
Present composite wood sheet material, the most frequently used is to make wood floors, to substitute full solid wooden floor board.General this sheet material does not have thermal conductivity.Simultaneously fire resistance a little less than.Along with the employing of heating systems such as floor heating, need timber floor that the function of heat conduction is also arranged at present.The poor-performing of existing composite board this respect.
Summary of the invention
The purpose of the utility model is to overcome the shortcoming of the described existing composite wood sheet material of background technology, and heat conduction of a kind of ability and composite wood sheet material simple in structure are provided.
For reaching above-mentioned purpose, technical scheme is:
A kind of heat conduction composite wood sheet material comprises wearing layer, decorative layer, base material and balance layer successively, and balance layer also has one deck graphite heat conducting layer down.
Described graphite heat conducting layer is made up of graphite heat-conducting fin and adhesive sticker, is attached to the balance layer lower surface.
Graphite heat-conducting fin is a kind of brand-new heat conduction and heat radiation material, has unique grain orientation, along the both direction uniform heat conduction, laminar structuredly can adapt to any surface well.When the utility model is used for timber floor and makes, graphite heat conducting is placed on the bottom on floor, can have fire resistance and radiation proof function simultaneously so that the floor has good heat-conducting.And this plate construction is simple, easily manufactured, can be used for processing various wooden objects.
Description of drawings
Fig. 1 is the utility model structural representation.
The specific embodiment
Like the structure chart of Fig. 1, this isThe cross-sectional view of heat conduction composite wood sheet material comprises wearing layer 1, decorative layer 2, base material 3 and balance layer 4 successively, and balance layer also has graphite heat conducting layer 5 down.
Wearing layer 1 main component is that special paper adds alundum (Al, and is very wear-resisting, and has anti-flammability;
Decorative layer 2 is the timber derived products that adopt through special processing, printing paper is soaked the pool with thermosetting resin be processed into stable in properties, waterproof, antiultraviolet, colour-fast attractive in appearance again; Can various floral designs be provided to sheet material.
Base material 3 can be used high-density plate, medium-density plate or particieboard, and base material is rubbed by the fast-growing woods material, the high-temperature high-pressure moulding, and both resistance to compression was impacted, and had kept wood feature again.
The thickness of balance layer 4 approximates wearing layer 1 and adds decorative layer 2, plays protection against the tide and stabilization, makes the floor stressed even in processing and use.
Graphite heat conducting layer 5 is made up of graphite heat-conducting fin and adhesive sticker, is attached to balance layer 4 lower surfaces.
Five layers of while are superimposed, send into production line, through the compacting of press high temperature, make finished product.Can produce wood floors and other various wooden articles for use through operations such as cutting, flutings again.

Claims (2)

1. a heat conduction composite wood sheet material comprises wearing layer (1), decorative layer (2), base material (3) and balance layer (4) successively, it is characterized in that: balance layer also has one deck graphite heat conducting layer (5) down.
2. a kind of heat conduction composite wood sheet material according to claim 1, it is characterized in that: described graphite heat conducting layer (5) is made up of graphite heat-conducting fin and adhesive sticker, is attached to the balance layer lower surface.
CN2012200865686U 2011-10-21 2012-03-09 Heat-conduction compound wood board Expired - Fee Related CN202439291U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012200865686U CN202439291U (en) 2011-10-21 2012-03-09 Heat-conduction compound wood board

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201120403250.1 2011-10-21
CN201120403250 2011-10-21
CN2012200865686U CN202439291U (en) 2011-10-21 2012-03-09 Heat-conduction compound wood board

Publications (1)

Publication Number Publication Date
CN202439291U true CN202439291U (en) 2012-09-19

Family

ID=46820745

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012200865686U Expired - Fee Related CN202439291U (en) 2011-10-21 2012-03-09 Heat-conduction compound wood board

Country Status (1)

Country Link
CN (1) CN202439291U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106437078A (en) * 2016-10-13 2017-02-22 王长坤 Glass heating floor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106437078A (en) * 2016-10-13 2017-02-22 王长坤 Glass heating floor

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120919

Termination date: 20180309