KR20100094812A - Flooring having heat conductive layer - Google Patents

Abstract

PURPOSE: A flooring material including a thermally conductive layer is provided to maximize the thermal conductivity by adopting metallic powder, carbon nano-tube, or graphite to the multi-layered structure of a floor. CONSTITUTION: A flooring material includes a surface-protective layer(10), a decorating layer(20), a base layer(30), and a rear layer(40). The base layer is composed of one or more board selected from a group including a wood-based board, an inorganic-based board, and a non-chlorinated synthetic resin board. One or more layer of the flooring material is thermally conductive layers including thermally conductive filler. The thermally conductive filler is selected from a group including aluminum-nitride, silicon carbide, ferrite, copper, carbon nano-tube, and graphite material.

Description

Flooring material having a heat conductive layer {Flooring having heat conductive layer}

TECHNICAL FIELD The present invention relates to a thermally conductive flooring material, and more preferably, to a thermally conductive flooring material having a wooden base material such as plywood, high density fiberboard, and particleboard.

Conventional flooring materials have a fully adhesive construction method that is adhered to the floor using epoxy or urethane adhesive when plywood is used as a base material. At this time, the floor heating is the same because of the relatively thick thickness compared to general PVC flooring and tiles. Even though there was a disadvantage that the thermal efficiency falls.

In the case of reinforced floor using high density fiberboard (HDF), it is not used to adhere to the floor but rather to process the click shape on the side surface so that the floors can be joined to each other, so that consumers can use the floating construction floating at a certain distance from the floor. Doing. At this time, the heat of the floor heating is not directly in contact with the flooring product, there is a disadvantage that the floor heating efficiency is significantly lower than the other types of flooring, flooring, tiles, plywood ondol flooring, marble flooring and the like.

Korean Patent Registration No. 524850 discloses a flooring material having excellent thermal conductivity in a flooring material comprising a plurality of resin layers, wherein at least one resin layer includes aluminum nitride (AlN) as a thermally conductive filler.

Korean Patent Laid-Open Publication No. 2000-66695 discloses a multi-layer floor covering comprising: 0.1 to 50 parts by weight of thermally conductive metal powder and 0.1 to 50 parts by weight of latent heat storage material based on 100 parts by weight of PVC resin of each layer. It is disclosed that the heat storage flooring material, characterized in that included in.

Korean Patent Laid-Open Publication No. 2005-98480 discloses a multi-layered flooring consisting of a surface layer consisting of a plurality of layers and a lower layer mainly on a base layer, wherein a conductive adhesive layer, PCM microcapsules, and metal fibers are contained under the base layer. A heat storage insulation flooring material is disclosed in which one heat storage fiber layer is laminated.

Korean Patent Publication No. 2008-69301 discloses a conductive flooring comprising at least one conductive layer containing a polymeric polyester-based conductive plasticizer.

Japanese Patent Laid-Open No. 2005-282306 discloses 40 to 95 mass% of metal powder as aggregate, 25 to 2 mass% of rubber as binder, 15 to 1.5 mass% of thermoplastic resin as binder, and thermoplastic elastomer as binder. A damping sheet for flooring materials is disclosed, comprising a sheet member formed by mixing a mass of 1 to 1% by mass with 10 to 0.5% by mass of a deterioration inhibitor as a binder and forming a sheet.

However, the thermally conductive flooring materials of the prior arts are limited to polyvinyl chloride (PVC) -based flooring materials.

The present invention has been made in order to solve the above problems, the object of the present invention by applying a metallic powder or carbon nanotube (CNT) component with high thermal conductivity to maximize the thermal conductivity of the flooring, it occurs during heating operation It is to provide a thermally conductive flooring material designed to transfer heat quickly and evenly warm the floor.

In order to achieve the above object, the present invention includes a surface protective layer, a stucco layer, a base layer and a backing layer from above, wherein the base layer is one or more selected from wood-based boards, inorganic boards, non-chlorine-based resin boards Wherein at least one of the layers is a thermally conductive layer comprising at least one thermally conductive filler selected from aluminum nitride (AlN), silicon carbide, ferrite, copper, carbon nanotubes and graphite materials. Provide flooring.

The present invention relates to a flooring material having excellent thermal conductivity, preferably in a flooring material composed of a wood-based substrate and a plurality of layers, at least one layer, preferably a backing layer, such as aluminum nitride, ferrite, copper, etc. A thermally conductive filler, preferably a thermally conductive filler, such as carbon nanotubes, characterized in that it comprises a.

In the present invention, the content of the thermally conductive filler is preferably 0.1 to 50 parts by weight based on 100 parts by weight of the base resin. If the content of the thermally conductive filler is less than 0.1 parts by weight, the thermal conductivity is insignificant, and if it exceeds 50 parts by weight, it is difficult to mass-produce because workability in the manufacturing process is impossible.

