CN202428432U - Waffle tray for bulk IC electronic components - Google Patents
Waffle tray for bulk IC electronic components Download PDFInfo
- Publication number
- CN202428432U CN202428432U CN2011205149993U CN201120514999U CN202428432U CN 202428432 U CN202428432 U CN 202428432U CN 2011205149993 U CN2011205149993 U CN 2011205149993U CN 201120514999 U CN201120514999 U CN 201120514999U CN 202428432 U CN202428432 U CN 202428432U
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- fupan
- hua
- bulk
- planar
- electronic component
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Abstract
A Waffle tray for bulk IC electronic components comprises a rectangular body (1), and is characterized in that a plurality of planar IC element square grooves (2) are formed on the rectangular body (1), a strip-shaped deformation preventing groove (3) is formed on the back side of the rectangular body (1), circular arc structures (4) are arranged at the four corners of each planar IC element square groove (2), and a Waffle tray mark IC direction notch (5) is formed at one corner of the rectangular body (1). The utility model solves more problems that bulk IC elements cannot achieve machine sticking, and the material consumption of a tipper hopper material feeding frame for tubular IC elements are higher, and the Waffle tray for bulk IC electronic components has the advantages of simple structure, convenience in operation, low cost, easiness in realization and the like.
Description
Technical field
The utility model relates to a kind of production Turnover Box, especially a kind of Electronic Components Manufacturing turnover articles for use, specifically a kind of IC electronic component Hua Fupan in bulk.
Background technology
Fast development along with SMT industry chip mounter technology; Paster speed and paster required precision are increasingly high; The integrated degree of components and parts is more and more concentrated, and components and parts are developed to integrated miniaturization by many kinds small dimension. and the IC of each electronics corporation oneself buying now components and parts, oneself carry out program making and fire; Cause a large amount of tube elements, the braid element becomes diffusing linear element.
In current electronic manufacturing industry; Also all there is the special vibrations feed appliance of making to pipe dress IC components and parts in majority chip mounter producer; But these feed appliances in use are not very desirable; Be easy to cause quality problem bad or that higher some influences like this of device loss mount to exist. because the chip mounter industry develops to high speed gradually now; Produce needs and also need mount at a high speed in the production process to satisfy, but under more such conditions, the high speed of production just exists also the problem that mounts such as above-mentioned said influence to take place; The integrated volume that brings of small dimension of pipe dress electronic device is little, in light weight, the characteristics of thin thickness design the vibrations feed appliance of making to these chip mounter producers and have higher requirement; Device is overturn in the vibrations of getting in the material process, and the brisance that vibrations produce is not enough, gets the material casting action that the material failure is brought; Loaded down with trivial details and the frequent degree of can device. these influence product quality; Production efficiency also increases with the cost that the existence that increases variety of problems such as Manufacturing Worker's labour intensity lets manufacturing enterprise pay. for example: the lifting of product fraction defective, efficient can not get improving in the production of machinery process, and the loss that on the above two problem, has also increased the IC device improves.
Summary of the invention
The purpose of the utility model is can't adsorb the shape IC element that looses to chip mounter, and it is high to use the vibrations bin can produce the material casting rate, the material upset, and the distortion of IC pin, can IC element is frequent, and production efficiency is low
The IC element is easily by problems such as electrostatic breakdowns, and a kind of can the enhancing productivity of designing reduced working strength, lowers static to the influence of IC components and parts, reduces the IC electronic component in bulk of product quality fraction defective significantly and uses Hua Fupan.
The technical scheme of the utility model is:
A kind of IC electronic component in bulk is used Hua Fupan; It comprises rectangle body 1; It is characterized in that being provided with in the described rectangle body 1 a plurality of planar I C element square grooves 2; The back side of rectangle body 1 is provided with strip anti-deformation groove 3, and four jiaos of described planar I C element square groove 2 are provided with arc structure 4, and one jiao of rectangle body 1 is provided with Hua Fupan mark IC direction breach 5.
The circular arc of the arc structure 4 that described planar I C element square groove is 2 four jiaos half is through being 0.8 ± 0.16 millimeter.
The length of described strip anti-deformation groove 3 is 15 ± 1.5 centimetres, and width is 4.5 ± 0.45 millimeters, and the degree of depth is not less than 1.5 ± 0.3 millimeters, and adjacent strip anti-deformation groove 3 stagger arrangement are arranged.
Described Hua Fupan mark IC direction breach 5 is that a husband magnificent is coiled three millimeters breach laterally cutting sth. askew in the upper right corner.
Spacing between around the described planar I C element square groove 2 is 2 ± 0.2 millimeters.
The beneficial effect of the utility model is:
The utility model helps enhancing productivity, and at same template, can improve 30% the daily output in the production process of identical device.
The utility model helps reducing the generation of product fraction defective, according to first portion statistics, uses Hua Fupan to mount fraction defective and descends more than 85%.