In the present invention, the wood-based board is a water resistant plywood, Medium Density Fiberboard (MDF), High Density Fiberboard (HDF: High Density Fiberboard), Particle Board (PB: Particle Board), Kenaf Board (Kenaf Board), Number Paper powder mixing board (WFPC), etc. can be used, and if the wood-based board is a thermally conductive layer, the thermal conductive filler is included in the adhesive used for the wood-based board.

In the present invention, as the inorganic board, magnesium board, silicon board, gypsum board, cellulose fiber reinforced cement board (CRC: Cellulose fiber Reinforced Cement board) can be used.

In the present invention, the non-chlorinated synthetic resin board is a polycarbonate (PC: Poly Carbonate) board, polyethylene (PE: Poly Ethylene) board, polypropylene (PP: Poly Propylene) board, polyethylene terephthalate (PET: Poly Ethylene Terephthalate) board, Glycol-modified polyethylene terephthalate board (PETG: Poly Ethylene Terephthalate Glycol modified), acrylonitrile butadiene styrene (ABS) board, acryl board, and the like can be used.

In the present invention, when the back layer is a heat conductive layer, the back layer comprises a urethane acrylate resin and a heat conductive filler. In the present invention, the more the more conductive layers are, the better, it is preferable to configure the back layer as a thermal conductive layer in consideration of the thermal conductivity efficiency compared to the cost. When the urethane acrylate resin is used as the back layer, moisture permeation can be prevented, and it can be easily formed by a coating curing process, and there is an advantage in that continuous production is possible.

The present invention maximizes the thermal conductivity of flooring flooring by applying a metallic powder or a specific material (carbon nanotube, graphite, etc.) having excellent thermal conductivity to the flooring flooring having a multilayer structure.

The flooring material of the present invention has excellent thermal conductivity compared to the conventional flooring material, the effect of the heating supply appears quickly, and after the heating is completed, the thermal insulation effect is shown for a considerable time, so the economy is excellent.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. However, the scope of the present invention is not limited by the accompanying drawings and examples.

1 is a cross-sectional view of the floor covering according to the present invention, which is composed of a surface protective layer 10, a decorative layer 20, a base layer 30, and a back layer 40 from above.

As the surface protective layer 10, an overlay of a conventional UV curable paint or a melamine resin may be used.

The stucco layer 20 forms an exterior layer that truly and freely represents the wood appearance of the flooring material, and may use a deco paper impregnated with veneer, a transfer printing layer, or a resin that is mainly wood veneer.

As the base layer 30, a wood board is mainly used, but both an inorganic board and a non-chlorine synthetic resin board can be used.

Wood-based boards may be used such as boards such as water-resistant plywood, MDF, HDF, particle board, Kenyaf board, resin wood flour mixing board, and inorganic boards include magnesium board, silicon board, gypsum board, CRC board, etc. The non-chlorine-based synthetic resin board may be used, such as PC, PE, PP, PET, PETG, ABS, acrylic board may be used. Among the boards mentioned above, preferred boards in the present invention are a plywood and HDF.

The back layer 40 may improve structural stability by preventing deformation of the flooring material, and the back layer 40 may use paper, metal foil, ultraviolet curable paint, thermosetting resin, synthetic resin sheet, and the like. Especially urethane acrylate resin is preferable. When using a urethane acrylate resin can prevent moisture permeation, can be easily formed by the coating curing process, there is an advantage that can be continuously produced.

The more heat conductive layers are better, the better, but in consideration of the cost-effective heat conduction efficiency, it is preferable to configure the back layer 40 as a heat conductive layer. The thermal conductive layer is not limited to the back layer 40 but may be another layer, and the number thereof is not particularly limited. If the wood board is a thermally conductive layer, the thermal filler is included in the adhesive used for the wood board. For example, a thermally conductive filler is added to an adhesive used to bond a plurality of end plates that are cross-laminated when manufacturing a water resistant laminate, and a thermally conductive filler is added to an adhesive used to bond fibers when preparing a fiberboard.

The thermally conductive fillers are excellent in thermal conductivity, and are used in combination of metallic powders such as copper, aluminum nitride, silicon carbide, ferrite, and the like, or a mixture of one or more of high performance thermally conductive materials such as carbon nanotubes. It is preferable to use the particle diameter of a thermally conductive filler which is 1-50 micrometers.

Carbon nanotube (CNT: Carbon Nano Tube) is a new material in which hexagons made of 6 carbons are connected to each other to form a tube shape, and the diameter of the tube is only several to several tens of nanometers. Its electrical conductivity is similar to that of copper, its thermal conductivity is like the best diamond in nature, and it is 100 times stronger than steel. Carbon fiber breaks with only 1% strain, while carbon nanotubes can withstand 15% strain. In addition, carbon nanotubes have many contact points connected to each other due to their molecular structure, so the heat generation area is wide, so the heat transfer efficiency to the heating element is excellent, the temperature rise time to the highest temperature is fast, and the hair structure is entangled with each other. Excellent durability for long time use.

2 is a manufacturing process diagram of the floor covering according to the present invention, the first step of forming a back layer 40 on the back surface of the base layer 30; A second step of forming the stucco layer 20 on the base layer 30; Forming a surface protective layer 10 on the stucco layer 20; A fourth step of curing the surface protective layer 10 by UV curing or high temperature high pressure (HPL, LPL) curing; It is divided into a total of five processes including the fifth process of cutting and shaping.

3 is a plan view of the flooring floor having a T & G shape according to the present invention, the flooring material of the present invention is finally composed of the groove 50 and the projections 60 (TonG & Groove), which can be combined with each other, It may have a connection structure by a click system or a connector.

Example 1

After forming the backing layer 40 for structural stability under the water-resistant plywood base layer 30, and then forming the stucco layer 20 on the base layer 30, the surface protective layer on the top of the stucco layer 20 After forming (10), the flooring material as shown in Figure 1 was prepared by cutting and shape processing in the form of T & G (50, 60).

The heat conductive layer was formed on the back surface layer 40, and 10 parts by weight of the metal copper powder having excellent thermal conductivity was added to 100 parts by weight of the urethane acrylate resin, which is the base resin, and formed on the back surface of the water-resistant plywood base layer 30 by a conventional method. .

The stucco layer 20 was laminated with a natural veneer on top of the water-resistant plywood base layer 30 by thermal pressure plastering using an adhesive mainly composed of urea melamine-based resin, the surface protective layer 10 is a UV curable paint in a conventional manner Formed by coating and curing.

The laminated product was cut using a tenoner to have a width of 85 to 95 mm and a length of 850 to 950 mm, and a finished product was manufactured by performing T & G processing on the side.

[Example 2]

In the same manner as in Example 1, carbon nanotubes were used as the thermally conductive filler.

Comparative Example 1

Based on the water-resistant plywood laminated natural veneer on top and treated with UV-cured surface coating, the existing plywood flooring product of the structure without the back layer was manufactured because no treatment was performed on the back surface of the plywood.

Comparative Example 2

Melamine-impregnated paper was laminated on the upper and lower parts of the HDF as a base material, and a conventional reinforced floor was manufactured by LPL (Low Pressure Laminate).

[Test Example]

About the flooring material of an Example and a comparative example, the thermal conductivity was measured using the thermal conductivity analyzer, and the result is shown in Table 1.

division Example 1 Example 2 Comparative Example 1 Comparative Example 2 Thermal Conductivity (Watt / m-K) 1.65 1.98 0.17 0.18

According to Table 1, the thermal conductivity of the floor covering according to the present invention was very excellent, more than 10 times the conventional plywood floor and reinforced floor. In addition, when the flooring material of the present invention was installed on the floor and supplied with heating, the heating effect appeared quickly and uniformly on the entire flooring material, and the warming effect continued even after the heating was finished.

1 is a cross-sectional view of the floor covering according to the present invention.

Figure 2 is a manufacturing process of the floor covering according to the present invention.

3 is a plan view of the floor covering having a T & G (Tongue & Groove) form in accordance with the present invention.

[Description of Symbols for Main Parts of Drawing]

10: surface protective layer

20: stucco

30: substrate layer

40: back layer

50: Groove

60: Tongue

Claims (8)

A surface protective layer, a stucco layer, a base layer and a back layer from above, The base layer is composed of one or more boards selected from wood board, inorganic board, non-chlorine synthetic resin board, At least one of the layers is a flooring material comprising at least one thermally conductive layer selected from aluminum nitride, silicon carbide, ferrite, copper, carbon nanotubes and graphite materials. The floor covering according to claim 1, wherein the thermally conductive filler is carbon nanotubes. The flooring material according to claim 1 or 2, wherein the content of the thermally conductive filler is 0.1 to 50 parts by weight based on 100 parts by weight of the base resin. The floorboard material according to claim 1 or 2, wherein the wood-based board is at least one selected from a water resistant plywood board, a medium density fiber board, a high density fiber board, a particle board, a Kenyaf board, and a resin wood powder mixing board. The flooring material according to claim 4, wherein the wood-based board is a heat conductive layer, and the heat-conductive filler is included in the adhesive used for the wood-based board. The floorboard material according to claim 1 or 2, wherein the inorganic board is at least one selected from magnesium board, silicon board, gypsum board, and cellulose fiber-reinforced cement board. The non-chlorine synthetic resin board is selected from polycarbonate board, polyethylene board, polypropylene board, polyethylene terephthalate board, glycol modified polyethylene terephthalate board, acrylonitrile butadiene styrene board, acryl board. Flooring material, characterized in that at least one. The flooring material according to claim 1 or 2, wherein the backing layer is a heat conductive layer, and the backing layer comprises urethane acrylate resin and a heat conductive filler.

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