The utility model can reduce about per tour time 30 minutes shutdown material loading time at least, greatly reduces labor intensity of operating staff, reduces error probability.
The utility model is simple in structure, and handled easily is cheap, is easy to realize.
Description of drawings
Fig. 1 is the structural representation of facing of the utility model.
Fig. 2 is the backsight structural representation of the utility model.
Fig. 3 is the local enlarged diagram of the planar I C element square groove of the utility model.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is further described.
Shown in Fig. 1-3.
A kind of IC electronic component in bulk is used Hua Fupan; Utilize epoxy plate FR47 to make and form, it comprises rectangle body 1, is provided with a plurality of planar I C element square grooves 2 in the described rectangle body 1; The back side of rectangle body 1 is provided with strip anti-deformation groove 3 (as shown in Figure 2); Four jiaos of described planar I C element square groove 2 are provided with arc structure 4 (Fig. 3), and one jiao of rectangle body 1 is provided with Hua Fupan mark IC direction breach 5, as shown in Figure 1.Described Hua Fupan back side anti-deformation groove 3 can effectively prevent the body distortion of Yin Huafu dish and the IC component level that causes when placing, and height relief is indefinite, the big and bad generation of influence absorption precision of position deviation.Hua Fupan mark IC direction breach 5 can help operating personnel simply to grasp IC material loading direction, stops the quality problem that causes because of the material loading anisotropy.The arc structure 4 that planar I C element square groove is four jiaos can help the conveniently laying of operating personnel, picks up the IC element, reduces labour intensity, reduces the bad loss of IC element.Normal pitch between the square groove can form a logical standard when manufacturing PCB plank program, the operation when reducing program making must be exempted from program error.The concrete size of each several part can be:
The circular arc of the arc structure 4 that described planar I C element square groove is 2 four jiaos half is through being 0.8 ± 0.16 millimeter.
The length of described strip anti-deformation groove 3 is 15 ± 1.5 centimetres, and width is 4.5 ± 0.45 millimeters, and the degree of depth is not less than 1.5 ± 0.3 millimeters, and adjacent strip anti-deformation groove 3 stagger arrangement are arranged.
Described Hua Fupan mark IC direction breach 5 is that a husband magnificent is coiled three millimeters breach laterally cutting sth. askew in the upper right corner.
Spacing between around the described planar I C element square groove 2 is 2 ± 0.2 millimeters.
Utility model does not relate to all identical with the prior art prior art that maybe can adopt of part and realizes.
Claims (5)
1. an IC electronic component in bulk is used Hua Fupan; It comprises rectangle body (1); It is characterized in that being provided with in the described rectangle body (1) a plurality of planar I C element square grooves (2); The back side of rectangle body (1) is provided with strip anti-deformation groove (3), and four jiaos of described planar I C element square groove (2) are provided with arc structure (4), and one jiao of rectangle body (1) is provided with Hua Fupan mark IC direction breach (5).
2. IC electronic component in bulk according to claim 1 is used Hua Fupan, and the circular arc half of arc structure (4) that it is characterized in that (2) four jiaos of described planar I C element square grooves is through being 0.8 ± 0.16 millimeter.
3. IC electronic component in bulk according to claim 1 is used Hua Fupan; The length that it is characterized in that described strip anti-deformation groove (3) is 15 ± 1.5 centimetres; Width is 4.5 ± 0.45 millimeters; The degree of depth is not less than 1.5 ± 0.3 millimeters, and adjacent strip anti-deformation groove (3) stagger arrangement is arranged.
4. IC electronic component in bulk according to claim 1 is used Hua Fupan, it is characterized in that described Hua Fupan mark IC direction breach (5) is that a husband magnificent is coiled three millimeters breach laterally cutting sth. askew in the upper right corner.
5. IC electronic component in bulk according to claim 1 is used Hua Fupan, it is characterized in that the spacing between described planar I C element square groove (2) all around is 2 ± 0.2 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205149993U CN202428432U (en) | 2011-12-12 | 2011-12-12 | Waffle tray for bulk IC electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205149993U CN202428432U (en) | 2011-12-12 | 2011-12-12 | Waffle tray for bulk IC electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202428432U true CN202428432U (en) | 2012-09-12 |
Family
ID=46777904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205149993U Expired - Lifetime CN202428432U (en) | 2011-12-12 | 2011-12-12 | Waffle tray for bulk IC electronic components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202428432U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103594402A (en) * | 2013-11-21 | 2014-02-19 | 华东光电集成器件研究所 | Plate for containing chip components |
-
2011
- 2011-12-12 CN CN2011205149993U patent/CN202428432U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103594402A (en) * | 2013-11-21 | 2014-02-19 | 华东光电集成器件研究所 | Plate for containing chip components |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120912 |